US7516536B2
(en)
*
|
1999-07-08 |
2009-04-14 |
Toho Engineering Kabushiki Kaisha |
Method of producing polishing pad
|
US6869343B2
(en)
*
|
2001-12-19 |
2005-03-22 |
Toho Engineering Kabushiki Kaisha |
Turning tool for grooving polishing pad, apparatus and method of producing polishing pad using the tool, and polishing pad produced by using the tool
|
US7029365B2
(en)
*
|
2000-02-17 |
2006-04-18 |
Applied Materials Inc. |
Pad assembly for electrochemical mechanical processing
|
US7077721B2
(en)
*
|
2000-02-17 |
2006-07-18 |
Applied Materials, Inc. |
Pad assembly for electrochemical mechanical processing
|
US7678245B2
(en)
|
2000-02-17 |
2010-03-16 |
Applied Materials, Inc. |
Method and apparatus for electrochemical mechanical processing
|
US20080156657A1
(en)
*
|
2000-02-17 |
2008-07-03 |
Butterfield Paul D |
Conductive polishing article for electrochemical mechanical polishing
|
US20050092621A1
(en)
*
|
2000-02-17 |
2005-05-05 |
Yongqi Hu |
Composite pad assembly for electrochemical mechanical processing (ECMP)
|
US7125477B2
(en)
*
|
2000-02-17 |
2006-10-24 |
Applied Materials, Inc. |
Contacts for electrochemical processing
|
US7303462B2
(en)
*
|
2000-02-17 |
2007-12-04 |
Applied Materials, Inc. |
Edge bead removal by an electro polishing process
|
US7059948B2
(en)
*
|
2000-12-22 |
2006-06-13 |
Applied Materials |
Articles for polishing semiconductor substrates
|
US7303662B2
(en)
*
|
2000-02-17 |
2007-12-04 |
Applied Materials, Inc. |
Contacts for electrochemical processing
|
US6962524B2
(en)
*
|
2000-02-17 |
2005-11-08 |
Applied Materials, Inc. |
Conductive polishing article for electrochemical mechanical polishing
|
US7374644B2
(en)
*
|
2000-02-17 |
2008-05-20 |
Applied Materials, Inc. |
Conductive polishing article for electrochemical mechanical polishing
|
US6979248B2
(en)
*
|
2002-05-07 |
2005-12-27 |
Applied Materials, Inc. |
Conductive polishing article for electrochemical mechanical polishing
|
US20040020789A1
(en)
*
|
2000-02-17 |
2004-02-05 |
Applied Materials, Inc. |
Conductive polishing article for electrochemical mechanical polishing
|
US6991528B2
(en)
*
|
2000-02-17 |
2006-01-31 |
Applied Materials, Inc. |
Conductive polishing article for electrochemical mechanical polishing
|
US7670468B2
(en)
|
2000-02-17 |
2010-03-02 |
Applied Materials, Inc. |
Contact assembly and method for electrochemical mechanical processing
|
US7066800B2
(en)
*
|
2000-02-17 |
2006-06-27 |
Applied Materials Inc. |
Conductive polishing article for electrochemical mechanical polishing
|
US6616513B1
(en)
*
|
2000-04-07 |
2003-09-09 |
Applied Materials, Inc. |
Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile
|
WO2002028598A1
(en)
*
|
2000-10-02 |
2002-04-11 |
Rodel Holdings, Inc. |
Method for conditioning polishing pads
|
JP2002200555A
(en)
*
|
2000-12-28 |
2002-07-16 |
Ebara Corp |
Polishing tool and polishing device with polishing tool
|
US7137879B2
(en)
*
|
2001-04-24 |
2006-11-21 |
Applied Materials, Inc. |
Conductive polishing article for electrochemical mechanical polishing
|
US7344432B2
(en)
*
|
2001-04-24 |
2008-03-18 |
Applied Materials, Inc. |
Conductive pad with ion exchange membrane for electrochemical mechanical polishing
|
KR100646702B1
(en)
*
|
2001-08-16 |
2006-11-17 |
에스케이씨 주식회사 |
Chemical mechanical polishing pad having holes and/or grooves
|
US6648743B1
(en)
*
|
2001-09-05 |
2003-11-18 |
Lsi Logic Corporation |
Chemical mechanical polishing pad
|
JP3843933B2
(en)
*
|
2002-02-07 |
2006-11-08 |
ソニー株式会社 |
Polishing pad, polishing apparatus and polishing method
|
WO2003083918A1
(en)
*
|
2002-04-03 |
2003-10-09 |
Toho Engineering Kabushiki Kaisha |
Polishing pad and semiconductor substrate manufacturing method using the polishing pad
|
US20050194681A1
(en)
*
|
2002-05-07 |
2005-09-08 |
Yongqi Hu |
Conductive pad with high abrasion
|
TWI252793B
(en)
*
|
2002-08-20 |
2006-04-11 |
Nanya Technology Corp |
Wear auto-display polishing pad and fabricating method of the same
|
US6923362B2
(en)
*
|
2002-09-30 |
2005-08-02 |
The Curators Of University Of Missouri |
Integral channels in metal components and fabrication thereof
|
US20040152402A1
(en)
*
|
2003-02-05 |
2004-08-05 |
Markus Naujok |
Wafer polishing with counteraction of centrifugal forces on polishing slurry
|
US6783436B1
(en)
|
2003-04-29 |
2004-08-31 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Polishing pad with optimized grooves and method of forming same
|
JP4292025B2
(en)
|
2003-05-23 |
2009-07-08 |
Jsr株式会社 |
Polishing pad
|
US20040259479A1
(en)
*
|
2003-06-23 |
2004-12-23 |
Cabot Microelectronics Corporation |
Polishing pad for electrochemical-mechanical polishing
|
US6942549B2
(en)
*
|
2003-10-29 |
2005-09-13 |
International Business Machines Corporation |
Two-sided chemical mechanical polishing pad for semiconductor processing
|
US7442116B2
(en)
*
|
2003-11-04 |
2008-10-28 |
Jsr Corporation |
Chemical mechanical polishing pad
|
US7018274B2
(en)
*
|
2003-11-13 |
2006-03-28 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc |
Polishing pad having slurry utilization enhancing grooves
|
US6843711B1
(en)
*
|
2003-12-11 |
2005-01-18 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc |
Chemical mechanical polishing pad having a process-dependent groove configuration
|
JP2005177897A
(en)
*
|
2003-12-17 |
2005-07-07 |
Nec Electronics Corp |
Polishing method, polishing device, and method of manufacturing semiconductor device
|
US20050178666A1
(en)
*
|
2004-01-13 |
2005-08-18 |
Applied Materials, Inc. |
Methods for fabrication of a polishing article
|
US6951510B1
(en)
*
|
2004-03-12 |
2005-10-04 |
Agere Systems, Inc. |
Chemical mechanical polishing pad with grooves alternating between a larger groove size and a smaller groove size
|
KR20060046093A
(en)
*
|
2004-05-20 |
2006-05-17 |
제이에스알 가부시끼가이샤 |
Chemical mechanical polishing pad and chemical mechanical polishing method
|
US7270595B2
(en)
*
|
2004-05-27 |
2007-09-18 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Polishing pad with oscillating path groove network
|
US6974372B1
(en)
*
|
2004-06-16 |
2005-12-13 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Polishing pad having grooves configured to promote mixing wakes during polishing
|
US7198546B2
(en)
*
|
2004-06-29 |
2007-04-03 |
Lsi Logic Corporation |
Method to monitor pad wear in CMP processing
|
US7040970B2
(en)
*
|
2004-07-15 |
2006-05-09 |
Lam Research Corporation |
Apparatus and method for distributing a polishing fluid
|
US20060030156A1
(en)
*
|
2004-08-05 |
2006-02-09 |
Applied Materials, Inc. |
Abrasive conductive polishing article for electrochemical mechanical polishing
|
US6895631B1
(en)
|
2004-09-08 |
2005-05-24 |
Dedication To Detail, Inc. |
Buffing pad wear indicator
|
US7084064B2
(en)
*
|
2004-09-14 |
2006-08-01 |
Applied Materials, Inc. |
Full sequence metal and barrier layer electrochemical mechanical processing
|
WO2006039436A2
(en)
*
|
2004-10-01 |
2006-04-13 |
Applied Materials, Inc. |
Pad design for electrochemical mechanical polishing
|
US7520968B2
(en)
*
|
2004-10-05 |
2009-04-21 |
Applied Materials, Inc. |
Conductive pad design modification for better wafer-pad contact
|
US20060079159A1
(en)
*
|
2004-10-08 |
2006-04-13 |
Markus Naujok |
Chemical mechanical polish with multi-zone abrasive-containing matrix
|
JP4448766B2
(en)
*
|
2004-12-08 |
2010-04-14 |
信越化学工業株式会社 |
Polishing method
|
US7131895B2
(en)
*
|
2005-01-13 |
2006-11-07 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
CMP pad having a radially alternating groove segment configuration
|
US20060219663A1
(en)
*
|
2005-03-31 |
2006-10-05 |
Applied Materials, Inc. |
Metal CMP process on one or more polishing stations using slurries with oxidizers
|
US7427340B2
(en)
*
|
2005-04-08 |
2008-09-23 |
Applied Materials, Inc. |
Conductive pad
|
US20070037491A1
(en)
*
|
2005-08-12 |
2007-02-15 |
Yuzhuo Li |
Chemically modified chemical mechanical polishing pad, process of making a modified chemical mechanical polishing pad and method of chemical mechanical polishing
|
JP4884726B2
(en)
*
|
2005-08-30 |
2012-02-29 |
東洋ゴム工業株式会社 |
Manufacturing method of laminated polishing pad
|
JP4756583B2
(en)
*
|
2005-08-30 |
2011-08-24 |
株式会社東京精密 |
Polishing pad, pad dressing evaluation method, and polishing apparatus
|
DE102006062692B4
(en)
*
|
2006-02-06 |
2008-08-21 |
J. Schmalz Gmbh |
Suction pads
|
KR100882045B1
(en)
*
|
2006-02-15 |
2009-02-09 |
어플라이드 머티어리얼스, 인코포레이티드 |
Polishing apparatus with grooved subpad
|
US7267610B1
(en)
*
|
2006-08-30 |
2007-09-11 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
CMP pad having unevenly spaced grooves
|
WO2008029537A1
(en)
*
|
2006-09-08 |
2008-03-13 |
Toyo Tire & Rubber Co., Ltd. |
Method for production of polishing pad
|
JP2008062367A
(en)
*
|
2006-09-11 |
2008-03-21 |
Nec Electronics Corp |
Polishing device, polishing pad, and polishing method
|
US7234224B1
(en)
*
|
2006-11-03 |
2007-06-26 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Curved grooving of polishing pads
|
SG177963A1
(en)
|
2007-01-15 |
2012-02-28 |
Toyo Tire & Rubber Co |
Polishing pad and method for producing the same
|
US20080293343A1
(en)
*
|
2007-05-22 |
2008-11-27 |
Yuchun Wang |
Pad with shallow cells for electrochemical mechanical processing
|
DE102007024954A1
(en)
*
|
2007-05-30 |
2008-12-04 |
Siltronic Ag |
Method for polishing semiconductor wafer, involves conditioning of porous polishing clothes, which is made of definite material and have definite porosity and pore distribution, by conditioner
|
JP4593643B2
(en)
*
|
2008-03-12 |
2010-12-08 |
東洋ゴム工業株式会社 |
Polishing pad
|
US9180570B2
(en)
|
2008-03-14 |
2015-11-10 |
Nexplanar Corporation |
Grooved CMP pad
|
CN102026775A
(en)
*
|
2008-05-16 |
2011-04-20 |
东丽株式会社 |
Polishing pad
|
ITMI20080222U1
(en)
*
|
2008-07-15 |
2010-01-16 |
Valentini Guido |
"CUP FOR WORKING SURFACES WITH CURVED SUCTION CHANNELS"
|
US8118641B2
(en)
*
|
2009-03-04 |
2012-02-21 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Chemical mechanical polishing pad having window with integral identification feature
|
KR101674564B1
(en)
*
|
2009-01-05 |
2016-11-09 |
에프엔에스테크 주식회사 |
Multi-layered chemical-mechanical planarization pad
|
TWI535527B
(en)
*
|
2009-07-20 |
2016-06-01 |
智勝科技股份有限公司 |
Polishing method, polishing pad and polishing system
|
WO2012036444A2
(en)
*
|
2010-09-15 |
2012-03-22 |
주식회사 엘지화학 |
Polishing pad for cmp
|
TW201235155A
(en)
*
|
2011-02-25 |
2012-09-01 |
Hon Hai Prec Ind Co Ltd |
Cleaning scrap device for grinding plate
|
US8968058B2
(en)
|
2011-05-05 |
2015-03-03 |
Nexplanar Corporation |
Polishing pad with alignment feature
|
DE102011082777A1
(en)
*
|
2011-09-15 |
2012-02-09 |
Siltronic Ag |
Method for double-sided polishing of semiconductor wafer e.g. silicon wafer, involves forming channel-shaped recesses in surface of polishing cloth of semiconductor wafer
|
US8801949B2
(en)
*
|
2011-09-22 |
2014-08-12 |
Dow Global Technologies Llc |
Method of forming open-network polishing pads
|
MX356390B
(en)
|
2011-12-31 |
2018-05-28 |
Saint Gobain Abrasives Inc |
Abrasive article having a non-uniform distribution of openings.
|
CN102873625A
(en)
*
|
2012-11-01 |
2013-01-16 |
昆山市大金机械设备厂 |
Polishing device
|
CN102909648A
(en)
*
|
2012-11-01 |
2013-02-06 |
昆山市大金机械设备厂 |
Automatic grinding device
|
JP5887290B2
(en)
*
|
2013-02-25 |
2016-03-16 |
ニッタ・ハース株式会社 |
Polishing pad
|
US9308620B2
(en)
*
|
2013-09-18 |
2016-04-12 |
Texas Instruments Incorporated |
Permeated grooving in CMP polishing pads
|
CN103753382B
(en)
*
|
2014-01-06 |
2016-04-27 |
成都时代立夫科技有限公司 |
A kind of polishing pad and preparation method thereof
|
TWM506674U
(en)
*
|
2014-01-06 |
2015-08-11 |
Chengdu Times Live Science And Technology Co Ltd |
Polishing pad
|
CN103878684B
(en)
*
|
2014-03-06 |
2016-03-02 |
浙江工业大学 |
A kind of abrasive disk with polishing function
|
CN106457525A
(en)
*
|
2014-06-10 |
2017-02-22 |
奥林巴斯株式会社 |
Grinding tool, grinding method, and grinding device
|
US9873180B2
(en)
|
2014-10-17 |
2018-01-23 |
Applied Materials, Inc. |
CMP pad construction with composite material properties using additive manufacturing processes
|
US10875153B2
(en)
|
2014-10-17 |
2020-12-29 |
Applied Materials, Inc. |
Advanced polishing pad materials and formulations
|
US11745302B2
(en)
|
2014-10-17 |
2023-09-05 |
Applied Materials, Inc. |
Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
|
CN113579992A
(en)
|
2014-10-17 |
2021-11-02 |
应用材料公司 |
CMP pad construction with composite material properties using additive manufacturing process
|
US10092998B2
(en)
*
|
2015-06-26 |
2018-10-09 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Method of making composite polishing layer for chemical mechanical polishing pad
|
CN105415168B
(en)
*
|
2015-10-30 |
2018-01-16 |
佛山市金辉高科光电材料有限公司 |
A kind of composite polishing pad and preparation method thereof
|
US10391605B2
(en)
|
2016-01-19 |
2019-08-27 |
Applied Materials, Inc. |
Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
|
JP6565780B2
(en)
*
|
2016-04-14 |
2019-08-28 |
株式会社Sumco |
Wafer edge polishing pad, wafer edge polishing apparatus, and wafer edge polishing method
|
US10857647B2
(en)
*
|
2017-06-14 |
2020-12-08 |
Rohm And Haas Electronic Materials Cmp Holdings |
High-rate CMP polishing method
|
US10861702B2
(en)
|
2017-06-14 |
2020-12-08 |
Rohm And Haas Electronic Materials Cmp Holdings |
Controlled residence CMP polishing method
|
US10777418B2
(en)
*
|
2017-06-14 |
2020-09-15 |
Rohm And Haas Electronic Materials Cmp Holdings, I |
Biased pulse CMP groove pattern
|
US10586708B2
(en)
|
2017-06-14 |
2020-03-10 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Uniform CMP polishing method
|
US10857648B2
(en)
*
|
2017-06-14 |
2020-12-08 |
Rohm And Haas Electronic Materials Cmp Holdings |
Trapezoidal CMP groove pattern
|
US11471999B2
(en)
|
2017-07-26 |
2022-10-18 |
Applied Materials, Inc. |
Integrated abrasive polishing pads and manufacturing methods
|
WO2019032286A1
(en)
|
2017-08-07 |
2019-02-14 |
Applied Materials, Inc. |
Abrasive delivery polishing pads and manufacturing methods thereof
|
JP6294553B1
(en)
*
|
2017-10-11 |
2018-03-14 |
光触媒抗菌サービス株式会社 |
Charger for terminal
|
KR102026250B1
(en)
|
2018-02-05 |
2019-09-27 |
에스케이실트론 주식회사 |
Wafer polishing pad and Manufacturing Method of it
|
JP7299970B2
(en)
|
2018-09-04 |
2023-06-28 |
アプライド マテリアルズ インコーポレイテッド |
Formulations for improved polishing pads
|
JP7431807B2
(en)
*
|
2019-04-03 |
2024-02-15 |
株式会社クラレ |
polishing pad
|
WO2020255744A1
(en)
*
|
2019-06-19 |
2020-12-24 |
株式会社クラレ |
Polishing pad, method for manufacturing polishing pad, and polishing method
|
CN111941251A
(en)
*
|
2020-07-08 |
2020-11-17 |
上海新昇半导体科技有限公司 |
Polishing pad, polishing equipment and polishing method of silicon wafer
|
US11878389B2
(en)
|
2021-02-10 |
2024-01-23 |
Applied Materials, Inc. |
Structures formed using an additive manufacturing process for regenerating surface texture in situ
|