JPH04339585A - Drilling machine - Google Patents

Abstract

PURPOSE:To shorten the time for processing and to execute positioning with high accuracy by projecting a laser beam as a light image of a prescribed shape to a work via the fine hole of a mask, measuring the position of the work, and drilling the work by moving the work. CONSTITUTION:The laser beam P emitted by a laser light source 10 is passed through a mask 30 and is made into a prescribed shape. The work W is irradiated with this beam, by which the work is drilled. The position of the groove of the work W is measured by illuminating the work W with a projecting optical system 50 from the side of the laser light source 10. The hole position of the work W is measured by measuring optical systems 70, 80 from the opposite image of the laser light source 10. Exact positioning is executed by subjecting the data of both to image processing and comparing the data with a computer. Since the drilling is executed via the mask 30, many holes can be simultaneously bored. The work W is processed while the processing position of the work is observed and, therefore, the positioning is executed with high accuracy.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hole punching machine that punches holes using laser light.

0002

2. Description of the Related Art The use of laser light to make holes in a workpiece in a predetermined shape and size is mainly aimed at achieving high processing accuracy. In particular, the ink ejection opening holes of the ink ejection unit (hereinafter referred to as "inkjet head") of printers attached to computers and word processors that perform recording by ejecting ink, have the same processing precision as the ink ejection volume. This processing requires careful attention because it affects the ejection direction, etc.

[0003] The above-mentioned inkjet head is particularly employed among inkjet recording systems that eject ink using thermal energy. Typical configurations and principles of recording devices that eject ink using thermal energy as described above are disclosed in, for example, U.S. Pat. No. 4,723,129 and U.S. Pat.
It is applicable to both the so-called on-demand type and continuous type. This method can be explained using the on-demand type as an example.
An electrothermal transducer is disposed corresponding to the sheet or liquid path in which liquid (ink) is held, and the electrothermal transducer generates thermal energy in response to a drive signal to generate heat on the heat-active surface of the recording head. Film boiling occurs, forming bubbles in the liquid (ink) that correspond one-to-one to the above drive signal, and the growth and contraction of these bubbles causes the liquid (ink) to be ejected from the ejection port in the form of droplets. . The drive signal given here is disclosed in U.S. Patent No. 446335.
A pulse signal such as that disclosed in No. 9, No. 4,345,262 is preferred. Further, regarding the temperature increase rate of the heat acting surface, U.S. Pat. No. 4,313,124
The conditions disclosed in the specification may be adopted.

[0004] The structure of the above-mentioned inkjet head is composed of a combination of an ejection port, a liquid channel (a straight liquid channel or a right-angled liquid channel), and an electrothermal transducer as disclosed in the above-mentioned specifications. In addition to this, the structure disclosed in, for example, US Pat. No. 4,558,333 and US Pat. No. 4,459,600 may be used, in which the heat acting portion is arranged in a bending region. Furthermore, the structure of the inkjet head described above is such that a common slit is used as a discharge part of the electrothermal converters for a plurality of electrothermal converters.
The configuration described in Japanese Patent Application Laid-open No. 3670, or the configuration in which apertures for absorbing output waves of thermal energy correspond to the discharge portions, for example, the configuration described in Japanese Patent Application Laid-Open No. 138461/1980, may be used. Note that the recording head described in the above-mentioned specification has a length that can correspond to a predetermined width by combining multiple recording heads, but one recording head has a length that can correspond to a predetermined width (the maximum recording that can be recorded by the recording device). The length may correspond to the width of the medium.

[0005] Furthermore, the structure of the above inkjet head is that it can be electrically connected (because of the electrothermal converter) by being attached to the main body of the apparatus, and also has a replaceable chip type that receives ink supply, or the recording head itself. It may also be a cartridge type provided in the.

[0006]

However, when drilling holes in a workpiece such as an inkjet head using a laser, there are the following problems.

(1) Focusing the laser beam on one point and drilling holes one by one takes time and reduces work efficiency.

(2) The size of the hole greatly affects the intensity of the laser beam, but since the energy distribution of the laser beam emitted by an excimer laser is not uniform, when drilling by focusing the laser beam on one point, the hole size The size of the hole is not uniform and it is not possible to make a hole of the desired shape.

(3) In order to open a hole with a large hole area without changing the material or shape of the mask or workpiece, it is necessary to increase the energy density of the laser irradiated to the workpiece.

The present invention has been made in view of the problems of the above-mentioned conventional techniques, and an object of the present invention is to provide a hole punching machine that can drill a desired number of uniform holes in a workpiece at the same time. There is.

[0011]

[Means for Solving the Problems] The present invention provides a hole punching machine for drilling a hole of a predetermined shape in a workpiece by irradiation from an excimer laser, in which a predetermined fine hole is formed corresponding to the hole to be drilled in the workpiece. A mask that transmits laser light from the excimer laser to the workpiece side through a fine hole, a projection optical system that projects a light image of a predetermined shape onto the workpiece through the fine hole of the mask, and measures the position of the workpiece. The apparatus is equipped with a measurement system and a movement system using optical means to move the workpiece.

[0012] In the above-mentioned hole punching machine, the projection optical system includes a telecentric optical system, and the illumination optical system illuminates the workpiece from the excimer laser side,
One type has a measurement system placed on the side opposite to the excimer laser of the workpiece, one has an illumination optical system that illuminates the workpiece from the side opposite to the excimer laser, and there is a flywheel on the laser optical path between the excimer laser and the mask. An eye lens and a field lens are arranged in order from the excimer laser side, and on a laser optical path between the excimer laser and the fly's eye lens, the laser light emitted by the excimer laser is turned into a beam that matches the fly's eye lens. A beam shaping optical system is arranged to shape the laser beam, and the beam shaping optical system directs the laser beam through a fly-eye lens in a direction perpendicular to the plane formed by the laser optical axis and the direction in which the fine holes of the mask are lined up. One type has a separation optical system that separates the beam into the number of beams corresponding to the number of columns, the other type has a beam shaping optical system with a prism-based separation optical system, and the other type has an ink ejection system that performs recording by ejecting ink from the workpiece. In some cases, holes for ink ejection are made in the workpiece.

[0013]

[Operation] The hole punching machine of the present invention irradiates a mask with laser light emitted by an excimer laser, and projects the laser light image that passes through the micro holes formed in the mask onto the workpiece through the projection optical system. Holes are drilled by focusing an image on a predetermined processing position, and by forming a desired number of fine holes in the mask, it is possible to drill a plurality of holes at the same time. Further, the processing position of the workpiece and the laser beam image are determined while observing the workpiece with a measurement system of optical means.
Positioning is achieved by driving a moving system to move the workpiece so that the processing position and the laser beam image match.

[0014]

Embodiments Next, embodiments of the present invention will be described with reference to the drawings.

FIGS. 1 and 2 are a plan view and a side view, respectively, showing an embodiment of the hole punching machine of the present invention.

The hole punching machine of this embodiment uses an ultraviolet laser beam P emitted by a laser light source 10 using an excimer laser.
is passed through a mask 30 which is formed into a desired shape corresponding to the hole to be opened, and the mask image that has passed through the mask 30 is aligned so as to be orthogonal to the laser beam P, and an inkjet head or the like is attached to the head. The workpiece W is irradiated with the ink to form a hole such as an ink ejection port in the workpiece W.

The hole punching machine of this embodiment has a laser light source 1
an illumination optical system 20 for uniformly irradiating the mask 30 with a laser beam P emitted by the laser beam P; a position adjustment mechanism 32 for adjusting the position of the mask 30; and a positioning jig on which the workpiece W is mounted. 40, a projection optical system 50 that projects a mask image emitted through the mask 30 onto the workpiece W, and a projection optical system 50 that projects the mask image emitted through the mask 30 onto the workpiece W. a transmitted illumination system 60 that irradiates illumination light from the laser light source 10 side;
Reflective optical systems 74 and 84 (FIG. 12(a)
), the transmitted illumination system 60 and the reflective optical system 74,
The optical image formed by irradiating the workpiece W with illumination light by the 84 is displayed on two industrial televisions (hereinafter referred to as
It is called "TV". ) 71 and 81, respectively, are placed on the apparatus frame 90. Furthermore, two image processing systems 208 and 20 each take in image signals of images formed on the ITVs 71 and 81 and perform signal processing related to positioning of the workpiece W.
9, and a control system 2 having a display 201 that controls the light emission of the laser light source 10 and the alignment of the workpiece W.
00.

Here, regarding the workpiece W, as shown in FIG. 3(a),
, (b), and (c).

FIGS. 3(a), 3(b), and 3(c) are a perspective view, a sectional view, and a front view, respectively, showing a workpiece W in which a hole has been drilled.

The work W of this embodiment is for forming an inkjet head, and has 64 or 12 pieces.
8 slots G ((a), (b) in FIG. 3) which become ink flow paths.
), in (c), G1 , G2 , G3 , G4
Only four are shown. ) are arranged in parallel in the longitudinal direction, and a plate-like member W3 (processed surface W1) that becomes an orifice plate is integrally formed with the top member W2.

Hole H (H1, H1 in FIGS. 3(a), (b), and (c)
Only four, H2, H3, and H4 are shown. ) are opened in the plate-like member W3 once or in multiple times by the laser beam that has passed through the mask 30 so as to coincide with the slots G (G1, G2, G3, G4). Two of the workpieces W are mounted on the positioning jig 40 with the processed surface W1 of the plate member W3 facing the laser light source 10, and then aligned with respect to the laser beam.

In the hole punching machine of this embodiment, the workpiece W is aligned by aligning the center positions of two predetermined slots so that they correspond to the two slots among the holes previously drilled in the workpiece W. This is done by aligning the center positions of the two holes. The center position of the hole and the center position of the slot are determined by processing the image signals of the hole image and the slot image observed by the ITVs 71 and 81 of the measurement optical systems 70 and 80 in the image processing systems 208 and 209. The center position of the hole thus determined is stored as a reference value in the RAM 202 (see Figure 2), which is a storage means.
is stored via the control system 200. In addition, control system 2
00, the center position of the slot determined by the image processing systems 208 and 209 is compared with the reference value to calculate the amount of deviation of the workpiece W, and the calculated amount of deviation is transmitted to the movement system controller 206 as the amount of movement. By driving the moving stage 120 via the moving system controller 206, the work W
The center of the hole and the center of the slot are aligned.

[0023] In the hole punching machine, the laser light source 1
Laser beam P (200Hz, 50W, 2
8 mm x 6 mm) first enters the illumination optical system 20,
After that, the mask 30 is irradiated.

In this illumination optical system 20, first, as shown in FIG. 4(a), the light is converted into a circular shape by a combination of an elliptical mask 21, a concave cylindrical lens 22, and a convex cylindrical lens 23. This is 28mm x 6
An elliptical mask 21 with a mask hole 211 as shown in FIG. The cylindrical lens 22 is disposed so as to spread the light beam in the narrow direction (the short axis direction of the ellipse), and the convex cylindrical lens 23 returns the light beam to a circular shape of 28 mm and parallel light P2. This means that the two concave and convex cylindrical lenses 22 and 23 are arranged at a ratio f1 of the respective distances f1 and f2 from the elliptical mask 21.
:f2 becomes f1 :f2 as shown in FIG. 4(c).
This is possible by arranging the lens on the optical axis of the laser beam P so that the ratio of concave and convex cylindrical lenses 22 and 23 is 6:28 (concave:convex).

Further, on the optical path of the parallel light P2, a convex lens 24 and a concave lens 25 are arranged, and the ratio f3:f4 of the distances f3 and f4 between them is set to 28:20,
The 28 mm circular parallel light P2 is
is converted into a 20 mm circular parallel beam P3. The shape of the parallel light P3 matches the shape of the fly's eye lens 26, which will be described later, since the parallel light P3 continues to enter the fly's eye lens 26, which will be described later. constitutes a beam shaping optical system.

Next, a fly's eye lens 26 and a field lens 2 for Keller illumination, in which seven convex lenses 261 each having a diameter of 6 mm are arranged as shown in FIGS. 5(a) and 5(b).
7 are sequentially arranged on the optical axis of the parallel light P3, as shown in FIG. 6, and the parallel light P3 is divided into seven parts. Then, as shown in FIG. 7, the divided light beams illuminate a mask hole 31 formed in the mask 30 and having the shape of a 19 mm straight line of holes formed at a constant angle. At this time, the illumination light is Keller illumination, and the mask 30 is irradiated with laser light of uniform intensity.

The mask 30 is made by etching a mask hole 31 four times the size of the hole to be made using Ni with a thickness of 25 μm.

This mask 30 has a mask position adjustment mechanism 3.
It is fixed to a mask holder (not shown) on 2, and its position is adjusted by instructions transmitted from control system 200 via interface 205.

As described above, among the light beams divided by the illumination optical system 20 and irradiated onto the mask 30, the light beams exiting the mask 30 and having the shape necessary for drilling a hole are telecentric, forming the projection optical system 50. An image is formed on the workpiece W by a 1/4 reduction projection lens 51, and a hole of the required shape is drilled. By using a telecentric projection lens in the projection optical system 50 in this manner, it is possible to prevent a change in the magnification of the laser light image due to positional deviation of the workpiece in the laser optical axis direction.

As shown in FIG. 8(a), the workpiece W is
It is mounted on the positioning jig 40 with the processing surface W1 inclined toward the laser light source 10 side.

The positioning jig 40 is equipped with two sets of two vacuum holes 401 as shown in FIG. The abutment mechanism (see FIG. 9) is provided for fixing the workpiece W that has been moved. As shown in FIG. 8C, this positioning jig 40 performs a suction operation using a suction source (not shown) by driving a vacuum solenoid 402 using a drive signal transmitted from the control system 200 via an interface 204. Then, the two workpieces W are sucked and held by two vacuum holes 401, respectively. Further, the suction pressure in the vacuum hole 401 is constantly detected by a vacuum sensor 403, and the control system 200 monitors the holding state of the workpiece W based on the detected pressure. Further, as shown in FIGS. 8(b) and 9, the positioning jig 40 includes five positioning references 404, two points on the suction holding surface side and three points on the side surface of the workpiece W. .

Two workpieces W are conveyed and supplied onto this positioning jig 40 by the automatic hand 100, and after being supplied, the workpieces W are vacuum-adsorbed, and as shown in FIG.
Two abutting mechanisms 405 from the optical axis direction of the laser beam P,
406 to abut the laser beam P in the optical axis direction (direction of arrow Y), and then abutment mechanism 40 from the direction in which the holes are arranged.
7 in the direction of the row of holes (arrow X direction), and
Workpieces W are fixed.

The two abutment mechanisms 405 and 406 correspond to the two workpieces W held on the positioning jig 40, respectively. This abutment mechanism 405, 406
The abutment mechanism 407 from the direction in which the holes are lined up opens and closes the solenoid valves 411, 412, and 413, respectively, in response to instructions from the control system 200, and the air cylinder 4
It operates by driving 08, 409, and 410.

Furthermore, the moving stage 120 on which the above-mentioned positioning jig 40 is placed can be moved in the laser optical axis direction (Y direction), in the axial direction perpendicular to the laser optical axis and the direction in which the holes are lined up (Z direction), and in the Rotation direction with the axial direction as the rotation axis (θZ direction),
It is movable in a total of five axes: the direction in which the holes are lined up (X direction), and the direction of rotation with the laser optical axis as the rotation axis (θY direction), and operates according to instructions transmitted from the control system 200 through the movement system controller 206. Position the workpiece W.

[0035] The above-mentioned abutment mechanisms 405, 406, 40
After the workpiece W is fixed by step 7, the groove position of the workpiece W is measured.

To measure the groove position, the workpiece W is irradiated with the transmitted illumination light Q1 from the transmitted illumination system 60 on the side of the laser light source 10, and the optical image of the groove generated thereby is transmitted through the plate-like member W3 and is emitted by the laser light source. 10 and the measurement optical system 70, 8 on the opposite side
This is done by observing at 0.

In the transmitted illumination system 60, transmitted illumination light Q1
In order to irradiate the work W with the transmitted illumination light Q1, as shown in FIG.
A 5° mirror 62 is provided.

The optical fiber 61 is arranged so that its emitted light is orthogonal to the optical axis of the laser beam P, and the 45° mirror 62 is arranged so that the transmitted illumination light Q1 obtained by the optical fiber 61 is aligned with the laser beam P. They are arranged so that they are reflected in the same direction. Further, the 45° mirror 62 is attached to an air cylinder 63 whose rotational direction is restricted, and is configured to be movable to a position where it does not block the laser beam when emitting laser light.

The transmitted illumination system 60 is controlled by instructions transmitted from the control system 200 via the interface 204.
The emitted light is emitted by moving the shutter 65 that blocks the emitted light, and the 45° mirror 62 similarly drives the air cylinder 63 via the vacuum solenoid 64 according to instructions from the control system 200. It is moved by this.

Assuming that there are 64 holes to be drilled in the workpiece W, the grooves to be observed are the grooves at both ends (
1 of the 1st slot G1 and the 64th slot G64)
There are two inner grooves, the second slot G2 and the 63rd slot G63. The second slot G2 and the 63rd slot generated by being irradiated with the transmitted illumination light Q1
As shown in FIG. 10, the optical image of the No.
6, and enter measurement optical systems 70 and 80 without interference. In this way, by observing the image using the illumination light from the laser light source side, the image of the slot stands out and a stable image can be obtained.

The structure of the measurement optical systems 70 and 80 will be explained. As shown in FIG. 12(a), a mirror 66
Objective lenses 72 and 8 are provided at the reflection destinations of the light images, respectively.
2 is arranged, and furthermore, the light image is formed on the optical axis of the light image passing through the objective lenses 72 and 82.
2/3 inch ITV71,8 with 0 pixel resolution
1 is placed. Further, the objective lenses 72, 82
Half mirrors 73 and 83 are disposed on the optical axis of the optical image between the ITVs 71 and 81, respectively, and the half mirrors 73 and 83 allow the reflection optics provided on their reflection optical paths to be The light generated by the systems 74 and 84 is reflected toward the mirror 66, respectively.

In the ITVs 71 and 81, when measuring the groove position of the workpiece W, a transmitted light image generated by illuminating the workpiece W with the transmitted illumination system 60 is reflected by the mirror 66, and then reflected by the half mirror 73, 83 and forms an image. Furthermore, when measuring the position of the machined hole and the area of the machined hole, which will be described later, the light emitted from the reflective optical systems 74 and 84 is reflected by the half mirrors 73 and 83, respectively, and then further reflected by the mirror 66. , the workpiece W is irradiated from the side opposite to the laser light source, and the reflected light image of the processed hole is reflected from the workpiece W, and after being reflected by the mirror 66, it is transmitted through the half mirrors 73 and 83 to form an image. .

The reflective optical systems 74 and 84 are provided with shutters 75 and 85 at the light emitting portions, respectively, and the shutters 75 and 85 are controlled by instructions transmitted from the control system 200 through the interface 204 (see FIG. 2). By moving the emitted light to the half mirrors 73, 83
emitted in the direction.

The measurement optical systems 70 and 80 described above are placed on adjustment means 76 and 86 for manual position adjustment, respectively.

The adjustment means 76, 86 are shown in FIG. 12 (b).
), moving stages 762 and 862 are used for adjusting the measurement optical systems 70 and 80 in the optical axis direction, respectively, and a plane perpendicular to the plane formed by the laser optical axis and the direction in which the holes are arranged. Moving stages 763, 8 for adjustment in direction
63, and a moving stage 761, 861 for adjustment in a direction perpendicular to a plane formed by the moving direction of the moving stages 762, 862 and the moving direction of the moving stages 763, 863. be.

Furthermore, the measurement optical systems 70 and 80 are shown in FIG.
As shown in FIG. 2(c), in order to improve the precision of positioning after measuring the groove position, autofocus units 77 and 87 are installed to send the position information of the groove in the laser optical axis direction to the control system 200. We are prepared.

In the measuring optical systems 70 and 80, the second slot G2 of the workpiece W reflected by the mirror 66
The optical image of the groove of the 63rd slot G63 is, respectively,
0.33 μm/
Images are formed with pixel resolution.

The two output signals S1 of the ITVs 71 and 81 are sent to the image processing systems 208 and 208, respectively, in FIG.
The two groove positions are determined by the image processing systems 208 and 209 based on the output signal S1.

The groove position measurement by the image processing systems 208 and 209 will now be explained with reference to the flowchart shown in FIG. Note that the image processing systems 208 and 209 simultaneously process the second slot G2 and the sixth slot G2, respectively, using the same method.
In order to measure the groove position of the third slot G63, only one image processing system 208 will be described.

First, the image signal of the image of the second slot G2 projected on the ITV 71 of the measurement optical system 70 is stored in the RAM 20.
2 (S501). The image information captured in the RAM 202 is the i-th (0≦i≦499)-th in the horizontal direction and the j-th (0≦j≦479) in the vertical direction in the capture area of 500 pixels in the horizontal direction and 480 pixels in the vertical direction. The pixels of (i, j)
The data of that pixel is represented by V(i,j). This V(i,j) indicates brightness and is expressed as 8-bit data from 0 to 255 (0: black, 255: white)
.

FIG. 14(a) shows an image of the slot G2 projected on the ITV 71. In this image, the line indicating the slot G2 is shown in black. This image of slot G2 also shows scratches that appear to have been made during molding of workpiece W.
This means that the captured image signals also include those indicating flaws. Therefore, filtering processing is applied to the image signal of the slot G2 to remove the scratched portion (S502).

This filtering process will be explained with reference to FIGS. 15(a), (b), (c), and (d).

Here, as shown in FIG. 15(a),
A case in which scratches are removed from an original image will be explained.

First, the brightness of each pixel is binarized. The value of brightness V (i, j) of pixel (i, j) is equal to or higher than a certain value (slice level) as V (i, j) = 1
(white), and those below the slice level are V(i,j)
= 0 (black) and perform this for all pixels. The slice level is determined by finding the maximum and minimum values in all pixel data V (i, j) before the binarization process, and taking the average value of these maximum and minimum values.

Next, filtering processing is performed. To process one pixel (i, j), this pixel (i,
pixel (i, j) if there is even one pixel whose brightness in the binarization process is 1 among the pixels in the range from i-2 to i+2 and from j-2 to j+2 with pixel j) as the center. brightness V
(i, j)=1, and V(i, j)=0 only when the brightness of all pixels within the range is 0.

Here, both (c) and (d) of FIG.
Regarding the pixel (i, j), it shows the pixels in the range from i-2 to i+2 and from j-2 to j+2, and (c
), the brightness of the pixel (i+2, j-2) is 1, and for (d) in FIG. 15, the brightness of all pixels within the range is 0. Therefore, in this case Figure 1
5(c), the brightness of pixel (i, j) is V(i,
j) becomes 1, and for (d) in FIG. 15, V(i,j
) becomes 0.

The above process is performed when i is 2 to 497 and J is 2 to 497.
This is performed for each pixel in a range of 477. Other pixels are set to 1. The above-mentioned scratches and the like are usually not all black (0) in the range of 5 pixels for i and 5 pixels for j, so as a result of the filtering process,
You can obtain an image with scratches removed, as shown in the image below.

As mentioned above, in this embodiment, since filtering is performed for 5 pixels, images of 5 pixels or less are removed, but normally, the line indicating the slot is for 10 pixels. The images showing the slots are not removed because the images are of a certain extent. Slot G2 after filtering process
The image is shown in FIG. 14(b).

Next, the Y coordinate of the chin resting part of the slot G2, that is, the line of the corner formed by the top member W2 and the plate member W3 in FIG. ). In this case, all pixels of ITV71 (500 x 4
80 pixels), find the sum Vj of brightness for each row.

[0060]

##EQU00001## The graph in FIG. 14(d) is a graph showing the sum of brightness Vj for each row in correspondence with the rows. In this graph,
The lowest brightness is on the line of the chin rest shown in FIG. 14(b).

FIG. 14(e) shows an enlarged view of the lowest brightness portion of the graph of FIG. 14(d).

[0062] Here, the lowest value Vmin of the sum Vj of brightness for each row is found, a predetermined value F (for example, 10) is added to the lowest value Vmin, and this is set as the slice level, and two points intersect with the above graph. Let the Y coordinate corresponding to the center of the chin be the position yl of the chin rest.

Then, the result of adding a predetermined value a to the position yl of the chin resting portion is determined as the Y position of the slot G2 (Y=yl
+a). The value of a is, for example, if the depth of the slot is 40 μm.
If so, about 20 μm is good.

The Y coordinate yl, which is the position of the chin resting portion, indicates the center of the line of the chin resting portion. When this chin rest part is enlarged, it actually has unevenness, so a predetermined value b (in this example, 2
0 pixel (6.6 μm), a stable line (Y = y
l+b) (S505).

The brightness of this yl+b line V(i, y
l+b) is shown in (f) of FIG. 14, and 2
Two dark areas (low brightness points) appear. These two dark areas correspond to the points A and B where the line Y=yl+b intersects the line indicating the groove in FIG. 14(c), and an enlarged view of the dark areas is shown in FIG. 14(g). Shown below.

In (g) of FIG. 14, for the two dark areas, the X coordinates X1, is calculated (S506). Then, the coordinates corresponding to the calculated center of X1 and X2 (X=X1+X2)/2) are set as the X position of the slot G2 (S507)
.

In the determined groove position, the X position corresponds to the direction in which the holes are arranged (X direction), and the Y position corresponds to the direction perpendicular to the laser optical axis and the direction in which the holes are arranged (Z direction). , G2, and G63, the image processing system 20
8,209 at the same time.

Image processing systems 208 and 20 as described above
The results of the groove positions of the slots G2 and G63 obtained in step 9 are transmitted to the control system 200 through the cable S2 (RS232) and the interface 207.
0, the transmitted groove position data and the RAM
The amount of deviation from the reference value stored in 202 is calculated.

[0069] The calculation details are as follows:
Calculations are made for three axes: a direction perpendicular to the laser optical axis and the direction in which the holes are lined up (Z direction), and a movement direction (θY direction) with the optical axis of the laser beam as the rotation axis.

The amount of movement about these three axes is calculated by the following formula.

Here, the positions of the second slot G2 in the X and Z directions are (X2, Z2), and the positions of the 63rd slot G63 in the X and Z directions are (X63,
Z63), the reference value corresponding to slot G2 is (x2, z2), and the reference value corresponding to slot G63 is (x2, z2).
x63, z63), the deviation amount dZ in the Z direction is dZ=(z63-z2)/2-(Z63-Z2)/
The amount of deviation dX in the 2X direction is dX={(x63-X63)/2+(x2-X2)
}/2.

Further, if the distance between the optical axes of the position detection mechanisms of the measurement optical systems 70 and 80 is D, then the reference value indicates 2.
The distance between the two reference points is expressed as D+x2 +x63. Here, if x2≫D, x63≫D, then the distance between the two reference points is D.

Therefore, the amount of deviation dθY in the θY direction
teeth,

[0074]

[Math 2] becomes.

The amount of deviation about the three axes calculated based on the above equations is input from the control system 200 to the movement system controller 206 as the amount of movement of the workpiece W. The movement system controller 206 drives the movement stage 120 via three drivers corresponding to the three axes based on the movement amount. In this positioning, two axes other than the three axes mentioned above, the laser optical axis direction (Y direction) and the rotation direction (θZ direction) whose rotational axis is an axis perpendicular to the laser optical axis and the direction in which the holes are lined up, have a certain accuracy. I will not make any adjustments because it will be in the
In order to improve accuracy, the amount of movement about the two axes is calculated from the difference between the signal values of the autofocus units 77 and 87 attached to the measurement optical systems 70 and 80 and the reference value stored in the RAM 202. It is also possible to calculate and adjust it. In this case, the calculated amount of movement is
00 to the movement system controller 206, and based on the movement amount input to the movement system controller 206, the movement stage 120 is moved via the two drivers corresponding to the two axes.

After adjusting the position of the workpiece W, the control system 200 causes the laser light source 10 to emit light for a certain period of time (2 seconds) via the cable S3 (RS232) and the interface 203. As a result, a predetermined hole is opened in the workpiece W,
Thereafter, the hole position and hole diameter are calibrated as described later, and the positioning jig 40 is moved to the position of the second workpiece W, and the hole is drilled in the same manner as the first workpiece.

After machining the second workpiece W, the positioning jig 40 is moved to the machining position of the first workpiece W, and the control system 200 drives the vacuum solenoid 402 to suck the workpiece W. At the same time, a completion signal is sent to the auto hand controller (hereinafter referred to as "AH controller") 103 via cable S4.

The auto hand 100 has a supply side finger and a discharge side finger, and after receiving a completion signal, discharges the processed workpiece with the discharge side finger, and then drills an unprocessed workpiece with the supply side finger. It is supplied to the positioning jig 40 of the machine.

The finger of the automatic hand 100 of this embodiment is provided with two suction ports 101 and 102 on both the supply side and the discharge side, as shown in FIG. 16, so that two suction ports 101 and 102 can be supplied and discharged at the same time.

In the hole punching process, the positional accuracy and printing performance of the hole that serves as the ink discharge port (particularly the variation in the discharge direction)
is closely related, and in order to suppress the printing performance to a constant value, the perforation position accuracy must be within a certain range (for example, ±2 μm).

For example, as shown in FIG. 17, this positional accuracy is determined by the direction perpendicular to the plane formed by the hole arrangement direction and the laser optical axis (arrow A direction), the hole arrangement direction (
(in the direction of arrow B) and variations in pore diameter are considered. Figure 1
7 shows printed dots produced by ejecting ink from an inkjet head produced using the workpiece W after the hole-drilling process.

Here, regarding the product (ink jet head) manufactured using the workpiece W for which the hole-drilling process has been completed, FIGS. 18(a) and (b) and FIGS. 19(a) and (b)
).

FIGS. 18(a) and 18(b) are a perspective view and a longitudinal sectional view showing the inkjet head, respectively, and FIGS. 19(a) and 19(b) are respectively the ejection ports of the inkjet head. FIG. 2 is a vertical cross-sectional view and a cross-sectional view showing the vicinity.

This inkjet head is shown in FIG.
As shown in a) and (b), a workpiece W that has been subjected to a hole-drilling process is placed on a heater board 143. The heater board 143 is shown in FIGS.
), the slot Gn (G1 , G2
Only shown in the diagram. ) corresponding to the heater 143n (
Only 1431 and 1432 are shown. ) are arranged in parallel, and the workpiece W is placed on the heater board 143 with the slot Gn and the heater 143n aligned with each other. Also, in Figure 18 (
As shown in a) and (b), the hole H drilled in the workpiece W
n is an ejection port 141n, a slot Gn communicating with the ejection port 141n is an ink flow path, a plate-like member W3 is an orifice plate 142, and ink I is stored inside the top member W2. When the inkjet head is installed in a printing device, the heaters 143n are connected to a print drive unit (not shown) through wiring members 144n, respectively, as shown in FIG. 19(b).

In this inkjet head, when ink is ejected from the ejection port 1411, the heater 143n is driven by the drive signal from the print drive section to heat the ink I in the slot G1, as shown in FIG.
As shown in (b), bubbles are generated in the slot G1,
The ink on the ejection port 1411 side is ejected from the bubbles as droplets. The same applies to the other discharge ports 141n.

In order to keep the printing performance of such an inkjet head to a constant value, the amount of deviation between the position of the laser beam after passing through the mask 30 (mask image) and the relative positional relationship between the measuring optical systems 70 and 80 is suppressed. There is a need. Therefore, a calibration method is used in which the position of the drilled hole is measured and this position is used as a reference position for the groove position of the workpiece W to be drilled next. This includes the measurement optical systems 70, 80 and the measurement optical system 7.
Reflection optical systems 74, 84 attached to 0, 80, and I
Image processing systems 208 and 209 that perform image processing of signals S1 from TVs 71 and 81 and a control system 200 are used.

After drilling, the shutters 75 and 85 that block the emitted light from the reflective optical systems 74 and 84 are opened, and the emitted light is reflected by the half mirrors 73 and 83, respectively, to the objective lenses 72 and 82. After passing through the light, it is reflected by a mirror 66 and irradiated onto the workpiece W. Then, the optical image reflecting from the workpiece W and showing the shape of the drilled hole is transmitted to the measurement optical system 7.
0.80 ITV71,81, and the ITV71
, 81 are image-processed by image processing systems 208 and 209 to calculate the position of the drilled hole, and the calculated value is transferred to the control system 200 via the cable S2 and the interface 207.

Here, hole position measurement by the image processing systems 208 and 209 will be explained along the flowchart shown in FIG. Note that since the image processing systems 208 and 209 simultaneously measure the hole positions of the second hole H2 and the 63rd hole H63, respectively, using the same method, only one of the image processing systems 208 will be described.

First, an image signal of the image of the second hole H2 projected on the ITV 71 of the measurement optical system 70 is acquired (S5
10). FIG. 21 shows an image of the hole H2 projected on the ITV 71. The brightness of all pixels of this ITV71 is measured using an 8-bit binary code (
0 to 255), and the frequency of brightness, that is, the number of pixels with the same brightness, is checked in the range of all pixels (S511
). The frequency of this brightness is shown in FIG. In FIG. 22,
Two peak values appear, indicating the dark part of the hole H2 and the other bright parts, and the part with the smaller value (Vmin) indicates the dark part of the hole H2.From this graph, it is possible to determine the brightness at which the peak value exists. Maximum value Vmax and minimum value Vmi
n is calculated (S512). Obtained Vmax and Vmi
Binarize the image signal from n (distinguish into dark and bright areas)
Find the slice level to do this using the formula below (
S513).

Slice level = Vmin + (Vmax - Vm
in)×G (G: 0.5) The obtained slice level and the brightness of each pixel are compared to check the magnitude relationship, and the image signal is binarized (S514). As a result, the hole H2 portion and the other portions are distinguished, and an image of the hole H2 is formed by binarizing the image signal as shown in FIG. 23.

In this binarized image, the X center of gravity and the Y center of gravity are determined by the following equations (S515).

[0092]

[Equation 3] Then, the obtained X center of gravity and Y center of gravity are respectively converted to hole H2.
hole position X and hole position Y (S517).

Regarding this hole position, the two holes H2 and H63 are found at the same time, as in the case of the slot holes,
In the determined hole positions, the hole position X corresponds to the direction in which the holes are arranged, and the hole position Y corresponds to the direction perpendicular to the laser optical axis and the direction in which the holes are arranged.

Hole H2 and hole H63 thus obtained
The position data of is transferred to the control system 200.

The control system 200 uses the value indicating the hole position as a reference position, and uses the hole alignment direction (X direction) and the laser optical axis and hole alignment direction previously stored in the RAM 202. When positioning the workpiece W in the three axes described above, use these two values as reference values (X, Z) to determine the groove position for image processing. The difference from the value (X, Z) is used as the movement amount.

Further, the area of the holes greatly affects the printing performance (particularly the density), and it is important for the performance to keep the variation in size and the average value of the size constant.

As shown in FIG. 24, the hole drilled in the workpiece W is tapered so that the diameter on the laser beam entrance side (incidence diameter 162) is large and the diameter on the exit side (output diameter 161) is small. This taper becomes smaller as the power of the laser beam is increased, and the exit diameter 161 becomes larger while the incident diameter 162 is constant, and the hole area becomes larger as shown in the characteristic diagram of FIG. Further, the same effect can be obtained by changing the number of laser beam irradiation pulses applied to the perforated portion.

As described above, there is a large relationship between the diameter of the hole, the laser power density, and the number of irradiation pulses.
The excimer laser used as 0 uses pulsed discharge, and the amount of light varies each time.It also has a large effect on the gas concentration in the laser, impurity concentration, applied voltage, optical system life, dirt, etc. The power is unstable due to the

Therefore, as shown in FIGS. 26(a) and 26(b), a mask hole 11 of a certain area is formed at the exit of the laser beam P.
Power meter 11 with aluminum mask 112 with 3
1, and a beam splitter 114 having a reflectance of several percent is placed in the middle so that the laser beam hits the aluminum mask 112. and,
During laser irradiation, the light reflected by the beam splitter 114 is received by the power meter 111 through the mask hole 113 of the aluminum mask 112, so that the output signal S5 indicating the power density of the laser beam from the power meter 111 becomes a constant value. Then, the control system 200 connects the interface 203
And the voltage applied to the laser light source 10 is changed via the cable S3. Output signal S from power meter 111
5 is sent to the control system 200 through the A/D converter 115.

FIG. 26(c) shows an example of the relationship between the voltage applied to the laser light source 10 and the laser power.

[0101] In this way, by measuring the laser power during laser emission during hole drilling and changing the voltage applied to the laser light source 10, the power density of the laser light P can be kept constant. It becomes possible to suppress variations in hole size within a certain value. The above-mentioned power meter 111 is classified into one using a light amount measurement method and one using a heat measurement method. Furthermore, regarding the area of the hole, measure the area of the hole opened,
It is also possible to control the voltage applied to the laser light source 10 using this area to maintain a constant hole area.

[0102] In this case, the measurement optical systems 70, 80,
Reflection optical systems 74 and 84 attached to the measurement optical systems 70 and 80, and ITV 7 of the two measurement optical systems 70 and 80
an image processing system 208 that performs image processing on signals from 1 and 81;
209 and a control system 200 are used.

After drilling, the shutters 75 and 85 that block the emitted light from the reflective optical systems 74 and 84 are opened to irradiate the workpiece W from the side opposite to the laser light source through the objective lenses 72 and 82. The light image reflecting from the workpiece W and showing the shape of the drilled hole is transmitted to the two measurement optical systems 7.
The image is formed on ITV71,81 attached to 0,80,
Signals S1 from the ITVs 71 and 81 are subjected to image processing in image processing systems 208 and 209, respectively. At this time, the area of the drilled hole is calculated and the value is transferred to the control system 200 via the cable S2 and the interface 207.

[0104] Here, the pore area measurement by the image processing systems 208 and 209 will be explained along the flowchart shown in FIG. Note that in this case as well, the image processing systems 208, 20
9 simultaneously and in the same way respectively holes H2 . In order to measure the hole area of hole H63, one image processing system 20
Only 8 will be explained.

First, the hole position X obtained as described above,
From Y, a predetermined value e is used to set the starting point of area measurement.
1 and e2 (in this embodiment, both correspond to 100 pixels) are subtracted. (S520, S521, S522). Continuing,
To set the measurement range, a predetermined value f (200 pixels in this example) is added to the X start point and Y start point, respectively, and within that range, the binarization during hole position measurement is performed. The number of pixels indicating dark areas in the image is counted (S523). As a result, the number of pixels in the hole has been determined, and the hole area is determined by multiplying the number of pixels by the value h (0.33 μm x 0.33 μm in this example) that indicates the area of one pixel. (S524).

The data on the area of the two holes H2 and H63 thus obtained is transferred to the control system 200.

[0107] The control system 200 determines the voltage to be applied to the laser light source 10 based on a fixed calculation formula using the transferred hole area data, and applies the voltage to the cable S3 and the interface 203.
is transferred to the laser light source 10 via. This determines the voltage applied to the laser light source 10 when processing the next workpiece W. This method also makes it possible to keep the pore area constant.

Regarding the area of the hole, the energy distribution of the illumination light of the mask 30 during the hole-drilling process is important, and if there is variation in the distribution, the hole diameter will vary and uneven printing will occur.

Therefore, as shown in FIG. 28, a beam splitter 191 is installed between the field lens 27 and the mask 30.
to reflect several percent of the amount of light perpendicular to the optical axis. Then, the light receiving surface of the line sensor 192 is placed at a position equivalent to the position of the mask 30 on the optical axis of this reflected light, and further on the optical axis of the reflected light between the line sensor 192 and the half mirror 191. A power measuring device 190 containing a filter 193 for attenuating light and cutting visible light is disposed. From this power measuring device 190, the output of the line sensor 192 corresponding to the amount of illumination light hitting the mask 30 is measured.
It is transmitted to the control system 200 via the amplifier 194 and the A/D converter 195, and the distribution of light hitting the 1st hole to the 64th hole of the mask 30 is measured, and the MAX as shown in FIG. Check that the difference between the value and the MIN value is within a certain value. If the value is not within a certain value, control system 2
00 indicates the occurrence of an abnormality on the display 201 and stops the hole punching machine. Thereby, the energy distribution of the laser light irradiated onto the mask 30 can be suppressed within an allowable range.

Next, a series of drilling operations performed by the laser drilling machine of this embodiment will be explained with reference to the flowcharts shown in FIGS. 30 and 31.

First, if there is a workpiece W that has been drilled on the positioning jig 40, it is ejected by the autohand 100 (S530), and two new unprocessed first and second workpieces W are transferred to the autohand 100. According to the positioning jig 4
0 (S531). When the first and second two works W are mounted on the positioning jig 40, they are each vacuum-suctioned by the vacuum holes 401, and then abutted and fixed by the abutting mechanisms 405, 406, and 407 (S532).

[0112] Here, the above steps S530 to S53
2, the operations from discharging and supplying the workpiece W to abutting and fixing the workpiece W on the positioning jig 40 will be described in detail with reference to the flowchart shown in FIG.

[0113] As mentioned above, the auto hand 100 has the following functions.
Equipped with two fingers, one on the supply side and one on the discharge side,
The two processed workpieces W are discharged and the two unprocessed workpieces W are supplied at the same time.

First, while drilling is being performed on the two unprocessed workpieces W previously supplied onto the positioning jig 40, the auto hand 100 moves the unprocessed workpiece W to be drilled next. The first and second two works W are held by the supply side fingers by vacuum suction and are waiting above the positioning jig 40.

[0115] Then, after completing the drilling of the two works W on the positioning jig 40, the AH controller 10
3 (S580), the automatic hand 100 descends to the position of the workpiece W on the positioning jig 40 (S581). At this time, in the positioning jig 40, the abutment mechanisms 405, 406, 407
The abutting fixation of the processed workpiece W is released (S582), and the vacuum suction via the vacuum hole 401 is released (583). After that, auto hand 1
The two processed workpieces W are vacuum-suctioned by the discharge-side finger 00 (S584). Subsequently, the supply side finger of the automatic hand 100 is moved to the workpiece supply position of the positioning jig 40, and the automatic hand 100 is lowered (S585, S586). Then, the vacuum suction of the unprocessed first and second workpieces W by the autohand 100 is released (S587), and the first and second workpieces W are transferred to the positioning jig 40. In the positioning jig 40, the first,
The second work W is vacuum-adsorbed (S588
), the abutment mechanisms 405 and 406 are further driven to abut the first and second two works W from the laser optical axis direction (S589), and then the abutment mechanisms 40
7 is driven to abut the first and second works W from the direction in which the holes are lined up (S590), and the first and second works W supplied onto the positioning jig 40 are fixed.

First, with respect to the first and second workpieces W fixed as described above, the first workpiece W is processed by the image processing systems 208 and 20 using the method shown in FIG.
When the measurement of the slots G2 and G63 by 9 is completed, the control system 200 compares the two measured groove positions with a reference value indicating the corresponding hole position, and determines the deviation amount of the groove positions to a predetermined value. (S534)
, S535). If it is not within the standard, the moving stage 120 is driven via the moving system controller 206 based on the amount of deviation to move the groove position so that it falls within the standard of the reference value (S536). Said step S534
, S535, if the groove position deviates from the standard, count the number of times, and perform the steps from S533 onwards until the number reaches a predetermined number (10 times in this embodiment). The operation is repeated (S537). If the predetermined number of times (10 times) has been exceeded, the occurrence of an abnormality is displayed on the display 201 (S558), the drilling machine is stopped, and a restart instruction is awaited (S559).

If it is determined in step S535 that the groove position is within the standard, the shutter 65 of the transmitted illumination system 60 is driven to block the transmitted illumination light Q1, and the air cylinder 63 is driven. The 45° mirror 62 is retracted from the laser optical axis (S536, S539), and the shutters 75, 85 of the reflective optical systems 74, 84 are
It is driven and removed from the output optical path of the reflective optical systems 74 and 84 (S540). After that, the laser light source 10 is caused to emit light (S541), and after 2 seconds, the light emission is stopped (S542,
S543). At this time, the drilling of the first workpiece W has been completed.

[0118] Then, in order to measure the center position and area of the hole drilled in the first workpiece W, the movable stage 120 is moved in the laser optical axis direction (Y direction) toward the laser optical axis side by the thickness of the plate member W3. It is moved (S544).

This movement allows measurement of the hole position and hole area using the reflective optical system 74 on the side opposite to the laser light source, as described above.
Since this is carried out by illuminating the first workpiece W with illumination light from 84, the IT of the hole image produced by the illumination light is
The focus of V71, 81 is shifted by the thickness of the plate member W3 from the focus of the image of the slot created by illuminating the first workpiece W with the transmitted illumination system 60 when measuring the slot position. It is from.

After the movement of the moving stage 120 toward the laser light source is completed, the center position and area of the processed hole are measured by the method shown in FIGS. 20 and 27 described above (S545). When both measurements are completed, the RA
The reference value of the hole position stored in M202 is rewritten to a value indicating the center position of the processed hole measured this time, and the applied voltage for driving the laser light source 10 is changed depending on the size of the measured hole area. settings (S546, S547).

[0121] At this point, the operation on the first workpiece W has been completed.

[0122] Next, in order to drill a hole in the second workpiece W, the moving stage 120 is moved in the direction in which the holes are lined up (X direction) and the second workpiece W is placed on the laser optical axis (S548). . After that, in order to measure the slot position of the second work W, the shutter 6 of the transmitted illumination system 60 is
5 from the transmitted illumination optical path, and
Drive the air cylinder 63 to move the 45° mirror 62 of the transmitted illumination system 60 onto the laser optical axis (S549, S55
0), further, the shutter 75 of the reflective optical system 74 is driven to block the light emitted from the reflective optical system 74 (S5
51). After moving the moving stage 120 in the laser optical axis direction (Y direction) toward the laser light source by the thickness of the plate member W3 (S552), the grooves G1 and G are moved in the same manner.
63 position is measured (S553).

[0123] As in the case of the first workpiece W, the measured groove positions are compared with the reference values stored in the RAM 202 to determine whether or not the amount of deviation is within a predetermined standard. (S554, S55). If the measured groove position is not within the standard, the moving stage 120 is similarly moved so that the groove position coincides with the center position of the hole indicated by the reference value (S556). This operation (S55
3 to S556) are repeated up to a predetermined number of times (10 times) if the measured groove position does not fall within the specifications (S55
7) If the number of times (10 times) is exceeded, the occurrence of an abnormality is displayed on the display 201 (S558), and the drilling machine is stopped and waits for a restart instruction (S559).

If the measured groove position is within the standard value, the operations for the first workpiece W (S538 to S54) are performed.
Perform the same operations as in 7) (S560 to S569),
A hole is made in the second workpiece W, the position and area of the hole are measured, and the reference value in the RAM 202 indicating the hole position is rewritten, and the voltage applied to the laser light source 10 is changed according to the area of the hole. Set.

[0125] At this point, the operation on the second workpiece W has been completed.

[0126] Thereafter, the first workpiece W is returned to the initial position by moving the moving stage 120 in the direction in which the holes are lined up (X direction) (S570). Then, the shutter 65 of the transmitted illumination system 60 is removed from the transmitted illumination optical path, and the air cylinder 63 is driven to move the 45° mirror 62 onto the laser optical axis (S571, S572). , 84 are driven to block the light emitted from the reflective optical systems 74, 84 (S573).
. Next, move the moving stage 120 in the direction of the laser optical axis (Y
direction) toward the laser light source by the thickness of the plate-like member W3 (S574), and if there is an unprocessed workpiece W, the operations from step S530 described above are repeated to perform hole-drilling.

During the above-described hole-drilling operation, the distribution of the laser beam irradiated onto the mask hole 31 of the mask 30 may be measured using the power measuring device 190 (see FIG. 28).

Regarding the reference value indicating the hole position, a hole is drilled in advance in a dummy member having the same shape as the workpiece W, the center position of the hole is measured, and the measured value is stored in advance in the RAM 202 as the reference value. May be stored.

The excimer laser used as the laser light source 10 in the above embodiment is a laser capable of oscillating ultraviolet light, capable of outputting high-intensity energy, having excellent monochromaticity, good directivity, and capable of short pulse oscillation. Instead, there is the advantage that the energy density can be increased by focusing the light with a lens. In other words, an excimer laser oscillator generates a short pulse (
It can oscillate ultraviolet light of 15 to 35 ns), and Kr-F, Xe
-Cl, Ar-F lasers, etc. are often used. These oscillation energies are several 100 mj/pulse, and the pulse repetition frequency is 30 to 1000 Hz. When such high-intensity, short-pulse ultraviolet light is irradiated onto the surface of a polymer resin, the irradiated area instantaneously decomposes and scatters with plasma emission and an impact sound, creating a so-called "ABLATIVE PHOTO".
DE COMPOSITION (APD) ” process, which allows for the drilling of polymer resins.
2. There is a clear difference from laser drilling. For example, when a polyimide (PI) film is irradiated with laser light using an excimer laser (KrF laser), the PI
Since the light absorption wavelength of the film is in the UV region, it is possible to make clean holes, but conventional YA, which is not in the UV region,
With the G laser, the edges of the hole become rough, and with the CO2 laser, craters are formed around the hole.

[0130] Metals such as SUS, opaque ceramics, Si, etc. are not affected by excimer laser light irradiation in the atmosphere, and therefore can be used as the material for the mask 30 described above.

[0131] Next, actual results in a hole-drilling machine using such an excimer laser will be exemplified. (Example 1) The workpiece W used here has slots G with a width of 43 μm and a height of 45 μm formed at a pitch of 70.5 μm in the top member W2, and a discharge port (orifice) with a diameter of 31 μmφ in the plate member W3. When forming, using INDEX200K (manufactured by Lumonics) as an excimer laser,
Laser output 250mJ/pulse, repetition frequency 200H
z, when processing with an oscillation time of 2 seconds, the results shown in Table 1 below were obtained. Note that the thickness of the plate member W3 at this time is 40 to 45 μm, and the material is polysulfone. Also,
For comparison, we clarified the difference in machining accuracy with the conventional example (
(see Table 1).

[0132]

[Table 1] As is clear from Table 1, when holes are drilled using the hole punching machine of this example, the variation in orifice area and the shape of the orifice are considerably improved compared to the conventional method. Naturally, this also improves the performance of the inkjet head produced by the hole punching machine of this example. That is,
The amount and direction of droplet ejection is uniform, and characters, graphics, etc. are clear and do not lose their shape.

Lens groups 21 to 25 forming the beam shaping optical system of the illumination optical system 20 in the embodiment described above (FIG. 4)
(see (a)), the laser light source is connected to the fly-eye lens 2.
This is for uniformly irradiating the entire fly-eye lens 26 according to the shape of the fly-eye lens 26.
It is not necessary to irradiate the entire area, just irradiate the necessary areas in a straight line.

An example of the beam shaping optical system in that case is shown in FIG.
Shown in 3.

The beam shaping optical system shown in FIG. 33 divides the laser beam P emitted from the laser light source 10 into three beams in a direction perpendicular to the plane formed by the laser optical axis and the direction in which the holes are arranged. As an optical system, prisms 311,3
12 is arranged in front of the fly's eye lens 26 with a gap provided in the laser optical axis portion (center portion of the laser beam P). With this arrangement, the prism 31
The beam is divided into three beams: two beams that each pass through 1,312, and a beam that passes through the gap.

[0136] These three beams are connected to the fly eye lens 26.
must be separated by a predetermined interval in a direction perpendicular to the plane, such that the optical axis of

[0137] The fly eye lens 26 has 6 lenses as described above.
Since lenses of φ are combined, the distance between their optical axes is 5.2 mm in the direction perpendicular to the plane. Since the width of the light beam is 6 mm in that direction, it is divided into three beams of 2 mm each. Originally, the beams are 2mm apart, so prism 3
11,312 must separate the beams by 3.2 mm.

The prisms 311 and 312 described above have a plane of incidence and a plane of emission parallel to each other, and the plane of incidence and plane of emission are rotated in a direction of rotation with the axis of rotation in the direction in which the mask holes 31 are lined up. , the distance between the three beams is 5.2 mm
It has a predetermined inclination with respect to the laser optical axis so that. Further, side surfaces of the prisms 311 and 312 that face each other (surfaces facing the gap) are parallel to the laser optical axis.

Furthermore, here, the prism 311,
Although a gap is formed between the prisms 312, the prisms 311 and 312 may be bonded together using a glass plate or the like.

FIG. 34 shows a beam incident on the fly's eye lens 26 when the prisms 311 and 312 are provided as described above.

[0141] With this configuration, the laser output is 250 mJ/pulse and the laser beam is 28 mm x 6.
mm rectangle, and its laser beam is 28 mm x 2 mm.
When divided into three beams, the energy density of each divided laser beam is 250 mJ/(2.8 x 0.6 cm) = 14
It becomes 9mJ/cm2. On the other hand, the prism 3 mentioned above
If 11,312 is not used, fly eye lens 26
It is equivalent to irradiating a laser beam expanded to 20 mm x 20 mm, and the energy density at this time is 2
50mJ/(2×2cm)=63mJ/cm2. Therefore, by providing the separation optical system using the prisms 311 and 312 as described above, the energy density can be improved by about 2.4 times. Such a configuration is effective when the aspect ratios of the light beams irradiating the mask are significantly different, such as when the holes are arranged substantially in a straight line. In this way, by irradiating the laser beam only to necessary locations on the fly's eye lens 26, it is possible to increase the energy density of the irradiated laser beam.

Furthermore, on the optical axis between the prisms 311, 312 and the laser light source 10, a compression optical system 330 for compressing the beam shape is provided, as shown in FIG. 35, consisting of a convex lens 331 and a concave lens 332. It doesn't matter if you place it.

[0143]

[Effects of the Invention] Since the present invention is constructed as described above, it produces the following effects.

(1) Since holes are drilled using a laser beam image formed through a mask, a large number of holes can be drilled at the same time, reducing processing time. Furthermore, by changing the mask, it becomes possible to make holes of different shapes, which simplifies the work.

(2) Since the workpiece can be moved by the movement system while observing the machining position of the workpiece by the measurement system, highly accurate positioning is possible and variations in the drilling position can be reduced. It disappears.

(3) By using a telecentric optical system for the projection optical system, changes in the magnification of the laser light image due to positional deviation of the workpiece in the direction of the laser optical axis are prevented, so uniform holes can always be drilled. becomes possible.

(4) By irradiating the mask with laser light through the fly-eye lens and field lens, the illumination light onto the mask becomes a high-density laser light with uniform energy distribution, which reduces processing time and The uniformity of the pore shape is further improved.

(5) By providing the beam shaping optical system with a separation optical system that separates the light beam into a number of beams that match the number of rows of fly-eye lenses, the energy density of the laser light irradiated onto the mask is improved. However, even when using the same mask, it is possible to increase the hole area.

(6) When the hole punching machine of the present invention is used to make ink ejection holes in the ejection section of a recording device that performs printing by ejecting ink, the amount and direction of ink ejection will be uniform, and characters will be , it is possible to record figures etc. clearly and with high precision without losing their shape.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing an embodiment of a hole punching machine of the present invention.

FIG. 2 is a side view of the hole punching machine shown in FIG. 1;

FIG. 3 is a diagram showing an example of a work W after drilling, and (a), (b), and (c) are a perspective view, a sectional view, and a front view, respectively.

FIG. 4 is a diagram showing an example of an illumination optical system, in which (a) is a diagram showing its optical path, (b) is a diagram showing an elliptical mask, and (c) is a diagram showing an elliptical mask.
is a diagram showing the arrangement of concave and convex cylindrical lenses.

FIG. 5 is a diagram showing an example of a fly-eye lens of the illumination optical system, with (a) being a front view and (b) being a side view.

FIG. 6 is a diagram showing an example of an illumination optical path to a mask by an illumination optical system.

FIG. 7 is a perspective view showing an example of a mask.

FIG. 8 is a diagram showing an example of a positioning jig, in which (a) is a side view, (b) is a plan view showing a vacuum hole, and (c) is a block diagram showing a work suction mechanism.

FIG. 9 is a diagram showing an example of a butting mechanism of a positioning jig.

FIG. 10 is a diagram showing an example of a transmitted illumination system.

FIG. 11 is a perspective view showing an example of a work W. FIG.

FIG. 12 is a diagram showing an example of a measurement optical system, in which (a) is a plan view, (b) is a side view showing an adjustment means, and (c) is an AF
It is a diagram showing a circuit.

FIG. 13 is a flowchart illustrating an example of the groove position measurement operation of the image processing system.

[Fig. 14] (a), (b), and (c) are diagrams showing an example of an image of a slot projected on an industrial television, and (d)
, (e), (f), and (g) are characteristic diagrams showing the brightness of the image of the slot.

FIG. 15 is a diagram for explaining filtering processing in the image processing system.

FIG. 16 is a sectional view showing an example of an automatic hand.

FIG. 17 is a diagram showing an example of printed dots formed by ejecting ink from an inkjet head.

FIG. 18 is a diagram showing an example of an inkjet head, in which (a) is a perspective view and (b) is a cross-sectional view.

FIG. 19 is a diagram showing an example of an ink ejection part of an inkjet head, in which (a) is a front view showing the ejection port, and (b)
FIG. 2 is a cross-sectional view showing a slot leading to a discharge port.

FIG. 20 is a flowchart showing an example of the hole position measurement operation of the image processing system.

FIG. 21 is a diagram showing an example of an image of a hole projected on an industrial television.

FIG. 22 is a characteristic diagram showing the frequency of brightness of a hole image projected on an industrial television.

FIG. 23 is a diagram showing an image of a hole formed by binarizing an image signal.

FIG. 24 is a cross-sectional view showing an example of a hole made by a laser beam.

FIG. 25 is a characteristic diagram showing the relationship between laser power and hole area.

FIG. 26 is a diagram showing an example of a power sensor for measuring the power of laser light, in which (a) is a block diagram;
(b) is a front view, and (c) is a characteristic diagram showing the relationship between the voltage applied to the laser light source and the laser power.

FIG. 27 is a flowchart showing an example of the operation of measuring the pore area of the image processing system.

FIG. 28 is a block diagram showing another example of a power measuring device for measuring the power of laser light.

FIG. 29 is a characteristic diagram showing the illumination distribution of laser light on a mask.

FIG. 30 is a flowchart showing an example of the operation (first half) of the hole punching machine of the present invention.

FIG. 31 is a flowchart showing an example of the operation (second half) of the hole punching machine of the present invention.

FIG. 32 is a flowchart illustrating an example of workpiece supply and discharge by the automatic hand and abutment operation by the positioning jig.

FIG. 33 is a diagram showing a second embodiment of the illumination optical system.

FIG. 34 is a front view showing an example of laser light incident on the fly's eye lens of the illumination optical system.

FIG. 35 is a diagram showing a third example of the illumination optical system.

[Explanation of symbols]

10 Laser light source 20 Illumination optical system 21 Elliptical mask 22 Concave cylindrical lens 23 Convex cylindrical lens 24, 261 Convex lens 25 Concave lens 26 Fly's eye lens 27 Field lens 30 Mask 31, 113, 211 Mask hole 32 Mask position adjustment mechanism 40 Positioning jig 50 Projection optical system 51 Reduction projection lens 60 Transmission illumination system 61 Optical fiber 62 45° mirror 63, 64, 408, 409, 410 Air cylinder 65, 75, 85 Shutter 66 Mirror 70, 80 Measurement optical system 71, 81 Industrial television 72, 82
Objective lenses 73, 83 Half mirrors 74, 84 Reflective optical systems 76, 86 Adjustment means 77, 87 Autofocus unit 90
Device frame 100 Auto hands 101, 102 Suction port 103 Auto hand controller 110
Power sensor 111 Power meter 112 Aluminum mask 114, 191 Beam splitter 115, 19
5 A/D converter 120, 761, 762, 763, 861, 862, 8
63 Movement stage 141 Discharge port 142 Orifice plate 143 Heater board 144 Wiring material 161 Output diameter 162 Input diameter 190 Power measuring device 192 Line sensor 193 Filter 194 Amplifier 200 Control system 201 Display 202 RAM 203, 204, 205, 207 Interface 206 Movement System controllers 208, 209 Image processing systems 311, 312 Prism 401 Vacuum hole 402 Vacuum solenoid 403 Vacuum sensor 404 Positioning reference

Claims (8)

[Claims] 1. A drilling machine that makes a hole of a predetermined shape in a workpiece by irradiation from an excimer laser, in which a predetermined fine hole is formed corresponding to the hole to be drilled in the workpiece, and the excimer laser beam passes through the fine hole. a mask that transmits laser light from the mask to the workpiece side; a projection optical system that projects an optical image of a predetermined shape onto the workpiece through microscopic holes in the mask; and a projection optical system that measures the position of the workpiece and moves the workpiece. A hole punching machine characterized by being equipped with a measuring system and a moving system using optical means. 2. The drilling machine according to claim 1, wherein the projection optical system includes a telecentric optical system. 3. The method according to claim 1, further comprising an illumination optical system for illuminating the workpiece from the excimer laser side, and a measurement system disposed on the side of the workpiece opposite to the excimer laser.
Or the hole punching machine described in 2. 4. The drilling machine according to claim 3, further comprising an illumination optical system that illuminates the workpiece from the side opposite to the excimer laser. 5. A fly-eye lens and a field lens are arranged in order from the excimer laser side on the laser optical path between the excimer laser and the mask, and on the laser optical path between the excimer laser and the fly-eye lens. 5. The drilling machine according to claim 1, further comprising a beam shaping optical system for shaping the laser light emitted by the excimer laser into a beam that matches the fly's eye lens. 6. The beam shaping optical system directs the laser beam in a direction perpendicular to the plane formed by the laser optical axis and the direction in which the fine holes of the mask are arranged, in a number corresponding to the number of rows of fly-eye lenses. 6. The drilling machine according to claim 5, further comprising a separation optical system that separates the beam into beams. 7. The hole punching machine according to claim 6, wherein the separation optical system of the beam shaping optical system is constituted by a prism. 8. The workpiece of claim 1, 2, 3, or 3, wherein the workpiece is an inkjet section of a recording device that performs recording by discharging ink, and the workpiece is provided with holes for inkjet.
The hole punching machine according to 4, 5, 6 or 7.