AU2001271709A1 - Grooved polishing pads and methods of use - Google Patents

Grooved polishing pads and methods of use

Info

Publication number
AU2001271709A1
AU2001271709A1 AU2001271709A AU7170901A AU2001271709A1 AU 2001271709 A1 AU2001271709 A1 AU 2001271709A1 AU 2001271709 A AU2001271709 A AU 2001271709A AU 7170901 A AU7170901 A AU 7170901A AU 2001271709 A1 AU2001271709 A1 AU 2001271709A1
Authority
AU
Australia
Prior art keywords
pad
bit
grooves
recess
stop member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001271709A
Inventor
Shyng-Tsong Chen
Kenneth M Davis
Kenneth P. Rodbell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of AU2001271709A1 publication Critical patent/AU2001271709A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/26Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for

Abstract

Grooves are formed in a CMP pad by positioning the pad on a supporting surface with a working surface of the pad in spaced relation opposite to a router bit and at least one projecting stop member adjacent to the router bit, an outer end portion of the bit projecting beyond the stop. When the bit is rotated, relative axial movement between the bit and the pad causes the outer end portion of the bit to cut an initial recess in the pad. Relative lateral movement between the rotating bit and the pad then forms a groove which extends laterally away from the recess and has a depth substantially the same as that of the recess. The depths of the initial recess and the groove are limited by applying a vacuum to the working surface of the pad to keep it in contact with the stop member(s). Different lateral movements between the bit and the pad are used to form a variety of groove patterns, the depths of which are precisely controlled by the stop member(s). The grooves may be formed in the polishing surface and/or the rear opposite surface of the pad and passages may be provided for interconnecting the rear grooves with the polishing surface or the front grooves.
AU2001271709A 2000-06-29 2001-06-29 Grooved polishing pads and methods of use Abandoned AU2001271709A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US21477400P 2000-06-29 2000-06-29
US60214774 2000-06-29
US09/668,142 US6656019B1 (en) 2000-06-29 2000-09-25 Grooved polishing pads and methods of use
US09668142 2000-09-25
PCT/US2001/020904 WO2002002279A2 (en) 2000-06-29 2001-06-29 Grooved polishing pads and methods of use

Publications (1)

Publication Number Publication Date
AU2001271709A1 true AU2001271709A1 (en) 2002-01-14

Family

ID=26909345

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001271709A Abandoned AU2001271709A1 (en) 2000-06-29 2001-06-29 Grooved polishing pads and methods of use

Country Status (9)

Country Link
US (2) US6656019B1 (en)
EP (1) EP1303381B1 (en)
JP (1) JP3823086B2 (en)
CN (1) CN1233508C (en)
AT (1) ATE289895T1 (en)
AU (1) AU2001271709A1 (en)
DE (1) DE60109170T2 (en)
TW (1) TW567121B (en)
WO (1) WO2002002279A2 (en)

Families Citing this family (111)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7516536B2 (en) * 1999-07-08 2009-04-14 Toho Engineering Kabushiki Kaisha Method of producing polishing pad
US6869343B2 (en) * 2001-12-19 2005-03-22 Toho Engineering Kabushiki Kaisha Turning tool for grooving polishing pad, apparatus and method of producing polishing pad using the tool, and polishing pad produced by using the tool
US7029365B2 (en) * 2000-02-17 2006-04-18 Applied Materials Inc. Pad assembly for electrochemical mechanical processing
US7077721B2 (en) * 2000-02-17 2006-07-18 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US7678245B2 (en) 2000-02-17 2010-03-16 Applied Materials, Inc. Method and apparatus for electrochemical mechanical processing
US20080156657A1 (en) * 2000-02-17 2008-07-03 Butterfield Paul D Conductive polishing article for electrochemical mechanical polishing
US20050092621A1 (en) * 2000-02-17 2005-05-05 Yongqi Hu Composite pad assembly for electrochemical mechanical processing (ECMP)
US7125477B2 (en) * 2000-02-17 2006-10-24 Applied Materials, Inc. Contacts for electrochemical processing
US7303462B2 (en) * 2000-02-17 2007-12-04 Applied Materials, Inc. Edge bead removal by an electro polishing process
US7059948B2 (en) * 2000-12-22 2006-06-13 Applied Materials Articles for polishing semiconductor substrates
US7303662B2 (en) * 2000-02-17 2007-12-04 Applied Materials, Inc. Contacts for electrochemical processing
US6962524B2 (en) * 2000-02-17 2005-11-08 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7374644B2 (en) * 2000-02-17 2008-05-20 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6979248B2 (en) * 2002-05-07 2005-12-27 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US20040020789A1 (en) * 2000-02-17 2004-02-05 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6991528B2 (en) * 2000-02-17 2006-01-31 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7670468B2 (en) 2000-02-17 2010-03-02 Applied Materials, Inc. Contact assembly and method for electrochemical mechanical processing
US7066800B2 (en) * 2000-02-17 2006-06-27 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US6616513B1 (en) * 2000-04-07 2003-09-09 Applied Materials, Inc. Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile
WO2002028598A1 (en) * 2000-10-02 2002-04-11 Rodel Holdings, Inc. Method for conditioning polishing pads
JP2002200555A (en) * 2000-12-28 2002-07-16 Ebara Corp Polishing tool and polishing device with polishing tool
US7137879B2 (en) * 2001-04-24 2006-11-21 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7344432B2 (en) * 2001-04-24 2008-03-18 Applied Materials, Inc. Conductive pad with ion exchange membrane for electrochemical mechanical polishing
KR100646702B1 (en) * 2001-08-16 2006-11-17 에스케이씨 주식회사 Chemical mechanical polishing pad having holes and/or grooves
US6648743B1 (en) * 2001-09-05 2003-11-18 Lsi Logic Corporation Chemical mechanical polishing pad
JP3843933B2 (en) * 2002-02-07 2006-11-08 ソニー株式会社 Polishing pad, polishing apparatus and polishing method
WO2003083918A1 (en) * 2002-04-03 2003-10-09 Toho Engineering Kabushiki Kaisha Polishing pad and semiconductor substrate manufacturing method using the polishing pad
US20050194681A1 (en) * 2002-05-07 2005-09-08 Yongqi Hu Conductive pad with high abrasion
TWI252793B (en) * 2002-08-20 2006-04-11 Nanya Technology Corp Wear auto-display polishing pad and fabricating method of the same
US6923362B2 (en) * 2002-09-30 2005-08-02 The Curators Of University Of Missouri Integral channels in metal components and fabrication thereof
US20040152402A1 (en) * 2003-02-05 2004-08-05 Markus Naujok Wafer polishing with counteraction of centrifugal forces on polishing slurry
US6783436B1 (en) 2003-04-29 2004-08-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with optimized grooves and method of forming same
JP4292025B2 (en) 2003-05-23 2009-07-08 Jsr株式会社 Polishing pad
US20040259479A1 (en) * 2003-06-23 2004-12-23 Cabot Microelectronics Corporation Polishing pad for electrochemical-mechanical polishing
US6942549B2 (en) * 2003-10-29 2005-09-13 International Business Machines Corporation Two-sided chemical mechanical polishing pad for semiconductor processing
US7442116B2 (en) * 2003-11-04 2008-10-28 Jsr Corporation Chemical mechanical polishing pad
US7018274B2 (en) * 2003-11-13 2006-03-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc Polishing pad having slurry utilization enhancing grooves
US6843711B1 (en) * 2003-12-11 2005-01-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc Chemical mechanical polishing pad having a process-dependent groove configuration
JP2005177897A (en) * 2003-12-17 2005-07-07 Nec Electronics Corp Polishing method, polishing device, and method of manufacturing semiconductor device
US20050178666A1 (en) * 2004-01-13 2005-08-18 Applied Materials, Inc. Methods for fabrication of a polishing article
US6951510B1 (en) * 2004-03-12 2005-10-04 Agere Systems, Inc. Chemical mechanical polishing pad with grooves alternating between a larger groove size and a smaller groove size
KR20060046093A (en) * 2004-05-20 2006-05-17 제이에스알 가부시끼가이샤 Chemical mechanical polishing pad and chemical mechanical polishing method
US7270595B2 (en) * 2004-05-27 2007-09-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with oscillating path groove network
US6974372B1 (en) * 2004-06-16 2005-12-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad having grooves configured to promote mixing wakes during polishing
US7198546B2 (en) * 2004-06-29 2007-04-03 Lsi Logic Corporation Method to monitor pad wear in CMP processing
US7040970B2 (en) * 2004-07-15 2006-05-09 Lam Research Corporation Apparatus and method for distributing a polishing fluid
US20060030156A1 (en) * 2004-08-05 2006-02-09 Applied Materials, Inc. Abrasive conductive polishing article for electrochemical mechanical polishing
US6895631B1 (en) 2004-09-08 2005-05-24 Dedication To Detail, Inc. Buffing pad wear indicator
US7084064B2 (en) * 2004-09-14 2006-08-01 Applied Materials, Inc. Full sequence metal and barrier layer electrochemical mechanical processing
WO2006039436A2 (en) * 2004-10-01 2006-04-13 Applied Materials, Inc. Pad design for electrochemical mechanical polishing
US7520968B2 (en) * 2004-10-05 2009-04-21 Applied Materials, Inc. Conductive pad design modification for better wafer-pad contact
US20060079159A1 (en) * 2004-10-08 2006-04-13 Markus Naujok Chemical mechanical polish with multi-zone abrasive-containing matrix
JP4448766B2 (en) * 2004-12-08 2010-04-14 信越化学工業株式会社 Polishing method
US7131895B2 (en) * 2005-01-13 2006-11-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having a radially alternating groove segment configuration
US20060219663A1 (en) * 2005-03-31 2006-10-05 Applied Materials, Inc. Metal CMP process on one or more polishing stations using slurries with oxidizers
US7427340B2 (en) * 2005-04-08 2008-09-23 Applied Materials, Inc. Conductive pad
US20070037491A1 (en) * 2005-08-12 2007-02-15 Yuzhuo Li Chemically modified chemical mechanical polishing pad, process of making a modified chemical mechanical polishing pad and method of chemical mechanical polishing
JP4884726B2 (en) * 2005-08-30 2012-02-29 東洋ゴム工業株式会社 Manufacturing method of laminated polishing pad
JP4756583B2 (en) * 2005-08-30 2011-08-24 株式会社東京精密 Polishing pad, pad dressing evaluation method, and polishing apparatus
DE102006062692B4 (en) * 2006-02-06 2008-08-21 J. Schmalz Gmbh Suction pads
KR100882045B1 (en) * 2006-02-15 2009-02-09 어플라이드 머티어리얼스, 인코포레이티드 Polishing apparatus with grooved subpad
US7267610B1 (en) * 2006-08-30 2007-09-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having unevenly spaced grooves
WO2008029537A1 (en) * 2006-09-08 2008-03-13 Toyo Tire & Rubber Co., Ltd. Method for production of polishing pad
JP2008062367A (en) * 2006-09-11 2008-03-21 Nec Electronics Corp Polishing device, polishing pad, and polishing method
US7234224B1 (en) * 2006-11-03 2007-06-26 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Curved grooving of polishing pads
SG177963A1 (en) 2007-01-15 2012-02-28 Toyo Tire & Rubber Co Polishing pad and method for producing the same
US20080293343A1 (en) * 2007-05-22 2008-11-27 Yuchun Wang Pad with shallow cells for electrochemical mechanical processing
DE102007024954A1 (en) * 2007-05-30 2008-12-04 Siltronic Ag Method for polishing semiconductor wafer, involves conditioning of porous polishing clothes, which is made of definite material and have definite porosity and pore distribution, by conditioner
JP4593643B2 (en) * 2008-03-12 2010-12-08 東洋ゴム工業株式会社 Polishing pad
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
CN102026775A (en) * 2008-05-16 2011-04-20 东丽株式会社 Polishing pad
ITMI20080222U1 (en) * 2008-07-15 2010-01-16 Valentini Guido "CUP FOR WORKING SURFACES WITH CURVED SUCTION CHANNELS"
US8118641B2 (en) * 2009-03-04 2012-02-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having window with integral identification feature
KR101674564B1 (en) * 2009-01-05 2016-11-09 에프엔에스테크 주식회사 Multi-layered chemical-mechanical planarization pad
TWI535527B (en) * 2009-07-20 2016-06-01 智勝科技股份有限公司 Polishing method, polishing pad and polishing system
WO2012036444A2 (en) * 2010-09-15 2012-03-22 주식회사 엘지화학 Polishing pad for cmp
TW201235155A (en) * 2011-02-25 2012-09-01 Hon Hai Prec Ind Co Ltd Cleaning scrap device for grinding plate
US8968058B2 (en) 2011-05-05 2015-03-03 Nexplanar Corporation Polishing pad with alignment feature
DE102011082777A1 (en) * 2011-09-15 2012-02-09 Siltronic Ag Method for double-sided polishing of semiconductor wafer e.g. silicon wafer, involves forming channel-shaped recesses in surface of polishing cloth of semiconductor wafer
US8801949B2 (en) * 2011-09-22 2014-08-12 Dow Global Technologies Llc Method of forming open-network polishing pads
MX356390B (en) 2011-12-31 2018-05-28 Saint Gobain Abrasives Inc Abrasive article having a non-uniform distribution of openings.
CN102873625A (en) * 2012-11-01 2013-01-16 昆山市大金机械设备厂 Polishing device
CN102909648A (en) * 2012-11-01 2013-02-06 昆山市大金机械设备厂 Automatic grinding device
JP5887290B2 (en) * 2013-02-25 2016-03-16 ニッタ・ハース株式会社 Polishing pad
US9308620B2 (en) * 2013-09-18 2016-04-12 Texas Instruments Incorporated Permeated grooving in CMP polishing pads
CN103753382B (en) * 2014-01-06 2016-04-27 成都时代立夫科技有限公司 A kind of polishing pad and preparation method thereof
TWM506674U (en) * 2014-01-06 2015-08-11 Chengdu Times Live Science And Technology Co Ltd Polishing pad
CN103878684B (en) * 2014-03-06 2016-03-02 浙江工业大学 A kind of abrasive disk with polishing function
CN106457525A (en) * 2014-06-10 2017-02-22 奥林巴斯株式会社 Grinding tool, grinding method, and grinding device
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
CN113579992A (en) 2014-10-17 2021-11-02 应用材料公司 CMP pad construction with composite material properties using additive manufacturing process
US10092998B2 (en) * 2015-06-26 2018-10-09 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making composite polishing layer for chemical mechanical polishing pad
CN105415168B (en) * 2015-10-30 2018-01-16 佛山市金辉高科光电材料有限公司 A kind of composite polishing pad and preparation method thereof
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
JP6565780B2 (en) * 2016-04-14 2019-08-28 株式会社Sumco Wafer edge polishing pad, wafer edge polishing apparatus, and wafer edge polishing method
US10857647B2 (en) * 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings High-rate CMP polishing method
US10861702B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Controlled residence CMP polishing method
US10777418B2 (en) * 2017-06-14 2020-09-15 Rohm And Haas Electronic Materials Cmp Holdings, I Biased pulse CMP groove pattern
US10586708B2 (en) 2017-06-14 2020-03-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Uniform CMP polishing method
US10857648B2 (en) * 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Trapezoidal CMP groove pattern
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. Abrasive delivery polishing pads and manufacturing methods thereof
JP6294553B1 (en) * 2017-10-11 2018-03-14 光触媒抗菌サービス株式会社 Charger for terminal
KR102026250B1 (en) 2018-02-05 2019-09-27 에스케이실트론 주식회사 Wafer polishing pad and Manufacturing Method of it
JP7299970B2 (en) 2018-09-04 2023-06-28 アプライド マテリアルズ インコーポレイテッド Formulations for improved polishing pads
JP7431807B2 (en) * 2019-04-03 2024-02-15 株式会社クラレ polishing pad
WO2020255744A1 (en) * 2019-06-19 2020-12-24 株式会社クラレ Polishing pad, method for manufacturing polishing pad, and polishing method
CN111941251A (en) * 2020-07-08 2020-11-17 上海新昇半导体科技有限公司 Polishing pad, polishing equipment and polishing method of silicon wafer
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5177908A (en) * 1990-01-22 1993-01-12 Micron Technology, Inc. Polishing pad
US5216843A (en) * 1992-09-24 1993-06-08 Intel Corporation Polishing pad conditioning apparatus for wafer planarization process
US6056851A (en) * 1996-06-24 2000-05-02 Taiwan Semiconductor Manufacturing Company Slurry supply system for chemical mechanical polishing
US5645469A (en) * 1996-09-06 1997-07-08 Advanced Micro Devices, Inc. Polishing pad with radially extending tapered channels
US5921855A (en) * 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
US6273806B1 (en) * 1997-05-15 2001-08-14 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
US6001001A (en) * 1997-06-10 1999-12-14 Texas Instruments Incorporated Apparatus and method for chemical mechanical polishing of a wafer
US5913713A (en) * 1997-07-31 1999-06-22 International Business Machines Corporation CMP polishing pad backside modifications for advantageous polishing results
US5882251A (en) * 1997-08-19 1999-03-16 Lsi Logic Corporation Chemical mechanical polishing pad slurry distribution grooves
JPH11216663A (en) * 1998-02-03 1999-08-10 Sony Corp Grinding pad, grinding apparatus and grinding method
US6238271B1 (en) * 1999-04-30 2001-05-29 Speed Fam-Ipec Corp. Methods and apparatus for improved polishing of workpieces

Also Published As

Publication number Publication date
CN1233508C (en) 2005-12-28
JP2004501789A (en) 2004-01-22
TW567121B (en) 2003-12-21
JP3823086B2 (en) 2006-09-20
US20030199234A1 (en) 2003-10-23
EP1303381B1 (en) 2005-03-02
ATE289895T1 (en) 2005-03-15
WO2002002279A3 (en) 2002-05-30
DE60109170T2 (en) 2006-01-12
US6656019B1 (en) 2003-12-02
WO2002002279A2 (en) 2002-01-10
CN1449322A (en) 2003-10-15
DE60109170D1 (en) 2005-04-07
EP1303381A2 (en) 2003-04-23
US6685548B2 (en) 2004-02-03

Similar Documents

Publication Publication Date Title
AU2001271709A1 (en) Grooved polishing pads and methods of use
AU2001273045A1 (en) Polishing pad grooving method and apparatus
TWI412429B (en) Tools for polishing and associated methods
WO2006028866A3 (en) Toolholder and cutting insert for a toolholder assembly
CA2361633A1 (en) Method for producing a cutting tool and a cutting tool
AU2003210281A1 (en) Rotary cutting tool comprising an exchangeable cutting insert
EP1447841A4 (en) Method of machining semiconductor wafer-use polishing pad and semiconductor wafer-use polishing pad
EP1125664A3 (en) Drilling tool for stone
TW376348B (en) Resilient clamping mechanism for inserts
DK1396303T3 (en) Boron and process for its preparation
MXPA05013215A (en) Cleaning pads.
WO2004016377A3 (en) Drilling tool and method for producing port seals
SE9800212L (en) Cutting Tools
DE602004026748D1 (en) POLISHING CUSHION WITH PARTITIONED WINDOW
ATE554871T1 (en) TOOL HOLDER
SI1827744T1 (en) Cutting tool and cutting insert therefor
TW200510124A (en) Polishing pad for electrochemical-mechanical polishing
WO2002049791A8 (en) Adjustment method and apparatus for a boring tool
ATE318674T1 (en) CUTTING OR SAWING MACHINE
WO2002028578A3 (en) Cutting tool and method and apparatus for making the same
CA2305812A1 (en) Drill bit inserts with zone of compressive residual stress
SE9903302L (en) Cutting for groove knitting
TW200531784A (en) Chemical mechanical polishing pad
EP1157777A3 (en) Operating head for automatic machine tools
WO2002090717A3 (en) Support base and toolholder for a milling drum