DE60109170D1 - Polierkissen mit rillenmuster und deren anwendungsverfahren - Google Patents

Polierkissen mit rillenmuster und deren anwendungsverfahren

Info

Publication number
DE60109170D1
DE60109170D1 DE60109170T DE60109170T DE60109170D1 DE 60109170 D1 DE60109170 D1 DE 60109170D1 DE 60109170 T DE60109170 T DE 60109170T DE 60109170 T DE60109170 T DE 60109170T DE 60109170 D1 DE60109170 D1 DE 60109170D1
Authority
DE
Germany
Prior art keywords
pad
bit
grooves
recess
stop member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60109170T
Other languages
English (en)
Other versions
DE60109170T2 (de
Inventor
Shyng-Tsong Chen
M Davis
P Rodbell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE60109170D1 publication Critical patent/DE60109170D1/de
Application granted granted Critical
Publication of DE60109170T2 publication Critical patent/DE60109170T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
DE60109170T 2000-06-29 2001-06-29 Polierkissen mit rillenmuster und deren anwendungsverfahren Expired - Lifetime DE60109170T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US21477400P 2000-06-29 2000-06-29
US214774P 2000-06-29
US09/668,142 US6656019B1 (en) 2000-06-29 2000-09-25 Grooved polishing pads and methods of use
US668142 2000-09-25
PCT/US2001/020904 WO2002002279A2 (en) 2000-06-29 2001-06-29 Grooved polishing pads and methods of use

Publications (2)

Publication Number Publication Date
DE60109170D1 true DE60109170D1 (de) 2005-04-07
DE60109170T2 DE60109170T2 (de) 2006-01-12

Family

ID=26909345

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60109170T Expired - Lifetime DE60109170T2 (de) 2000-06-29 2001-06-29 Polierkissen mit rillenmuster und deren anwendungsverfahren

Country Status (9)

Country Link
US (2) US6656019B1 (de)
EP (1) EP1303381B1 (de)
JP (1) JP3823086B2 (de)
CN (1) CN1233508C (de)
AT (1) ATE289895T1 (de)
AU (1) AU2001271709A1 (de)
DE (1) DE60109170T2 (de)
TW (1) TW567121B (de)
WO (1) WO2002002279A2 (de)

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US20080156657A1 (en) * 2000-02-17 2008-07-03 Butterfield Paul D Conductive polishing article for electrochemical mechanical polishing
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US7670468B2 (en) 2000-02-17 2010-03-02 Applied Materials, Inc. Contact assembly and method for electrochemical mechanical processing
US7077721B2 (en) * 2000-02-17 2006-07-18 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US7066800B2 (en) * 2000-02-17 2006-06-27 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US6979248B2 (en) * 2002-05-07 2005-12-27 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7303462B2 (en) * 2000-02-17 2007-12-04 Applied Materials, Inc. Edge bead removal by an electro polishing process
US7125477B2 (en) * 2000-02-17 2006-10-24 Applied Materials, Inc. Contacts for electrochemical processing
US7029365B2 (en) * 2000-02-17 2006-04-18 Applied Materials Inc. Pad assembly for electrochemical mechanical processing
US7303662B2 (en) * 2000-02-17 2007-12-04 Applied Materials, Inc. Contacts for electrochemical processing
US20050092621A1 (en) * 2000-02-17 2005-05-05 Yongqi Hu Composite pad assembly for electrochemical mechanical processing (ECMP)
US20040020789A1 (en) * 2000-02-17 2004-02-05 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6991528B2 (en) * 2000-02-17 2006-01-31 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7374644B2 (en) * 2000-02-17 2008-05-20 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7059948B2 (en) * 2000-12-22 2006-06-13 Applied Materials Articles for polishing semiconductor substrates
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US6616513B1 (en) * 2000-04-07 2003-09-09 Applied Materials, Inc. Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile
US20020042200A1 (en) * 2000-10-02 2002-04-11 Clyde Fawcett Method for conditioning polishing pads
JP2002200555A (ja) * 2000-12-28 2002-07-16 Ebara Corp 研磨工具および該研磨工具を具備したポリッシング装置
US7344432B2 (en) * 2001-04-24 2008-03-18 Applied Materials, Inc. Conductive pad with ion exchange membrane for electrochemical mechanical polishing
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KR100646702B1 (ko) * 2001-08-16 2006-11-17 에스케이씨 주식회사 홀 및/또는 그루브로 형성된 화학적 기계적 연마패드
US6648743B1 (en) * 2001-09-05 2003-11-18 Lsi Logic Corporation Chemical mechanical polishing pad
JP3843933B2 (ja) * 2002-02-07 2006-11-08 ソニー株式会社 研磨パッド、研磨装置および研磨方法
WO2003083918A1 (fr) * 2002-04-03 2003-10-09 Toho Engineering Kabushiki Kaisha Tampon a polir et procede de fabrication de substrat a semi-conducteurs utilisant ce tampon a polir
US20050194681A1 (en) * 2002-05-07 2005-09-08 Yongqi Hu Conductive pad with high abrasion
TWI252793B (en) * 2002-08-20 2006-04-11 Nanya Technology Corp Wear auto-display polishing pad and fabricating method of the same
US6923362B2 (en) * 2002-09-30 2005-08-02 The Curators Of University Of Missouri Integral channels in metal components and fabrication thereof
US20040152402A1 (en) * 2003-02-05 2004-08-05 Markus Naujok Wafer polishing with counteraction of centrifugal forces on polishing slurry
US6783436B1 (en) 2003-04-29 2004-08-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with optimized grooves and method of forming same
JP4292025B2 (ja) * 2003-05-23 2009-07-08 Ｊｓｒ株式会社 研磨パッド
US20040259479A1 (en) * 2003-06-23 2004-12-23 Cabot Microelectronics Corporation Polishing pad for electrochemical-mechanical polishing
US6942549B2 (en) * 2003-10-29 2005-09-13 International Business Machines Corporation Two-sided chemical mechanical polishing pad for semiconductor processing
US7442116B2 (en) * 2003-11-04 2008-10-28 Jsr Corporation Chemical mechanical polishing pad
US7018274B2 (en) * 2003-11-13 2006-03-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc Polishing pad having slurry utilization enhancing grooves
US6843711B1 (en) * 2003-12-11 2005-01-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc Chemical mechanical polishing pad having a process-dependent groove configuration
JP2005177897A (ja) * 2003-12-17 2005-07-07 Nec Electronics Corp 研磨方法および研磨装置と半導体装置製造方法
US20050178666A1 (en) * 2004-01-13 2005-08-18 Applied Materials, Inc. Methods for fabrication of a polishing article
US6951510B1 (en) * 2004-03-12 2005-10-04 Agere Systems, Inc. Chemical mechanical polishing pad with grooves alternating between a larger groove size and a smaller groove size
KR20060046093A (ko) * 2004-05-20 2006-05-17 제이에스알 가부시끼가이샤 화학 기계 연마 패드 및 화학 기계 연마 방법
US7270595B2 (en) * 2004-05-27 2007-09-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with oscillating path groove network
US6974372B1 (en) * 2004-06-16 2005-12-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad having grooves configured to promote mixing wakes during polishing
US7198546B2 (en) * 2004-06-29 2007-04-03 Lsi Logic Corporation Method to monitor pad wear in CMP processing
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US20060030156A1 (en) * 2004-08-05 2006-02-09 Applied Materials, Inc. Abrasive conductive polishing article for electrochemical mechanical polishing
US6895631B1 (en) 2004-09-08 2005-05-24 Dedication To Detail, Inc. Buffing pad wear indicator
US7084064B2 (en) * 2004-09-14 2006-08-01 Applied Materials, Inc. Full sequence metal and barrier layer electrochemical mechanical processing
WO2006039436A2 (en) * 2004-10-01 2006-04-13 Applied Materials, Inc. Pad design for electrochemical mechanical polishing
US7520968B2 (en) * 2004-10-05 2009-04-21 Applied Materials, Inc. Conductive pad design modification for better wafer-pad contact
US20060079159A1 (en) * 2004-10-08 2006-04-13 Markus Naujok Chemical mechanical polish with multi-zone abrasive-containing matrix
JP4448766B2 (ja) * 2004-12-08 2010-04-14 信越化学工業株式会社 研磨方法
US7131895B2 (en) * 2005-01-13 2006-11-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having a radially alternating groove segment configuration
US20060219663A1 (en) * 2005-03-31 2006-10-05 Applied Materials, Inc. Metal CMP process on one or more polishing stations using slurries with oxidizers
US7427340B2 (en) * 2005-04-08 2008-09-23 Applied Materials, Inc. Conductive pad
US20070037491A1 (en) * 2005-08-12 2007-02-15 Yuzhuo Li Chemically modified chemical mechanical polishing pad, process of making a modified chemical mechanical polishing pad and method of chemical mechanical polishing
JP4884726B2 (ja) * 2005-08-30 2012-02-29 東洋ゴム工業株式会社 積層研磨パッドの製造方法
JP4756583B2 (ja) * 2005-08-30 2011-08-24 株式会社東京精密 研磨パッド、パッドドレッシング評価方法、及び研磨装置
DE102006062692B4 (de) * 2006-02-06 2008-08-21 J. Schmalz Gmbh Sauggreifer
US20070197145A1 (en) * 2006-02-15 2007-08-23 Applied Materials, Inc. Polishing article with window stripe
US7267610B1 (en) * 2006-08-30 2007-09-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having unevenly spaced grooves
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JP2008062367A (ja) * 2006-09-11 2008-03-21 Nec Electronics Corp 研磨装置、研磨パッド、研磨方法
US7234224B1 (en) * 2006-11-03 2007-06-26 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Curved grooving of polishing pads
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DE102007024954A1 (de) * 2007-05-30 2008-12-04 Siltronic Ag Poliertuch für DSP und CMP
JP4593643B2 (ja) * 2008-03-12 2010-12-08 東洋ゴム工業株式会社 研磨パッド
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US8118641B2 (en) * 2009-03-04 2012-02-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having window with integral identification feature
JP5587337B2 (ja) * 2009-01-05 2014-09-10 イノパッド，インコーポレイテッド 複数層化学機械平坦化パッド
TWI535527B (zh) * 2009-07-20 2016-06-01 智勝科技股份有限公司 研磨方法、研磨墊與研磨系統
JP5635194B2 (ja) * 2010-09-15 2014-12-03 エルジー・ケム・リミテッド Ｃｍｐ用研磨パッド
TW201235155A (en) * 2011-02-25 2012-09-01 Hon Hai Prec Ind Co Ltd Cleaning scrap device for grinding plate
US8968058B2 (en) 2011-05-05 2015-03-03 Nexplanar Corporation Polishing pad with alignment feature
DE102011082777A1 (de) * 2011-09-15 2012-02-09 Siltronic Ag Verfahren zum beidseitigen Polieren einer Halbleiterscheibe
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CN102909648A (zh) * 2012-11-01 2013-02-06 昆山市大金机械设备厂 自动研磨装置
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JP5887290B2 (ja) * 2013-02-25 2016-03-16 ニッタ・ハース株式会社 研磨パッド
US9308620B2 (en) * 2013-09-18 2016-04-12 Texas Instruments Incorporated Permeated grooving in CMP polishing pads
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CN103753382B (zh) * 2014-01-06 2016-04-27 成都时代立夫科技有限公司 一种抛光垫及其制备方法
CN103878684B (zh) * 2014-03-06 2016-03-02 浙江工业大学 一种带有抛光功能的研磨盘
CN106457525A (zh) * 2014-06-10 2017-02-22 奥林巴斯株式会社 研磨工具、研磨方法及研磨装置
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Also Published As

Publication number Publication date
CN1449322A (zh) 2003-10-15
CN1233508C (zh) 2005-12-28
WO2002002279A2 (en) 2002-01-10
ATE289895T1 (de) 2005-03-15
JP3823086B2 (ja) 2006-09-20
EP1303381A2 (de) 2003-04-23
EP1303381B1 (de) 2005-03-02
US6656019B1 (en) 2003-12-02
AU2001271709A1 (en) 2002-01-14
US20030199234A1 (en) 2003-10-23
US6685548B2 (en) 2004-02-03
WO2002002279A3 (en) 2002-05-30
JP2004501789A (ja) 2004-01-22
DE60109170T2 (de) 2006-01-12
TW567121B (en) 2003-12-21

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8328 Change in the person/name/address of the agent

Representative=s name: DUSCHER, R., DIPL.-PHYS. DR.RER.NAT., PAT.-ANW., 7