JPH01321088A - Piercing method by laser beam - Google Patents

Piercing method by laser beam

Info

Publication number
JPH01321088A
JPH01321088A JP63153318A JP15331888A JPH01321088A JP H01321088 A JPH01321088 A JP H01321088A JP 63153318 A JP63153318 A JP 63153318A JP 15331888 A JP15331888 A JP 15331888A JP H01321088 A JPH01321088 A JP H01321088A
Authority
JP
Japan
Prior art keywords
laser beam
mask
workpiece
holes
fine holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63153318A
Other languages
Japanese (ja)
Other versions
JP2628189B2 (en
Inventor
Hideji Takaoka
秀嗣 高岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamamatsu Photonics KK
Original Assignee
Hamamatsu Photonics KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics KK filed Critical Hamamatsu Photonics KK
Priority to JP63153318A priority Critical patent/JP2628189B2/en
Publication of JPH01321088A publication Critical patent/JPH01321088A/en
Application granted granted Critical
Publication of JP2628189B2 publication Critical patent/JP2628189B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/40—Paper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To improve piercing efficiency and machining accuracy by superposing a mask having many fine holes with small pitches on a material to be machined and irradiating an ultraviolet laser beam thereon from the mask side. CONSTITUTION:An excimer laser beam machine 1 oscillating about 0.248mum wavelength is provided and the mask 2 on which the many fine holes 3 are formed with sufficiently small pitches is superposed on the material 4 to be machined such as paper via a fixed plate 5. The ultraviolet laser beam is oscillated from the excimer laser beam machine 1 and allowed to irradiate toward the material 4 to be machined from the mask 2 side. At this time, patterns of the fine holes 3 of the mask 2 are transferred on the material 4 to be machined and the many fine holes are formed on the material 4 to be machined. Since the many fine holes are subjected to laser beam machining at the same time, the piercing efficiency is improved. Since machining is performed in a short time without thermal deformation on the peripheral parts of the holes by ultraviolet energy, the machining accuracy is improved.

Description

【発明の詳細な説明】 「産業上の利用分野」 本発明はレーザビームの径よりも充分に小さな径の微細
孔を多数穿設するためのレーザビームによる孔あけ方法
に関するものである。DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention relates to a method of drilling holes using a laser beam for drilling a large number of fine holes having a diameter sufficiently smaller than the diameter of the laser beam.

「従来の技術」 レーザビームによる加工装置は、溶接、孔あけ、切断、
トリミングなどの加工が可能である。このうち、孔あけ
には１例えばＣＯ２し、−ザやＹＡＧレーザをレンズで
充分に絞り込み、レーザビームの直径を小さくして被加
工物に照射して行っていた。"Conventional technology" Laser beam processing equipment is capable of welding, drilling, cutting,
Processing such as trimming is possible. Among these, for drilling, for example, CO2 is used, a laser or YAG laser is sufficiently focused with a lens, the diameter of the laser beam is made small, and the workpiece is irradiated with the laser.

「発明が解決しようとする課題」 しかるに、ＣＯ□レーザやＹＡＧレーザはいずれも赤外
線であり、レーザビームをレンズで絞って１個ずつ孔あ
けしていたため、多数の孔をあけるには極めて能率が悪
く、また、赤外線による孔あけ加工は孔周辺部に凹凸、
ぼり、盛り上りなどができて加工精度も悪いという問題
点があった。``Problem to be solved by the invention'' However, CO□ lasers and YAG lasers both use infrared rays, and the laser beams are narrowed down with a lens to drill holes one by one, which makes it extremely inefficient to drill a large number of holes. In addition, drilling using infrared rays creates unevenness around the hole.
There were problems such as curvature and bulges, and poor processing accuracy.

本発明は多数の微細孔を同時に、しかも精度よく孔あけ
できる孔あけ方法を提供することを目的とするものであ
る。SUMMARY OF THE INVENTION An object of the present invention is to provide a method for drilling a large number of fine holes simultaneously and with high accuracy.

「課題を解決するための手段」 本発明はレーザ装置から紫外線のレーザビーム、具体的
にはエキシマレーザビームを所定の面積をもって発生し
、このレーザビームの面積に比し充分小さなピッチで多
数の微細孔を穿設したマスクを、被加工物上に重合し、
前記マスク側からレーザビームを照射して被加工物に微
細孔を同時に多数あけるようにした方法である。"Means for Solving the Problem" The present invention generates an ultraviolet laser beam, specifically an excimer laser beam, with a predetermined area from a laser device, and generates a large number of fine particles at a sufficiently small pitch compared to the area of the laser beam. Polymerize a mask with holes on the workpiece,
In this method, a laser beam is irradiated from the mask side to simultaneously drill a large number of microscopic holes in the workpiece.

「作用」 レーザビームとして発振波長が０．２４８μｍのエキシ
マレーザを用い、このエキシマレーザをマスクの上から
照射する。すると、マスクに形成された微細孔パターン
と同じたけ被加工物に微細孔があけられる。被加工物の
面積がレーザビームより大きいときには、可変ミラーを
使用してビームを移動させるか、レーザビームは固定し
て被加工物を移動させる。"Operation" An excimer laser with an oscillation wavelength of 0.248 μm is used as a laser beam, and this excimer laser is irradiated from above the mask. Then, micro-holes of the same size as the micro-hole pattern formed on the mask are drilled in the workpiece. When the area of the workpiece is larger than the laser beam, a variable mirror is used to move the beam, or the laser beam is fixed and the workpiece is moved.

「実施例」 以下、本発明の実施例を図面に基づき説明する。"Example" Embodiments of the present invention will be described below based on the drawings.

「実施例１」 第１図（ａ）　（ｂ）において、（１）はエキシマレー
ザ装置で、このエキシマレーザ装置（１）は、発振波長
が０．２４８μｍのエキシマレーザを、例えば６ｎｍＸ
２０ｎｎ程度の面積をもって発生する。（２）はマスク
で。"Example 1" In FIGS. 1(a) and 1(b), (1) is an excimer laser device, and this excimer laser device (1) emits an excimer laser with an oscillation wavelength of 0.248 μm, for example, 6 nm
It occurs with an area of about 20 nn. (2) with a mask.

このマスク（２）は例えば厚さ１００μｍ程度のステン
レス板からなり、孔（３）の径が４０μｍ、ピッチが７
０μｍの微細孔パターンが形成されているものとする。This mask (2) is made of, for example, a stainless steel plate with a thickness of about 100 μm, and the diameter of the holes (3) is 40 μm and the pitch is 7.
It is assumed that a micropore pattern of 0 μm is formed.

（４）は被加工物で、この被加工物（４）は例えば厚さ
が１０−２５μｍのポリエチレン、ポリイミドなどの高
分子フィルムやフィルタ用の紙などとする。(4) is a workpiece, and the workpiece (4) is, for example, a polymer film made of polyethylene or polyimide having a thickness of 10 to 25 μm, paper for a filter, or the like.

この被加工物（４）とマスク（２）は固定板（５）上で
重合される。This workpiece (4) and mask (2) are superimposed on a fixed plate (5).

以上のようにしてエキシマレーザ装置（１）からのエキ
シマレーザをマスク（２）側から照射する。As described above, the excimer laser from the excimer laser device (1) is irradiated from the mask (2) side.

するとマスク（２）の微細孔パターンが被加工物（４）
上に転写され、数分で同時に多数の微細孔があけられる
。Then, the fine hole pattern of the mask (2) becomes the workpiece (4).
It is transferred onto the surface, and multiple micropores are simultaneously drilled in a few minutes.

「実゛施例２」 この例では、マスク（２）と被加工物（４）がエキシマ
レーザビームの面積以上の場合、第２図に示すようにミ
ラー（６）を回転してレーザビームを移動走査させなが
ら孔あけ加工する例を示している。"Example 2" In this example, when the area of the mask (2) and workpiece (4) is larger than the area of the excimer laser beam, the mirror (6) is rotated as shown in FIG. An example is shown in which drilling is performed while moving and scanning.

この場合、ミラー（６）は一定速度で連続的に何回も往
復して被加工物（４）の微細孔の深さを少しずつ深くし
てゆき、被加工物（４）の全面に略同時に微細孔をあけ
る場合と、レーザビームの面積分だけ微細孔があくまで
連続して照射し、微細孔があいたらつぎの位置へ移動し
、以下同様に間欠的に移動して順次微細孔をあける場合
とがある。In this case, the mirror (6) continuously reciprocates many times at a constant speed to gradually increase the depth of the micropores in the workpiece (4), covering approximately the entire surface of the workpiece (4). In some cases, the micro holes are drilled at the same time, and in other cases, the laser beam is continuously irradiated until the micro holes are filled by the area of the laser beam, and once the micro holes are made, it moves to the next position, and then moves intermittently in the same way to sequentially drill micro holes. There are cases.

「実施例３」 この例では、第３図に示すように、Ｘ−Ｙ移動装置（６
）に、被加工物（４）とマスク（２）を取付け、このＸ
−Ｙ移動装置（６）により前記マスク（２）と波力「１
物（４）をＸ−Ｙ方向に移動して微細孔をあける例を示
している。この例においてもｘ−Ｙ移動装置（６）は一
定速度で何回も往復する場合と、レーザビームと同じ面
積ずつ間欠的に移動する場合がある。“Example 3” In this example, as shown in FIG.
), attach the workpiece (4) and mask (2), and
- The mask (2) and the wave force "1" are moved by the Y moving device (6).
An example is shown in which a fine hole is made by moving the object (4) in the X-Y direction. In this example as well, the x-y moving device (6) may reciprocate many times at a constant speed, or may move intermittently over the same area as the laser beam.

「実施例４」 この例では第４図に示すように、回転ドラム（７）の外
周面に被加工物（４）とマスク（２）を取付け、この回
転ドラム（７）により前記マスク（２）と被加工物（４
）を回転して微細孔をあける例を示している。"Example 4" In this example, as shown in FIG. ) and workpiece (4
) is shown to create a microhole.

この例でも回転ドラム（７）を一定速度で回転する場合
と、間欠的に回転する場合とがある。さらに回転ドラム
（７）の長さが長いときは上下方向にも移動できるよう
にする。In this example as well, there are cases in which the rotating drum (7) is rotated at a constant speed and cases in which it is rotated intermittently. Furthermore, when the length of the rotating drum (7) is long, it can be moved in the vertical direction as well.

「発明の効果」 本発明は上述のような加工方法とすることにより、紫外
線のエキシマレーザビームを用いて多数の微細孔が同時
に加工でき、極めて作業能率にすぐれている。また、エ
キシマレーザは紫外線エネルギーによる物質の光分解に
よる蒸発気化のため、加工孔周辺部は熱変形を受けず精
度よく孔あけできる。さらに、レーザビームがどのよう
な形状をしていても、マスクに形成したパターンにより
目的の形状に孔をあけることができるという効果を有す
る。"Effects of the Invention" By employing the above-described processing method, the present invention can simultaneously process a large number of fine holes using an ultraviolet excimer laser beam, resulting in extremely high working efficiency. In addition, since the excimer laser uses ultraviolet energy to photolyze and evaporate the material, the surrounding area of the hole is not thermally deformed and can be drilled with high precision. Furthermore, no matter what shape the laser beam has, the pattern formed on the mask allows holes to be made in the desired shape.

【図面の簡単な説明】[Brief explanation of the drawing]

図は本発明によるレーザビームによる孔あけ方法を示す
もので、第１図は第１実施例の説明図、第２図は第２実
施例の説明図、第３図は第３実施例の説明図、第４図は
第４実施例の説明図である。 （１）・・・エキシマレーザ装置、（２）・・・マスク
、（３）・・・孔、（４）・・・被加工物、（５）・・
・固定板、（６）・・・ｘ−ｙ移動装置、（７）・・・
回転ドラム。 第　　２　　問 第　　３　　図The drawings show a method of drilling holes using a laser beam according to the present invention. Fig. 1 is an explanatory diagram of the first embodiment, Fig. 2 is an explanatory diagram of the second embodiment, and Fig. 3 is an explanatory diagram of the third embodiment. FIG. 4 is an explanatory diagram of the fourth embodiment. (1)...excimer laser device, (2)...mask, (3)...hole, (4)...workpiece, (5)...
・Fixing plate, (6)...x-y moving device, (7)...
rotating drum. Question 2, Figure 3

Claims (5)

【特許請求の範囲】[Claims] （１）レーザ装置から紫外線のレーザビームを所定の面
積をもって発生し、このレーザビームの面積に比し充分
小さなピッチで多数の微細孔を穿設したマスクを、被加
工物上に重合し、前記マスク側からレーザビームを照射
して被加工物に微細孔を同時に多数あけるようにしたこ
とを特徴とするレーザビームによる孔あけ方法。(1) A laser beam of ultraviolet light is generated with a predetermined area from a laser device, a mask in which a large number of fine holes are bored at a sufficiently small pitch compared to the area of the laser beam is superimposed on the workpiece, and the A method for drilling holes using a laser beam, characterized in that a laser beam is irradiated from the mask side to simultaneously drill a large number of fine holes in a workpiece. （２）レーザビームはエキシマレーザビームである請求
項（１）記載のレーザビームによる孔あけ方法。(2) The method for drilling holes using a laser beam according to claim (1), wherein the laser beam is an excimer laser beam. （３）レーザビームの面積より充分大きなマスクと被加
工物を固定板上に取付け、レーザビームを回転ミラーで
移動走査せしめるようにした請求項（１）または（２）
記載のレーザビームによる孔あけ方法。(3) Claim (1) or (2), wherein a mask and workpiece that are sufficiently larger than the area of the laser beam are mounted on a fixed plate, and the laser beam is moved and scanned by a rotating mirror.
Drilling method using a laser beam as described. （４）レーザビームの面積より充分大きなマスクと被加
工物をＸ−Ｙ移動装置に取付け、このＸ−Ｙ移動装置を
Ｘ−Ｙ方向に移動せしめるようにした請求項（１）また
は（２）記載のレーザビームによる孔あけ方法。(4) Claim (1) or (2) wherein a mask and workpiece that are sufficiently larger than the area of the laser beam are attached to an X-Y moving device, and the X-Y moving device is moved in the X-Y direction. Drilling method using a laser beam as described. （５）レーザビームの面積より充分大きなマスクと被加
工物を回転ドラムに取付け、この回転ドラムを回転せし
めるようにした請求項（１）または（２）記載のレーザ
ビームによる孔あけ方法。(5) A method for drilling holes using a laser beam according to claim (1) or (2), wherein the mask and the workpiece, which are sufficiently larger than the area of the laser beam, are attached to a rotating drum, and the rotating drum is rotated.
JP63153318A 1988-06-21 1988-06-21 Drilling method by laser beam Expired - Fee Related JP2628189B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63153318A JP2628189B2 (en) 1988-06-21 1988-06-21 Drilling method by laser beam

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63153318A JP2628189B2 (en) 1988-06-21 1988-06-21 Drilling method by laser beam

Publications (2)

Publication Number Publication Date
JPH01321088A true JPH01321088A (en) 1989-12-27
JP2628189B2 JP2628189B2 (en) 1997-07-09

Family

ID=15559873

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63153318A Expired - Fee Related JP2628189B2 (en) 1988-06-21 1988-06-21 Drilling method by laser beam

Country Status (1)

Country Link
JP (1) JP2628189B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH049291A (en) * 1990-04-27 1992-01-14 Canon Inc Boring machine by laser
JPH04339585A (en) * 1991-05-13 1992-11-26 Canon Inc Drilling machine
CN107398640A (en) * 2016-05-18 2017-11-28 南京魔迪多维数码科技有限公司 A kind of method and system of cutting brittle material

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH049291A (en) * 1990-04-27 1992-01-14 Canon Inc Boring machine by laser
JPH04339585A (en) * 1991-05-13 1992-11-26 Canon Inc Drilling machine
CN107398640A (en) * 2016-05-18 2017-11-28 南京魔迪多维数码科技有限公司 A kind of method and system of cutting brittle material

Also Published As

Publication number Publication date
JP2628189B2 (en) 1997-07-09

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