DE60144538D1 - Chemisches mechanisches polierstück mit mikrolöchern - Google Patents

Chemisches mechanisches polierstück mit mikrolöchern

Info

Publication number
DE60144538D1
DE60144538D1 DE60144538T DE60144538T DE60144538D1 DE 60144538 D1 DE60144538 D1 DE 60144538D1 DE 60144538 T DE60144538 T DE 60144538T DE 60144538 T DE60144538 T DE 60144538T DE 60144538 D1 DE60144538 D1 DE 60144538D1
Authority
DE
Germany
Prior art keywords
micro
chemical mechanical
holes
mechanical polish
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60144538T
Other languages
English (en)
Inventor
In-Ha Park
Tae-Kyoung Kwon
Jae-Seok Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SKC Co Ltd
Original Assignee
SKC Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SKC Co Ltd filed Critical SKC Co Ltd
Application granted granted Critical
Publication of DE60144538D1 publication Critical patent/DE60144538D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Steroid Compounds (AREA)
DE60144538T 2001-08-02 2001-08-29 Chemisches mechanisches polierstück mit mikrolöchern Expired - Lifetime DE60144538D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2001-0046796A KR100497205B1 (ko) 2001-08-02 2001-08-02 마이크로홀이 형성된 화학적 기계적 연마패드
PCT/KR2001/001463 WO2003012846A1 (en) 2001-08-02 2001-08-29 Chemical mechanical polishing pad with micro-holes

Publications (1)

Publication Number Publication Date
DE60144538D1 true DE60144538D1 (de) 2011-06-09

Family

ID=19712816

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60144538T Expired - Lifetime DE60144538D1 (de) 2001-08-02 2001-08-29 Chemisches mechanisches polierstück mit mikrolöchern

Country Status (9)

Country Link
US (2) US20040048559A1 (de)
EP (1) EP1430520B1 (de)
JP (1) JP2004537424A (de)
KR (1) KR100497205B1 (de)
CN (1) CN1312739C (de)
AT (1) ATE507580T1 (de)
DE (1) DE60144538D1 (de)
TW (1) TW592888B (de)
WO (1) WO2003012846A1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6794605B2 (en) * 2001-08-02 2004-09-21 Skc Co., Ltd Method for fabricating chemical mechanical polshing pad using laser
US6998166B2 (en) * 2003-06-17 2006-02-14 Cabot Microelectronics Corporation Polishing pad with oriented pore structure
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
US7875091B2 (en) * 2005-02-22 2011-01-25 Saint-Gobain Abrasives, Inc. Rapid tooling system and methods for manufacturing abrasive articles
US7524345B2 (en) * 2005-02-22 2009-04-28 Saint-Gobain Abrasives, Inc. Rapid tooling system and methods for manufacturing abrasive articles
US7867302B2 (en) * 2005-02-22 2011-01-11 Saint-Gobain Abrasives, Inc. Rapid tooling system and methods for manufacturing abrasive articles
US20070010175A1 (en) * 2005-07-07 2007-01-11 San Fang Chemical Industry Co., Ltd. Polishing pad and method of producing same
US20070111644A1 (en) * 2005-09-27 2007-05-17 Spencer Preston Thick perforated polishing pad and method for making same
US7569268B2 (en) * 2007-01-29 2009-08-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
KR101186531B1 (ko) * 2009-03-24 2012-10-08 차윤종 폴리우레탄 다공질체의 제조방법과 그 제조방법에 따른 폴리우레탄 다공질체 및 폴리우레탄 다공질체를 구비한 연마패드
KR101177497B1 (ko) * 2009-07-01 2012-08-27 서강대학교산학협력단 기공이 형성된 ｃｍｐ 연마패드 및 기공의 형성방법
KR101044281B1 (ko) * 2009-07-30 2011-06-28 서강대학교산학협력단 기공이 형성된 ｃｍｐ 연마패드와 그의 제조방법
KR101044279B1 (ko) * 2009-07-30 2011-06-28 서강대학교산학협력단 Ｃｍｐ 연마패드와 그의 제조방법
JP5484145B2 (ja) * 2010-03-24 2014-05-07 東洋ゴム工業株式会社 研磨パッド
WO2012071259A1 (en) * 2010-11-23 2012-05-31 Taiwan Green Point Enterprises Co., Ltd. Method and structure of binding plastic and metal material together
CN114589619B (zh) * 2020-12-03 2023-04-25 中国科学院微电子研究所 半导体研磨垫及制备方法
TWI767689B (zh) * 2021-05-05 2022-06-11 健行學校財團法人健行科技大學 微細孔拋光裝置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2668016B2 (ja) * 1988-09-21 1997-10-27 スピードファム株式会社 ポリッシングパッド及びその製造方法
US5020283A (en) * 1990-01-22 1991-06-04 Micron Technology, Inc. Polishing pad with uniform abrasion
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5329734A (en) * 1993-04-30 1994-07-19 Motorola, Inc. Polishing pads used to chemical-mechanical polish a semiconductor substrate
JP3042593B2 (ja) * 1995-10-25 2000-05-15 日本電気株式会社 研磨パッド
JPH10329007A (ja) * 1997-05-28 1998-12-15 Sony Corp 化学的機械研磨装置
JPH1199468A (ja) * 1997-09-29 1999-04-13 Toshiba Corp 研磨パッド及びそれを用いた研磨装置
JP2907209B1 (ja) * 1998-05-29 1999-06-21 日本電気株式会社 ウェハ研磨装置用裏面パッド
KR20000025003A (ko) * 1998-10-07 2000-05-06 윤종용 반도체 기판의 화학 기계적 연마에 사용되는 연마 패드
JP2001071256A (ja) * 1999-08-31 2001-03-21 Shinozaki Seisakusho:Kk 研磨パッドの溝形成方法及び装置並びに研磨パッド

Also Published As

Publication number Publication date
US20040048559A1 (en) 2004-03-11
KR100497205B1 (ko) 2005-06-23
EP1430520B1 (de) 2011-04-27
JP2004537424A (ja) 2004-12-16
KR20030012655A (ko) 2003-02-12
CN1312739C (zh) 2007-04-25
ATE507580T1 (de) 2011-05-15
WO2003012846A1 (en) 2003-02-13
CN1559082A (zh) 2004-12-29
EP1430520A1 (de) 2004-06-23
US20070173187A1 (en) 2007-07-26
EP1430520A4 (de) 2008-04-09
TW592888B (en) 2004-06-21

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