JPH04250978A - Manufacture of electrodeposited grinding wheel - Google Patents
Manufacture of electrodeposited grinding wheelInfo
- Publication number
- JPH04250978A JPH04250978A JP2415563A JP41556390A JPH04250978A JP H04250978 A JPH04250978 A JP H04250978A JP 2415563 A JP2415563 A JP 2415563A JP 41556390 A JP41556390 A JP 41556390A JP H04250978 A JPH04250978 A JP H04250978A
- Authority
- JP
- Japan
- Prior art keywords
- grinding wheel
- abrasive grains
- small holes
- core
- grinding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000006061 abrasive grain Substances 0.000 claims abstract description 44
- 238000009826 distribution Methods 0.000 claims abstract description 13
- 238000007747 plating Methods 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 7
- 238000003892 spreading Methods 0.000 claims 1
- 239000004575 stone Substances 0.000 abstract 4
- 238000005553 drilling Methods 0.000 description 4
- 238000009827 uniform distribution Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
Abstract
Description
【０００１】0001
【産業上の利用分野】この発明は、電着砥石の製造方法
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electrodeposited grindstone.
【０００２】0002
【従来の技術】従来の技術における電着砥石の製造方法
は、砥石コアの砥石面にダイヤモンド粒やＣＢＮ砥粒を
ランダムに散布配列した上で、メッキ加工を施し、砥粒
をメッキ層で砥石コアに固着するのである。[Prior Art] The conventional manufacturing method for electrodeposited whetstones involves randomly scattering and arranging diamond grains or CBN abrasive grains on the whetstone surface of a whetstone core, and then plating the abrasive grains in a plating layer. It sticks to the core.
【０００３】0003
【発明が解決しようとする課題】従来の技術における電
着砥石の製造方法によれば、砥石コアの砥石面に砥粒が
ランダムに散布配列されるので、砥石面に固着された砥
粒の分布が不均一で粗密が生じ、砥粒の集中度をコント
ロールできない。砥粒の集中度を調整して、砥粒の密集
を避けるのには、砥粒の粒径を大きくする手段がとられ
ているが、粒径の大きい砥粒を製作できないため、限界
がある。[Problems to be Solved by the Invention] According to the conventional manufacturing method of an electrodeposited grindstone, abrasive grains are randomly scattered and arranged on the grinding wheel surface of the grinding wheel core, so that the distribution of the abrasive grains fixed to the grinding wheel surface is reduced. The concentration of abrasive grains cannot be controlled due to non-uniformity and density. In order to adjust the concentration of abrasive grains and avoid crowding of abrasive grains, the method of increasing the grain size of the abrasive grains has been taken, but there is a limit as it is not possible to produce abrasive grains with large grain sizes. .
【０００４】0004
【課題を解決するための手段】この発明の電着砥石の製
造方法は、金属製の砥石コアの砥石面に対し適宜の大き
さの小穴を適宜の分布密度であける穴加工を行い、その
小穴が分布した砥石コアの砥石面に対し適宜の勾配の傾
け又は面平行の振動、及び砥粒の散布を行い、それから
小穴に砥粒が嵌り込んだ砥石面に対してメッキを付着さ
せて砥石面に砥粒を固定するのである。[Means for Solving the Problems] The method for producing an electrodeposited grindstone of the present invention involves drilling small holes of an appropriate size at an appropriate distribution density on the grinding wheel surface of a metal grinding wheel core, and The grinding wheel surface of the grinding wheel core on which is distributed is tilted at an appropriate slope or vibrated parallel to the plane, and the abrasive grains are scattered. Then, plating is applied to the grinding wheel surface where the abrasive grains fit into the small holes, and the grinding wheel surface is The abrasive grains are fixed in place.
【０００５】[0005]
【実施例】この発明の実施例における電着砥石の製造方
法を図面に従って説明する。金属製の砥石コア１の砥石
面に対し、適宜の大きさの小穴２を適宜の分布密度であ
ける。小穴の大きさは、図１及び図２に示すように砥粒
の径より多少小さいか、多少大きいか、又は２，３粒の
砥粒３が並び得る大きさである。深さは、砥粒の一部の
みが没する程度の浅穴であるが、砥粒の径より多少小さ
い場合には、深さは不問である。EXAMPLE A method of manufacturing an electrodeposited grindstone according to an example of the present invention will be explained with reference to the drawings. Small holes 2 of an appropriate size are made at an appropriate distribution density on the grinding wheel surface of a metal grinding wheel core 1. As shown in FIGS. 1 and 2, the size of the small holes is either slightly smaller than the diameter of the abrasive grains, slightly larger than the diameter of the abrasive grains, or a size that allows two or three grains of abrasive grains 3 to line up. The depth of the hole is shallow enough that only a portion of the abrasive grains are submerged, but the depth does not matter as long as it is somewhat smaller than the diameter of the abrasive grains.
【０００６】穴あけ手段は、例えばマイクロドリルによ
る穴あけ加工、又はパルスレーザ（ＣＯ２ 、ＹＡＧ）
による穴あけ加工である。その加工装置における制御に
より穴の分布密度は適宜調整され、その結果、所望の密
度の均一分布の小穴２が砥石コア１の砥石面に形成され
得る。上記の均一分布の小穴加工装置の一例としては、
図３に示すようなレーザ加工機がある。レーザ発振器１
０から投射されたレーザ光線は、サーボモータ１２で回
転する有孔遮光板１３によりパルス状となって反射鏡１
４及び集光レンズ１５を介して断続的に砥石コア１の砥
石面に対して照射される。そして、照射点の砥石面には
、小穴２が形成される。その際、砥石コア１は、サーボ
モータ１６で回転駆動され、反射鏡・集光レンズブロッ
ク１７は、サーボモータ１８で回転駆動される軸線方向
送りねじ１９により軸線方向に移動する。そこで、サー
ボモータ１２，１６，１８は、夫々制御装置により所望
の設定値に基づいて作動制御される。それにより砥石コ
アの砥石面には、所望の分布度の照射点でレーザ光線が
照射される。即ち所望の分布度の小穴２が形成される。[0006] The drilling means is, for example, drilling using a micro drill or a pulsed laser (CO2, YAG).
This is a hole drilling process. The distribution density of the holes is appropriately adjusted by control in the processing device, and as a result, small holes 2 having a desired density and uniform distribution can be formed on the grinding wheel surface of the grinding wheel core 1. An example of the above-mentioned uniform distribution small hole machining device is:
There is a laser processing machine as shown in FIG. Laser oscillator 1
The laser beam projected from 0 is turned into a pulse by a perforated light shielding plate 13 rotated by a servo motor 12, and then reflected by a reflecting mirror 1.
4 and a condenser lens 15, the grinding wheel surface of the grinding wheel core 1 is intermittently irradiated with light. A small hole 2 is formed on the grindstone surface at the irradiation point. At this time, the grindstone core 1 is rotationally driven by a servo motor 16, and the reflecting mirror/converging lens block 17 is moved in the axial direction by an axial feed screw 19 that is rotationally driven by a servo motor 18. Therefore, the servo motors 12, 16, and 18 are each operated and controlled by a control device based on desired set values. As a result, the grindstone surface of the grindstone core is irradiated with the laser beam at irradiation points with a desired degree of distribution. That is, small holes 2 with a desired degree of distribution are formed.
【０００７】そして、小穴２が分布した砥石コア１の砥
石面の上に砥粒３（ダイヤモンド粒やＣＢＮ砥粒のよう
な超砥粒）を散布し、砥石面を適宜の勾配で傾ける。す
ると、砥石面に落下して各小穴２毎に１個乃至２，３個
嵌り込んだ砥粒３は、そのまま各小穴２に留まるが、残
余の砥粒３は、滑り落ちて排除される。又は、砥石面を
適宜の勾配で傾け、その上に砥粒３を散布すると、砥粒
３は、直接、又は傾斜した砥石面を滑りながら各小穴２
毎に１個乃至２，３個嵌り込み、残余の砥粒３は、滑り
落ちて排除される。その結果、小穴２の分布に相当する
分布で、砥粒３が砥石面に配列される。[0007] Then, abrasive grains 3 (superabrasive grains such as diamond grains or CBN abrasive grains) are scattered on the grinding wheel surface of the grinding wheel core 1 in which the small holes 2 are distributed, and the grinding wheel surface is tilted at an appropriate slope. Then, the abrasive grains 3 that have fallen onto the grindstone surface and become stuck in each of the small holes 2, one to two or three of them, remain in each of the small holes 2, but the remaining abrasive grains 3 slide down and are removed. Alternatively, by tilting the whetstone surface at an appropriate slope and scattering the abrasive grains 3 on it, the abrasive grains 3 will be applied to each small hole 2 either directly or while sliding on the inclined whetstone surface.
One to two or three abrasive grains get stuck in each case, and the remaining abrasive grains 3 slide off and are removed. As a result, the abrasive grains 3 are arranged on the grindstone surface with a distribution corresponding to the distribution of the small holes 2.
【０００８】砥粒の配列の別の手段として、小穴２が分
布した砥石コア１の砥石面に対する砥粒３の散布と該砥
石面に対する面に沿った方向の振動とを行う方法がある
。その場合も、砥石面に落下した砥粒３は、砥石面の傾
斜と同様に各小穴２毎に嵌り込んだ砥粒３は各小穴２に
留まるが、残余の砥粒３は滑り落ちて排除される。Another means of arranging the abrasive grains is to scatter the abrasive grains 3 onto the grinding wheel surface of the grinding wheel core 1 in which the small holes 2 are distributed, and to vibrate the grinding wheel in a direction along the surface of the grinding wheel surface. In that case as well, the abrasive grains 3 that have fallen onto the grinding wheel surface are stuck in each small hole 2, similar to the slope of the grinding wheel surface, and remain in each small hole 2, but the remaining abrasive grains 3 slide down and are removed. be done.
【０００９】更に別の砥粒の配列の手段としては、小穴
２が分布した砥石コア１の砥石面の上に砥粒３を散布し
、メッキによる仮付けした後、砥石面を刷毛等で払うか
、裏返すかすると、小穴２に嵌り込んだ砥粒３に比し、
残余の砥粒３は、仮付けのメッキ層による保持力が低い
ので、砥石面から脱落排除される。Another method for arranging the abrasive grains is to scatter the abrasive grains 3 on the grinding wheel surface of the grinding wheel core 1 in which the small holes 2 are distributed, and after temporarily attaching them by plating, brush the grinding wheel surface with a brush or the like. Or, if you turn it over, it will be compared to the abrasive grains 3 that fit into the small holes 2.
Since the remaining abrasive grains 3 have a low retention force due to the temporary plating layer, they fall off from the grinding wheel surface and are removed.
【００１０】上記のような各手段により全小穴２に砥粒
３が嵌り込んで配列された砥石面にメッキ加工（ニッケ
ルメッキ等）を施し、メッキ層４により砥粒３を砥石コ
ア１に固着する。かくして、適宜調整された均一の小穴
の分布に相当する分布で砥粒が分布した電着砥石が得ら
れる。[0010] By each of the above-mentioned means, the surface of the grinding wheel on which the abrasive grains 3 are fitted and arranged in all the small holes 2 is plated (nickel plating, etc.), and the abrasive grains 3 are fixed to the grinding wheel core 1 by the plating layer 4. do. In this way, an electrodeposited grindstone is obtained in which abrasive grains are distributed in a distribution corresponding to a suitably adjusted uniform distribution of small holes.
【００１１】[0011]
【発明の効果】この発明の電着砥石の製造方法により得
られた電着砥石は、適宜調整された均一の小穴の分布に
相当する分布で砥石面に固着されているので、研削性能
がよい。[Effects of the Invention] The electrodeposited grindstone obtained by the method for producing an electrodeposited grindstone of the present invention has good grinding performance because it is fixed to the grindstone surface with a distribution corresponding to the appropriately adjusted uniform distribution of small holes. .
【図１】 この発明の電着砥石の製造方法により得ら
れた電着砥石の断面図である。FIG. 1 is a sectional view of an electrodeposited grindstone obtained by the method for manufacturing an electrodeposited grindstone of the present invention.
【図２】 この発明の電着砥石の製造方法の砥粒の配
列の手段における各種小穴の断面図である。FIG. 2 is a cross-sectional view of various small holes in the means for arranging abrasive grains in the method for producing an electrodeposited grindstone of the present invention.
【図３】 この発明の電着砥石の製造方法におけるレ
ーザ加工機の概略構成図である。FIG. 3 is a schematic configuration diagram of a laser processing machine in the method for manufacturing an electrodeposited grindstone of the present invention.
１ 砥石コア ２ 小穴 ３ 砥粒 ４ メッキ層 1. Grindstone core 2 Small hole 3 Abrasive grains 4 Plating layer
Claims (1)
する適宜の大きさの小穴を適宜の分布密度であける穴加
工、（２）小穴が分布した砥石コアの砥石面に対する砥
粒の散布及び小穴に対する非嵌合の砥粒の除去、（３）
並びに小穴に砥粒が嵌り込んだ砥石面へのメッキの付着
から構成された電着砥石の製造方法Claim 1: (1) Hole processing to make small holes of appropriate size with appropriate distribution density on the grinding wheel surface of a metal grinding wheel core, (2) Spreading of abrasive grains on the grinding wheel surface of the grinding wheel core in which small holes are distributed. and removal of non-fitting abrasive grains from small holes, (3)
Also, a method for manufacturing an electroplated whetstone, which consists of attaching plating to a whetstone surface with abrasive grains fitted into small holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2415563A JPH04250978A (en) | 1990-12-28 | 1990-12-28 | Manufacture of electrodeposited grinding wheel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2415563A JPH04250978A (en) | 1990-12-28 | 1990-12-28 | Manufacture of electrodeposited grinding wheel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04250978A true JPH04250978A (en) | 1992-09-07 |
Family
ID=18523905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2415563A Pending JPH04250978A (en) | 1990-12-28 | 1990-12-28 | Manufacture of electrodeposited grinding wheel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04250978A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002049807A1 (en) * | 2000-12-21 | 2002-06-27 | Nippon Steel Corporation | Cmp conditioner, method for arranging rigid grains used for cmp conditioner, and method for manufacturing cmp conditioner |
| WO2008036892A1 (en) * | 2006-09-22 | 2008-03-27 | Saint-Gobain Abrasives, Inc. | Conditioning tools and techniques for chemical mechanical planarization |
| US20110073094A1 (en) * | 2009-09-28 | 2011-03-31 | 3M Innovative Properties Company | Abrasive article with solid core and methods of making the same |
| US8905823B2 (en) | 2009-06-02 | 2014-12-09 | Saint-Gobain Abrasives, Inc. | Corrosion-resistant CMP conditioning tools and methods for making and using same |
-
1990
- 1990-12-28 JP JP2415563A patent/JPH04250978A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002049807A1 (en) * | 2000-12-21 | 2002-06-27 | Nippon Steel Corporation | Cmp conditioner, method for arranging rigid grains used for cmp conditioner, and method for manufacturing cmp conditioner |
| CN100361786C (en) * | 2000-12-21 | 2008-01-16 | 新日本制铁株式会社 | CMP Conditioner, method for arranging rigid grains used for CMP conditioner, and method for manufacturing CMP conditioner |
| US7465217B2 (en) | 2000-12-21 | 2008-12-16 | Nippon Steel Corporation | CMP conditioner, method for arranging hard abrasive grains for use in CMP conditioner, and process for producing CMP conditioner |
| WO2008036892A1 (en) * | 2006-09-22 | 2008-03-27 | Saint-Gobain Abrasives, Inc. | Conditioning tools and techniques for chemical mechanical planarization |
| US8905823B2 (en) | 2009-06-02 | 2014-12-09 | Saint-Gobain Abrasives, Inc. | Corrosion-resistant CMP conditioning tools and methods for making and using same |
| US20110073094A1 (en) * | 2009-09-28 | 2011-03-31 | 3M Innovative Properties Company | Abrasive article with solid core and methods of making the same |
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