CN107398640A - A kind of method and system of cutting brittle material - Google Patents
A kind of method and system of cutting brittle material Download PDFInfo
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- CN107398640A CN107398640A CN201610333174.9A CN201610333174A CN107398640A CN 107398640 A CN107398640 A CN 107398640A CN 201610333174 A CN201610333174 A CN 201610333174A CN 107398640 A CN107398640 A CN 107398640A
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- laser
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- brittle material
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention provides a kind of method and system of cutting brittle material.A kind of method of cutting brittle material, comprises the following steps：Laser rays is broken the barriers on the cutpoint to be cut for focusing on fragile material, cut；The barrier is single focal argon laser lens, or the substrate provided with duct；And the laser rays, the duct and the cutpoint to be cut are conllinear.The cutting method of the present invention reduces fracture and microcrack phenomenon by reducing scattering of the laser energy in non-cutting direction.
Description
Technical field
The present invention relates to material processing field, in particular to a kind of method of cutting brittle material
And system.
Background technology
Fragile material refers to the material being easily broken during by pulling force or impact, also refers under external force
The deformation for only producing very little destroys the material of fracture.At present, fragile material is in electronic device field
Using very extensive.And in the manufacturing process of electronic equipment, to meet industrial design requirements, need
The workpiece of required 3D shapes is cut out from substrate made of fragile material, wherein " cutting "
Technique directly affects the precision and quality of workpiece.
Mainly strongly cut using mechanical device (scroll saw, numerical control (CNC), grinding machine) in conventional art
Fragile material is cut, its technical problem underlying is：Poor line productivity can be caused, that is, work as mechanical force
When acting on substrate, fracture, fragmentation or microcrack phenomenon are serious.Generally, microcrack is surface
Or the crack under surface, the crack be cutting process during with the angled inclination of cut direction
A direction on material in caused by.These cracks stay on workpiece and reduce having for workpiece
Imitate intensity.On the surface, microcrack can cause excessive fragmentation.Microcrack is due to that energy prolongs
Stretch into caused by non-cutting direction.Mechanical process requires that emery wheel applies pressure to workpiece, to make it possible to
Amount is directed into workpiece, and this is difficult to be avoided microcrack.Therefore, generally walked using multiple polishings
Rapid to compensate crack, not only waste of materials, also wastes time and energy.
Fracture, fragmentation phenomenon can be reduced using laser-processing system, but due to process step design not
Rationally, the cutting of high quality still can not be realized, its parts manufactured also has to pass through identical
Polishing step is to compensate fragmentation or microcrack.
In view of this, it is special to propose the present invention.
The content of the invention
The first object of the present invention is to provide a kind of method of cutting brittle material, and described cuts
By reducing, scattering of the laser energy in non-cutting direction reduces fracture to segmentation method and microcrack shows
As.
The second object of the present invention is to provide a kind of system of cutting brittle material, and described cuts
The system of cutting can reduce the fracture occurred in fragile material cutting and microcrack phenomenon.
In order to realize the above-mentioned purpose of the present invention, spy uses following technical scheme：
A kind of method of cutting brittle material, comprises the following steps：
Laser rays is broken the barriers on the cutpoint to be cut for focusing on fragile material, cut；
The barrier is single focal argon laser lens, or the substrate provided with duct；It is and described
Laser rays, the duct and the cutpoint to be cut are conllinear.
Compared with prior art, the present invention mainly optimizes the road that laser rays is pointed into fragile material
Footpath, i.e., thing is placed obstacles halfway to reduce laser energy dissipating on non-cutting point or cut direction
Penetrate, laser energy is farthest concentrated on cut point, and extend along cut direction, so
The caused fracture of light energy scattering and microcrack phenomenon can be reduced.
Above barrier can be realized by diversified forms, such as single focal argon laser lens, or
Substrate provided with duct.Single focal argon laser lens can make light energy focus on a point, without dissipating
Other points are mapped to, are exactly to focus on cut point in the present invention, its advantage is will not to cause energy dissipation.
Substrate provided with duct is then mechanically, to enable a part of light energy and duct, cut
Cutpoint is collinearly focused on cut point, and remaining light energy is then by the material beyond duct on substrate
Material is absorbed, so as to which this portion of energy will not cause to damage to the non-cutting position of fragile material, i.e.,
Fracture or microcrack problem will not be caused.Certainly, if continuously being cut, i.e. generating laser
With the progress continuous moving forward of cutting, then the duct on substrate is a long and narrow fine crack, and this is thin
Seam is positioned at the surface of line of cut.
Above-mentioned cutting method can also further optimize：
Preferably, also include before the cutting：To the fragile material predetermined cut path,
And the method for the cutting is further：
Along the cutting path, processed with the laser rays on the fragile material a series of
In the space of discrete distribution, the space is through hole or blind hole or density atenuator region；Described in
Crack described in the array extension in space on fragile material, until material separates, produce required work
Part.
The purpose of above cutting method is that further reduce is broken and microcrack phenomenon, specific works
Principle is：
It is that a series of spaces in discrete distribution are processed along cutting path using laser first,
Cause the density of cut direction material less than the density of material on non-cutting direction, therefore cut direction
On Materials Fracture intensity be less than other regions, i.e., the strength of materials in cut direction is weaker, so as to
Preferentially it is broken when second step is by external impacts (i.e. vee crack), causes non-cutting side therewith
Upward material breaks and the quantity of microcrack and size reduction.
As can be seen here, place obstacles thing and optimizing incision method the two measures combine, more
Further reduce fracture and microcrack phenomenon.
Space of the present invention refers to sensu lato space, both can be existing for macrospace
Through hole or blind hole；It can also be the material in region, i.e. the space both sides in floor level in density
Expect that density is all higher than the density of material of gap.Mainly according to the degree of brittleness of material in actual production
Select the type in space.
In the scheme cut in two steps, the fragile material is enhanced glass or enhanced blue treasured
Shi Shi, the space are blind hole.
Enhanced glass and sapphire intensity are larger, and space difficulty of processing is big, and processes sky
Fracture or microcrack phenomenon are might have during gap, is blind hole by void designs therefore, can be appropriate
Avoid problem above, and the substrate be provided with the cutting path surface be equipped with it is described blind
Kong Shi, best results；
In contrast, when the fragile material is non-reinforcing type glass or non-reinforcing type sapphire,
The space is through hole.
Unfavorable phenomenon during enhanced glass processing had so both been not present, follow-up expansion can be reduced again
Open up the difficulty in crack.
Preferably, when the fragile material is glass, the space is the through hole or blind hole of cylindricality.
The shape in space has a major impact to cutting efficiency and quality, for glass, cylindricality
Space processing efficiency and quality it is all higher.If this factor is not considered certainly, it is possible to using any
The combination of single shape or various shapes, such as stack spheroid or taper etc..
Preferably, laser used is when processing the space：Pulse width in below 30ps,
Pulse is more than 1 μ J, and for repetitive rate in more than 10khz, wavelength is infrared, green or ultraviolet, arteries and veins
Punch die formula is pulse or burst mode.
The laser belongs to ultra-short pulse laser, it is easier to by Voice segment substrate top surface
Or lower surface forms space, and controllability is strong, can adjust to obtain different shape and different points
The space of cloth type.
Preferably, the method for the extension is：Acoustic vibration, mechanical force, electrostatic force or laser.
The purpose of vee crack can be realized with upper type, simply cost is different with operation difficulty.
In general, using the external force that dynamics is small, such as machinery when if the distribution density in space is larger
Power, if using the external force of great efforts, such as acoustic vibration, electrostatic force or laser when distribution density is smaller.
Preferably, when processing the space with laser rays, the incidence angle of laser rays is 80 °
-100°。
80 ° -100 ° of incidence angle cutting precision is higher.
The system of all of above cutting method of the present invention, which can be realized, many kinds, especially with
The continuous progress of science and technology, applicable system are also being continued to optimize, and hereafter provide only one of which letter
Single diced system：
Including generating laser and barrier, the barrier is single focal argon laser lens, or
Substrate provided with duct.
As described above, the system can reduce fracture, the principle of microcrack phenomenon is：
The common principle of single focal argon laser lens and substrate is：Laser energy is reduced in non-cutting point
Or the scattering in cut direction, laser energy is farthest concentrated on cut point, and edge is cut
Direction extension is cut, can so reduce the caused fracture of light energy scattering and microcrack phenomenon.
Both differences are as detailed above.It should be noted that on substrate is used, should be by duct
To the cut point of quasi-brittle material, the surface of cut point is located at.
The diced system can further optimize：
Preferably, the generating laser is detachably connected with the barrier, is conveniently adjusted two
Position between person.
Preferably, in addition to alignment sensor, the alignment sensor are sent out with the laser respectively
Emitter is connected with the barrier.
Cooperated between alignment sensor, generating laser and barrier three, can be automatic
Advance, while realize precisely cutting.
Compared with prior art, beneficial effects of the present invention are：
(1) reduce fault of construction during fragile material cutting, be mainly reduction of caused broken
Split the quantity and size with microcrack；
(2) cutting efficiency of fragile material is improved；
(3) cutting cost is reduced：Because the energy consumed during processing space is less than an existing step
The consumed energy of laser cutting, and second step can use the less energy spread crack of dynamics,
Therefore the present invention reduces the energy consumption of laser on the whole, has decreased cost.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be right
The required accompanying drawing used is briefly described in embodiment or description of the prior art.
Fig. 1 is the method schematic of one of which cutting brittle material provided by the invention；
Fig. 2 is the method schematic of another cutting brittle material provided by the invention；
Fig. 3 is the optical diffraction schematic diagram of single focal argon laser lens.
Embodiment
Embodiment of the present invention is described in detail below in conjunction with embodiment, but this area skill
Art personnel will be understood that the following example is merely to illustrate the present invention, and be not construed as the limitation present invention
Scope.Unreceipted actual conditions person in embodiment, the condition suggested according to normal condition or manufacturer
Carry out.Agents useful for same or the unreceipted production firm person of instrument, it is that can be obtained by commercially available purchase
Conventional products.
Fig. 1 is using schematic diagram when being provided with the flat board in duct as barrier cutting brittle material, light
Line is sent from generating laser 1, is focused on by the duct 3 of flat board 2 on fragile material 4.
Schematic diagram when Fig. 2 is using single focal argon laser lens as barrier cutting brittle material, light
Line is sent from generating laser 1, is focused on by single focal argon laser lens 5 on fragile material 4.
Fig. 3 is the optical diffraction schematic diagram of single focal argon laser lens.
Embodiment 1
The non-reinforced type silicate glass of cutting：
The first step：Predetermined cut path；
Second step：Single focal argon laser lens are placed between generating laser and material to be cut, are made
The laser that laser transmitter projects go out can vertical focusing on cutting path,
3rd step：Again along cutting path, the running parameter of generating laser is set, existed with following laser
A series of equally (refer on every cutting route equidistantly) distributions are processed on material to be cut
Space, the space are the through hole of cylindricality, and through hole runs through the thickness of substrate；
Laser：Pulse width 30ps, pulse 1 μ J, repetitive rate 10khz, infrared, average angle of incidence
90 °, pulse；
4th step：Using vacuum machine equipment, the crack along on the array extension substrate in the space,
Until material separates, required workpiece is produced.
Workpiece quality：
Fragmentation<50 μm, microcrack<10 μm, bending strength>100MPa, effective feeding speed
Rate>20mm/s.
Embodiment 2
The non-reinforced type sapphire of cutting：
The first step：Predetermined cut path；
Second step：Single focal argon laser lens are placed between generating laser and material to be cut, are made
The laser that laser transmitter projects go out can vertical focusing on cutting path,
3rd step：Again along cutting path, the running parameter of generating laser is set, existed with following laser
A series of equally (refer on every cutting route equidistantly) distributions are processed on material to be cut
Space, the space are the through hole of cylindricality, and through hole runs through the thickness of substrate；
Laser：Pulse width 30ps, pulse 1 μ J, repetitive rate 10khz, infrared, average angle of incidence
90 °, pulse；
4th step：Using vacuum machine equipment, the crack along on the array extension substrate in the space,
Until material separates, required workpiece is produced.
Workpiece quality：
Fragmentation<47 μm, microcrack<8 μm, bending strength>100MPa, effective feed rate>
20mm/s。
Embodiment 3
Cut enhanced type silicon silicate glass：
The first step：Predetermined cut path；
Second step：Single focal argon laser lens are placed between generating laser and material to be cut, are made
The laser that laser transmitter projects go out can vertical focusing on cutting path,
3rd step：Again along cutting path, the running parameter of generating laser is set, existed with following laser
A series of equally (refer on every cutting route equidistantly) distributions are processed on material to be cut
Space, the space are the blind hole of cylindricality, and the top surface and basal surface of substrate have distribution；
Laser：Pulse width 30ps, pulse 1 μ J, repetitive rate 10khz, infrared, average angle of incidence
90 °, pulse；
4th step：Using vacuum machine equipment, the crack along on the array extension substrate in the space,
Until material separates, required workpiece is produced.
Workpiece quality：
Fragmentation<40 μm, microcrack<10 μm, bending strength>110MPa, effective feeding speed
Rate>20mm/s.
Embodiment 4
Cut enhanced sapphire：
The first step：Predetermined cut path；
Second step：Single focal argon laser lens are placed between generating laser and material to be cut, are made
The laser that laser transmitter projects go out can vertical focusing on cutting path,
3rd step：Again along cutting path, the running parameter of generating laser is set, existed with following laser
A series of equally (refer on every cutting route equidistantly) distributions are processed on material to be cut
Space, the space are the blind hole of cylindricality, and the top surface and basal surface of substrate have distribution；
Laser：Pulse width 30ps, pulse 1 μ J, repetitive rate 10khz, infrared, average angle of incidence
90 °, pulse；
4th step：Using vacuum machine equipment, the crack along on the array extension substrate in the space,
Until material separates, required workpiece is produced.
Workpiece quality：
Fragmentation<42 μm, microcrack<7 μm, bending strength>100MPa, effective feed rate>
20mm/s。
Embodiment 5
Ceramic cutting：
The first step：Predetermined cut path；
Second step：Single focal argon laser lens are placed between generating laser and material to be cut, are made
The laser that laser transmitter projects go out can vertical focusing on cutting path,
3rd step：Again along cutting path, the running parameter of generating laser is set, existed with following laser
A series of equally (refer on every cutting route equidistantly) distributions are processed on material to be cut
Space, the space are density atenuator region, and the density phase in the space in same cut direction
Together；
Laser：Pulse width 30ps, pulse 1 μ J, repetitive rate 10khz, infrared, average angle of incidence
90 °, pulse；
4th step：Using vacuum machine equipment, the crack along on the array extension substrate in the space,
Until material separates, required workpiece is produced.
Workpiece quality：
Fragmentation<40 μm, microcrack<6 μm, bending strength>100MPa, effective feed rate>
20mm/s。
Embodiment 6
The non-reinforced type silicate glass of cutting：
The first step：Predetermined cut path；
Second step：Single focal argon laser lens are placed between generating laser and material to be cut, are made
The laser that laser transmitter projects go out can vertical focusing on cutting path,
3rd step：Again along cutting path, the running parameter of generating laser is set, existed with following laser
A series of equally (refer on every cutting route equidistantly) distributions are processed on material to be cut
Space, the space are the through hole of cylindricality, and through hole runs through the thickness of substrate；
Laser：Pulse width 20ps, the μ J of pulse 3, repetitive rate 20khz, infrared (wavelength 780nm),
90 ° of average angle of incidence, pulse；
4th step：Using vacuum machine equipment, the crack along on the array extension substrate in the space,
Until material separates, required workpiece is produced.
Workpiece quality：
Fragmentation<32 μm, microcrack<5 μm, bending strength>100MPa, effective feed rate>
25mm/s。
Embodiment 7
The non-reinforced type silicate glass of cutting：
The first step：Predetermined cut path；
Second step：Single focal argon laser lens are placed between generating laser and material to be cut, are made
The laser that laser transmitter projects go out can vertical focusing on cutting path,
3rd step：Again along cutting path, the running parameter of generating laser is set, existed with following laser
A series of equally (refer on every cutting route equidistantly) distributions are processed on material to be cut
Space, the space are the through hole of cylindricality, and through hole runs through the thickness of substrate；
Laser：Pulse width 20ps, pulse 3 μ J, repetitive rate 20khz, green (wavelength 550nm),
90 ° of average angle of incidence, pulse；
4th step：Using vacuum machine equipment, the crack along on the array extension substrate in the space,
Until material separates, required workpiece is produced.
Workpiece quality：
Fragmentation<40 μm, microcrack<5 μm, bending strength>100MPa, effective feed rate>
27mm/s。
Embodiment 8
The non-reinforced type silicate glass of cutting：
The first step：Predetermined cut path；
Second step：Single focal argon laser lens are placed between generating laser and material to be cut, are made
The laser that laser transmitter projects go out can vertical focusing on cutting path,
3rd step：Again along cutting path, the running parameter of generating laser is set, existed with following laser
A series of equally (refer on every cutting route equidistantly) distributions are processed on material to be cut
Space, the space are the through hole of cylindricality, and through hole runs through the thickness of substrate；
Laser：Pulse width 20ps, the μ J of pulse 3, repetitive rate 20khz, ultraviolet (wavelength 250nm),
90 ° of average angle of incidence, pulse；
4th step：Using vacuum machine equipment, the crack along on the array extension substrate in the space,
Until material separates, required workpiece is produced.
Workpiece quality：
Fragmentation<26 μm, microcrack<4 μm, bending strength>100MPa, effective feed rate>
30mm/s。
Embodiment 9
The non-reinforced type silicate glass of cutting：
The first step：Predetermined cut path；
Second step：Single focal argon laser lens are placed between generating laser and material to be cut, are made
The laser that laser transmitter projects go out can vertical focusing on cutting path,
3rd step：Again along cutting path, the running parameter of generating laser is set, existed with following laser
A series of equally (refer on every cutting route equidistantly) distributions are processed on material to be cut
Space, the space are the through hole of cylindricality, and through hole runs through the thickness of substrate；
Laser：Pulse width 10ps, the μ J of pulse 5, repetitive rate 20khz, ultraviolet (wavelength 250nm),
90 ° of average angle of incidence, pulse；
4th step：Using vacuum machine equipment, the crack along on the array extension substrate in the space,
Until material separates, required workpiece is produced.
Workpiece quality：
Fragmentation<30 μm, microcrack<5 μm, bending strength>100MPa, effective feed rate>
26mm/s。
Embodiment 10
The non-reinforced type silicate glass of cutting：
The first step：Predetermined cut path；
Second step：A flat board is placed between generating laser and material to be cut, on the flat board
Provided with duct, the duct vertical focusing of the laser that laser transmitter projects go out through flat board is set to cut
Cut on path, i.e., laser rays, duct and cut point are conllinear；
3rd step：Again along cutting path, the running parameter of generating laser is set, existed with following laser
A series of equally (refer on every cutting route equidistantly) distributions are processed on material to be cut
Space, the space are the through hole of cylindricality, and through hole runs through the thickness of substrate；
Laser：Pulse width 30ps, pulse 1 μ J, repetitive rate 10khz, infrared, average angle of incidence
90 °, pulse；
4th step：Using vacuum machine equipment, the crack along on the array extension substrate in the space,
Until material separates, required workpiece is produced.
Workpiece quality：
Fragmentation<50 μm, microcrack<10 μm, bending strength>100MPa, effective feeding speed
Rate>20mm/s.
Reference examples
The non-reinforced type silicate glass of cutting：
The first step：Predetermined cut path；
Second step：Along the cutting path, connect with following laser straight and cut out workpiece；
Laser：Pulse width 30ps, pulse 1 μ J, repetitive rate 10khz, infrared, average angle of incidence
90 °, pulse.
Although illustrate and describing the present invention with specific embodiment, but it will be appreciated that and do not carrying on the back
Many other change and modification can be made in the case of from the spirit and scope of the present invention.Therefore,
This means all these changes for including belonging in the scope of the invention in the following claims and repair
Change.
Claims (10)
- A kind of 1. method of cutting brittle material, it is characterised in that comprise the following steps：Laser rays is broken the barriers on the cutpoint to be cut for focusing on fragile material, cut；Wherein, the barrier is single focal argon laser lens, or the substrate provided with duct；And institute It is conllinear to state laser rays, the duct and the cutpoint to be cut.
- 2. the method for cutting brittle material according to claim 1, it is characterised in that in institute Also include before stating cutting：To the fragile material predetermined cut path, and the method for the cutting It is further：Along the cutting path, first processed with the laser rays on the fragile material and a series of be in The space of discrete distribution, the space are through hole or blind hole or density atenuator region；Again along the sky Crack described in the array extension of gap on fragile material, until material separates, produce required workpiece.
- 3. the method for cutting brittle material according to claim 2, it is characterised in that described When fragile material is enhanced glass or enhanced sapphire, the space is blind hole；The fragility material Expect for non-reinforcing type glass or non-reinforcing type sapphire when, the space is through hole.
- 4. the method for cutting brittle material according to claim 2, it is characterised in that described When fragile material is glass, the space is the through hole or blind hole of cylindricality.
- 5. the method for cutting brittle material according to claim 2, it is characterised in that processing Laser used is during the space：Pulse width is in below 30ps, and pulse is more than 1 μ J, weight Multiple rate is infrared, green or ultraviolet in more than 10khz, wavelength, and pulse mode is pulse or burst Pattern.
- 6. the method for cutting brittle material according to claim 2, it is characterised in that described The method of extension is：Acoustic vibration, mechanical force, electrostatic force or laser.
- 7. the method for cutting brittle material according to claim 1, it is characterised in that use institute When stating the laser rays processing space, the incidence angle of the laser rays is 80 ° -100 °.
- 8. the system of the method applied to the cutting brittle material described in claim any one of 1-7, It is characterised in that it includes generating laser and barrier, the barrier is single focal argon laser lens, Or the substrate provided with duct.
- 9. system according to claim 8, it is characterised in that the generating laser and institute Barrier is stated to be detachably connected.
- 10. system according to claim 8, it is characterised in that also including alignment sensor, The alignment sensor is connected with the generating laser with the barrier respectively.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113075908A (en) * | 2021-03-23 | 2021-07-06 | 王豪 | Method for processing gem and jade artware through numerical control engraving and milling |
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| CN113075908A (en) * | 2021-03-23 | 2021-07-06 | 王豪 | Method for processing gem and jade artware through numerical control engraving and milling |
| CN113075908B (en) * | 2021-03-23 | 2022-04-19 | 王豪 | Method for processing gem and jade artware through numerical control engraving and milling |
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