JP2002307210A - Single crystal diamond cutting tool and its manufacturing method - Google Patents

Single crystal diamond cutting tool and its manufacturing method

Info

Publication number
JP2002307210A
JP2002307210A JP2001121057A JP2001121057A JP2002307210A JP 2002307210 A JP2002307210 A JP 2002307210A JP 2001121057 A JP2001121057 A JP 2001121057A JP 2001121057 A JP2001121057 A JP 2001121057A JP 2002307210 A JP2002307210 A JP 2002307210A
Authority
JP
Japan
Prior art keywords
crystal diamond
cutting
diamond
cutting edge
sub
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001121057A
Other languages
Japanese (ja)
Inventor
Noboru Hiraiwa
昇 平岩
Toshihisa Nokimori
壽久 野木森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Van Moppes Ltd
Original Assignee
Toyoda Van Moppes Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Van Moppes Ltd filed Critical Toyoda Van Moppes Ltd
Priority to JP2001121057A priority Critical patent/JP2002307210A/en
Publication of JP2002307210A publication Critical patent/JP2002307210A/en
Pending legal-status Critical Current

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Cutting Tools, Boring Holders, And Turrets (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a single crystal diamond cutting tool that can uniformly cut fine streaks on the surface of a workpiece without forming burrs. SOLUTION: In this single crystal diamond cutting tool, a single crystal diamond tip 3 is fitted to the tip of a shank and put in feed motion in a cutting direction and in a feed direction perpendicular to the cutting direction to a rotating workpiece to cut the workpiece. In this case, an auxiliary cutting edge 2 is formed at the front edge of a rake face 4 formed at the upper face of the tip, parallel with a feed direction along a line intersecting a front flank relief 5 formed at the front face of the tip, and a plurality of projections and recesses 8 in the cutting direction are formed at the auxiliary cutting edge 2 in the same pitch in the feed direction over the whole length.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、単結晶ダイヤモン
ドチップをシャンク先端に取り付けた単結晶ダイヤモン
ドバイトに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a single crystal diamond cutting tool in which a single crystal diamond tip is attached to a shank tip.

【0002】[0002]

【従来の技術】電子写真感光体の基体等の光学機械部品
においては、加工面が鏡面状態では無く、均一で微細な
条痕があり、所定の表面粗さを有することが要求される
場合がある。このような要求に応えるために、他結晶ダ
イヤモンドから成るダイヤモンドチップにおいて、逃げ
面を研磨痕のない研磨面とすることにより切刃稜の微小
うねりを小さくし、切刃稜を微小な幅だけ面取りするこ
とにより他結晶ダイヤモンド特有の大きな凹凸を除去し
て、加工面を鏡面ではなく、0.2〜1μm程度の面粗
さに加工することができる多結晶ダイヤモンドチップが
特開昭6−190610号公報に記載されている。
2. Description of the Related Art In optical mechanical parts such as a base of an electrophotographic photosensitive member, it is required that a processed surface is not mirror-finished, has uniform and fine streaks, and has a predetermined surface roughness. is there. In order to respond to such demands, in the case of diamond chips made of other crystal diamonds, the flank is a polished surface without polishing marks, thereby minimizing minute waviness of the cutting edge and chamfering the cutting edge by a very small width. Japanese Patent Application Laid-Open No. 6-190610 discloses a polycrystalline diamond chip capable of removing large irregularities peculiar to other crystal diamonds and processing the processed surface to a surface roughness of 0.2 to 1 μm instead of a mirror surface. It is described in the gazette.

【0003】[0003]

【発明が解決しようとする課題】上述の多結晶ダイヤモ
ンドチップは、逃げ面を研磨痕のない研磨面とし、切刃
稜を微小な幅だけ面取りすることにより他結晶ダイヤモ
ンド特有の大きな凹凸を除去して、面取り後の切刃稜の
凹凸を0.1〜0.6μmの範囲にしているが、係る凹
凸は多結晶ダイヤモンドの結晶粒に基づいて形成される
ものであり、加工面に所望の均一で微細な条痕を形成す
ることができなかった。また、切削加工中に多結晶ダイ
ヤモンドの結晶粒が脱落し、加工面にバリを発生するこ
とがあった。
In the above-mentioned polycrystalline diamond chip, the flank is a polished surface without polishing marks, and the edge of the cutting edge is chamfered by a minute width to remove large irregularities peculiar to other crystal diamond. The unevenness of the edge of the cutting edge after chamfering is in the range of 0.1 to 0.6 μm, but such unevenness is formed based on the crystal grains of polycrystalline diamond, and a desired uniform Could not form fine streaks. Also, during the cutting process, the crystal grains of the polycrystalline diamond may fall off, causing burrs on the machined surface.

【0004】本発明は、係る従来の不具合を解消するた
めになされたもので、その目的はワーク表面に微細な条
痕を均一にバリを発生させることなく効率的に切削加工
することができる単結晶ダイヤモンドバイトを提供する
ことである。
SUMMARY OF THE INVENTION The present invention has been made to solve such a conventional problem, and has as its object to simply cut fine streaks on the work surface efficiently without generating burrs. The purpose is to provide a crystal diamond bite.

【0005】[0005]

【課題を解決するための手段】上記の課題を解決するた
め、請求項1に記載の発明の構成上の特徴は、単結晶ダ
イヤモンドチップがシャンク先端に取り付けられ回転す
るワークに対して切込み及び切込み方向と直角な送り方
向に送り運動されてワークを切削加工する単結晶ダイヤ
モンドバイトにおいて、前記チップ上面に形成されたす
くい面の前端縁に前記チップ前面に形成された前逃げ面
との交線に沿って副切刃を前記送り方向と平行に形成
し、該副切刃に切込み方向の凹凸を送り方向に同一ピッ
チで全長に渡って複数個形成したことである。
In order to solve the above-mentioned problems, a structural feature of the invention according to claim 1 is that a single crystal diamond tip is attached to a tip of a shank and cuts and cuts into a rotating workpiece. In a single-crystal diamond tool that cuts a workpiece by feeding motion in a feed direction perpendicular to the direction, the intersection of the front edge of the rake face formed on the chip upper surface and the front flank formed on the chip front surface is formed. Along with the feed direction, a plurality of sub-cutting edges are formed along the feed direction, and a plurality of irregularities in the cutting direction are formed at the same pitch in the feed direction over the entire length of the sub-cutting edge.

【0006】請求項2に係る発明の構成上の特徴は、請
求項1に記載の単結晶ダイヤモンドバイトにおいて、前
記前逃げ面に前記送り方向と略直角な方向に延在する複
数の溝を送り方向に前記同一ピッチで形成することによ
り前記副切刃に前記凹凸を形成したことである。
According to a second aspect of the present invention, in the single-crystal diamond tool according to the first aspect, a plurality of grooves extending in a direction substantially perpendicular to the feed direction are provided in the front flank. The unevenness is formed on the sub-cutting edge by forming the same pitch in the direction.

【0007】請求項3に係る発明の構成上の特徴は、請
求項1に記載の単結晶ダイヤモンドバイトにおいて、前
記すくい面に前記送り方向と略直角な方向に延在する複
数の溝を送り方向に前記同一ピッチで形成することによ
り前記副切刃に前記凹凸を形成したことである。
According to a third aspect of the present invention, in the single crystal diamond tool according to the first aspect, a plurality of grooves extending in a direction substantially perpendicular to the feed direction are formed in the rake face. The unevenness is formed on the sub-cutting edge by forming the same pitch.

【0008】請求項4に係る発明の構成上の特徴は、請
求項1乃至請求項3のいずれかに記載の単結晶ダイヤモ
ンドバイトにおいて、前記前逃げ面又はすくい面内で前
記副切刃と略直角な方向に前記単結晶ダイヤモンドの加
工が容易な結晶方向を実質的に一致させたことである。
According to a fourth aspect of the present invention, there is provided a single crystal diamond cutting tool according to any one of the first to third aspects, wherein the single cutting edge is substantially equal to the sub cutting edge in the front flank or rake face. That is, the crystal direction in which the processing of the single-crystal diamond is easy is substantially matched with the direction perpendicular to the direction.

【0009】請求項5に係る発明の構成上の特徴は、請
求項1乃至請求項4のいずれかに記載の単結晶ダイヤモ
ンドバイトを製造する方法にして、研磨機に回転可能に
支承された研磨円盤の回転中心と直角な研磨面に、前記
ダイヤモンドチップに同一ピッチで形成された複数の溝
と同一形状の複数の溝を前記同一ピッチで前記研磨円盤
の回転中心と同心円状に刻設し、前記研磨円盤を前記研
磨面に研削油を混合したダイヤモンドパウダが供給され
た状態で回転駆動し、前記副切刃を前記研磨円盤の半径
方向に実質的に一致させた状態で前記ダイヤモンドチッ
プの前逃げ面又はすくい面を前記研磨面に押し付けるこ
とにより前記複数の溝を前記ダイヤモンドチップの前逃
げ面又はすくい面に形成することである。
According to a fifth aspect of the present invention, there is provided a method for manufacturing a single crystal diamond tool according to any one of the first to fourth aspects, wherein the polishing is rotatably supported by a polishing machine. On a polishing surface perpendicular to the rotation center of the disk, a plurality of grooves having the same shape as a plurality of grooves formed at the same pitch on the diamond chip are engraved in a concentric manner with the rotation center of the polishing disk at the same pitch, The polishing disk is rotated and driven in a state where diamond powder mixed with grinding oil is supplied to the polishing surface, and the sub-cutting blade is positioned in front of the diamond chip in a state where the sub cutting edge is substantially aligned in the radial direction of the polishing disk. The plurality of grooves are formed on the front flank or rake face of the diamond chip by pressing a flank or rake face against the polishing surface.

【0010】[0010]

【発明の作用・効果】上記のように構成した請求項1に
係る発明においては、単結晶ダイヤモンドチップがシャ
ンク先端に取り付けられ回転するワークに対して切込み
及び送り運動されてワークを切削加工する単結晶ダイヤ
モンドバイトにおいて、前記チップ上面のすくい面の前
端縁にチップ前面の前逃げ面との交線に沿って副切刃を
送り方向と平行に形成し、この副切刃に切込み方向の凹
凸を送り方向に同一ピッチで全長に渡って複数個形成し
たので、ワークの加工表面に微細な条痕を均一にバリを
発生させることなく形成することができる上記のように
構成した請求項2に係る発明においては、請求項1に記
載の単結晶ダイヤモンドバイトにおいて、前逃げ面に送
り方向と略直角な方向に延在する複数の溝を送り方向に
同一ピッチで形成することにより副切刃に凹凸を形成し
たので、請求項1に記載の発明の効果に加え、切削中に
発生する切削屑を前記溝により円滑に排出することがで
きてバリの発生を確実に防止することができる。
According to the first aspect of the present invention, a single-crystal diamond tip is mounted on the tip of a shank and cuts and fed to a rotating workpiece to cut the workpiece. In the crystal diamond cutting tool, a sub-cutting edge is formed at the front edge of the rake face of the chip upper surface along the line of intersection with the front flank face of the chip front face in parallel with the feed direction, and the sub-cutting edge has irregularities in the cutting direction. A plurality of marks are formed at the same pitch in the feed direction over the entire length, so that fine streaks can be uniformly formed on the processed surface of the work without generating burrs. In the invention, in the single crystal diamond tool according to the first aspect, a plurality of grooves extending in a direction substantially perpendicular to the feed direction are formed on the front flank at the same pitch in the feed direction. As a result, unevenness is formed on the sub-cutting edge, so that in addition to the effect of the invention according to claim 1, cutting chips generated during cutting can be smoothly discharged by the groove, and the generation of burrs can be reliably prevented. Can be prevented.

【0011】上記のように構成した請求項3に係る発明
においては、請求項1に記載の単結晶ダイヤモンドバイ
トにおいて、すくい面に送り方向と略直角な方向に延在
する複数の溝を送り方向に同一ピッチで形成することに
より副切刃に前記凹凸を形成したので、請求項1に記載
の発明の効果に加え、バイトの切れ味が低下したとき前
逃げ面を研削することで容易に副切刃を鋭利に再生する
ことができる。
[0011] In the invention according to claim 3 configured as described above, in the single crystal diamond tool according to claim 1, a plurality of grooves extending in a direction substantially perpendicular to the feed direction on the rake face are formed. The unevenness is formed on the sub-cutting edge by forming the same pitch, so that in addition to the effect of the invention according to claim 1, the sub-cutting can be easily formed by grinding the front flank when the cutting performance of the cutting tool decreases. The blade can be regenerated sharply.

【0012】上記のように構成した請求項4に係る発明
においては、前逃げ面又はすくい面内で前記副切刃と略
直角な方向に単結晶ダイヤモンドの加工が容易な結晶方
向を実質的に一致させたので、前逃げ面又はすくい面に
複数の溝を正確に鋭利に研磨加工することができ、基体
表面に所望形状の条痕をより均一にバリを発生させるこ
となく加工することができる。
In the invention according to claim 4 configured as described above, the crystal direction in which the processing of the single crystal diamond is easy in a direction substantially perpendicular to the sub-cutting edge in the front flank or rake face is substantially changed. Since they are matched, a plurality of grooves can be accurately and sharply polished on the front flank or rake face, and the desired shape can be processed more uniformly on the surface of the base without generating burrs. .

【0013】上記のように構成した請求項5に係る発明
においては、回転駆動される研磨円盤の回転中心と直角
な研磨面に所望形状の複数の溝を同一ピッチで回転中心
と同心円状に刻設し、研磨面に研削油を混合したダイヤ
モンドパウダを供給して、ダイヤモンドバイトの副切刃
を研磨円盤の半径方向に実質的に一致させた状態でダイ
ヤモンドチップの前逃げ面又はすくい面を研磨面に押し
付けることにより複数の溝を形成するようにしたので、
前逃げ面又はすくい面に所望形状の溝を高い形状精度、
ピッチ精度で形成することができる。
[0013] In the invention according to claim 5 configured as described above, a plurality of grooves of a desired shape are engraved on the polishing surface perpendicular to the rotation center of the rotationally driven polishing disk at the same pitch concentrically with the rotation center. A diamond powder mixed with grinding oil is supplied to the polishing surface, and the front flank or rake surface of the diamond chip is polished with the sub cutting edge of the diamond bit substantially aligned in the radial direction of the polishing disk. Because it was made to form multiple grooves by pressing against the surface,
Groove of desired shape on front flank or rake face with high shape accuracy,
It can be formed with pitch accuracy.

【0014】[0014]

【実施の形態】本発明の実施形態を図面に基づいて説明
する。本発明に係る単結晶ダイヤモンドバイト1(以
下、ダイヤモンドバイトと言う。)は、図1に示すよう
に、単結晶ダイヤモンドで形成されたチップ3がシャン
ク7にロー付けされて構成されている。ダイヤモンドバ
イト1は、円筒状のワークの表面を切削加工して切削表
面に略円周方向に沿って多数の均一な条痕を形成し、表
面粗さが0.5〜5μmの電子写真感光体の円筒状基体
などを製造するものである。
An embodiment of the present invention will be described with reference to the drawings. As shown in FIG. 1, a single crystal diamond cutting tool 1 (hereinafter referred to as a diamond cutting tool) according to the present invention is configured by brazing a tip 3 formed of single crystal diamond to a shank 7. The diamond cutting tool 1 is an electrophotographic photosensitive member having a surface roughness of 0.5 to 5 μm by cutting a surface of a cylindrical work to form a large number of uniform striations in a substantially circumferential direction on the cut surface. To produce a cylindrical substrate.

【0015】ダイヤモンドバイト1のチップ3は単結晶
ダイヤモンドによって形成され且つ刃長に沿って凹凸が
連続して形成されている。すなわち、チップ3は、図2
に示すように単結晶ダイヤモンドによって特定形状に形
成されている。これにより、ダイヤモンドバイト1は、
円筒状基体の表面に略円周方向に沿って多数の条痕を形
成し、上記のように、基体の表面粗さを0.5〜5μm
に調整することができる。
The tip 3 of the diamond cutting tool 1 is formed of single crystal diamond and has irregularities formed continuously along the blade length. That is, the chip 3 is
As shown in the figure, it is formed in a specific shape by single crystal diamond. Thereby, diamond tool 1
A large number of striations are formed substantially in the circumferential direction on the surface of the cylindrical substrate, and the surface roughness of the substrate is 0.5 to 5 μm as described above.
Can be adjusted.

【0016】周知の通り、仕上げバイトの場合、チップ
は、すくい面と逃げ面(主逃げ面)によって構成される
切刃(主切刃)、および、すくい面と前逃げ面によって
構成され且つ主切刃と略直交する方向に伸長された副切
刃を備えているが、ダイヤモンドバイト1のチップ3の
副切刃2は、鋸状の刃稜を備えていることが重要であ
る。
As is well known, in the case of a finishing bite, the chip is constituted by a cutting edge (main cutting edge) constituted by a rake face and a flank (main flank), and a cutting edge constituted by a rake face and a front flank, and Although it has a sub-cutting edge extended in a direction substantially perpendicular to the cutting edge, it is important that the sub-cutting edge 2 of the tip 3 of the diamond cutting tool 1 has a serrated edge.

【0017】上述の副切刃2が形成されたチップ3は、
図2に示すように、上面にすくい面4、前面に前逃げ面
5が形成されている。すくい面4の前端縁には、前逃げ
面5との交線に沿って副切刃2が形成され、この副切刃
2は、ダイヤモンドバイト1が図3に示す数値制御旋盤
10の刃物台19に取り付けられたとき、送り方向であ
るZ軸と平行になるように形成されている。以下におい
ても、ダイヤモンドバイト1の形状が送り方向、切り込
み方向と関係付けられている場合、ダイヤモンドバイト
1が数値制御旋盤10の刃物台19に取り付けられた使
用状態における関係を示すものとする。前逃げ面5には
送り方向と略直角な方向に延在する複数の溝6が送り方
向に同一ピッチで10〜350個/mmの密度で全長に
渡って複数個形成され、これにより副切刃2に切込み方
向の凹凸8が送り方向に同一ピッチで10〜350個/
mmの密度で全長に渡って複数個形成されている。
The tip 3 on which the sub cutting edge 2 is formed is
As shown in FIG. 2, a rake face 4 is formed on the upper face, and a front flank face 5 is formed on the front face. A sub-cutting edge 2 is formed at the front edge of the rake face 4 along an intersecting line with the front flank 5, and the sub-cutting edge 2 is a tool rest of a numerically controlled lathe 10 shown in FIG. When it is attached to the mounting member 19, it is formed so as to be parallel to the Z axis which is the feeding direction. Hereinafter, when the shape of the diamond tool 1 is related to the feed direction and the cutting direction, the relationship in the use state in which the diamond tool 1 is attached to the tool rest 19 of the numerically controlled lathe 10 is shown. A plurality of grooves 6 extending in a direction substantially perpendicular to the feed direction are formed on the front flank 5 at the same pitch in the feed direction at a density of 10 to 350 / mm over the entire length, thereby forming sub-cuts. The unevenness 8 in the cutting direction on the blade 2 is 10 to 350 pieces /
Plural pieces are formed over the entire length at a density of mm.

【0018】上記の副切刃2の凹凸8は、チップ3の製
作において、基本形状を形成した後、微細な条溝を備え
た研磨工具による研磨によって付与される。副切刃2の
凹凸8は、切削加工において発生する微小な切削屑を円
滑に排出するため、図2に示すように、副切刃2から前
逃げ面5に亙って形成するのが好ましい。また、チップ
3の副切刃2においては、基体の表面を全体として平滑
にして均一な条痕を形成するために、凸部と凹部とのピ
ーク点の間隔dを0.5〜5μmにし、且つ同一ピッチ
で形成することが必要である。係る凹凸8を副切刃2に
切込み方向に形成するために、チップ3のすくい面4を
すくい角0°、前逃げ面5を前逃げ角βで平坦に仕上げ
加工した場合、前逃げ面5に連続して形成される複数の
溝6は、前逃げ面5に垂直な方向の深さmを、m=d×
cosβとして形成される。
The irregularities 8 of the sub-cutting edge 2 are formed by polishing with a polishing tool having fine grooves after forming the basic shape in the production of the chip 3. The unevenness 8 of the sub cutting edge 2 is preferably formed from the sub cutting edge 2 to the front flank 5 as shown in FIG. 2 in order to smoothly discharge minute chips generated in the cutting process. . In addition, in the sub-cutting edge 2 of the tip 3, the distance d between the peak points of the convex portions and the concave portions is set to 0.5 to 5 μm in order to form a uniform streak by smoothing the surface of the base as a whole. In addition, they must be formed at the same pitch. In order to form such irregularities 8 in the cutting direction in the sub-cutting edge 2, when the rake face 4 of the chip 3 is flattened with a rake angle of 0 ° and the front flank face 5 with a front flank angle β, the front flank face 5 is formed. A plurality of grooves 6 continuously formed at a depth m in a direction perpendicular to the front flank 5 and m = d ×
formed as cosβ.

【0019】ダイヤモンドバイト1を使用して基体を切
削加工する数値制御旋盤10は、図3に示すように、主
軸台12がベッド11上に固定され、主軸台12にサー
ボモータ14により回転駆動される主軸13がC軸回り
に回転可能に軸承されている。主軸13の先端にはワー
クWの先端を把持するチャック15が取り付けられてい
る。ベッド11上面に設けられた案内面16にはサドル
17がC軸と平行なZ軸方向に摺動自在に装架され、サ
ーボモータ18により図略のボールネジ送り機構を介し
て送り運動されるようになっている。サドル17の上面
にはダイヤモンドバイト1が取り付けられる刃物台19
がZ軸と直角なX軸方向に摺動自在に装架され、サーボ
モータ20により図略のボールネジ送り機構を介して切
込み運動されるようになっている。21は案内面16に
Z軸方向に位置調整可能に固定された心押し台で、心押
し台21にはラム22が主軸13と同軸線上に進退可能
に支承され、ラム22の先端にワークWの後端を支持す
るセンタ23が嵌着されている。
As shown in FIG. 3, a numerical control lathe 10 for cutting a base body using a diamond cutting tool 1 has a headstock 12 fixed on a bed 11 and is driven to rotate by a servomotor 14 on the headstock 12. The main shaft 13 is rotatably supported about a C-axis. A chuck 15 for holding the tip of the work W is attached to the tip of the main shaft 13. A saddle 17 is slidably mounted on a guide surface 16 provided on the upper surface of the bed 11 in a Z-axis direction parallel to the C-axis, and is fed by a servo motor 18 via a ball screw feed mechanism (not shown). It has become. On the upper surface of the saddle 17, a tool rest 19 on which the diamond tool 1 is mounted
Are mounted so as to be slidable in the X-axis direction perpendicular to the Z-axis, and are cut by a servo motor 20 via a ball screw feed mechanism (not shown). Reference numeral 21 denotes a tailstock fixed to the guide surface 16 so as to be adjustable in the Z-axis direction. A ram 22 is supported on the tailstock 21 so as to be able to advance and retreat on a coaxial line with the main shaft 13. A center 23 that supports the rear end of the camera is fitted.

【0020】ダイヤモンドバイト1よる基体の製造にお
いては、円筒状のワークWを数値制御旋盤10のチャッ
ク15に取付け、主軸10をサーボモータ14により2
000〜10000rpmで回転させ、ダイヤモンドバ
イト1の副切刃2の凹部の底部分でもワークWを切削す
るように刃物台19をサーボモータ20によりワークW
に向かってX軸方向に切り込み、切削点に適宜クーラン
トを流してサドル17に主軸1回転当たりの送り量が
0.05〜0.5mm/rev.でZ軸方向に送り運動
を与えてダイヤモンドバイト1によりワークWを切削加
工する。これによりワークWに複数条の凹凸を螺旋状に
効率的に形成することができる。これにより均一で微細
な条痕が表面に形成された表面粗さが0.5〜5μmの
基体を得ることができる。
In the manufacture of a substrate using a diamond cutting tool 1, a cylindrical work W is mounted on a chuck 15 of a numerically controlled lathe 10, and a spindle 10 is
The tool post 19 is rotated by the servo motor 20 so that the workpiece W is cut even at the bottom of the concave portion of the sub cutting edge 2 of the diamond cutting tool 1 while rotating at 000 to 10000 rpm.
In the X-axis direction, and a coolant is appropriately flowed at the cutting point to feed the saddle 17 with a feed rate of 0.05 to 0.5 mm / rev. The workpiece W is cut by the diamond cutting tool 1 by giving a feed motion in the Z-axis direction. Thereby, a plurality of irregularities can be efficiently formed spirally on the work W. This makes it possible to obtain a substrate having a surface roughness of 0.5 to 5 μm in which uniform and fine streaks are formed on the surface.

【0021】本発明に係るダイヤモンドバイト1におい
ては、上記のように、仕上げ加工としての切削加工を施
す際、副切刃2は、従来のダイヤモンドバイトのような
ダイヤモンド粒子の露出による刃こぼれ状の刃稜に比
べ、より滑らかな刃稜を有し、しかも、予めより鋭利な
所定の凹凸形状が付与されているため、優れた切れ味を
発揮し、そして、表面に微細な条痕を均一に且つバリを
発生させることなく形成できる。その結果、感光層にお
いて欠陥のない一層高品位な電子写真感光体の基体を製
造できる。
In the diamond cutting tool 1 according to the present invention, as described above, when cutting is performed as a finishing work, the sub cutting edge 2 is shaped like a conventional diamond cutting tool due to exposure of diamond particles. Compared to the blade ridge, it has a smoother blade ridge, and because it has been given a sharper predetermined uneven shape in advance, it exhibits excellent sharpness and uniformly and finely scratches on the surface It can be formed without generating burrs. As a result, a higher quality electrophotographic photoreceptor substrate free from defects in the photosensitive layer can be manufactured.

【0022】また、本発明に係るダイヤモンドバイト1
においては、副切刃2から前逃げ面5に亙って複数の溝
6による凹凸が形成されているので、切削中に発生する
微小な切削屑を副切刃2から前逃げ面5に連続する凹部
によって円滑に排出できるため、バリの発生をより確実
に防止することが出来る。
The diamond cutting tool 1 according to the present invention
In this case, since a plurality of grooves 6 are formed from the sub cutting edge 2 to the front flank 5, minute cutting chips generated during cutting are continuously formed from the sub cutting edge 2 to the front flank 5. Since the discharge can be performed smoothly by the concave portion, the generation of burrs can be more reliably prevented.

【0023】次に、ダイヤモンドバイト1の製造方法に
ついて説明する。図4は、ダイヤモンドバイト1の単結
晶ダイヤモンドチップ3を研磨する研磨機40を概略示
す斜視図である。ベッド41上にX軸方向に移動可能に
載置された主軸台42にはモータにより回転駆動される
主軸43がX軸と直角で水平なZ軸方向に軸承され、主
軸43の先端にはZ軸と直角な研磨面44が形成された
鋳物製の研磨円盤45が取り付けられている。主軸台4
2は公知の往復駆動装置によりX方向に往復動され、研
磨円盤45にオシレーションを付与できるようになって
いる。46はベッド41上にZ軸方向に移動可能に載置
された送りテーブルで、上面に研磨されるダイヤモンド
バイト1を着脱可能に取り付ける保治具47が固定さ
れ、研磨面44に向かって送りネジ機構により進退可能
となっている。
Next, a method for manufacturing the diamond cutting tool 1 will be described. FIG. 4 is a perspective view schematically showing a polishing machine 40 for polishing the single crystal diamond chip 3 of the diamond cutting tool 1. A spindle 43, which is rotationally driven by a motor, is mounted on a headstock 42 mounted on a bed 41 so as to be movable in the X-axis direction in a Z-axis direction which is perpendicular to the X-axis and is horizontal. A polishing disk 45 made of casting and having a polishing surface 44 perpendicular to the axis is attached. Headstock 4
2 is reciprocated in the X direction by a known reciprocating drive device so that the polishing disk 45 can be oscillated. Reference numeral 46 denotes a feed table mounted on the bed 41 so as to be movable in the Z-axis direction. A jig 47 for removably attaching the diamond cutting tool 1 to be polished on the upper surface is fixed. It is possible to advance and retreat.

【0024】先ず、図5に示すように、研磨面44が平
面に仕上られた研磨円盤45が取り付けられた研磨機4
0の保治具47にダイヤモンドバイト1をすくい面4が
研磨面44と平行になるように取り付け、研磨面44に
研磨油を混合したダイヤモンドパウダを塗布し、主軸4
3をモータで回転し、主軸台42を往復駆動装置により
X方向に往復運動させて研磨円盤45を回転及びオシレ
ーションさせた状態で、送りテーブル46を前進させて
すくい面4を研磨面44に押し付けてすくい面44を研
磨痕が残らないように研磨仕上げする。
First, as shown in FIG. 5, a polishing machine 4 equipped with a polishing disk 45 having a flat polishing surface 44 is mounted.
The diamond cutting tool 1 is mounted on the jig 47 so that the rake face 4 is parallel to the polishing face 44, and the polishing face 44 is coated with diamond powder mixed with polishing oil.
3 is rotated by a motor, the headstock 42 is reciprocated in the X direction by a reciprocating drive, and the polishing disk 45 is rotated and oscillated. The rake face 44 is pressed and polished so that no polishing marks remain.

【0025】次に、別の研磨機40の研磨円盤45の研
磨面44に、単結晶ダイヤモンドチップ3の前逃げ面5
に同一ピッチで形成された複数の溝6と実質的に同一形
状の複数の溝48を研磨円盤45の回転中心と同心円状
に10〜350個/mmの密度で形成する。即ち、保治
具47にRバイトを取り付け、研磨円盤45を回転駆動
し、副切刃2の凹凸部8の凸部と凹部のピーク点の間隔
dに前逃げ角βの余弦cosβを乗じた値mだけRバイトを
研磨面44に切り込んで深さmの断面が略二等辺三角形
の環状溝を旋削し、この環状溝を10〜350個/mm
の密度で繰り返し加工して複数の溝48を研磨面44に
形成する。その後、図6に示すように、保治具47にダ
イヤモンドバイト1を副切刃2が研磨円盤45の水平方
向の半径と実質的に一致し、且つ前逃げ面5が研磨面4
4と平行になるように取り付け、研磨面44に研磨油を
混合したダイヤモンドパウダを塗布し、主軸43をモー
タで回転し、主軸台42を静止させた状態で、送りテー
ブル46を前進させて前逃げ面5を研磨面44に押し付
けて研磨し、前逃げ面5に深さがm=d×cosβの溝6
を10〜350個/mmの密度で形成する。この場合、
研磨油を混合したダイヤモンドパウダを研磨面44に適
宜供給しながら溝6を研磨加工する。
Next, the front flank 5 of the single crystal diamond chip 3 is placed on the polishing surface 44 of the polishing disk 45 of another polishing machine 40.
A plurality of grooves 48 having substantially the same shape as the plurality of grooves 6 formed at the same pitch are formed concentrically with the rotation center of the polishing disk 45 at a density of 10 to 350 / mm. That is, a value obtained by attaching an R bit to the jig 47, rotating and driving the polishing disk 45, and multiplying the cosine cosβ of the front clearance angle β by the interval d between the peak point of the convex portion and the concave portion of the concave and convex portion 8 of the sub-cutting edge 2. An R bit is cut into the polished surface 44 by m, and an annular groove having a depth m of approximately an isosceles triangle is turned.
The grooves 48 are formed in the polished surface 44 by repeatedly processing at a density of. Then, as shown in FIG. 6, the diamond cutting tool 1 and the auxiliary cutting edge 2 are substantially aligned with the horizontal radius of the polishing disk 45 and the front flank 5 is
4 and a diamond powder mixed with polishing oil is applied to the polishing surface 44, the spindle 43 is rotated by a motor, and the feed table 46 is moved forward while the headstock 42 is stationary. The flank 5 is pressed against the polishing surface 44 for polishing, and the front flank 5 has a groove 6 having a depth of m = d × cos β.
Are formed at a density of 10 to 350 pieces / mm. in this case,
The groove 6 is polished while appropriately supplying diamond powder mixed with polishing oil to the polishing surface 44.

【0026】チップ3の前逃げ面5内の副切刃2と直角
な方向に単結晶ダイヤモンドの加工の容易な結晶方向が
実質的に一致するように単結晶ダイヤモンドチップ3が
形成されている場合、前逃げ面5に複数の溝6を正確に
鋭利に研磨加工することができ、副切刃2の凹凸8をよ
り鋭利に規則正しく形成し、基体表面に所望の条痕をよ
り均一にバリを発生させることなく形成することが可能
となる。
When the single crystal diamond chip 3 is formed such that the crystal direction in which the single crystal diamond is easily machined substantially matches the direction perpendicular to the sub-cutting edge 2 in the front flank 5 of the chip 3. The plurality of grooves 6 can be accurately and sharply polished on the front flank 5, the irregularities 8 of the sub-cutting edge 2 can be formed more sharply and regularly, and the desired streaks can be uniformly formed on the surface of the base body. It is possible to form without generating.

【0027】上記実施形態では、すくい面4を研磨仕上
げした後に、前逃げ面5に複数の溝6を形成している
が、前逃げ面5に複数の溝6を形成した後にすくい面4
を研磨仕上げするようにしてもよい。
In the above embodiment, after the rake face 4 is polished and finished, the plurality of grooves 6 are formed in the front flank 5, but after the plurality of grooves 6 are formed in the front flank 5, the rake face 4 is formed.
May be polished.

【0028】上記第1実施形態では、前逃げ面5に複数
の溝6を形成することにより副切刃2に切込み方向の凹
凸8を送り方向に同一ピッチで形成しているが、図7に
示すように、チップ52の上面にすくい面53、前面に
前逃げ面54を形成し、すくい面53の前端縁に、前逃
げ面54との交線に沿って副切刃55を送り方向と平行
に形成し、すくい面53に送り方向と略直角な方向に延
在する複数の溝56を送り方向に同一ピッチで副切刃5
5の全長に渡って複数個形成し、これにより副切刃55
に切込み方向の凹凸8を送り方向に同一ピッチで全長に
渡って複数個形成するようにしてもよい。
In the first embodiment, a plurality of grooves 6 are formed in the front flank 5 to form the unevenness 8 in the cutting direction on the sub cutting edge 2 at the same pitch in the feeding direction. As shown, a rake face 53 is formed on the upper surface of the chip 52, and a front flank 54 is formed on the front face, and the sub cutting edge 55 is formed on the front edge of the rake face 53 along the line of intersection with the front flank 54 in the feed direction. A plurality of grooves 56 formed in parallel and extending on the rake face 53 in a direction substantially perpendicular to the feed direction are provided with the sub-cutting blades 5 at the same pitch in the feed direction.
5 are formed over the entire length of the sub cutting edge 55,
Alternatively, a plurality of irregularities 8 in the cutting direction may be formed over the entire length at the same pitch in the feed direction.

【0029】この場合、凸部と凹部とのピーク点の間隔
が0.5〜5μmとなる凹凸8を副切刃55に形成する
ために、チップ32のすくい面53をすくい角0°、前
逃げ面54を前逃げ角βで平坦に仕上加工した場合、す
くい面54に連続して形成される複数の溝56は、すく
い面54に垂直方向の深さnを、n=d/tanβとし
て形成する。
In this case, in order to form the irregularities 8 on the sub-cutting edge 55 in which the interval between the peak points of the convex portions and the concave portions is 0.5 to 5 μm, the rake face 53 of the chip 32 is formed with a rake angle of 0 ° and a front angle of 0 °. When the flank 54 is finished to be flat at the front clearance angle β, the plurality of grooves 56 continuously formed on the rake face 54 have a depth n in a direction perpendicular to the rake face 54, where n = d / tanβ. Form.

【0030】すくい面4に複数の溝56を製造する方法
は、研磨円盤45の研磨面に形成する溝48の深さnを
n=d/tanβとする以外は、前逃げ面5に複数の溝
6を形成する場合と同様であるので、説明を省略する。
The method of manufacturing the plurality of grooves 56 on the rake face 4 is as follows. Except that the depth n of the groove 48 formed on the polishing surface of the polishing disk 45 is n = d / tanβ, a plurality of grooves 56 are formed on the front flank 5. Since this is the same as the case where the groove 6 is formed, the description is omitted.

【0031】本発明に係る単結晶ダイヤモンドバイト
は、電子写真感光体用円筒状基体の他にも加工表面に微
細な条痕を均一にバリを発生させることなく形成する必
要があるワークの切削加工に使用することができる。円
盤状ワークの盤面を切削加工する場合は、単結晶ダイヤ
モンドバイト1を副切刃7がX軸と平行になるように数
値制御旋盤10の刃物台19に取り付けてZ軸方向に切
込みを与え、刃物台19に主軸1回転当たりの送り量が
凹凸8のピッチの整数倍に等しくなるようにX軸方向に
送り運動を与えてダイヤモンドバイト1によりワークを
切削加工する。
The single-crystal diamond cutting tool according to the present invention is used for cutting a work that needs to form fine streaks uniformly on the processing surface without generating burrs in addition to the cylindrical substrate for the electrophotographic photosensitive member. Can be used for When cutting the disk surface of the disk-shaped work, the single crystal diamond tool 1 is attached to the tool rest 19 of the numerically controlled lathe 10 so that the sub cutting edge 7 is parallel to the X axis, and a cut is given in the Z axis direction. The workpiece is cut by the diamond tool 1 by giving a feed motion to the tool rest 19 in the X-axis direction so that the feed amount per one rotation of the main shaft becomes equal to an integral multiple of the pitch of the unevenness 8.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本発明に係るダイヤモンドバイトの側面図で
ある。
FIG. 1 is a side view of a diamond cutting tool according to the present invention.

【図2】 本発明に係るダイヤモンドバイトのチップを
示す斜視図である。
FIG. 2 is a perspective view showing a tip of a diamond cutting tool according to the present invention.

【図3】 本発明に係るダイヤモンドバイトを取り付け
てワークを切削加工する数値制御旋盤の斜視図である。
FIG. 3 is a perspective view of a numerical control lathe on which a work is cut by attaching a diamond cutting tool according to the present invention.

【図4】 チップを研磨する研磨機の斜視図である。FIG. 4 is a perspective view of a polishing machine for polishing chips.

【図5】 すくい面を平坦な研磨面で仕上げ研磨する状
態を示す図である。
FIG. 5 is a diagram showing a state in which a rake face is finish-polished with a flat polished face.

【図6】 溝が形成された研磨面で前逃げ面に複数の溝
を形成する状態を示す図である。
FIG. 6 is a view showing a state in which a plurality of grooves are formed on a front flank on a polished surface on which grooves are formed.

【図7】 チップの第2実施形態を示す斜視図である。FIG. 7 is a perspective view showing a second embodiment of the chip.

【符号の説明】[Explanation of symbols]

1…単結晶ダイヤモンドバイト、2,55…副切刃、
3,52…チップ、4,53…すくい面、5,54…前
逃げ面、6,56…溝、7…シャンク、8…凹凸、10
…数値制御旋盤、40…研磨機、44…研磨面、45…
研磨円盤、48…溝、W…ワーク。
1 ... single crystal diamond tool, 2, 55 ... minor cutting edge,
3, 52: tip, 4, 53: rake face, 5, 54: front flank face, 6, 56: groove, 7: shank, 8: unevenness, 10
... numerical control lathe, 40 ... polishing machine, 44 ... polishing surface, 45 ...
Polishing disk, 48 groove, W work.

フロントページの続き Fターム(参考) 3C046 AA07 CC00 HH01 3C058 AA04 AA07 AA09 CA01 CA04 CB01 CB03 DA02 DB08 Continued on front page F-term (reference) 3C046 AA07 CC00 HH01 3C058 AA04 AA07 AA09 CA01 CA04 CB01 CB03 DA02 DB08

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 単結晶ダイヤモンドチップがシャンク先
端に取り付けられ回転するワークに対して切込み及び切
込み方向と直角な送り方向に送り運動されてワークを切
削加工する単結晶ダイヤモンドバイトにおいて、前記チ
ップ上面に形成されたすくい面の前端縁に前記チップ前
面に形成された前逃げ面との交線に沿って副切刃を前記
送り方向と平行に形成し、該副切刃に切込み方向の凹凸
を送り方向に同一ピッチで全長に渡って複数個形成した
ことを特徴とする単結晶ダイヤモンドバイト。
1. A single-crystal diamond cutting tool in which a single-crystal diamond tip is attached to a tip of a shank, is cut into a rotating workpiece, and is fed in a feed direction perpendicular to the cutting direction to cut the workpiece. A sub-cutting edge is formed on the front edge of the formed rake face in parallel with the feed direction along a line of intersection with a front flank formed on the front surface of the chip, and irregularities in the cutting direction are fed to the sub-cutting edge. A single-crystal diamond bite formed in plural at the same pitch in the direction over the entire length.
【請求項2】 請求項1に記載の単結晶ダイヤモンドバ
イトにおいて、前記前逃げ面に前記送り方向と略直角な
方向に延在する複数の溝を送り方向に前記同一ピッチで
形成することにより前記副切刃に前記凹凸を形成したこ
とを特徴とする単結晶ダイヤモンドバイト。
2. The single crystal diamond tool according to claim 1, wherein a plurality of grooves extending in a direction substantially perpendicular to the feed direction are formed on the front flank at the same pitch in the feed direction. A single-crystal diamond tool, wherein the irregularities are formed on a sub-cutting edge.
【請求項3】 請求項1に記載の単結晶ダイヤモンドバ
イトにおいて、前記すくい面に前記送り方向と略直角な
方向に延在する複数の溝を送り方向に前記同一ピッチで
形成することにより前記副切刃に前記凹凸を形成したこ
とを特徴とする単結晶ダイヤモンドバイト。
3. The single crystal diamond cutting tool according to claim 1, wherein a plurality of grooves extending in a direction substantially perpendicular to the feed direction are formed on the rake face at the same pitch in the feed direction. A single-crystal diamond cutting tool, wherein the unevenness is formed on a cutting edge.
【請求項4】 請求項1乃至請求項3のいずれかに記載
の単結晶ダイヤモンドバイトにおいて、前記前逃げ面又
はすくい面内で前記副切刃と略直角な方向に前記単結晶
ダイヤモンドの加工が容易な結晶方向を実質的に一致さ
せたことを特徴とする単結晶ダイヤモンドバイト。
4. The single crystal diamond cutting tool according to claim 1, wherein the single crystal diamond is machined in a direction substantially perpendicular to the sub cutting edge in the front flank or rake face. A single-crystal diamond cutting tool characterized by substantially matching easy crystallographic directions.
【請求項5】 請求項1乃至請求項4のいずれかに記載
の単結晶ダイヤモンドバイトを製造する方法にして、研
磨機に回転可能に支承された研磨円盤の回転中心と直角
な研磨面に、前記ダイヤモンドチップに同一ピッチで形
成された複数の溝と同一形状の複数の溝を前記同一ピッ
チで前記研磨円盤の回転中心と同心円状に刻設し、前記
研磨円盤を前記研磨面に研削油を混合したダイヤモンド
パウダが供給された状態で回転駆動し、前記副切刃を前
記研磨円盤の半径方向に実質的に一致させた状態で前記
ダイヤモンドチップの前逃げ面又はすくい面を前記研磨
面に押し付けることにより前記複数の溝を前記ダイヤモ
ンドチップの前逃げ面又はすくい面に形成することを特
徴とする単結晶ダイヤモンドバイトの製造方法。
5. The method for producing a single crystal diamond tool according to claim 1, wherein a polishing surface perpendicular to a rotation center of a polishing disk rotatably supported by a polishing machine is provided. A plurality of grooves of the same shape as a plurality of grooves formed at the same pitch on the diamond chip are engraved at the same pitch concentrically with the rotation center of the polishing disk, and the polishing disk is ground with grinding oil. While the mixed diamond powder is supplied, it is driven to rotate, and the front flank or rake face of the diamond chip is pressed against the polishing surface with the sub-cutting edge substantially aligned in the radial direction of the polishing disk. Forming a plurality of grooves on the front flank or rake face of the diamond tip.
JP2001121057A 2001-04-19 2001-04-19 Single crystal diamond cutting tool and its manufacturing method Pending JP2002307210A (en)

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JP2005527394A (en) * 2002-05-29 2005-09-15 スリーエム イノベイティブ プロパティズ カンパニー Diamond tool with multi-chip diamond
WO2007047593A1 (en) * 2005-10-19 2007-04-26 3M Innovative Properties Company Aligned multi-diamond cutting tool assembly for creating microreplication tools
WO2007047712A1 (en) * 2005-10-19 2007-04-26 3M Innovative Properties Company Cutting tool assembly including diamond cutting tips at half-pitch spacing for land feature creation
JP2009166191A (en) * 2008-01-17 2009-07-30 Towa Corp Working method of diamond tool, and diamond tool
JP2011502058A (en) * 2007-10-29 2011-01-20 スリーエム イノベイティブ プロパティズ カンパニー Cutting tool using one or more machined tool tips with diffractive mechanisms
JP2014208396A (en) * 2013-03-29 2014-11-06 住友電工ハードメタル株式会社 METHOD OF MANUFACTURING cBN GRINDING TOOL
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Cited By (14)

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JP2005527394A (en) * 2002-05-29 2005-09-15 スリーエム イノベイティブ プロパティズ カンパニー Diamond tool with multi-chip diamond
KR101330857B1 (en) 2005-10-19 2013-11-18 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Aligned multi-diamond cutting tool assembly for creating microreplication tools and method for creating the same
WO2007047712A1 (en) * 2005-10-19 2007-04-26 3M Innovative Properties Company Cutting tool assembly including diamond cutting tips at half-pitch spacing for land feature creation
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TWI385040B (en) * 2005-10-19 2013-02-11 3M Innovative Properties Co Cutting tool assembly including diamond cutting tips at half-pitch spacing for land feature creation
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JP2011502058A (en) * 2007-10-29 2011-01-20 スリーエム イノベイティブ プロパティズ カンパニー Cutting tool using one or more machined tool tips with diffractive mechanisms
JP2014128874A (en) * 2007-10-29 2014-07-10 3M Innovative Properties Co Cutting tool using one or more machined tool tips with diffractive mechanism
JP2009166191A (en) * 2008-01-17 2009-07-30 Towa Corp Working method of diamond tool, and diamond tool
JP2014208396A (en) * 2013-03-29 2014-11-06 住友電工ハードメタル株式会社 METHOD OF MANUFACTURING cBN GRINDING TOOL
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JPWO2020178932A1 (en) * 2019-03-04 2021-03-11 国立大学法人東海国立大学機構 Machining method and machining equipment

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