JP2679869B2 - Positioning method for drilling position and laser drilling machine - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a method for aligning a drilling position in a laser drilling machine and a laser drilling machine.

[Conventional technology]

The reason that a laser beam is used to make a hole of a predetermined shape and size in a work is mainly to pay attention to the high processing accuracy. In particular, the hole of the ink discharge port of the ink jet head used in the printer attached to the computer or the word processor affects the ink discharge amount, the discharge direction, etc. without changing the processing accuracy, so this processing requires careful attention. .

The ink jet head is used in a bubble jet type recording head among ink jet recording types. Then, a typical configuration and principle of the bubble jet recording apparatus are disclosed in, for example, U.S. Pat.No. 4,723,129, No. 4740796, etc., so-called, on-demand type, continuous type. Is also applicable. This method will be described with reference to an on-demand type, for example. An electrothermal converter is provided corresponding to a sheet or a liquid path holding a liquid (ink), and the electrothermal converter responds to a drive signal. Thermal energy is generated, causing film boiling on the heat-acting surface of the recording head. As a result, bubbles corresponding to the above-described drive signals are formed one-to-one in the liquid (ink), and ejected by the growth and shrinkage of the bubbles. The liquid (ink) is ejected from the outlet in the form of droplets. The driving signal given here is preferably a pulse signal as disclosed in US Pat. Nos. 4,463,359 and 4,345,262. As for the rate of temperature rise of the heat acting surface, the condition disclosed in US Pat. No. 4,313,124 may be adopted.

The ink jet head is composed of a combination of an ejection port, a liquid passage (a straight liquid passage or a right-angled liquid passage), and an electric heat exchanger as disclosed in the above-mentioned specifications. Also, the heat acting portion is arranged in the bending region. For example, the configuration disclosed in US Pat. Nos. 4,558,333 and 4,459,600 may be adopted. Further, the ink jet head has a structure in which a plurality of electrothermal converters have a common slit as a discharge portion of the electrothermal converters, for example, the structure disclosed in JP-A-59-123670, or The structure may be such that the opening for absorbing the output wave of energy corresponds to the discharge portion, for example, the structure disclosed in Japanese Patent Laid-Open No. 59-138461. Note that the recording head described in the above-mentioned specification secures a length that can correspond to a predetermined width by combining a plurality of recording heads. However, a single recording head has a predetermined width (maximum recording that can be recorded by the recording apparatus. The length may correspond to the width of the medium).

In addition, the above-described inkjet head can be electrically (for electrothermal converter) connected by being attached to the apparatus main body, and can be provided on a convertible chip type that receives ink supply or the recording head itself. It may be a cartridge type.

[Problems to be solved by the invention]

However, when a laser punching machine is used to punch a workpiece such as an inkjet head with a laser, if the laser light is focused to one point and punched one by one, a workpiece that requires a large number of holes is
The processing takes a very long time. In particular, it takes a lot of time to set an accurate drilling position for a work, resulting in a problem that work efficiency is significantly reduced.

The present invention has been made in view of the problems of the above-described conventional technology, and for a workpiece that requires a large number of holes, a hole in a laser boring machine that enables boring with high positional accuracy in a short time. It is an object of the present invention to provide a method of aligning a boring position and a laser boring machine used for carrying out the method.

[Means for Solving the Problem] The present invention relates to a method for aligning a hole processing position when a plurality of holes are formed at predetermined processing positions on a processing surface of a work by using a laser beam, wherein the laser Light is converted into a desired light beam corresponding to a plurality of holes to be opened and is applied to each processing position on the processing surface, and the center position of at least two light beams applied to the processing surface is used as a position reference. Value, and measuring each processing position on the processing surface of the workpiece where the at least two light beams are irradiated, and comparing the measured processing position with the corresponding position reference value to obtain a processing position and a position reference value. The position reference value indicating the central position of the at least two light beams is the center of a hole previously formed by the light beams. Is the position There are cases.

Further, the present invention comprises a laser light source and a projection optical system for irradiating the processed surface of the work mounted on the moving stage with the laser light emitted from the laser light source, and a predetermined processed surface of the work. In a laser drilling machine for drilling a plurality of holes at a processing position, for converting the laser light between the laser light source and the projection optical system into a desired laser light flux corresponding to the plurality of holes to be drilled. The mask on which the mask pattern is formed is arranged, and the storage means for storing the position reference indicating at least two hole center positions of the processed holes formed in the machined workpiece and the machined surface of the unmachined workpiece are stored. A transmissive illumination system for irradiating from a laser light source side, a reflective optical system for illuminating the at least two processed holes of the perforated workpiece from a side opposite to the laser light source, and the transmissive illumination system. When illuminating the machined surface of the unmachined work, the machined positions corresponding to the at least two machined holes are observed, and at least two machined holes of the machined work by the reflection optical system are observed. When illuminating, the observation optical system for observing the processing hole, and the position measurement value indicating each of the processing positions observed by the measurement optical system are obtained, and the hole center of each processing hole observed by the measurement optical system is obtained. An image processing system for obtaining a position, and each position measurement value obtained by the image processing system is compared with a corresponding position reference value stored in the storage means to calculate a position displacement amount, and the calculated position displacement is calculated. The control system drives the moving stage based on the amount and stores the hole center position obtained by the image processing system as the position reference value in the storage means.

The work is an inkjet head in which a plurality of groove holes serving as ink flow paths are arranged side by side, and in the mask, an orifice plate of the inkjet head is formed with an ink discharge port communicating with each of the plurality of groove holes. In some cases, the position measurement value obtained by the image processing system is the center position of the slot.

[Action]

A method for aligning a drilling processing position according to the present invention is a positional deviation amount between a central position of at least two light beams irradiated on a processing surface of a work and a processing position of the processing surface irradiated with the light beams. Is calculated, and the work is moved based on the calculated positional deviation amount, and the processing position is aligned with the central position of the light flux. Since it corresponds to a plurality of holes to be formed, a plurality of processing positions are aligned at the same time.

The laser boring machine of the present invention converts at least two laser beams emitted from a laser light source into laser beams corresponding to a plurality of holes to be bored, and at least two boring-processed workpieces opened by the laser beams. Since the unprocessed work is moved based on the amount of positional deviation between the center position of the hole and the processed position of the unprocessed work corresponding to the processed hole, the positions of the plurality of processed positions of the unprocessed work with respect to the laser light flux. Since the matching is performed at the same time and the laser beam is applied to the processed surface of the unprocessed work, a plurality of holes can be simultaneously formed.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

1 (a) and 1 (b) are a plan view and a side view, respectively, showing an example of a laser drilling machine of the present invention.

The laser hole punching machine of the present embodiment passes a mask 30 of ultraviolet laser light P emitted from a laser light source 10 using an excimer laser into a desired shape corresponding to a hole to be opened, and the mask 30 The mask image that has passed through 30 is irradiated onto a work W such as an inkjet head that is mounted so as to be aligned so as to be orthogonal to the laser light P, and a hole such as an ink ejection port is formed in the work W.

The laser boring machine of the present embodiment has an irradiation optical system 20 for uniformly irradiating the mask 30 with the laser light P emitted from the laser light source 10, and a mask position adjustment for adjusting the position of the mask 30. A mechanism 32, a moving stage 120 equipped with a positioning jig 0 on which the work W is mounted, a projection optical system 50 for projecting a mask image emitted through the mask 30 onto the work W, and the work W When aligning,
A transmissive illumination system 60 for irradiating the work W with illumination light from the laser light source 10 side, and reflective optical systems 74, 84 for irradiating the work W with illumination light from a direction opposite to the transmissive illumination system 60 (Fig. 11 (a)). (See above), and the transmission illumination system 60 and the reflection optical system 7 are also provided.
An optical image formed by illuminating the work W with illumination light by 4,84 is used by two industrial televisions (hereinafter referred to as ITV).
Measurement optical systems 70 and 80 for forming images on 71 and 81, respectively, are mounted on the device frame 90.
Two image processing systems 208 and 209 which respectively take in the image signals of the images formed by the V71 and 81 and perform signal processing relating to the alignment of the work W, and control the light emission of the laser light source 10 and the alignment of the work W And a control system 200 having a display 201.

Here, regarding the work W, FIGS. 2 (a), (b),
This will be described with reference to FIG.

2 (a), (b), and (c) are a perspective view, a cross-sectional view, and a front view, respectively, showing the work W in which holes have been punched.

The work W of this embodiment is for forming an ink jet head, and has 64 or 128 groove holes G (inks in FIG. 2 (a), (b), and (c)) that serve as ink flow paths. _{G 1, G 2, G 3} , shows four G ₄ only.) relative to the top member W ₂ arranged in parallel in the longitudinal direction, the plate-like member W ₃ in which the orifice plate (working surface W ₁ ) Is integrally formed. Holes H to be formed in the work W and serving as discharge ports
(In FIGS. 2 (a), (b), and (c), H ₁ , H ₂ , H ₃ , H
Only ₄ of 4 are shown. ) Is the groove G (G ₁ , G ₂ , G ₃ ,
So as to match the G _4), it is opened in the plate-like member W ₃ is divided into one or more times by a laser beam passing through the mask 30. Two pieces of this work W are mounted on the positioning jig 40 so that the processed surface W ₁ side of the plate-shaped member W ₃ faces the laser light source 1, and thereafter, alignment with respect to the laser light is performed.

In the laser drilling machine of the present embodiment, the work W is aligned by aligning the center positions of two predetermined groove holes with two corresponding ones of the two holes out of the holes previously formed in the work W. This is done by matching the center position of the hole. The center position of this hole and the center position of the slot are determined by the measurement optical system 70, 8
Image signals of the image of the hole and the image of the groove observed by the ITV71, 81 of 0 are obtained by signal processing by the image processing systems 208, 209, and the obtained center position of the hole is a storage means as a reference value. The data is stored in the RAM 202 (see FIG. 1B) via the control system 200. In the control system 200, the image processing system 2
The shift amount of the work W is calculated by comparing the center position of the groove hole obtained in 08 and 209 with the reference value, and the calculated shift amount is transmitted to the movement system controller 206 as a movement amount and moved via the movement system controller 206. By driving the stage 120, the center of the hole of the work W and the center of the groove hole are aligned with each other.

In the laser drilling machine, the laser beam P (200 Hz, 50 W, 28 mm × 6 mm) emitted from the laser light source 10 first enters the illumination optical system 20 and then irradiates the mask 30. In this illumination optical system 20, first, as shown in FIG. 3A, a combination of an elliptical mask 21, a concave cylindrical lens 22 and a convex cylindrical lens 23 converts the light into a circular shape. In this, an elliptical mask 21 having a mask hole 211 as shown in FIG. 3 (b) is arranged at the center of the luminous flux of the laser light P emitted in a rectangle of 28 mm × 6 mm to make the laser light P into an ellipse. The first concave cylindrical lens 22 is cut out and arranged so as to be widened in the direction in which the width of the light beam is narrow (6 mm side), and is returned by the concave cylindrical lens 23 so that the light beam becomes a circular 28 mm parallel light P ₂ . This is because two concave and convex cylindrical lenses 22 and 23 have a ratio f ₁ : f _{2 of} respective distances f ₁ and f ₂ from the elliptical mask 21 as shown in FIG. 3 (c). Are arranged on the optical axis of the laser light P so that f ₁ : f ₂ = 6: 28, and the power ratio of the concave and convex cylindrical lenses 22 and 23 is set to 6:28 (concave: convex). It becomes possible by doing.

Further, the convex lens 24 and the concave lens 25 are arranged on the optical path of the parallel light P ₂ with a ratio f ₃ : f ₄ of the distance f ₃ : f ₄ of their arrangement intervals being 2
At 8:20, the 28 mm circular parallel light P ₂ is converted into a 20 mm circular parallel light P ₃ by a beam compressor arranged so that the focal positions are the same.

Next, as shown in FIG. 5, a fly eye lens 26 for Keller illumination and a field lens 27 in which seven convex lenses 261 having a diameter of 6 mm are arranged as shown in FIGS. 3 (a) and 3 (b). , flat Yukimitsu P ₃ disposed on the optical axis of the parallel light P ₃ in order
Is divided into seven, and the divided luminous flux is illuminated at a constant angle into a mask hole 31 in the shape of a hole formed on a 19 mm straight line formed in the mask 30, as shown in FIG.

The mask 30 is made by using Ni of 25 μm and etching a mask hole 31 having a size twice as large as the shape of the hole to be opened.

The mask 30 is fixed to a mask holder (not shown) on the mask position adjusting mechanism 32, and its position is adjusted by an instruction transmitted from the control system 200 via the interface 205.

As described above, out of the seven light fluxes that are divided by the illumination optical system 20 and applied to the mask 30, the light flux that exits the mask 30 and has the shape necessary for opening a hole is not the telecentric light that forms the projection optical system 50. An image is formed on the work W by the 1/4 reduction projection lens 51, and a hole having a required shape is formed.

As shown in FIG. 7A, the work W is mounted on the positioning jig 40 with the processing surface W ₁ inclined to the laser light source 10 side.

Since the positioning jig 40 holds the two works W,
As shown in FIG. 7B, two sets of two vacuum holes 401 are provided and an abutting mechanism for fixing the work W sucked and held in the vacuum holes 401 is provided. As shown in FIG. 7C, the positioning jig 40 drives the vacuum solenoid 402 by a drive signal transmitted from the control system 200 via the interface 204, thereby performing a suction operation by a suction source (not shown). Then, the two works W are suction-held by two vacuum holes 401 each. Further, the suction pressure in the vacuum hole 401 is constantly detected by the vacuum sensor 403, and the control system 200 monitors the holding state of the work W based on the detected pressure. Further, the positioning jig 40, as shown in FIG. 7 (b) and FIG.
It has a positioning reference 404 of 5 points in total including 2 points on the suction holding surface side and 3 points on the side surface of the work W, and after the work W is supplied onto the positioning jig 40 by the auto hand 100, vacuum suction is performed, As shown in FIG. 8, the two abutting mechanisms 405 and 406 from the optical axis direction of the laser light P cause the laser light P to move.
In the direction of the optical axis (the Y direction indicated by the arrow), and then abutting mechanism 407 from the direction in which the holes are arranged in the direction in which the holes are arranged (the X direction in the arrow) to fix the two works W. .

The two abutting mechanisms 405, 406 correspond to the two works W held on the positioning jig 40, respectively. The abutting mechanisms 405, 406 and the abutting mechanism 407 in the direction in which the holes are arranged are operated by opening and closing the solenoid valves 411, 412, 413 and driving the air cylinders 408, 409, 410, respectively, in accordance with an instruction from the control system 200.

Further, the moving stage 120 on which the above-mentioned positioning jig 40 is mounted has a laser optical axis direction (Y direction), an axial direction (Z direction) perpendicular to the alignment direction of the laser optical axis and the holes, and the axial direction. Rotational direction of rotation (θ _Z direction), hole arrangement direction (X
Direction), and a total of 5 axes in the rotation direction (θ _Y direction) with the laser optical axis as the rotation axis, and the workpiece W is positioned by operating according to an instruction transmitted from the controller 201 through the movement system controller 206. To do.

After the work W is fixed by the abutting mechanisms 405, 406, 407, the groove position of the work W is measured.

The measurement of the groove position is performed by irradiating the work W with the transmitted illumination light Q ₁ from the transmitted illumination system 60 on the laser light source 10 side and transmitting the optical image of the groove through the plate-shaped member W ₃ to the side opposite to the laser light source 10. Measuring optical system
This is done by observing at 70 and 80. In the transmissive illumination system 60, for illuminating the transmissive illumination light Q ₁ in the workpiece W, as shown in FIG. 9, an optical fiber 61 for guiding a translucent over-illumination light Q ₁ to the workpiece W and 45 ° mirror 62 is provided Has been.

The optical fiber 61 is arranged so that the emitted light thereof is orthogonal to the optical axis of the laser light P, and the 45 ° mirror 62 is arranged such that the transmitted illumination light Q ₁ guided by the optical fiber 61 is in the same direction as the laser light P. The 45 ° mirror 62 is an air cylinder that is regulated in the direction of rotation.
It is attached to 63 so that it can move to a position where it does not block the laser light when it emits laser light.

The transmitted illumination system 60 is connected to the interface 204 from the control system 200.
The emitted light is emitted by moving the shutter 65 that blocks the emitted light according to an instruction transmitted via the vacuum solenoid 64 in accordance with an instruction from the control system 200. It is moved by driving the air cylinder 63 via.

As for the grooves to be observed, assuming that there are 64 holes to be opened in the work W, as shown in FIG. 10, the grooves on both ends (first groove G ₁ and 64th groove G ₆₄ ) The second one is the inner groove
Th slot G ₂ and the are two of the 63 th slot G _63, wherein the transmissive illumination light Q ₁ groove light G ₂ wherein the second occurring is irradiated by the 63 th slot G ₆₃ As shown in FIG. 9, the light images of are reflected by the mirrors 66 having two reflecting surfaces arranged on their optical paths and are incident on the measurement optical systems 70 and 80 without interference.

Explaining the configuration of the measurement optical system 70, 80, the first
As shown in FIG. 1A, the objective lenses 72 and 82 are arranged at the reflection destinations of the optical images by the mirror 66, respectively.
On the optical axis of the optical image that has passed through the objective lenses 72 and 82, 2 / 3-inch ITVs 71 and 81 having a resolution of 500 × 480 pixels, on which the optical image is formed, are arranged. Also, the objective lens 7
Half mirrors 73 and 83 are arranged on the optical axis of the optical image between the two 82 and the ITVs 71 and 81, respectively, and are provided on their reflection optical paths by the half mirrors 73 and 83. The light generated by the reflective optical systems 74 and 84 is reflected to the mirror 66 side, respectively. In the ITV 71, 81, the transmitted light image generated by illuminating the work W by the transmissive illumination system 60 at the time of measuring the groove position of the work W passes through the half mirrors 73, 83 after being reflected by the mirror 66. Then, when measuring the position of the processing hole and the area of the processing hole, which will be described later, the light emitted from the reflection optical systems 74 and 84 is further reflected after being reflected by the half mirrors 73 and 83, respectively. Reflected by the mirror 66, the work W is irradiated from the side opposite to the laser light source,
As a result, the reflected light image of the processing hole, which is reflected from the work W, is reflected by the mirror 66 and then passes through the half mirrors 73 and 83 to form an image. The reflection optical systems 74 and 84 are provided with shutters 75 and 85 at the light emitting portions, respectively, and by moving the shutters 75 and 85 according to an instruction transmitted from the control system 200 through the interface 204, the emitted light is emitted. Is emitted toward the half mirrors 73 and 83.

The above-mentioned measurement optical systems 70 and 80 are mounted on adjusting means 76 and 87 for manual position adjustment, respectively. As shown in FIG. 11 (b), the adjusting means 76 and 86 are movable stages 762 and 862 for adjusting the measurement optical systems 70 and 80 in the optical axis direction, and the laser optical axis and the hole alignment direction. In the direction perpendicular to the plane formed by the moving stages 763 and 863 for adjustment in the direction perpendicular to the plane formed by and the moving directions of the moving stages 762 and 862 and the moving stages 763 and 863. Movement stage 76 for adjustment of
With 1,861.

Further, as shown in FIG. 11 (c), the measurement optical systems 70 and 80 are respectively provided with autofocus units 77 and 87, and the autofocus units 77 and 87 are located at the groove positions of the work W. In order to improve the accuracy of alignment after measurement, the position information in the laser optical axis direction of the groove is controlled by the control system 20.
Send to 0.

In this measurement optical system 70, 80, the second groove hole G ₂ and the 63rd groove hole G ₂ of the work W reflected by the mirror 66
The optical images of the two grooves with ₆₃ are the objective lenses 72, 82, respectively.
Then, the light passes through the half mirrors 73 and 83 and is imaged on the ITV 71 and 81 at a magnification of 40 times with a resolution of 0.33 μm / pixel.

Then, the two output signals S1 of the ITVs 71 and 81 are input to two image processing systems 208 and 209 in FIG. 1, respectively, and the image processing systems 208 and 209 determine the two groove positions.

Regarding the groove position measurement of the image processing systems 208 and 209,
A description will be given along the flowchart shown in FIG. The image processing systems 208 and 209 use the same method at the same time.
In order to measure the groove positions of the second groove hole G ₂ and the 63rd groove hole G ₆₃ , only one image processing system 208 will be described.

First, the image signal of the image of the _second groove G ₂ projected on the ITV 71 of the measurement optical system 70 is taken into the RAM 202 (S501). RAM202
The image information captured in is horizontally 500 pixels, vertically 4
In the capture area of 80 pixels, the horizontal direction i (0 ≤ i ≤ 49
The 9th pixel and the j-th (0 ≦ j ≦ 479) pixel in the vertical direction are (i,
j), and the pixel data is represented by V (i, j). V (i, j) represents brightness and is represented by 8-bit data of 0 to 255 (0: black, 255: white).

In Figure 13 (a) shows an image of the slot G ₂ which is projected to ITV71.
In this image, the line showing the slot G ₂ is shown in black. The image of the groove G ₂ also shows a flaw that seems to have been formed when the work W is molded, and thus the captured image signal also includes a flaw. So the slot
A filtering process is applied to the G ₂ image signal to remove the scratched portion (S502).

Regarding this filtering process, FIG. 14 (a),
This will be described with reference to (b), (c) and (d).

Here, a case where a flaw is removed from the original image as shown in FIG. 14 (a) will be described.

First, the brightness of each pixel is binarized. V (i, j) = 1 (white) when the brightness V (i, j) of the pixel (i, j) is a constant value (slice level) or more, and V (i , j) = 0 (black), and this is performed for all pixels. Before the binarization process, the slice level is searched for the maximum value and the minimum value in the data V (i, j) of all the pixels, and is set as the average value of the maximum value and the minimum value.

Next, a filtering process is performed. One pixel (i,
j) is performed, i-
If one of the pixels in the range of 2 to i + 2, j-2 to j + 2 has a brightness of 1 in the binarization processing, the brightness of the pixel (i, j) is V (i , j) = 1, and V (i, j) = 0 only when the brightness of all pixels in the range is 0.

Here, FIGS. 14 (c) and 14 (d) both show pixels in the range of i-2 to i + 2 and j-2 to j + 2 with respect to the pixel (i, j). For (1), the brightness of the pixel (i + 2, j-2) is 1, and for (d) of FIG. 14, the brightness of all pixels in the range is 0. Therefore, in this case, the brightness V (i, j) of the pixel (i, j) is 1 in FIG. 14 (c), and V (i, j) is 0 in FIG. 14 (d).

The above processing is performed for each pixel in the range of i of 2 to 497 and j of 2 to 477. The other pixels are set to 1. As a result, i is 5 pixels, j is 5 pixels, and all are black (0).
As a result, the scratches and the like can be erased, and as a result, an image in which the scratches are removed can be obtained as shown in FIG. 14 (b).

As described above, in the present embodiment, since filtering for 5 pixels is performed, an image of 5 pixels or less will be removed, but normally, the line indicating the slot is about 10 pixels. Therefore, the image showing the slot is not removed. An image of the groove G ₂ after the filtering process is shown in FIG. 13 (b).

Next, the jaw mounting portion (i, j) of the groove G ₂ , that is, Y of the line of the corner formed by the top member W ₂ and the plate member W ₃ in FIG. 2 (a) described above. Find the coordinates (S503). In this case, the IT showing the image of the slot G ₂ after the filtering process
For all the pixels of V71 (500 × 480 pixels), the sum V _j of the brightness of each row is obtained.

The sum of the brightness V _j for each row is represented by the corresponding row.
13 is a graph of FIG. 13 (d). In this graph, the lowest brightness portion is on the line of the jaw loading portion shown in FIG. 13 (b).

An enlarged view of the lowest brightness portion in the graph of FIG. 13 (d) is shown in FIG. 13 (e).

Here, determine the minimum value V _min in the brightness of the sum Vj of each row to obtain the predetermined value FV _min to the minimum value V _min, the predetermined value F (e.g. 10) to the minimum value V _min In addition, this is set as a slice level, and the Y coordinate corresponding to the center of the two points intersecting with the graph is set as the position yl of the jaw mounting portion.

Then, the result of adding a predetermined value a to the position yl of the jaw mounting portion is defined as the Y position (Y = yl + a) of the groove hole G ₂ . a
The value of is preferably about 20 μm when the depth of the groove is 40 μm.

The Y coordinate yl that is the position of the jaw mounting portion indicates the center of the line of the jaw mounting portion. When the jaw mounting portion is enlarged, it actually has irregularities. Therefore, the Y coordinate yl has a predetermined value b (in this embodiment, 6.6 μm for 20 pixels).
m) is added to consider a stable line (Y = yl + b) corresponding to the chin rest portion as shown in FIG. 13 (c) (S5
05).

FIG. 13 (f) shows the brightness V (i, yl + b) of the yl + b line, and two dark areas (points of low brightness) appear. These two dark areas are shown in Fig. 13 (c).
In FIG. 13, the line Y = yl + b corresponds to the points A and B where the line indicating the groove intersects, and an enlarged view of the dark portion is shown in FIG. 13 (g).

In FIG. 13 (g), X-coordinates X ₁ and X ₂ corresponding to the centers of two points, that is, a point changing from a bright section to a dark section and a point changing from a dark section to a bright section, are set for two dark sections. Calculate (S506). And the center of calculated X ₁ and X ₂ The coordinate corresponding to is the X position of the slot G ₂ (S507).

In the obtained groove position, the X position corresponds to the hole arranging direction (X direction), and the Y position corresponds to the direction perpendicular to the laser optical axis and the hole arranging direction (z direction). G ₂ , G
₆₃ are simultaneously obtained by the image processing systems 208 and 209, respectively.

As described above, the groove hole G ₂ obtained by the image processing system 208, 209,
The result of each groove position of G ₆₃ is transmitted to the control system 200 through the cable S2 (RS232) and the interface 207.
The control system 200 calculates the amount of deviation between the transmitted groove position data and the reference value stored in the RAM 202 in advance.

The calculation contents are the hole arrangement direction (X direction), the direction perpendicular to the laser optical axis and the hole arrangement direction (Z direction), and the moving direction with the optical axis of the laser light as the rotation axis (θ _Y direction). The calculation is performed on the three axes.

The movement amount about these three axes is calculated by the following formula.

Here, the positions of the second slot G ₂ in the X and Z directions are (X ₂ , Z ₂ ), and the positions of the 63rd slot G ₆₃ in the X and Z directions are (X ₆₃ , Z ₆₃ ), the reference value corresponding to the groove G ₂ is (x ₂ , z ₂ ), and the reference value corresponding to the groove G ₆₃ is (x ₆₃ , z ₆₃ ). The amount of deviation dZ is dZ = (z ₆₃ −z ₂ ) / 2− (Z ₆₃ −Z ₂ ) / 2 The amount of deviation dX in the x direction is dX = {(x ₆₃ −X ₆₃ ) + (x ₂ −X ₂ ). } / 2.

When the distance between the optical axes of the position detecting mechanisms of the measurement optical systems 70 and 80 is D, the distance between the two reference points indicated by the reference value is represented by D + x ₂ + x ₆₃ . Where x ₂₂ >> D,
x ₆₃ >> D, the distance between the two reference points is D.

Therefore, the amount of deviation dθ _Y in the θ _Y direction is Becomes

The shift amounts about the three axes calculated based on the above equations are input from the control system 200 to the movement system controller 206 as the movement amount of the work W. The movement system controller 206 drives the movement stage 120 via three drivers corresponding to the three axes based on the movement amount. In this positioning, two axes other than the above three axes, that is, the laser optical axis direction (Y direction) and the rotation direction (θ _Z direction) having the axis perpendicular to the laser optical axis and the arrangement direction of the holes as the rotation axis are constant. Since it is in the range of accuracy, adjustment is not performed, but in order to improve the accuracy, the signal values of the autofocus units 77, 87 attached to the measurement optical systems 70, 80 and the reference value stored in the RAM 202 are used. The amount of movement about the two axes is calculated from the difference between
It is also possible to make an adjustment by moving the moving stage 120 via the two drivers corresponding to the two axes, based on the moving amount input to 06 and the moving system controller 206.

After adjusting the position of the work W, the laser light source 10 from the control system 200
Light is emitted for a fixed time (2 seconds) via the cable S3 (RS232) and the interface 203. As a result, a predetermined hole is opened in the work W, and thereafter, the hole position and the hole diameter are calibrated as described later, and the positioning jig 40 is moved to the position of the second work W, like the first work. And make a hole.

After the second machining, the positioning jig 40 is moved to the machining position of the first work W, and the vacuum solenoid 402 is driven by the control system 200 to cut off the suction state of the work W. A completion signal is sent to the auto hand controller (hereinafter referred to as AH controller) 103 via cable S4.

The auto hand 100 has fingers on the supply side and discharge side, and after receiving the completion signal, discharges the processed work with the discharge side finger, and then the supply side finger drills the unprocessed work to position the processing machine. Supply to the jig 40.

As shown in FIG. 15, the fingers of the auto hand 100 of this embodiment have two suction ports on both the supply side and the discharge side.
It is equipped with 101 and 102, and supplies and discharges two at the same time.

In the punching process, since the positional accuracy of the holes that are the ink ejection ports and the printing performance (especially the variation in the ejection direction) are greatly related, it is necessary to suppress the printing performance to a constant value.
The positional accuracy of punching must be within a certain range (for example, ± 2 μm).

As the positional accuracy, for example, as shown in FIG. 16, a direction (arrow A direction) perpendicular to a plane formed by the hole arrangement direction and the laser optical axis, and hole arrangement direction (arrow B). Direction) and variation in hole diameter are considered. FIG. 16 shows print dots formed by ejecting ink from an inkjet head manufactured using the workpiece W after the punching process.

Here, a product (inkjet head) manufactured using the work W for which the punching process has been completed will be described with reference to FIGS. 17 (a) and (b) and FIGS. 18 (a) and (b). .

FIGS. 17 (a) and 17 (b) are a perspective view and a vertical cross-sectional view showing the inkjet head, respectively, and FIGS. 18 (a) and 18 (b) are vertical cross sections showing the vicinity of the ejection port of the inkjet, respectively. It is a front view and a cross-sectional view.

This inkjet head is shown in FIGS. 17 (a) and 17 (b).
As shown in FIG. 5, a work W that has been perforated is placed and formed on the heater board 143. The heater board 143, as shown in FIGS. 18 (a) and 18 (b),
The heaters 143 _n (only 143 ₁ and 143 ₂ are shown) are arranged in parallel in correspondence with the groove holes G _n (only G ₁ and G ₂ are shown) of the work W. W is placed on the heater board 143 such that the groove G _n and the heater 143 _n are aligned with each other. In addition, FIG. 17 (a),
(B), the hole H _n drilled in the work W is discharge port 141 _n, slot G _n is an ink flow path communicating with the discharge port 141 _n, the plate-like member W ₃ is next to the orifice plate 142, Ink I is stored inside the top member W ₂ . When the ink jet head is incorporated in the printing apparatus, the heaters 143 _n are respectively connected via wiring members 144 _n as shown in FIG. 18 (b).
It is connected to a print driving unit (not shown).

In this ink jet head, when ink is ejected from the ejection port 141 ₁ drives the heater 143 ₁ by a drive signal from the print driver, the ink I in the slot G ₁
The by heat, as in the FIG. 18 (b), thereby generating bubbles in the groove hole G _1, of flying ink discharge ports 141 ₁ side as droplets from該泡. The same applies to the other ejection ports 141 _n .

In order to suppress the printing performance of such an inkjet head to a constant value, it is necessary to suppress the deviation amount of the relative positional relationship between the position (mask image) of the laser light after passing through the mask 30 and the measurement optical systems 70 and 80. . Therefore, the position of the hole that has been drilled is measured, and this position is used as a reference position for the groove position of the workpiece W to be subsequently drilled. The measurement optical system 70,80 and the reflection optical system 74,84 attached to the measurement optical system 70,80 and the image processing system 208,209 for performing the image processing of the signal S1 from the ITV 71,81 and the control system 200. To use. After the perforating process, the shutters 75 and 85 that block the light emitted from the reflective optical systems 74 and 84 are opened, and the light emitted is reflected by the half mirrors 73 and 83 respectively and passed through the objective lenses 72 and 82. After that, it is reflected by the mirror 66 and irradiated on the work W. Then, an optical image showing the shape of the opened hole, which is reflected from the work W, is formed on the ITV 71, 81 of the measurement optical system 70, 80, and the ITV 7
Image processing of the signals S1 of 1,81 is performed by the image processing systems 208 and 209 to calculate the positions of the opened holes, and the calculated values are transferred to the control system 200 via the cable S2 and the interface 207.

Here, regarding the hole position measurement of the image processing system 208, 209,
This will be described with reference to the flowchart shown in FIG. In addition,
Since the image processing systems 208 and 209 simultaneously measure the hole positions of the second hole H ₂ and the 63rd hole H _{63 by} the same method, only one image processing system 208 will be described.

First, the second hole H projected on the ITV71 of the measurement optical system 70
Capture the image signal in the image of ₂ (S510). FIG. 20 shows an image of the hole H ₂ projected on the ITV71. The brightness of all the pixels of this ITV71 is represented by an 8-bit binary code (0 to 255) as in the case of the above-mentioned groove position measurement, and the frequency of brightness, that is, the number of pixels of the same brightness Check in the pixel range (S511). The frequency of this brightness is shown in FIG. In FIG. 21, two peak values showing a dark part of the hole H ₂ and a bright part other than that appear, and a small value (V _min ) shows the dark part of the hole H _2. Then, the maximum value V _max and the minimum value V _min of the brightness where the peak value exists are obtained (S512). From the obtained V _max and the minimum value V _min , the image signal 2
The slice level for binarization (distinguishing between dark areas and bright areas) is obtained by the following formula (S513).

Slice level = V _min + (V _max −V _min ) × G (G: 0.5) The obtained slice level is compared with the brightness of each pixel to check the magnitude relationship and binarize the image signal (S514). This distinguishes the portion of the hole H _{2 from} the other portion,
As shown in the figure, an image of the hole H ₂ is formed by binarizing the image signal.

In this binarized image, the X centroid and the Y centroid are obtained by the following formula (S515).

Then, the X center of gravity and the Y center of gravity thus obtained are set as the hole position X and the hole position Y of the hole H ₂ (S517). Also for this hole position, two holes H ₂ and H ₆₃ are obtained at the same time as in the case of the above-mentioned slot, and at the obtained hole position, the hole position X corresponds to the arrangement direction of the holes and the hole position Y is , Corresponding to the direction perpendicular to the direction in which the laser optical axis holes are arranged.

The position data of the holes H ₂ and H ₆₃ obtained in this way are used for the control system.
Transferred to 200.

In the control system 200, the value indicating the position of the hole is used as a reference position, and the direction in which the holes are arranged in the RAM 202 (X direction) and the direction perpendicular to the laser optical axis and the direction in which the holes are arranged are stored in the RAM 202. (Z direction) and the two values are rewritten, and the work W described above is written.
At the time of positioning about the three axes, the two values are used as reference values (X, Z), and the difference from the groove position value (X, Z) of the image processing is moved as the movement amount.

The area of the holes has a great influence on the printing performance (especially the density), and it is important for the performance to keep the variation of the size and the average value of the sizes constant.

As shown in FIG. 23, the holes formed in the work W are tapered so that the diameter of the laser light on the incident side (incident diameter 162) is large and the diameter of the emitting side (emission diameter 161) is small. When the power of is increased, this taper becomes smaller and the incident diameter 16
2 is constant and the emission diameter 161 becomes large, and the hole area becomes large as shown in the characteristic diagram of FIG. Further, the same applies when the number of irradiation pulses of the laser beam to the perforated portion is changed.

As described above, the diameter of the hole, the laser power density, and the number of irradiation pulses have a great relationship. However, the excimer laser used as the laser light source here is based on pulse discharge, and the light quantity varies from time to time. The power is not stable because it is greatly affected by the gas concentration, impurity concentration, applied voltage in the laser, the life of the optical system, dirt, etc. Therefore,
As shown in FIGS. 25 (a) and 25 (b), a power sensor 110 composed of a power meter 111 having an aluminum mask 112 having a mask hole 113 having a constant area is arranged at the exit of the laser beam P, and the aluminum mask is used. So that the laser light hits 112,
A beam splitter 114 having a reflectance of several% is placed on the way. At the time of laser irradiation, the light reflected by the beam splitter 114 is passed through the mask hole 113 of the aluminum mask 112 to the power meter.
111, the control system so that the output signal S5 indicating the power density of the laser beam from the power meter 111 becomes a constant value.
The voltage applied to the laser light source 10 is changed by 200 via the interface 203 and the cable S3. The output signal S5 from the power meter 111 is sent to the control system 200 through the A / D converter 115. FIG. 25 (c) shows an example of the relationship between the voltage applied to the laser light source 10 and the laser power. As a result, if the laser power is measured during laser emission during drilling, the power density of the laser light P can be kept constant, and variations in the size of the holes can be suppressed within a fixed value. . As the power meter 111, there are a light quantity measurement type and a heat side fixed type.

Further, regarding the area of the hole, it is possible to measure the area of the opened hole and control the voltage applied to the laser light source 10 by this area to make the area of the hole constant. This is because the measurement optical system 70, 80, the reflection optical system 74, 84 attached to the measurement optical system 70, 80, and the two measurement optical systems 70, 80.
Image processing system 208,20 for image processing signals from ITV71,81
9 and control system 200 are used. After drilling, reflective optical system
The work W is irradiated from the objective lens 72, 82 side by opening the shutters 75, 85 blocking the emitted light from the 74, 84.

Then, an optical image showing the shape of the opened hole, which is reflected from the work W, is attached to the two measurement optical systems 70 and 80.
An image is formed on the TV 71, 81, the signal S1 from the ITV 71, 81 is image-processed by the image processing system 208, 209, respectively, and the area of the opened hole is calculated by this, and this value is passed through the cable S2 and the interface 207. Transfer to the control system 200.

Here, for the hole area measurement of the image processing system 208,209,
This will be described with reference to the flowchart shown in FIG. In addition,
Also in this case, the image processing systems 208 and 209 simultaneously measure the hole areas of the holes H ₂ and H _{63 by} the same method, respectively. Therefore, only one image processing system 208 will be described.

First, in order to set the start point of area measurement from the hole positions X and Y obtained as described above, predetermined values e ₁ and e ₂ (both 100 pixels in this embodiment) are subtracted (S520). , S521, S52
2). Then, to set the measurement range, the X start point and Y
A predetermined value f (200 pixels in this embodiment) is added to each of the starting points, and within that range, the number of pixels indicating the dark portion in the binarized image at the time of measuring the hole position is counted ( S523). As a result, the number of pixels in the hole is obtained, and the number of pixels is multiplied by the value h (0.33 μm × 0.33 μm in this embodiment) indicating the area of one pixel to obtain the hole area (S524). ).

The data of the hole areas of the _two holes H ₂ and H ₆₃ thus obtained are transferred to the control system 200.

In the control system 200, the voltage applied to the laser light source 10 is determined based on a fixed calculation formula based on the transferred hole area data, and the laser light source 10 is transmitted via the cable S3 and the interface 203.
Transfer to This determines the voltage applied to the laser light source 10 when processing the next work W. Even with this method,
It is possible to keep the pore area constant.

Also, regarding the area of the holes, the
The distribution of the illumination light of 30 is important, and if the distribution is uneven, the hole diameter is uneven and the printing is uneven. Therefore, the 27th
As shown in the figure, a beam splitter 191 is placed between the field lens 27 and the mask 30 to reflect a few% of the light quantity perpendicularly to the optical axis. And on the optical axis of this reflected light,
A light receiving surface of the line sensor 192 is placed at a position equivalent to the position of the mask 30, and a filter that cuts out dimming and visible light on the optical axis of the reflected light between the line sensor 192 and the half mirror 191. A power measuring device 190 containing 193 is arranged. The output of the line sensor 192 indicating the amount of illumination light hitting the mask 30 is transmitted from the power measuring device 190 to the control system 200 via the amplifier 194 and the A / D converter 195, and the first mask of the mask 30 is transmitted. Measure the distribution of light falling from the hole to the 64th hole and confirm that the difference between the MAX and MIN values as shown in Fig. 28 is within a certain value. If it is not within a certain value, the control system 200 indicates that an error has occurred.
Display on 01 and stop the drilling machine.

Next, a series of drilling operations by the laser drilling machine of this embodiment will be described with reference to the flowchart shown in FIG.

First, if there is a work W that has been machined on the positioning jig 40, it is discharged by the auto hand 100 (S530), and the newly unprocessed first and second two work W are processed by the auto hand 10.
It is supplied onto the positioning jig 40 by 0 (S531.)
When the first and second works W are mounted on the positioning jig 40, they are vacuum sucked by the vacuum holes 401, respectively, and then fixed by the abutting mechanisms 408, 409, 410 (S532).

Here, the work W in steps S530 to S532 described above.
The operations from the discharge and supply of the workpiece W to the abutting and fixing of the workpiece W on the positioning jig 40 will be described with reference to the flowchart shown in FIG.

As described above, the auto hand 100 has the two fingers on the supply side and the discharge side, and therefore discharges the two processed works W and supplies the two unprocessed works W at the same time.

First, while the two unworked workpieces W that have been supplied onto the positioning jig 40 are being previously drilled, the auto hand 100 is the first unworked workpiece that is to be drilled next. Then, the second two works W are held by vacuum suction by the supply-side fingers and stand by above the positioning jig 40.

Then, when the holes for the two workpieces W on the positioning jig 40 are completed and a completion signal is input via the AH controller 103 (S580), the auto hand 100 causes the workpiece W on the positioning jig 40 to move. It descends to the position (S581).
At this time, in the positioning jig 40, the abutting mechanism 40
The abutting and fixing of the processed work W by 5,406,407 is released (S582), and the vacuum suction through the vacuum hole 401 is released (S584). Then auto hand
The two processed workpieces W are vacuum-sucked by vacuum suction of 100 discharge side fingers (S584). Subsequently, the supply side finger of the auto hand 100 is moved to the work supply position of the positioning jig 40 to move the auto hand 10
Decrease 0 (S585, S586). And the auto hand 10
The vacuum suction of the unprocessed first and second workpieces W by 0 is released (S587), and the first and second workpieces W are transferred to the positioning jig 40. The positioning jig 40 has a vacuum hole 401
Vacuum suction of the first and second workpieces W respectively via (S588), and further drive the abutting mechanism 407 to abut the two workpieces W from the laser optical axis direction. After that (S589), the abutting mechanisms 405 and 406 corresponding to the first and second works W are driven to perform abutting from the direction in which the holes are arranged (S590), and the positioning jig
The first and second workpieces W supplied on the 40 are fixed.

For the first and second workpieces W fixed as described above, first, for the first workpiece W,
Grooves G ₂ and G ₆₃ by the image processing system 208 and 209 by the method shown in the figure.
The groove position of is measured (S533). When the measurement of the respective groove holes G ₂ and G ₆₃ is completed, the control system 200 compares the measured two groove positions with the reference values indicating the hole positions corresponding to them, and the deviation amount of the groove positions is determined. It is determined whether or not it is within a predetermined standard (S534,535). If it is not within the standard, the moving stage 120 is driven based on the displacement amount via the moving system controller 206 to move the groove position so as to be within the standard of the reference value (S536). Steps S534, S535
If the groove position is out of the standard,
The number of times is counted, and until the number of times reaches a predetermined number (10 times in this embodiment), step
The operations after S533 are repeated (S537). If the specified number of times (10 times) has been exceeded, an error is displayed on the display 201 and the
558) Stop the laser drilling machine and wait for a restart instruction (S559). When it is determined that the groove position is within the standard in the determination in step S535, the shutter 65 of the transillumination system 60 is driven to block the transillumination light Q ₁ .
The air cylinder 63 is driven to retract the 45 ° mirror 62 from the laser optical axis (S538, S539), and the reflection optical system 74, 84
The shutters 75 and 85 are driven to remove them from the emission optical paths of the reflection optical systems 74 and 84 (S540). Then the laser light source 10
Light is emitted (S541), and 2 seconds later, the light emission is stopped (S54
2, S543). At this time, the boring of the first work W is completed.

Then, in order to measure the center position and area of the holes made in the first work W, moves the moving stage 120 to the laser optical axis direction (Y-direction) of the plate member W ₃ to the thickness of the laser light source side ( S544). In this movement, the hole position and hole area are
As described above, since the first work W is illuminated and measured with the illumination light from the reflection optical systems 74 and 84 on the side opposite to the laser light source, the focus of the image of the hole with respect to the ITV 71 and 81 is the groove hole. Transmitted illumination light Q1 from transmitted illumination system 60 when measuring position
This is because the focus on the ITVs 71 and 81 of the image of the slot formed by illuminating the first work W due to is shifted by the thickness of the plate-shaped member W ₃ .

After the movement to the laser light source side by the moving stage 120 is completed, the center position and the area of the processed hole are measured by the method shown in FIGS. 19 and 26 described above (S54
Five). When the measurement of both is completed, the reference value of the hole position stored in RAM202 is rewritten to the value indicating the center position of the measured hole this time, and the laser light source is changed according to the size of the measured hole area. The applied voltage for driving 10 is set (S546, 547).

At this point, the operation on the first work W is completed.

Next, to make a hole in the second work W,
The moving stage 120 is moved in the hole arrangement direction (X direction) so that the second work W is arranged on the laser optical axis (S5).
48). After that, in order to measure the position of the groove of the second work W, the shutter 65 of the transmissive illumination system 60 is driven to be removed from the transmitted illumination optical path, and the air cylinder 63 is driven to drive the shutter 45 of the transmissive illumination system 60. The mirror 62 is moved on the optical axis of the laser (S549, S550), and the shutter 75 of the reflection optical system 74 is driven to block the light emitted from the reflection optical system 74 (S551). Then, after moving the moving stage 120 to the side opposite to the laser light source by the thickness of the plate member W _{3 in} the laser optical axis direction (Y direction) (S552), the positions of the groove holes G ₂ and G ₆₃ are similarly set. Is measured (S553).

The measured groove position is compared with the reference value stored in the RAM 202 as in the case of the first work W, and it is determined whether or not the deviation amount is within a predetermined standard (S554, S555). If the measured groove position is not within the standard, similarly, the moving stage 120 is moved so that the groove position coincides with the center position of the hole indicated by the reference value (S55).
6). This operation (S553 to S556) is repeated up to a predetermined number of times (10 times) unless the measured groove position falls within the standard (S557).
The occurrence of an abnormality is displayed in 1 (S558), the laser drilling machine is stopped, and a restart instruction is waited for (S559).

If the measured groove position is within the standard of the reference value, the first
Performing the same operation (S560 to 569) as the operation (S538 to S547) in the case of the workpiece W, a hole is made in the second workpiece W, and the position and area of the hole are measured to indicate the hole position. , Rewrite the reference value in RAM202, laser light source
The applied voltage to 10 is set according to the area of the hole.

At this point, the operation on the second work W is completed.

After that, move the moving stage 120 in the direction of the holes (X direction).
To return the first work W to the initial position (S57
0). Then, the shutter 65 of the transmitted illumination system 60 is removed from the transmitted illumination optical path, and the air cylinder 63 is driven to move the 45 ° mirror 62 on the laser optical axis (S571, S57
2) Further, the shutters 75 and 85 of the reflection optical systems 74 and 84 are driven to block the light emitted from the reflection optical systems 74 and 84 (S57
3). Subsequently, the moving stage 120 is moved in the laser optical axis direction (Y
After moving in the direction) to the thickness of the anti-laser light source side of the plate member W ₃ (S574), if there is unprocessed workpiece W, for machining drilled repeat the operation from step S530 mentioned above.

During the punching operation described above, the power measuring device 190 (27th
(See the drawing) may be used to measure the distribution of the laser light with which the mask hole 31 of the mask 30 is irradiated.

As for the reference value indicating the hole position, a hole is previously formed in a dummy member having the same shape as the work W, the center position of the hole is measured, and the measured value is stored in advance in the RAM 202 as the reference value. Good.

The lens groups 21 to 25 of the illumination optical system 20 described above are optical systems for adjusting the laser light flux to the fly-eye lens 26, but this may be configured as shown in FIG.

This is an arrangement in which prisms 311 and 312 which divide the laser light P emitted from the laser light source 10 into three in a direction perpendicular to the plane formed by the laser optical axis and the arrangement direction of the holes are arranged. It must be divided at a predetermined interval in a direction perpendicular to the plane as on the optical axis of the eye lens 26. Since the fly-eye lens 26 is a combination of 6φ lenses as described above, the distance between its optical axes is 5.2 mm apart in the direction perpendicular to the plane. The width of the luminous flux is 6 mm in that direction, so divide it into 3 parts by 2 mm. Since the beams are originally separated by 2 mm, it is necessary to separate the 3.2 mm beams by the prisms 311 and 312.

The prisms 311 and 312 are such that the incident surface and the exit surface of the laser light are parallel to each other, and the three laser light beams are rotated so that the beam interval becomes 5.2 mm by rotating in a rotation direction having a rotation axis in the alignment direction of the mask holes 31. Split into beams. FIG. 32 shows a beam incident on the fly-eye lens 46 when the prisms 311 and 312 are provided.

Further, on the optical axis between the prisms 311 and 312 and the laser light source 10, as shown in FIG. 33, a compression optical system 3 for compressing the beam shape, which comprises a convex lens 331 and a concave lens 332.
You can place 30.

The excimer laser used as the laser light source 10 in the present embodiment is a laser capable of oscillating ultraviolet light, capable of outputting high-intensity energy, excellent in monochromaticity, good directivity, not only short pulse oscillation, but also a lens. There is an advantage that the energy density can be increased by condensing with. That is, the Emissima laser oscillator can oscillate a short pulse (15 to 35 ns) ultraviolet light by discharge-exciting a mixed gas of a rare gas and a halogen, and a Kr-F, Xe-Cl, Ar-F laser or the like is often used. . The oscillation energy is several 100 mj / pulse, and the pulse repetition frequency is 30 to 1000 Hz. Thus, when the surface of the polymer resin is irradiated with high-intensity short-pulse ultraviolet light, the irradiated portion is instantaneously decomposed and scattered with plasma emission and impact noise. So-called "ABLATIVE PHOTODECOMPOS
ITION (APD) ”process, which allows the perforation of polymer resins.
For example, when drilling with a CO ₂ laser that is infrared,
It makes a clear difference. For example, when a polyimide (PI) film is irradiated with a laser beam using an excimer laser (KrF laser), the PI film has a light absorption wavelength in the UV region, so a clean hole can be made, but the conventional The YAG laser has rough edges, and the CO ₂ laser creates craters around the holes.

Metals such as SUS, opaque ceramics, Si, and the like are not affected even when irradiated with laser light of an excimer laser in the atmosphere, and thus can be applied as the material of the mask 30 described above.

Next, actual results of a laser drilling machine using such an excimer laser will be exemplified.

(Example 1) The work W used here has a pitch of 70.5μ on the top member W _2.
m, the width of the groove G is 4.3 μm, the height of the groove G is 45 μm, and in forming the discharge port diameter 31 μmφ of the plate-shaped member W _3, an INDEX200K (made by Lumonix) laser is used as an excimer laser. Output 250mj / pulse, repetition frequency 200H
When processed with z and oscillation time of 2 seconds, the results shown in Table 1 below are obtained. The thickness of the plate member W ₃ at this time is 40 to
45μm, the material is polysulfone. For comparison, the difference in processing accuracy from the conventional example was clarified (see Table 1).

As is clear from Table 1, when the laser boring machine of this example is used for boring, the area of the orifice varies and the shape and shape are considerably improved as compared with the conventional case. This naturally also improves the performance of the inkjet head made by the laser punching machine of this example. That is, the ejection amount and the ejection direction of the droplets become uniform, and the characters and figures are clear and do not lose their shapes.

〔The invention's effect〕

Since the present invention is configured as described above,
The following effects are obtained.

(1) According to the hole processing position alignment method of the present invention, it is possible to simultaneously perform the position adjustment of the processing positions with respect to the light beams corresponding to the plurality of holes to be opened. It is possible to significantly reduce work efficiency by reducing wasteful time in setting for drilling.

(2) According to the laser drilling machine of the present invention, it is possible to perform positioning for a plurality of processing positions at the same time, and to irradiate a laser beam to a plurality of aligned processing positions at the same time. Since the holes are opened, uniform holes can be efficiently formed.

(3) Since the positioning of the work is automatically performed by the processing machine, the worker is not exposed to the danger of the laser light, and the safety of the drilling work is ensured.

[Brief description of the drawings]

1 (a) and 1 (b) are a plan view and a side view, respectively, showing an embodiment of a laser drilling machine of the present invention, and FIG.
Drawings (a), (b), and (c) are a perspective view, a sectional view, and a front view showing an example of work W after perforation processing, respectively, and Drawing 3 (a) is a figure showing an optical path of an illumination optical system. , Fig. 3 (b)
Is a front view showing an elliptical mask of the illumination optical system, and FIG. 3 (c).
Is a diagram showing the positions of the concave and convex cylindrical lenses of the illumination optical system, FIGS. 4 (a) and 4 (b) are a front view and a side view showing the fly-eye lens of the illumination optical system, and FIG. The figure which shows the optical path of an optical system, FIG. 6 is a perspective view which shows a mask, FIG. 7 (a) is a side view which shows a positioning jig,
7 (b) is a plan view showing the vacuum holes of the positioning jig, FIG. 7 (c) is a block diagram showing the workpiece suction mechanism of the positioning jig, and FIG. 8 is an abutting mechanism of the positioning jig. FIG. 9 is a plan view showing the configuration of FIG.
FIG. 10 is a perspective view showing an example of the work, FIG. 11 (a) is a plan view showing the measurement optical system, FIG. 11 (b) is a side view showing the adjusting means, and FIG. 11 (c) is The figure which shows the AF circuit of the measurement optical system, the figure 12 is the flowchart which shows the operation of the groove position measurement of the image processing system, the figure 13 (a), (b) and (c) is the slot which is reflected in the industrial television Front view showing the statue of No. 13
Figures (d), (e), (f), and (g) are characteristic diagrams showing the distribution of the brightness of the pixels of the industrial television when the image of the slot is projected, respectively, and Fig. 14 (a), (B),
(C) and (d) are diagrams showing a filtering process of the image processing system, FIG. 15 is a sectional view showing an auto hand, and FIG. 16 is a print dot formed by ejecting ink from an inkjet head. FIGS. 17 (a) and 17 (b) are perspective views and cross-sectional views showing an inkjet head, FIG. 18 (a) is a front view showing ejection ports of the inkjet head, and FIG. 18 (b) is an inkjet head. FIG. 19 is a sectional view showing a slot hole communicating with the discharge port of FIG. 19, FIG. 19 is a flowchart showing the operation of hole position measurement of the image processing system, FIG. 20 is a view showing an image of the hole projected on the industrial television, and FIG. 21 is a hole. Fig. 22 is a characteristic diagram showing the frequency of brightness of pixels of an industrial television when an image of Fig. 22 is displayed. Fig. 22 shows a binarized image of a hole formed by binarizing an image signal. Fig. 23 shows a laser. Cross section showing an example of a hole opened by light , FIG. 24 is a characteristic diagram showing the relationship between laser power and hole area, FIG. 25 (a) is a block diagram showing the power sensor, FIG. 25 (b) is a front view showing the power sensor, and FIG. (C) is a characteristic diagram showing the relationship between the voltage applied to the laser light source and the laser power, and FIG. 26 is a flow chart showing the operation of the hole area measurement of the image processing system.
FIG. 27 is a block diagram showing a power measuring device, FIG. 28 is a characteristic diagram showing an illumination distribution of laser light on a mask, FIG. 29 is a flow chart showing an example of the operation of the laser drilling machine of the present invention, and FIG. Is a flow chart showing the supply and discharge of the work by the automatic hand and the abutting operation by the positioning jig, and FIG. 31 is a view showing the second embodiment of the illumination optical system,
FIG. 32 is a diagram showing an example of laser light incident on the fly-eye lens of the illumination optical system, and FIG. 33 is a diagram showing a third embodiment of the illumination optical system. 10 …… Laser light source, 20 …… Illumination optical system, 21 …… Ellipse mask, 22 …… Concave cylindrical lens, 23 …… Convex cylindrical lens, 24,261 …… Convex lens, 25 …… Concave lens, 26 …… Fly eye lens, 27 …… field lens, 30 …… mask, 31,113,211 …… mask hole, 32 …… mask position adjusting mechanism, 40 …… positioning jig, 50 …… projection optical system, 51 …… reduction projection lens, 60 …… transmission Illumination system, 61 …… Optical fiber, 62 …… 45 ° mirror, 63,64,408,409,410 …… Air cylinder, 65,75,85 …… Shutter, 66 …… Mirror, 70,80 …… Measurement optical system, 71,81 …… Industrial TV, 72,82 …… Objective lens, 73,83, …… Half mirror, 74,84 …… Reflective optical system, 76,86 …… Adjustment means, 77,87 …… Auto focus unit, 90… … Device frame, 100… Auto hand, 101, 102… Suction port, 103… Auto hand controller, 110 …… Power sensor, 111 …… Power meter, 112 …… Aluminum mask, 114,191 …… Beam splitter, 115,195 …… A / D converter, 120,761,762,763,861,862,863 …… Movement stage, 141 …… Discharge port, 142 ...... Orifice plate, 143 ...... Heater board, 144 ...... Wiring material, 161 …… Exit diameter, 162 …… Injection diameter, 190 …… Power measuring instrument, 192 …… Line sensor, 193 …… Filter, 194 …… Amplifier, 200 ... Control system, 201 ... Display, 202 ... RAM, 203,204,205,207 ... Interface, 206 ... Mobile system controller, 208,209 ... Image processing system, 311,312 ... Brism, 401 ... Vacuum hole, 402 …… Vacuum solenoid, 403 …… Vacuum sensor, 404 …… Positioning reference, 405,406,407 …… Abutting mechanism, 411,412,413 …… Solenoid valve.

Claims (4)

(57) [Claims] 1. A method of aligning a drilling processing position when drilling a plurality of holes at a predetermined processing position on a processing surface of a workpiece using laser light, wherein the laser light is a plurality of holes to be opened. Corresponding to each of the holes of the above-mentioned holes, and is irradiated to each processing position of the processing surface, and the center position of at least two light beams irradiated to the processing surface is set as a position reference value, and the processing of the workpiece is performed. Each processing position on the surface where the at least two light fluxes are irradiated is measured, and the measured processing position is compared with the corresponding position reference value to obtain a positional deviation amount between the processing position and the position reference value, A method for aligning a drilling position, wherein the work is moved based on the amount of positional deviation. 2. A method for aligning a drilling position, wherein a position reference value indicating a center position of at least two light beams is a center position of a hole previously drilled by the light beams. 3. A laser light source, and a projection optical system for irradiating a laser beam emitted from the laser light source onto a processing surface of a work mounted on a moving stage, the projection surface of a predetermined surface of the processing surface of the work. In a laser drilling machine for drilling a plurality of holes at a processing position, for converting the laser light between the laser light source and the projection optical system into a desired laser light flux corresponding to the plurality of holes to be drilled. The mask on which the mask pattern of 1 is formed is placed, and at least 2 of the drilled holes in the drilled workpiece
Storage means for storing position reference values indicating individual hole center positions, a transillumination system for illuminating a machining surface of an unmachined work from the laser light source side, and at least two of the holes-processed works When the processed surface of the unprocessed workpiece is illuminated by the reflective optical system for illuminating the processed hole from the side opposite to the laser light source side, and the processed position corresponding to the at least two processed holes is observed. And an observation optical system for observing the processing holes when at least two processing holes of the drilled workpiece are illuminated by the reflection optical system, and the processing positions observed by the measurement optical system. An image processing system that obtains a position measurement value and also obtains a hole center position of each processed hole observed by the measurement optical system, and each position measurement value obtained by the image processing system are stored in the storage means. The position shift amount is calculated by comparing with the corresponding position reference value, the moving stage is driven based on the calculated position shift amount, and the hole center position obtained by the image processing system is used as the position reference value. A laser drilling machine having a control system stored in a storage means. 4. A work is an ink jet head in which a plurality of groove holes serving as ink flow paths are arranged in parallel, and a mask is provided with an orifice plate of the ink jet head, and an ink discharge port communicating with each of the plurality of groove holes. 4. The laser drilling machine according to claim 3, wherein a mask pattern for forming is formed, and the position measurement value obtained by the image processing system is the center position of the groove hole.