KR100497205B1 - 마이크로홀이 형성된 화학적 기계적 연마패드 - Google Patents
마이크로홀이 형성된 화학적 기계적 연마패드 Download PDFInfo
- Publication number
- KR100497205B1 KR100497205B1 KR10-2001-0046796A KR20010046796A KR100497205B1 KR 100497205 B1 KR100497205 B1 KR 100497205B1 KR 20010046796 A KR20010046796 A KR 20010046796A KR 100497205 B1 KR100497205 B1 KR 100497205B1
- Authority
- KR
- South Korea
- Prior art keywords
- polishing pad
- polishing
- micro
- chemical mechanical
- holes
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
Abstract
Description
Claims (7)
- 연마패드 상에 형성되어 일정한 연마율이 유지되도록 다양한 패턴으로 분포되어 있는 복수개의 마이크로 홀을 포함하며,상기 복수개의 마이크로홀은 각각 원형, 타원형, 삼각형, 사각형, 다각형 또는 별모양의 단면을 갖고, 상기 연마패드의 두께방향으로 10 ㎛2~10㎜2범위의 일정한 단면적을 가지며, 상기 연마패드의 두께에 대해 0.01 내지 1배의 깊이로 상기 연마패드 표면과 경사지게 형성된 것을 특징으로 하는 화학적 기계적 연마패드.
- 삭제
- 삭제
- 삭제
- 삭제
- 제1항에 있어서, 상기 연마패드는 둘 이상의 영역으로 분할되며, 분할된 각각의 영역에는 서로 다른 단면적, 형태 및/또는 밀도를 갖는 마이크로홀이 형성되는 것을 특징으로 하는 화학적 기계적 연마패드.
- 제1항에 있어서, 상기 복수개의 마이크로홀은 레이저로 가공하는 것을 특징으로 하는 화학적 기계적 연마패드.
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2001-0046796A KR100497205B1 (ko) | 2001-08-02 | 2001-08-02 | 마이크로홀이 형성된 화학적 기계적 연마패드 |
CNB018236804A CN1312739C (zh) | 2001-08-02 | 2001-08-29 | 微孔化学机械抛光垫 |
DE60144538T DE60144538D1 (de) | 2001-08-02 | 2001-08-29 | Chemisches mechanisches polierstück mit mikrolöchern |
PCT/KR2001/001463 WO2003012846A1 (en) | 2001-08-02 | 2001-08-29 | Chemical mechanical polishing pad with micro-holes |
US10/110,801 US20040048559A1 (en) | 2001-08-02 | 2001-08-29 | Chemical mechanical polishing pad with micro-holes |
JP2003517928A JP2004537424A (ja) | 2001-08-02 | 2001-08-29 | マイクロ孔を有する化学的機械的研磨パッド |
EP01965709A EP1430520B1 (en) | 2001-08-02 | 2001-08-29 | Chemical mechanical polishing pad with micro-holes |
AT01965709T ATE507580T1 (de) | 2001-08-02 | 2001-08-29 | Chemisches mechanisches polierstück mit mikrolöchern |
TW090125417A TW592888B (en) | 2001-08-02 | 2001-10-15 | Chemical mechanical polishing pad with micro-holes |
US11/651,197 US20070173187A1 (en) | 2001-02-08 | 2007-01-08 | Chemical mechanical polishing pad with micro-holes |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2001-0046796A KR100497205B1 (ko) | 2001-08-02 | 2001-08-02 | 마이크로홀이 형성된 화학적 기계적 연마패드 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20030012655A KR20030012655A (ko) | 2003-02-12 |
KR100497205B1 true KR100497205B1 (ko) | 2005-06-23 |
Family
ID=19712816
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2001-0046796A KR100497205B1 (ko) | 2001-02-08 | 2001-08-02 | 마이크로홀이 형성된 화학적 기계적 연마패드 |
Country Status (9)
Country | Link |
---|---|
US (2) | US20040048559A1 (ko) |
EP (1) | EP1430520B1 (ko) |
JP (1) | JP2004537424A (ko) |
KR (1) | KR100497205B1 (ko) |
CN (1) | CN1312739C (ko) |
AT (1) | ATE507580T1 (ko) |
DE (1) | DE60144538D1 (ko) |
TW (1) | TW592888B (ko) |
WO (1) | WO2003012846A1 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011013894A1 (ko) * | 2009-07-30 | 2011-02-03 | 서강대학교 산학협력단 | 기공이 형성된 cmp 연마패드와 그의 제조방법 |
KR101186531B1 (ko) * | 2009-03-24 | 2012-10-08 | 차윤종 | 폴리우레탄 다공질체의 제조방법과 그 제조방법에 따른 폴리우레탄 다공질체 및 폴리우레탄 다공질체를 구비한 연마패드 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1328009C (zh) * | 2001-08-02 | 2007-07-25 | 株式会社Skc | 利用激光制造化学机械抛光垫的方法 |
US6998166B2 (en) | 2003-06-17 | 2006-02-14 | Cabot Microelectronics Corporation | Polishing pad with oriented pore structure |
TWI385050B (zh) * | 2005-02-18 | 2013-02-11 | Nexplanar Corp | 用於cmp之特製拋光墊及其製造方法及其用途 |
US7875091B2 (en) * | 2005-02-22 | 2011-01-25 | Saint-Gobain Abrasives, Inc. | Rapid tooling system and methods for manufacturing abrasive articles |
US7524345B2 (en) * | 2005-02-22 | 2009-04-28 | Saint-Gobain Abrasives, Inc. | Rapid tooling system and methods for manufacturing abrasive articles |
US7867302B2 (en) * | 2005-02-22 | 2011-01-11 | Saint-Gobain Abrasives, Inc. | Rapid tooling system and methods for manufacturing abrasive articles |
US20070010175A1 (en) * | 2005-07-07 | 2007-01-11 | San Fang Chemical Industry Co., Ltd. | Polishing pad and method of producing same |
US20070111644A1 (en) * | 2005-09-27 | 2007-05-17 | Spencer Preston | Thick perforated polishing pad and method for making same |
US7569268B2 (en) * | 2007-01-29 | 2009-08-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
KR101177497B1 (ko) * | 2009-07-01 | 2012-08-27 | 서강대학교산학협력단 | 기공이 형성된 cmp 연마패드 및 기공의 형성방법 |
KR101044279B1 (ko) * | 2009-07-30 | 2011-06-28 | 서강대학교산학협력단 | Cmp 연마패드와 그의 제조방법 |
JP5484145B2 (ja) * | 2010-03-24 | 2014-05-07 | 東洋ゴム工業株式会社 | 研磨パッド |
WO2012071259A1 (en) * | 2010-11-23 | 2012-05-31 | Taiwan Green Point Enterprises Co., Ltd. | Method and structure of binding plastic and metal material together |
CN114589619B (zh) * | 2020-12-03 | 2023-04-25 | 中国科学院微电子研究所 | 半导体研磨垫及制备方法 |
TWI767689B (zh) * | 2021-05-05 | 2022-06-11 | 健行學校財團法人健行科技大學 | 微細孔拋光裝置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100191227B1 (ko) * | 1992-08-19 | 1999-06-15 | 콘라드 에이취. 캐딩 | 중합체성 미소요소를 포함하는 연마패드,당행 패드와의 접촉에 의해 평면화된 반도체장치 및 연마 패드의 가공 표면의 재생방법 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2668016B2 (ja) * | 1988-09-21 | 1997-10-27 | スピードファム株式会社 | ポリッシングパッド及びその製造方法 |
US5020283A (en) * | 1990-01-22 | 1991-06-04 | Micron Technology, Inc. | Polishing pad with uniform abrasion |
US5329734A (en) * | 1993-04-30 | 1994-07-19 | Motorola, Inc. | Polishing pads used to chemical-mechanical polish a semiconductor substrate |
JP3042593B2 (ja) * | 1995-10-25 | 2000-05-15 | 日本電気株式会社 | 研磨パッド |
JPH10329007A (ja) * | 1997-05-28 | 1998-12-15 | Sony Corp | 化学的機械研磨装置 |
JPH1199468A (ja) * | 1997-09-29 | 1999-04-13 | Toshiba Corp | 研磨パッド及びそれを用いた研磨装置 |
JP2907209B1 (ja) * | 1998-05-29 | 1999-06-21 | 日本電気株式会社 | ウェハ研磨装置用裏面パッド |
KR20000025003A (ko) * | 1998-10-07 | 2000-05-06 | 윤종용 | 반도체 기판의 화학 기계적 연마에 사용되는 연마 패드 |
JP2001071256A (ja) * | 1999-08-31 | 2001-03-21 | Shinozaki Seisakusho:Kk | 研磨パッドの溝形成方法及び装置並びに研磨パッド |
-
2001
- 2001-08-02 KR KR10-2001-0046796A patent/KR100497205B1/ko active IP Right Grant
- 2001-08-29 AT AT01965709T patent/ATE507580T1/de not_active IP Right Cessation
- 2001-08-29 CN CNB018236804A patent/CN1312739C/zh not_active Expired - Lifetime
- 2001-08-29 EP EP01965709A patent/EP1430520B1/en not_active Expired - Lifetime
- 2001-08-29 WO PCT/KR2001/001463 patent/WO2003012846A1/en active Application Filing
- 2001-08-29 JP JP2003517928A patent/JP2004537424A/ja active Pending
- 2001-08-29 US US10/110,801 patent/US20040048559A1/en not_active Abandoned
- 2001-08-29 DE DE60144538T patent/DE60144538D1/de not_active Expired - Lifetime
- 2001-10-15 TW TW090125417A patent/TW592888B/zh not_active IP Right Cessation
-
2007
- 2007-01-08 US US11/651,197 patent/US20070173187A1/en not_active Abandoned
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100191227B1 (ko) * | 1992-08-19 | 1999-06-15 | 콘라드 에이취. 캐딩 | 중합체성 미소요소를 포함하는 연마패드,당행 패드와의 접촉에 의해 평면화된 반도체장치 및 연마 패드의 가공 표면의 재생방법 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101186531B1 (ko) * | 2009-03-24 | 2012-10-08 | 차윤종 | 폴리우레탄 다공질체의 제조방법과 그 제조방법에 따른 폴리우레탄 다공질체 및 폴리우레탄 다공질체를 구비한 연마패드 |
WO2011013894A1 (ko) * | 2009-07-30 | 2011-02-03 | 서강대학교 산학협력단 | 기공이 형성된 cmp 연마패드와 그의 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
US20070173187A1 (en) | 2007-07-26 |
US20040048559A1 (en) | 2004-03-11 |
KR20030012655A (ko) | 2003-02-12 |
ATE507580T1 (de) | 2011-05-15 |
EP1430520A1 (en) | 2004-06-23 |
CN1559082A (zh) | 2004-12-29 |
EP1430520B1 (en) | 2011-04-27 |
EP1430520A4 (en) | 2008-04-09 |
JP2004537424A (ja) | 2004-12-16 |
CN1312739C (zh) | 2007-04-25 |
TW592888B (en) | 2004-06-21 |
DE60144538D1 (de) | 2011-06-09 |
WO2003012846A1 (en) | 2003-02-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100497205B1 (ko) | 마이크로홀이 형성된 화학적 기계적 연마패드 | |
KR100442807B1 (ko) | 레이저 빔과 마스크를 이용한 연마패드의 제조방법 | |
US7255633B2 (en) | Radial-biased polishing pad | |
US6903021B2 (en) | Method of polishing a semiconductor device | |
US6641471B1 (en) | Polishing pad having an advantageous micro-texture and methods relating thereto | |
KR100646702B1 (ko) | 홀 및/또는 그루브로 형성된 화학적 기계적 연마패드 | |
JP4798713B2 (ja) | 研磨パッドの製造方法 | |
JP2000071168A (ja) | 加工品の表面を平坦化する方法 | |
JP3801998B2 (ja) | 加工品を研磨又は平坦化するための製品 | |
KR20050095818A (ko) | 웨이브 형태의 그루브가 형성된 화학적 기계적 연마패드 | |
JP4219940B2 (ja) | 研磨パッド |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
N231 | Notification of change of applicant | ||
AMND | Amendment | ||
E902 | Notification of reason for refusal | ||
AMND | Amendment | ||
E601 | Decision to refuse application | ||
J201 | Request for trial against refusal decision | ||
AMND | Amendment | ||
E902 | Notification of reason for refusal | ||
B701 | Decision to grant | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20130205 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20131213 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20160328 Year of fee payment: 12 |
|
FPAY | Annual fee payment |
Payment date: 20170217 Year of fee payment: 13 |
|
FPAY | Annual fee payment |
Payment date: 20171208 Year of fee payment: 14 |
|
FPAY | Annual fee payment |
Payment date: 20190618 Year of fee payment: 15 |