TWI278028B - Method for fabricating polishing pad using laser beam and mask - Google Patents

Abstract

Disclosed is a method for forming micro-holes, perforated holes, and/or grooves on a polishing pad using a laser beam and a mask. This method involves the steps, of determining a pattern of micro-holes, grooves, and/or perforated holes to be formed on a polishing pad, inputting the determined pattern to a computer numerical control (CNC) controller, selecting a mask corresponding to the determined pattern, positioning the mask under a laser device, parallel to the polishing pad, and driving the laser device adapted to irradiate the laser beam and a table adapted to conduct a three-dimensional movement and rotation while supporting the polishing pad, under the control of the CNC controller, thereby irradiating the laser beam from the laser device through the mask onto the polishing pad according to the inputted pattern.

Description

1278028 玖 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明A polishing pad in a grinding method, more particularly a method of forming micropores, perforations and/or grooves in a polishing pad using a laser beam and a reticle. C. Prior Art 3 Background of the Invention In the method of manufacturing a semiconductor device, chemical mechanical polishing (CMP) is usually used for two precision/mirror surface polishing methods which are used for spherical planarization. According to this CMP, there is a slurry length between the polishing pad and the wafer to be polished: for chemical etching of the surface of the wafer. Using this polishing pad, the surface of the I-insert of the wafer is mechanically polished. Referring to Fig. 1, a typical chemical mechanical polishing machine 15 is schematically illustrated, which is indicated by numeral 1. A chemical mechanical polishing method using the chemical mechanical polishing machine 1 is also schematically illustrated in Fig. 2. The chemical mechanical polishing method includes a chemical etching reaction treatment and a mechanical polishing treatment which are carried out using the polishing pad included in the chemical mechanical polishing machine. This chemical etching reaction is carried out by slurry 42. That is, the slurry 42 is adapted to chemically react with the surface of the wafer 30 to be polished, whereby it may be easily subjected to the mechanical polishing treatment after the chemical etching reaction. In the mechanical polishing process, the polishing crucible 1 steadily fixed on a stage 2 turns. The bezel ring 32 securely supports the wafer 3 while rotating and vibrates. The liquid of the abrasive particles is supplied to the 1278028 by the liquid supply tool 4, and the slurry is supplied to the polishing pad 10 and the wafer 30. The introduced abrasive particles are in frictional contact with the wafer by the relative rotational speed difference between the polishing pad 1 and the wafer 3 to mechanically polish them. The slurry 42 is a colloidal liquid comprising abrasive particles having a particle size of nanometer scale 5. This slurry 42 is spread on the polishing pad 10 during the polishing process. During the polishing process, when the polishing pad 1 is rotated, due to the centrifugal force generated by the rotation of the polishing pad 1 , the table liquid supplied to the polishing pad 1 is discharged outward from the periphery of the polishing pad 1 . In order to achieve improved polishing efficiency, a relatively large amount of abrasive particles are maintained on the upper surface of the polishing pad for a satisfactory period of time so that they perform polishing of the wafer. That is, the polishing pad 10 should keep the slurry 42 on its surface for as long as possible. In order to maintain the slurry on the polishing pad for a long period of time, a method of forming micron (#m) sized spherical micelles or a method of forming perforations and grooves on the surface of the polishing pad 15 may be used. During the polishing process, the micelles, perforations and grooves serve to control the flow and distribution of the continuously supplied slurry. Conventionally, the formation of the micelles in the polishing pad can be achieved using a physical method or a chemical method. A method in which each of the hollow 20 microelements having a cavity is incorporated into a polymer matrix to form micelles can be used as the physical method. A foaming method of forming a microparticle using a chemically formed bubble can be used as the chemical method. In the polymer matrix, the incorporation of the elements can be achieved by uniformly distributing the micro-elements in the polymer matrix, in a polymer base 7 1278028 玖, the invention describes a large amount of each A hollow micro-element with a cavity is achieved by this shape. The polymer matrix is prepared by mixing a curing agent with, for example, polyfluorene, a murine hydrocarbon or a mixture thereof. For the microcomponents, inorganic salts, sugars, water-soluble gums, resins or a mixture of five or more of them may be used. The microcomponent is made of polyvinyl alcohol, candied fruit, polyethylene thiopyrone, polyethylene glycol, polyurethane or a combination thereof. The 4-U 7G member has an average diameter of about 8 G microns. The microelements are uniformly distributed on the polymer matrix according to a shear mixing method so that they can form uniform micelles. Referring to Fig. 3, the micelles formed using the micro-elements of 10 pieces will be illustrated as the moon. However, the pad of the micelle formed in the manner described above is cut into segments each having a desired thickness to obtain a polishing pad. In each slice, the micelles randomly distributed in the pad are open at the section of the slice so that at the section of the slice we will show the shape of a circular or circular cross section. The size and location of the sections of the microcells exposed at the polishing surface of each polishing pad 15 are random. The random size and position of the cross-section of the micro-cells will make the uniformity required in the polishing pad worse. According to the chemical method, wherein the cells are formed by using a foaming method, the polymer matrix is formed by mixing a curing agent with a liquid phase polyamine. Water and a liquefied gas having a low boiling point and directly participating in a chemical reaction to generate a gas can also be used as a blowing agent, thereby generating bubbles to form micelles in the polymer matrix. The generation of these bubbles is achieved by a nucleation method caused by a high shear mixing operation. Surfactants which have a reduced surface tension can also be used to adjust the size of the microbubbles 1278028 玖, the invention's description thus obtaining the desired microbubble uniformity. Fig. 4 is a photograph showing the micelles formed by the method of the bubble. However, there is a problem with the microcells formed according to the foaming method, the microcells are too large to be coated on the chemical mechanical polishing crucible, and the microcells have a non-uniform distribution, and the method can adjust 5 the microcells. The size and distribution. The micelles are formed using a foaming method each having a micro-cavity having a cavity or a spherical structure having a circular or elliptical cross-sectional shape. Due to such a shape, the micelles have a section which changes in the thickness direction of the polishing pad. For this reason, the cross section of each of the microbubbles exposed on the polishing surface of the polishing pad during the polishing process is changed as the polishing pad is worn. In other words, as the polishing process proceeds, the diameter of the circular or elliptical microbubbles exposed on the polishing surface of the polishing pad will gradually decrease and eventually disappear. Finally, the cells that are not exposed under the surface of the polishing pad should be re-exposed on the polishing surface of the polishing pad. 15 Thus, the cross-section of each of the cells that are exposed at the polishing surface of the polishing pad changes during the polishing process. For this reason, there is a problem that the polishing rate is inconsistent. In order to form perforations or grooves in the polishing surface of the polishing pad, a machining method using a cutting or grinding process has been used. Referring to Figure 5a, the % cutter for forming the grooves is illustrated. When a polishing tool 抛光' is machined using a cutter press 7G mounted on a lathe, a concentric circular groove is formed on the upper surface of the polishing crucible as shown in Fig. 5b. Figure 5c is a representation of the wear along line a_a of Figure 5b. Moxibustion test 5bWc diagram 'The exemplary form of the groove formed by using the cutting machine will be 20 1278028 玖, the description of the invention is not illustrated. In Figure 5c, the grooves are indicated by numeral 75. An embodiment having a concentric circular groove is disclosed in U.S. Patent No. 5,894,769. Referring to Fig. 6a, which shows a horizontally ground machine 81, a dicing saw is mounted therein with a 5 舆 spacer (SpaCerS) 83. The dicing saw 82 is constructed to move on the X-axis side ten. The polishing pad 1 that is to be machined is moved in the y-axis direction. A groove 85 extending in the first direction according to these movements is formed on the upper surface of the polishing pad 10. After the grooves 85 are formed, the polishing crucible 1 is rotated by 9 turns. . In this case, when the polishing (4) is moved 10 in the y-axis direction, a groove extending in a second direction perpendicular to the first direction is formed. Therefore, the grooves arranged in the grid pattern are formed on the polishing surface as shown in Figs. 6b and 6c. - Referring to Figure 7a, a perforation inspection for forming a perforation in a polished crucible will be illustrated. When the perforating pins are used for the punching operation under the condition that the polishing pad is moved in the y-axis direction, the perforations are formed on the polishing surface (b) as shown in Fig. 7b. Examples of such perforations are disclosed in U.S. Patent No. 5,853,317. 20

This method of forming the perforations or grooves in the polishing pad is performed by a lathe or grinding, such as a concentric circle or a fixed pattern of the grid. For this reason, it is difficult to form a concave pattern to effectively control the flow of the slurry. According to the method of forming the perforations using the i-hole plug, the μ (four) holes have a fixed shape. When the hole plug is simply moved in the direction of the m y axis in the X or y axis direction, the holes are also opened h. For this reason, these teeth? There are early and fixed patterns. Therefore 10 1278028 玖, invention description It is difficult to obtain the effective hole pattern required in the chemical mechanical polishing process. In a polishing pad that is mechanically reinforced with a mechanical or mechanical tool and has a groove or perforation, debris formed during the Kie processing may remain in the concave or perforation. On the chemical mechanical abrasive «, the debris can be scratched on the polished surface. At the same time, U.S. Patent Nos. 5,9001,064 and 5,587,362 respectively disclose the use of a laser beam to form a concave pattern. According to these methods, a viscous reticle is used to eliminate g to remove traces of vapor accumulated on the polishing crucible. However, these methods are complicated because the hood should be compatible with the polishing pad. In addition, there is a problem that the 塾 疋 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不Even after the reticle is removed, the reticle of the reticle may remain on the enamel due to the heat of mechanical operation of the laser beam. For this reason 'it requires additional use' to remove the residual adhesive. When the pure light (four) is present, bubbles may form between the crucible and the adhesive layer of the viscous mask. In this case, when the laser beam rides on the bubbles, it is impossible to form a groove having a size equivalent to the groove size of the design. I [SUMMARY OF THE INVENTION] SUMMARY OF THE INVENTION Accordingly, in order to solve the problem of forming microbubbles using a micro-component or a foaming method each having a cavity, and to form a groove or perforation by the mechanical method, the present invention has been The present invention has a method of forming microvoids, grooves and/or perforations having an effective and dispersed pattern on the first mat. 20 1278028 发明, invention description The disadvantages of micro-methods that have cavities, that is, the result is that the polishing process is preemptive, & low or non-small cell size and a distinct purpose. - the formation of the seed material has the same function as the micelle, the _ has a controlled uniform hook distribution and the controlled size of the micro-holes 0. Another object of the invention is to eliminate the inclusion of conventional mechanical methods Disadvantages, that is, due to the fixed shape or pattern of the grooves or perforations, are not suitable for controlling the flow of the slurry' while providing a pattern 10 for forming a variety of different shapes, sizes and patterns during the polishing process. A method for effectively controlling the flow of a slurry. Another object of the present invention is to provide a method for forming a groove which not only eliminates the use of any viscous reticle, thereby including a laser beam In the case of a viscous reticle, the complexity of the entire process and the need for additional adhesive removal procedures are eliminated, and can be obtained while using a variety of different polishing pads. Improvements in the accuracy of the formation. To accomplish these objectives, in accordance with the principles of laser machining and reticle, the present invention provides microvoids and grooves for forming 20 different patterns desired by a user on a polishing pad. And/or a method of perforating. According to an embodiment of the invention, there is provided a method for manufacturing a polishing pad comprising the steps of: determining micropores, grooves and/or perforations to be formed on a polishing pad. a pattern; inputting the determined pattern into a computer numerical control (CNC) controller; selecting light having a microhole corresponding to the input pattern, a groove 12 1278028 玖, a description of the invention, and/or a pattern of perforations And microporous grooves and/or perforations on the polishing pad according to the input so as to have a pattern corresponding to the determined pattern are formed on the polishing pad. The drawing briefly illustrates the control of the CNC controller While supporting the polishing pad, the laser device for driving, high-in, and laser beams is adapted to perform three-dimensional movement and rotation, whereby the laser beam is emitted by the laser device to be supported by the table 2 1 is a schematic view showing a configuration of a typical chemical mechanical polishing machine and a polishing method using the chemical mechanical polishing machine; 10 FIG. 2 is a schematic view illustrating a concept of chemical mechanical polishing; and FIG. 3 is a conventional method according to a conventional method. Photograph of the micelles formed using each of the micro-elements having a cavity; Figure 4 is a photograph of the micelles formed using a conventional foaming method; Figure 5a is a schematic view illustrating a conventional cutting machine for forming the grooves 15b is a polishing pad having a groove forming a concentric circular shape using the conventional cutter; FIG. 5c is a cross-sectional view taken along line AA of FIG. 5b; Figure 6a is a schematic diagram showing the formation of a polishing pad having a groove having a grid pattern by a conventional horizontal grinding machine for mounting a conventional dicing saw and a squeegee; Figure 6b is a view showing the 6a The conventional horizontal grinding machine of the drawing forms a schematic view of a polishing pad having a groove type groove; and FIG. 6g illustrates a sectional view of a ridge-shaped groove formed by a conventional horizontal grinding machine; 13 1278028 玖, BRIEF DESCRIPTION OF THE DRAWINGS The Fig. 7a is a perspective view illustrating a conventional perforated plug that is suitable for forming a perforation on a mat before the ugly and ugly pad; and Fig. 7b is an illustration - a conventional tooth containing the first figure A plan view of a polishing pad forming a perforation by hole inspection; Fig. 7c is a cross-sectional view showing a & optical pad having a perforation formed by a conventional perforation inspection; Ray 8a is a description of the use in accordance with the present Schematic diagram of the firing system of the inventive machining method;

Figure 8b is a schematic view showing the condition of irradiating a laser beam onto a reticle used in the mechanical addition method according to the present invention; Fig. 9a is a diagram showing the formation in the case where only a laser beam is used. Photograph of the plan view structure of the hole; Figure 9b is a view showing the microporous shape formed by laser beam penetration using a photomask having a plurality of circular patterns in accordance with a preferred embodiment of the present invention. a photograph of the plan view structure of the polishing pad;

Figure 9c is a photograph showing a plan view structure of a polishing pad having micropores formed in the case where a laser beam having a pentagonal pattern is formed by laser beam penetration according to the embodiment of the present invention; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a polishing pad having micropores formed by a lightning strike according to a preferred embodiment of the present invention; and FIG. 1 is a view showing laser formation by another preferred embodiment in accordance with the present invention. Schematic diagram of a polishing pad for a perforated hole; Fig. 12 is a schematic view showing a polishing pad having a groove formed by a laser according to another preferred embodiment of the present invention. 14 1278028 发明, INSTRUCTION DESCRIPTION t 】 Best Mode for Carrying Out the Invention Now, the construction and function of the present invention will be described in detail with reference to the drawings of the appendices. 10

The present invention utilizes the principle of laser beam processing to polish the formation of micropores, (four) and/or perforations. The laser machining method has a property of reducing the area of the layer subjected to thermal deformation. The laser machining also uses a non-contact type to enter the lamp, so there is no tool wear. This laser machining also accurately processes objects with complex shapes, eliminates noise and vibration, and maintains a clean working environment. When the laser beam is incident on the polished surface of the polishing crucible, it will increase the surface temperature of the polishing pad. As a result, the material of the polishing pad is melted and evaporated in the surface area on the polishing pad illuminated by the laser beam. Machining of the microholes, grooves and/or perforations is accomplished when the material of the polishing pad is removed from the area illuminated by the laser by the pattern described above.

Referring to Fig. 8a, there is illustrated a laser machining system that is used in performing the laser machining method in accordance with the present invention. As shown in Fig. 8a, the laser processing system includes a laser device 1 照射 for illuminating a laser beam, a reticle 101, a table 1 〇 4 for performing a 3D movement for rotational motion, and 2 A computer digital control (CNC) controller 102 that controls the laser device 100 and the table 1〇4. The polishing pad to be polished is mounted on the table 104. The operator is free to determine the pattern of micro-holes, grooves and/or perforations to be formed on the polishing pad, that is, those micro-holes, grooves and/or 15 1278028 玖, the invention describes the size of the perforations, Depth and space. Only the formation of micropores will be described below. Of course, the formation of the grooves or perforations can be carried out using a type suitable for the formation of micropores. The creator can select the desired micropore shape from various shapes, such as a circle, an ellipse, a triangle 5, and a rectangular or square shape. The operator is also free to determine the diameter, width or depth of the micropores. The inclination of the micropores to the polishing surface and the configuration of the microholes can also be determined by the operator. The pattern of the micro holes determined by the inserter is input to the cnc controller 10 1G2. The pattern input can be done using the sweeping cat method, computer aided design ((10)) or other methods. The CNC controller 1() 2 recognizes the pattern of the input and controls the laser device 1 and the table ι4. The microvia pattern determined by the operator is designed directly onto the reticle material. For example, the desired pattern can be formed on a reticle composed of a glass 15 substrate and a chrome layer of an electric ore on the glass substrate in accordance with photolithography. In addition, the film of the two-shot masking material can be patterned according to the cutting method. According to this configuration, selective penetration of the laser beam can be achieved, as shown in the first diagram. The laser beam is thus illuminated at selected portions of the surface of the pad to form the desired pattern. At the use of this reticle, a micropattern that is difficult to use 20 C: shape may be formed. Therefore, in the case where the CNC is used in combination with the reticle, a pattern which is difficult to form by a conventional machining method is formed. For example, the laser machining method used for soil transfer is limited to the generation of dots or continuous lines. According to the invention, it may generate a rectangle or a pentagon. 16 1278028 发明, the invention describes the light designed according to the above description. A cover is mounted on the lower end of the laser device 100 in a pattern that is just above the polishing pad 10 while being parallel to the polishing pad 10. When the laser device 100 and the table 104 are driven under the control of the CNC controller 1〇2, the laser beam is irradiated through the photomask 101 mounted on the table 104, thereby being on the polishing pad. Micropores having a pattern corresponding to the pattern input to the CNC controller 102 are formed. 10 15 20

That is, under the control of the CNC controller 1 〇 2, the laser device 100 will be formed on the polishing pad 1 具有 having a shape, a size and a space corresponding to those inputs to the CNC controller 102, respectively. Micropores of the pattern. The shape of each micropore, such as a circle, square or pentagon, can be determined by adjusting the shape of the laser spot focused on the polishing pad. The diameter or width of the mother-microwell to be formed on the alpha-polio 塾1 可以 can be controlled by adjusting the size of the laser spot. For example, when the size of the laser spot is adjusted to 10 to 150 μm, micro-terrorism having a diameter of 1 to 1 μm can be formed. The space between the length of each micropore and the pupil arranged in the direction of travel of the laser beam can also be adjusted by controlling the connection of the laser beam, the male/intermittent, and the firing period. . The depth of each microwell can be adjusted by controlling the energy of the laser beam. In the same %, the table 1 4 on which the polishing pad 10 is mounted can be moved in the dimension direction, and then moved in the axial direction ' while rotating for _. According to the input micropore pattern, under the CNC controller, the micropore pattern required according to the x, y, and continued three-dimensional motion of the table (10) and the rotation of the table 104 can be used. Laser 17 1278028 玖, the invention describes the irradiation of the beam formed on the polishing pad 10. The micropores can have a desired angle for the polished surface. The density and configuration of the microholes can also be adjusted by controlling the movement and rotational speed of the table 104. Therefore, the micropores 5 having the desired pattern selected by the various patterns can be used in accordance with the control of the laser device 1 , the control of the reticle 101 and the control of the child table 1 〇 4 Formed on the polishing pad. The formation of the pits or perforations is the same as that used for the formation of the micropores. Such micropores, grooves and/or perforations may be selectively formed on the optical pad 10. In addition, they can form a combined pattern pattern. In the latter case, the micropores, grooves and/or perforations may be formed sequentially or simultaneously. The reticle 10 1 can generally be fabricated by forming a chrome layer on a transparent glass substrate and patterning the chrome layer in accordance with photolithography. The reticle 101 can be made of plastic, metal, polymer or paper. 15 91) and 9 (: graphs showing photographs of micropores formed according to the method of the present invention, respectively. The micropores of Fig. 9c are lasers having a wavelength of 197 to 248 nm by oscillating at 5 to 10 watts of energy. a beam of light, and selectively illuminating the oscillating field beam while allowing the laser beam to pass through the pattern of the reticle to form a depth at which the depth of the hole is illuminated by the laser beam The time tanning is controlled at 0.1 while 10 seconds while repeating the laser beam illumination at the same position. That is, the control of the laser beam illumination is not only performed according to the irradiation time but also according to the number of irradiations. As shown in Figures 9a, 9b and 9c, the micro- 18 1278028 依据 according to the invention, the invention 10 15 20 holes have a uniform diameter and a uniform distribution, while having a smooth surface. It is formed with accurate and various patterns. However, the conventional micropores 9a formed by only using laser beam irradiation may have a rough surface because the surface of one micropore 9 a of the mother is close to the formed micro The laser beam in the region of the hole is melted by the heat of the heat. According to the conventional method, the microcells having the cavity and the foaming method are used to form the microcells of Figs. 3 and 4, which have a uniform score. Not for the uneven size. For this reason, the exposed U cells may have a non-uniform cross section when the tire polishing process is performed. The micropores of the present invention have the same functions as the conventional micro-packets. Wherein they can supply the ground particles while collecting the debris generated during the grinding process, while the polishing pad is discharged back to the collected debris on the day of the same. In addition, the micropores of the present invention/ There is a uniform knives and a uniform size. Therefore, the micropores of the present invention have a much better effect than the conventional microcapsules. According to the present invention, the distribution and density of the micropores are required if desired. And the size can be freely determined, / the mask is simply mounted on the summer end of the laser device is not joined (four) according to the polishing pad of the present invention. Therefore, the whole method is simple ° it may not be required With any additional treatment, for example, an adhesive removal procedure, in addition to this, the method of the present invention has the advantage that it can also be used in situations where any viscous reticle cannot be used. The diagonally inclined portion of the lower right portion of the photograph shown in the figure forms a _ perforation on the polishing pad using a conventional perforated plug. As shown in Fig. 3, the HF hole has a cause due to the genus and remains in the Rough surface in the perforations. During the chemical mechanical polishing process, such fragments may be polished 19 1278028 5 10 15 玖, invention instructions, forming scratches. However, perforations or depressions formed in accordance with the present invention The groove does not 吝 4. This problem arises because the perforations or grooves have a smooth surface by laser machining. According to the present invention, perforations or grooves having various patterns can be Freely formed. 10, 11 and 12 are schematic views respectively showing an embodiment of a microporous hole or groove formed in accordance with the present invention. Θ第_ is a schematic diagram illustrating a polishing pad. There is a micropore configuration formed in accordance with the present invention. It is shown in Figure 1 that the micropores have different densities in different throw and pad radius regions. The micropores have a uniform density and a uniform size in each radius region. Figure U is a schematic view showing a polishing pad having a perforation configuration formed in accordance with the present invention. Figure 12 is a schematic view showing a polishing pad having a groove configuration formed in accordance with the present invention. In the case of the same as in the eleventh or twelfth aspect, the machining process is performed by selecting the table when moving (moving) with the direction (4). Although only a fixed pattern can be formed according to the conventional machining method, for example, the first, the 讣 or the several figures are based on the use of a CNC controller, the laser beam and the reticle can be freely formed without fixing, various Pattern of micropores, perforations or grooves

20 & According to the present invention, the polishing pad may have micropores, perforations or grooves of various patterns, and is not limited to the pattern illustrated in Fig. 10 and the drawings. The polishing crucible can also have a pattern of combinations of micropores, perforations or groove patterns. For example, the polishing crucible can have a combination of micropores and perforations, micropores and grooves or micropores, perforations, and grooves. 20 1278028 DESCRIPTION OF THE INVENTION Industrial Applicability As apparent from the above description, the present invention provides a method of easily forming micropores, perforations and/or grooves by means of a laser beam and a reticle. In accordance with the present invention, micropores having a uniform distribution and uniform size can be formed on the polishing pad by a laser beam, thereby maximizing the polishing pad, as compared to conventional polishing pads having non-uniform cells. Polishing efficiency. The present invention also provides an effect that can be improved in terms of machining efficiency and reduction in production cost. According to the present invention, perforations and grooves having accurate and various patterns can be formed. Therefore, it is possible to effectively control the flow of the slurry on the polishing pad. According to the present invention, the pattern of micropores, perforations and grooves having various shapes, sizes and depths, and combinations thereof, can be obtained by a laser beam and a reticle in a short time according to a given polishing condition. It is formed on a polishing pad. Therefore, it is possible to achieve a reduction in manufacturing efficiency and a reduction in manufacturing cost. However, the present invention relates to the purpose of the description for the method of manufacturing a polishing pad having micropores, perforations and/or grooves. It is to be understood that those skilled in the art will appreciate that various modifications, additions and substitutions may be made without departing from the scope and spirit of the invention. . [H0 type simple description] Fig. 1 is a schematic view showing the configuration of a typical chemical mechanical polishing machine and the polishing method using the "Xuan chemical mechanical polishing machine"; Fig. 2 is a schematic view showing the concept of a chemical mechanical polishing; 21 1278028 玖, Invention Description Each micro-element with a cavity Figure 3 is a photograph of a microcell formed using a conventional method; Figure 4 is a photograph of a microcell formed using a conventional foaming method; 5& Figure 5 is a schematic view showing a conventional cutting machine for forming a groove; Figure 5b is a polishing pad having a groove for forming a concentric circular shape using the conventional cutting machine; Figure 5c is along the 5th Figure 7A is a cross-sectional view of the AA line; Figure 6a is a schematic illustration of a polishing pad forming a groove containing a grid pattern by a conventional horizontal grinding machine that mounts a conventional dicing saw and a spacer. Figure 6b is a schematic view showing a polishing pad having a groove pattern of a grid type formed by a conventional horizontal grinding machine of Fig. 6a; Fig. 6c is a view showing a conventional horizontal grinding machine A cross-sectional view of a grid-shaped groove; 15 Figure 7a is a perspective view illustrating a conventional perforated plug suitable for forming a perforation in a polishing pad; Figure 7b is a view showing a conventional perforation having a Figure 7a A plan view of a polishing pad that is plugged to form a perforation; Figure 7c is a cross-sectional illustration of a polishing pad having a perforation formed using a conventional perforated plug; Figure 8a is a diagram illustrating use in accordance with the present invention Schematic diagram of a laser system for machining methods; Fig. 8b is a schematic view showing conditions for irradiating a laser beam onto a reticle used in the machining method according to the present invention; 22 1278028, Fig. 9a is a display A photograph of a plan view of a micropore formed in the case where only the first beam of the ray body is used; FIG. 9b is a view showing the formation with a majority of the circle according to the preferred embodiment of the present invention. In the case of a reticle of a patterned pattern, a photograph of a plan view structure of a polishing pad having a shape of a microporous shape; and Fig. 9c is a view showing the use of a laser beam penetrating using a fourth embodiment according to the present invention. In the case of a patterned reticle, a photograph of a plan view structure of the microporous polishing pad formed; and _ is a polishing having micropores formed by Ray 1 ray according to a preferred embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 11 is a schematic view showing a polishing pad having a perforation formed by laser according to another preferred embodiment of the present invention; and Fig. 12 is a view showing another comparison by means of the present invention. A schematic representation of a polishing pad for a laser formed groove of a preferred embodiment. [Main component representative symbol table of the drawing] 1···Chemical mechanical polishing machine 81···Horizontal grinding machine 10···Polishing pad 82··.Cutter 3 〇· · · Wafer 32··· Ring 40···Slurry supply tool 42···Slurry 7〇··Cutter 75··. Groove. 83···Spacer 85··· Groove 1〇〇···Laser device 101 · · · Photomask 102... Computer Digital Control Controller 104···Workbench 23

Claims (1)

1278028 Pick, Patent Application 1 1. A method for manufacturing a polishing pad, comprising the steps of: determining a pattern of micropores, grooves and/or perforations to be formed on a polishing pad; inputting a pattern of the decision into a computer digital control (CNc) controller; 5 selecting a mask having a pattern corresponding to the microholes, grooves and/or perforations of the input pattern; and supporting the polishing pad according to the input pattern under the control of the CNC controller Simultaneously 'driving a laser device suitable for emitting a laser beam and a table suitable for three-dimensional movement and rotation, whereby the laser beam is emitted by a device to the polishing pad supported by the table, and The input pattern moves the work # such that micropores, grooves and/or perforations having a pattern corresponding to the determined pattern are formed on the polishing pad. 2. The method of claim 1, wherein the beam spot formed by the laser beam on the polishing pad is sized to adjust the microvias, grooves, and/or formed on the polishing pad. Diameter or depth of the perforation: 3. The method of claim i, wherein the continuous and intermittent illumination periods of the laser beam are controlled to adjust the U-holes and grooves formed on the polishing pad And/or the length of the perforations, and the spaces between the microholes, grooves and/or perforations disposed adjacent to each other in the direction of travel of the laser beam. 4. The method of claim 2, wherein the energy of the laser beam is controlled to adjust the microholes, recesses, 12,128,2828, and the perforations of the patented range formed on the polishing pad. depth. 5. The method of claim 1, wherein the table is privately moved in the X-, y- and z-axis directions to adjust the microvias, grooves and/or teeth formed on the polishing pad. The hole is defined by the angle of 5 on the polished side of the polishing pad. 25