ATE289895T1 - Polierkissen mit rillenmuster und deren anwendungsverfahren - Google Patents

Polierkissen mit rillenmuster und deren anwendungsverfahren

Info

Publication number
ATE289895T1
ATE289895T1 AT01950744T AT01950744T ATE289895T1 AT E289895 T1 ATE289895 T1 AT E289895T1 AT 01950744 T AT01950744 T AT 01950744T AT 01950744 T AT01950744 T AT 01950744T AT E289895 T1 ATE289895 T1 AT E289895T1
Authority
AT
Austria
Prior art keywords
pad
bit
grooves
recess
stop member
Prior art date
Application number
AT01950744T
Other languages
English (en)
Inventor
Shyng-Tsong Chen
Kenneth M Davis
Kenneth P Rodbell
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of ATE289895T1 publication Critical patent/ATE289895T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
AT01950744T 2000-06-29 2001-06-29 Polierkissen mit rillenmuster und deren anwendungsverfahren ATE289895T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US21477400P 2000-06-29 2000-06-29
US09/668,142 US6656019B1 (en) 2000-06-29 2000-09-25 Grooved polishing pads and methods of use
PCT/US2001/020904 WO2002002279A2 (en) 2000-06-29 2001-06-29 Grooved polishing pads and methods of use

Publications (1)

Publication Number Publication Date
ATE289895T1 true ATE289895T1 (de) 2005-03-15

Family

ID=26909345

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01950744T ATE289895T1 (de) 2000-06-29 2001-06-29 Polierkissen mit rillenmuster und deren anwendungsverfahren

Country Status (9)

Country Link
US (2) US6656019B1 (de)
EP (1) EP1303381B1 (de)
JP (1) JP3823086B2 (de)
CN (1) CN1233508C (de)
AT (1) ATE289895T1 (de)
AU (1) AU2001271709A1 (de)
DE (1) DE60109170T2 (de)
TW (1) TW567121B (de)
WO (1) WO2002002279A2 (de)

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US20080156657A1 (en) * 2000-02-17 2008-07-03 Butterfield Paul D Conductive polishing article for electrochemical mechanical polishing
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US7303662B2 (en) * 2000-02-17 2007-12-04 Applied Materials, Inc. Contacts for electrochemical processing
US6991528B2 (en) * 2000-02-17 2006-01-31 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7374644B2 (en) * 2000-02-17 2008-05-20 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
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US20040020789A1 (en) * 2000-02-17 2004-02-05 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
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US6979248B2 (en) * 2002-05-07 2005-12-27 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7125477B2 (en) * 2000-02-17 2006-10-24 Applied Materials, Inc. Contacts for electrochemical processing
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US20040259479A1 (en) * 2003-06-23 2004-12-23 Cabot Microelectronics Corporation Polishing pad for electrochemical-mechanical polishing
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US7018274B2 (en) * 2003-11-13 2006-03-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc Polishing pad having slurry utilization enhancing grooves
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Also Published As

Publication number Publication date
JP2004501789A (ja) 2004-01-22
DE60109170T2 (de) 2006-01-12
CN1233508C (zh) 2005-12-28
WO2002002279A2 (en) 2002-01-10
EP1303381A2 (de) 2003-04-23
TW567121B (en) 2003-12-21
EP1303381B1 (de) 2005-03-02
US6656019B1 (en) 2003-12-02
US6685548B2 (en) 2004-02-03
AU2001271709A1 (en) 2002-01-14
DE60109170D1 (de) 2005-04-07
US20030199234A1 (en) 2003-10-23
WO2002002279A3 (en) 2002-05-30
CN1449322A (zh) 2003-10-15
JP3823086B2 (ja) 2006-09-20

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