KR100442807B1 - 레이저 빔과 마스크를 이용한 연마패드의 제조방법 - Google Patents
레이저 빔과 마스크를 이용한 연마패드의 제조방법 Download PDFInfo
- Publication number
- KR100442807B1 KR100442807B1 KR10-2002-0045832A KR20020045832A KR100442807B1 KR 100442807 B1 KR100442807 B1 KR 100442807B1 KR 20020045832 A KR20020045832 A KR 20020045832A KR 100442807 B1 KR100442807 B1 KR 100442807B1
- Authority
- KR
- South Korea
- Prior art keywords
- polishing pad
- holes
- grooves
- mask
- pattern
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 123
- 238000000034 method Methods 0.000 title claims abstract description 58
- 230000001678 irradiating effect Effects 0.000 claims abstract description 8
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000007517 polishing process Methods 0.000 abstract description 14
- 239000002002 slurry Substances 0.000 description 15
- 238000005520 cutting process Methods 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 238000009826 distribution Methods 0.000 description 10
- 239000000126 substance Substances 0.000 description 10
- 238000005187 foaming Methods 0.000 description 9
- 238000003672 processing method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 238000005553 drilling Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000203 mixture Chemical class 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 238000009827 uniform distribution Methods 0.000 description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 238000000053 physical method Methods 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004604 Blowing Agent Substances 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 229920001277 pectin Polymers 0.000 description 1
- 239000001814 pectin Substances 0.000 description 1
- 235000010987 pectin Nutrition 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 235000000346 sugar Nutrition 0.000 description 1
- 150000008163 sugars Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0823—Devices involving rotation of the workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
- B23K26/0861—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane in at least in three axial directions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B17/00—Surgical instruments, devices or methods, e.g. tourniquets
- A61B17/56—Surgical instruments or methods for treatment of bones or joints; Devices specially adapted therefor
- A61B2017/564—Methods for bone or joint treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
- B23K2101/35—Surface treated articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (5)
- 레이저 빔을 조사하는 레이저 장치; 연마패드 상에 형성시키고자 하는 패턴과 일치되는 마이크로홀, 그루브 및/또는 관통홀의 패턴을 갖는 마스크; 3차원 운동 및 회전운동을 하는 테이블; 상기 테이블 상에 장착되는 연마패드; 및 연마패드 상에 형성시킬 마이크로홀, 그루브 및/또는 관통홀의 패턴을 인식하여 이에 따라 상기 레이저 장치 및 테이블의 구동을 제어하는 CNC 콘트롤러를 포함하며, 연마패드 상에 형성시킬 마이크로 홀, 그루브 및/또는 관통홀의 패턴을 결정하여 CNC 콘트롤러에 입력하고 이 패턴과 일치되는 마스크를 선택하여 레이저 장치의 하단에 연마 패드와 수평되게 위치시킨 다음, 상기 CNC 콘트롤러의 제어하에서 레이저 장치 및 테이블을 구동시키고, 입력된 패턴에 따른 레이저 빔을 마스크를 통해 조사시켜 연마패드에 마이크로홀, 그루브 및/또는 관통홀을 형성시키는 것을 특징으로 하는 연마패드의 제조방법.
- 제1항에 있어서, 상기 연마패드에 가공되는 마이크로홀, 그루브 및/또는 관통홀의 직경 또는 너비를 조절하기 위해 레이저 스폿 사이즈를 조절하는 것을 특징으로 하는 연마패드의 제조방법.
- 제1항에 있어서, 상기 연마패드에 가공되는 마이크로홀, 그루브 및/또는 관통홀의 레이저 진행선 상의 길이 및 간격을 조절하기 위해 레이저빔의 단속/연속을조절하는 것을 특징으로 하는 연마패드의 제조방법.
- 제1항에 있어서, 상기 연마패드에 가공되는 마이크로홀, 그루브 및/또는 관통홀의 깊이를 조절하기 위해 레이저의 출력을 조절하는 것을 특징으로 하는 연마패드의 제조방법.
- 제1항에 있어서, 상기 연마패드에 가공되는 마이크로홀, 그루브 및/또는 관통홀이 연마면과 이루는 각도를 조절하기 위해 테이블을 X, Y, Z축 방향으로 이송하는 것을 특징으로 하는 연마패드의 제조방법.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW91133413A TWI278028B (en) | 2002-08-02 | 2002-11-14 | Method for fabricating polishing pad using laser beam and mask |
MYPI20030353 MY135291A (en) | 2002-08-02 | 2003-01-31 | Method for fabricating polishing pad using laser beam and mask |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020010046795 | 2001-08-02 | ||
KR20010046795 | 2001-08-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20030011722A KR20030011722A (ko) | 2003-02-11 |
KR100442807B1 true KR100442807B1 (ko) | 2004-08-04 |
Family
ID=19712815
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2002-0045832A KR100442807B1 (ko) | 2001-08-02 | 2002-08-02 | 레이저 빔과 마스크를 이용한 연마패드의 제조방법 |
Country Status (7)
Country | Link |
---|---|
US (2) | US6794605B2 (ko) |
EP (2) | EP1412129A4 (ko) |
JP (2) | JP2004537175A (ko) |
KR (1) | KR100442807B1 (ko) |
CN (2) | CN1328009C (ko) |
TW (1) | TW590855B (ko) |
WO (2) | WO2003011520A1 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100690367B1 (ko) * | 2005-12-06 | 2007-03-09 | 정병철 | 반도체 웨이퍼용 연마 패드 홀 성형 장치 |
KR100925170B1 (ko) | 2008-04-24 | 2009-11-05 | 주식회사 에이디피엔지니어링 | 레이저를 이용하여 웨이퍼 범핑용 템플릿을 제작하는 장치및 방법 |
Families Citing this family (49)
Publication number | Priority date | Publication date | Assignee | Title |
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EP1412129A4 (en) * | 2001-08-02 | 2008-04-02 | Skc Co Ltd | METHOD FOR PRODUCING A CHEMICAL-MECHANICAL POLISHING PILLOW USING LASER |
KR20030015567A (ko) * | 2001-08-16 | 2003-02-25 | 에스케이에버텍 주식회사 | 웨이브 형태의 그루브가 형성된 화학적 기계적 연마패드 |
KR100646702B1 (ko) * | 2001-08-16 | 2006-11-17 | 에스케이씨 주식회사 | 홀 및/또는 그루브로 형성된 화학적 기계적 연마패드 |
TWI252793B (en) * | 2002-08-20 | 2006-04-11 | Nanya Technology Corp | Wear auto-display polishing pad and fabricating method of the same |
SE526366C3 (sv) * | 2003-03-21 | 2005-10-26 | Silex Microsystems Ab | Elektriska anslutningar i substrat |
US20050087520A1 (en) * | 2003-10-28 | 2005-04-28 | Lixiao Wang | Method and apparatus for selective ablation of coatings from medical devices |
US7381121B2 (en) | 2004-02-17 | 2008-06-03 | Skc Co., Ltd. | Base pad polishing pad and multi-layer pad comprising the same |
KR100794761B1 (ko) * | 2004-10-13 | 2008-01-15 | 주식회사 디지아이 | 잉크제트 프린트헤드의 레이저 식각장치 및 그를 이용한헤드 제조방법 |
US20080318505A1 (en) * | 2004-11-29 | 2008-12-25 | Rajeev Bajaj | Chemical mechanical planarization pad and method of use thereof |
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US20070224925A1 (en) * | 2006-03-21 | 2007-09-27 | Rajeev Bajaj | Chemical Mechanical Polishing Pad |
US7846008B2 (en) * | 2004-11-29 | 2010-12-07 | Semiquest Inc. | Method and apparatus for improved chemical mechanical planarization and CMP pad |
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US7524345B2 (en) * | 2005-02-22 | 2009-04-28 | Saint-Gobain Abrasives, Inc. | Rapid tooling system and methods for manufacturing abrasive articles |
US7875091B2 (en) * | 2005-02-22 | 2011-01-25 | Saint-Gobain Abrasives, Inc. | Rapid tooling system and methods for manufacturing abrasive articles |
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GB2433460A (en) * | 2005-12-20 | 2007-06-27 | Arisawa Seisakusho Kk | Laser ablation apparatus,processing method and mask therefor |
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Also Published As
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JP2004537175A (ja) | 2004-12-09 |
US6794605B2 (en) | 2004-09-21 |
CN1328010C (zh) | 2007-07-25 |
US20030132207A1 (en) | 2003-07-17 |
EP1412131B1 (en) | 2015-06-10 |
EP1412129A1 (en) | 2004-04-28 |
WO2003011522A1 (en) | 2003-02-13 |
CN1328009C (zh) | 2007-07-25 |
CN1545441A (zh) | 2004-11-10 |
TW590855B (en) | 2004-06-11 |
EP1412131A4 (en) | 2006-05-17 |
JP2004536716A (ja) | 2004-12-09 |
WO2003011520A1 (en) | 2003-02-13 |
US20040232121A1 (en) | 2004-11-25 |
EP1412129A4 (en) | 2008-04-02 |
KR20030011722A (ko) | 2003-02-11 |
CN1549756A (zh) | 2004-11-24 |
EP1412131A1 (en) | 2004-04-28 |
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