DE60232469D1 - Leitender Polierkörper zum elektrochemisch-mechanischen Polieren - Google Patents
Leitender Polierkörper zum elektrochemisch-mechanischen PolierenInfo
- Publication number
- DE60232469D1 DE60232469D1 DE60232469T DE60232469T DE60232469D1 DE 60232469 D1 DE60232469 D1 DE 60232469D1 DE 60232469 T DE60232469 T DE 60232469T DE 60232469 T DE60232469 T DE 60232469T DE 60232469 D1 DE60232469 D1 DE 60232469D1
- Authority
- DE
- Germany
- Prior art keywords
- polishing
- article
- conductive
- electrochemical
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
- B24B37/14—Lapping plates for working plane surfaces characterised by the composition or properties of the plate materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H5/00—Combined machining
- B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
- B23H5/08—Electrolytic grinding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/22—Electroplating combined with mechanical treatment during the deposition
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/16—Polishing
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US28610701P | 2001-04-24 | 2001-04-24 | |
US32626301P | 2001-10-01 | 2001-10-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60232469D1 true DE60232469D1 (de) | 2009-07-09 |
Family
ID=26963595
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60232469T Expired - Lifetime DE60232469D1 (de) | 2001-04-24 | 2002-04-10 | Leitender Polierkörper zum elektrochemisch-mechanischen Polieren |
DE60211878T Expired - Lifetime DE60211878T2 (de) | 2001-04-24 | 2002-04-10 | Leitender polierkörper zum elektrochemisch-mechanischen polieren |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60211878T Expired - Lifetime DE60211878T2 (de) | 2001-04-24 | 2002-04-10 | Leitender polierkörper zum elektrochemisch-mechanischen polieren |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP1381491B1 (de) |
JP (1) | JP2004531885A (de) |
KR (2) | KR20030090788A (de) |
CN (1) | CN100398261C (de) |
AT (2) | ATE327864T1 (de) |
DE (2) | DE60232469D1 (de) |
TW (1) | TW536450B (de) |
WO (1) | WO2002085570A2 (de) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7153195B2 (en) | 2000-08-30 | 2006-12-26 | Micron Technology, Inc. | Methods and apparatus for selectively removing conductive material from a microelectronic substrate |
US7078308B2 (en) | 2002-08-29 | 2006-07-18 | Micron Technology, Inc. | Method and apparatus for removing adjacent conductive and nonconductive materials of a microelectronic substrate |
US7220166B2 (en) | 2000-08-30 | 2007-05-22 | Micron Technology, Inc. | Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate |
US7129160B2 (en) | 2002-08-29 | 2006-10-31 | Micron Technology, Inc. | Method for simultaneously removing multiple conductive materials from microelectronic substrates |
WO2004108358A2 (en) * | 2003-06-06 | 2004-12-16 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US6848977B1 (en) * | 2003-08-29 | 2005-02-01 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad for electrochemical mechanical polishing |
US20070187257A1 (en) * | 2004-03-19 | 2007-08-16 | Ebara Corporation | Electrolytic processing apparatus and electrolytic processing method |
US7618529B2 (en) * | 2004-05-25 | 2009-11-17 | Rohm And Haas Electronic Materials Cmp Holdings, Inc | Polishing pad for electrochemical mechanical polishing |
US20060163083A1 (en) * | 2005-01-21 | 2006-07-27 | International Business Machines Corporation | Method and composition for electro-chemical-mechanical polishing |
US7655565B2 (en) | 2005-01-26 | 2010-02-02 | Applied Materials, Inc. | Electroprocessing profile control |
JP2006332526A (ja) * | 2005-05-30 | 2006-12-07 | Renesas Technology Corp | 半導体装置の製造方法、電解研磨方法および研磨パッド |
US20070158201A1 (en) * | 2006-01-06 | 2007-07-12 | Applied Materials, Inc. | Electrochemical processing with dynamic process control |
CN103737130B (zh) * | 2013-12-03 | 2016-04-20 | 同济大学 | 一种凝胶态电刷电化学去毛刺及表面处理的方法 |
US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
KR102436416B1 (ko) | 2014-10-17 | 2022-08-26 | 어플라이드 머티어리얼스, 인코포레이티드 | 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 cmp 패드 구성 |
US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
JP6940495B2 (ja) * | 2015-10-30 | 2021-09-29 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法 |
KR20240015161A (ko) | 2016-01-19 | 2024-02-02 | 어플라이드 머티어리얼스, 인코포레이티드 | 다공성 화학적 기계적 연마 패드들 |
US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
CN107695867B (zh) * | 2017-11-02 | 2019-06-14 | 德淮半导体有限公司 | 化学机械研磨装置 |
PT3910095T (pt) * | 2020-05-11 | 2022-04-14 | Semsysco Gmbh | Sistema de distribuição de um fluido de processo para tratamento superficial químico e/ou electrolítico de um substrato rotativo |
KR102539172B1 (ko) * | 2021-11-12 | 2023-06-01 | 케이피엑스케미칼 주식회사 | 탄소나노튜브로 결속된 고내마모성 박막 코팅을 포함하는 복합 연마패드 및 이의 제조방법 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4793895A (en) * | 1988-01-25 | 1988-12-27 | Ibm Corporation | In situ conductivity monitoring technique for chemical/mechanical planarization endpoint detection |
US5136817A (en) * | 1990-02-28 | 1992-08-11 | Nihon Dempa Kogyo Co., Ltd. | Automatic lapping apparatus for piezoelectric materials |
US5081421A (en) * | 1990-05-01 | 1992-01-14 | At&T Bell Laboratories | In situ monitoring technique and apparatus for chemical/mechanical planarization endpoint detection |
US5562529A (en) * | 1992-10-08 | 1996-10-08 | Fujitsu Limited | Apparatus and method for uniformly polishing a wafer |
CN1083767A (zh) * | 1993-06-03 | 1994-03-16 | 浙江大学 | 用于塑料焊接的电热膜及其制造和用它焊接塑料的方法 |
US6056851A (en) * | 1996-06-24 | 2000-05-02 | Taiwan Semiconductor Manufacturing Company | Slurry supply system for chemical mechanical polishing |
US6020264A (en) * | 1997-01-31 | 2000-02-01 | International Business Machines Corporation | Method and apparatus for in-line oxide thickness determination in chemical-mechanical polishing |
US5911619A (en) * | 1997-03-26 | 1999-06-15 | International Business Machines Corporation | Apparatus for electrochemical mechanical planarization |
JPH1142554A (ja) * | 1997-07-25 | 1999-02-16 | Nec Corp | 研磨量制御装置 |
AU1468199A (en) * | 1997-11-25 | 1999-06-15 | Johns Hopkins University, The | Electrochemical-control of abrasive polishing and machining rates |
US6297159B1 (en) * | 1999-07-07 | 2001-10-02 | Advanced Micro Devices, Inc. | Method and apparatus for chemical polishing using field responsive materials |
US6368184B1 (en) * | 2000-01-06 | 2002-04-09 | Advanced Micro Devices, Inc. | Apparatus for determining metal CMP endpoint using integrated polishing pad electrodes |
US6736952B2 (en) * | 2001-02-12 | 2004-05-18 | Speedfam-Ipec Corporation | Method and apparatus for electrochemical planarization of a workpiece |
-
2002
- 2002-04-10 DE DE60232469T patent/DE60232469D1/de not_active Expired - Lifetime
- 2002-04-10 EP EP02728695A patent/EP1381491B1/de not_active Expired - Lifetime
- 2002-04-10 DE DE60211878T patent/DE60211878T2/de not_active Expired - Lifetime
- 2002-04-10 CN CNB028086767A patent/CN100398261C/zh not_active Expired - Fee Related
- 2002-04-10 KR KR10-2003-7013867A patent/KR20030090788A/ko not_active Application Discontinuation
- 2002-04-10 KR KR1020077023166A patent/KR20070103091A/ko not_active Application Discontinuation
- 2002-04-10 AT AT02728695T patent/ATE327864T1/de not_active IP Right Cessation
- 2002-04-10 JP JP2002583133A patent/JP2004531885A/ja not_active Withdrawn
- 2002-04-10 WO PCT/US2002/011009 patent/WO2002085570A2/en active Application Filing
- 2002-04-10 AT AT05077958T patent/ATE432145T1/de not_active IP Right Cessation
- 2002-04-23 TW TW091108392A patent/TW536450B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW536450B (en) | 2003-06-11 |
ATE327864T1 (de) | 2006-06-15 |
DE60211878T2 (de) | 2006-10-26 |
ATE432145T1 (de) | 2009-06-15 |
WO2002085570A3 (en) | 2003-04-24 |
EP1381491B1 (de) | 2006-05-31 |
KR20070103091A (ko) | 2007-10-22 |
CN100398261C (zh) | 2008-07-02 |
JP2004531885A (ja) | 2004-10-14 |
EP1381491A2 (de) | 2004-01-21 |
WO2002085570A2 (en) | 2002-10-31 |
KR20030090788A (ko) | 2003-11-28 |
DE60211878D1 (de) | 2006-07-06 |
CN1531473A (zh) | 2004-09-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE60232469D1 (de) | Leitender Polierkörper zum elektrochemisch-mechanischen Polieren | |
ATE322959T1 (de) | Polierartikel zum elektrochemisch-mechanischen polieren von substraten | |
BR0215381A (pt) | Produto abrasivo flexìvel, e, método para fabricar o mesmo | |
MY131030A (en) | Polishing pad with oriented pore structure | |
DE60102891D1 (de) | Vorrichtung und vefahren für das kontrollierte polieren und planarisieren von halbleiterschleifen | |
TW200605206A (en) | Semiconductor wafer and manufacturing process for semiconductor device | |
DE60144494D1 (de) | Chemisch-mechanisches polierstück mit wellenförmigen rillen | |
ATE464976T1 (de) | Polierkissen mit ausgespartem fenster | |
ATE465002T1 (de) | Vorrichtung zum prägen und beschichten mit klebstoff | |
TW200612500A (en) | Substrate with patterned conductive layer | |
SG135188A1 (en) | Methods and apparatuses for electrochemical-mechanical polishing | |
TW200627550A (en) | Dummy patterns in integrated circuit fabrication | |
ATE233131T1 (de) | System zum reinigen von halbleiterscheiben mit megasonischer wanderwelle | |
DE60144538D1 (de) | Chemisches mechanisches polierstück mit mikrolöchern | |
TWI266673B (en) | Polishing pad, polishing device, and polishing method | |
DE60208557D1 (de) | Schleifblatt mit schlitzen zum staubsaugen, vorrichtung zur endbearbeitung von oberflächen und schleifblatthalterung | |
TW200531784A (en) | Chemical mechanical polishing pad | |
DE60134997D1 (de) | Hydrophile oberfläche mit temporären schutzverkleidungen | |
ATE365776T1 (de) | Elektrisch leitfähige bodenbeläge | |
EP1351292A3 (de) | Halbleitervorrichtung mit flexiblem Bereich und Herstellungsverfahren | |
TWI256682B (en) | Semiconductor device and manufacturing method for the same | |
WO2004108358A3 (en) | Conductive polishing article for electrochemical mechanical polishing | |
ATE492047T1 (de) | Verbinder und kontakt-wafer | |
YU17903A (sh) | Alat za izradu dekorativnih motiva na sloju maltera | |
TW200518651A (en) | Device and method for manufacturing the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |