JP3088537B2 - Finishing method and processing device for holes of high hardness material - Google Patents

Finishing method and processing device for holes of high hardness material

Info

Publication number
JP3088537B2
JP3088537B2 JP35050591A JP35050591A JP3088537B2 JP 3088537 B2 JP3088537 B2 JP 3088537B2 JP 35050591 A JP35050591 A JP 35050591A JP 35050591 A JP35050591 A JP 35050591A JP 3088537 B2 JP3088537 B2 JP 3088537B2
Authority
JP
Japan
Prior art keywords
processing
reamer
finishing
hole
work
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP35050591A
Other languages
Japanese (ja)
Other versions
JPH05162012A (en
Inventor
剛士 稲田
重樹 向井
秀雄 五十嵐
忠夫 松井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nachi Fujikoshi Corp
Toyota Motor Corp
Original Assignee
Nachi Fujikoshi Corp
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nachi Fujikoshi Corp, Toyota Motor Corp filed Critical Nachi Fujikoshi Corp
Priority to JP35050591A priority Critical patent/JP3088537B2/en
Publication of JPH05162012A publication Critical patent/JPH05162012A/en
Application granted granted Critical
Publication of JP3088537B2 publication Critical patent/JP3088537B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Milling, Broaching, Filing, Reaming, And Others (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】この発明は、CBN、ダイヤモン
ドなどの硬質砥粒を刃部に電着などで固着したリーマに
より、高硬度材の孔を振動仕上げ加工する加工方法及び
加工装置に関する。
BACKGROUND OF THE INVENTION This invention, CBN, by reamer fixed hard abrasive grains such as like the blade portion to the electrodeposition diamond working method and vibrating finishing holes in hardened steel
It relates to a processing device .

【0002】[0002]

【従来の技術】HRc50以上に焼き入れされ、または
HRc30から50に調質された高硬度材の孔仕上げ加
工には、通常、砥石による内面研削加工又はホ−ニング
加工が行われていた。また、高硬度材の孔の仕上げ加工
にはワ−クの孔を精度良く仕上げることが求められるこ
とが多い。例えばワ−クが歯車や金型の場合、孔位置を
基準にして加工を行うので、孔位置を高精度に保って加
工しなけれならない。このようなワークの孔の研削加工
を行うには、ワークを強固、かつ高精度に保持する必要
があるが、このようにワークを保持することは至難の業
である。そのために、加工孔位置がずれたり、加工孔が
偏芯して加工孔とワ−ク外周の振れが大となって、満足
のいくワ−ク精度が得られないおそれがある。
2. Description of the Related Art Hole finishing of a hardened material hardened to HRc 50 or more or tempered to HRc 30 to 50 is usually carried out by inner grinding or honing with a grindstone. In addition, it is often required to finish the hole of the work with high accuracy in finishing the hole of the hard material. For example, when the work is a gear or a mold, the machining is performed based on the hole position, so that the machining must be performed while maintaining the hole position with high precision. In order to grind the hole of such a work, it is necessary to hold the work firmly and with high precision, but it is extremely difficult to hold the work in this way. For this reason, there is a possibility that the position of the processing hole is displaced or the processing hole is eccentric, and the deflection between the processing hole and the outer periphery of the work becomes large, so that satisfactory work accuracy cannot be obtained.

【0003】即ち、内面研削加工では、面粗度が1〜2
Rz、真円度が2〜4.5μmであるが、振れ精度が4
0〜60μmとなり、高精度化には限界がある。一方、
ホ−ニング仕上げ加工では、面粗度が1〜2Rz、真円
度が1〜2μm程度と高精度加工が可能であるが、加工
時間が長くかかりすぎ、しかも加工に際しては加工軸数
を多くして能率向上をはかっているために加工機械が大
型となり、しかも機械が高価であるので生産コストの増
大を招くことになる。かかる課題を解決すべくリ−マ刃
部に硬質砥粒(CBN又はダイヤモンド等の砥粒をい
う)を固着した(実際は電着した)種々のリ−マが発明
されている(例えば実開平3−40058号参照)。
[0003] That is, in the internal grinding, the surface roughness is 1-2.
Rz, roundness is 2 to 4.5 μm, but runout accuracy is 4
The thickness is 0 to 60 μm, and there is a limit to achieving higher precision. on the other hand,
Honing finish processing enables high precision processing with a surface roughness of 1 to 2 Rz and a roundness of about 1 to 2 μm. However, the processing time is too long, and the number of processing axes is increased in processing. In order to improve efficiency, the processing machine becomes large, and the production cost is increased because the machine is expensive. In order to solve such a problem, various reamers in which hard abrasive grains (referred to as abrasive grains such as CBN or diamond) are fixed (actually electrodeposited) to the reamer blade portion have been invented (for example, Japanese Utility Model Application Laid-Open No. HEI 3-103). -40058).

【0004】[0004]

【発明が解決しようとする課題】このようなリーマをフ
ロ−ティングチャックで把持し、研削代を0.1mm、
切削速度200m/minで回転数約4500回転(φ
15mmのリ−マ)で加工を試みてみた。しかし、硬度
をHRc55にした鋼の加工ではワ−ク孔精度も悪く、
そのうえ切り屑が砥粒間に詰まり砥粒の剥離が発生して
工具寿命が著しく短かった。かかる原因を究明したとこ
ろ、細長い切り屑が砥粒間に付着して切り屑詰まりを生
じ、砥粒が脱落して電着層が剥離することが判明した。
Such a reamer is gripped by a floating chuck, and the grinding allowance is 0.1 mm.
At a cutting speed of 200 m / min, the number of revolutions is about 4500 revolutions (φ
(15 mm reamer). However, when machining steel having a hardness of HRc55, the work hole accuracy is poor,
In addition, the chips were clogged between the abrasive grains and the abrasive grains were separated, resulting in a remarkably short tool life. As a result of investigating such a cause, it was found that elongated chips adhered between the abrasive grains and clogged the chips, the abrasive grains fell off, and the electrodeposition layer was peeled off.

【0005】[0005]

【課題を解決するための手段】本発明は、かかる課題を
解決すべく、刃部に硬質砥粒を固着したリーマにより高
硬度材の孔を仕上げ加工する加工方法であって、孔を仕
上げ加工する際に第1の加工工程と第2の加工工程とを
設け、第1の加工工程と第2の加工工程においてワーク
とリーマの少なくとも一方を低周波振動させるととも
、第1の加工工程の振動数及び振幅を、第2の加工工
程の振動数及び振幅よりも大きくすることにより、加工
孔精度、位置精度および工具寿命、加工能率の向上を図
ったものである。また、リーマに荒加工部と仕上げ部と
を設け、第1の加工工程をリーマの荒加工部における加
工とし、第2の加工工程をリーマの仕上げ部における
工とするとよい。また、係る加工方法を実施するため
に、刃部に硬質砥粒を固着したリーマを回転及び上下運
動させることで高硬度材の孔を仕上げ加工する加工装置
であって、ワークを支持するワーク支持手段と、荒加工
部と仕上げ部を有するリーマと、ワークに穿設された孔
とリーマの軸芯の位置合わせを行う位置合わせ手段と、
ワークとリーマの少なくとも一方に、リーマの荒加工部
による加工時と仕上げ部による加工時とは異なる低周波
振動を与える低周波振動付与手段と、を設けた高硬度材
の孔の仕上げ加工装置を提供することによって前述した
課題を解決した。
SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention is a processing method for finishing a hole in a high-hardness material by a reamer having hard abrasive grains fixed to a blade portion. A first processing step and a second processing step, at least one of the work and the reamer is subjected to low frequency vibration in the first processing step and the second processing step, and the vibration of the first processing step is performed. The number and amplitude
By making the vibration frequency and amplitude larger than those described above, machining hole accuracy, position accuracy, tool life, and machining efficiency are improved. Furthermore, it provided a roughing unit and a finishing unit in the reamer, the first processing step and processed in the roughing portion of the reamer, pressurizing the second processing step in the finishing portion of the reamer
It is good to work . Further, according machining method for carrying out, a processing apparatus for finishing a hole having a high hardness material by causing the Lee Ma that fixing the hard abrasive grains on the cutting unit rotating and vertical movement, supporting the workpiece Work supporting means, a reamer having a rough machining portion and a finishing portion, and a positioning means for performing positioning of a hole formed in the work and an axis of the reamer,
At least one of the workpiece and the reamer, a low-frequency vibration imparting means for applying a low-frequency vibration different from the time of processing by the rough processing part of the reamer and the time of processing by the finishing part, The above-mentioned problem was solved by providing.

【0006】なお、研削加工においては、高周波振動を
利用したり(例えば特開昭62−162451号)、あ
るいは超音波振動と低周波振動を重畳させる方法(特開
昭63−62661号)はあるが、本発明と異なり高周
波振動を利用した場合は、振動数が10KHz以上、振
幅0.03〜0.12mm/minの微振動であり、溶
着防止、切削トルクの軽減、高能率加工等を目的とした
ものである。また、高周波と低周波とを発生させるには
構造が複雑になる。本発明は上記のごとくリーマ加工方
法に関するものであり、しかも、ワーク又はリーマにリ
ーマの軸方向に低周波振動を与えながら高硬度材を仕上
げ、さらに、第1の加工工程の振動数及び振幅を、第2
の加工工程の振動数及び振幅よりも大きくすることによ
り、切削加工であるリーマ加工法における切り屑の分断
作用に有効な低周波振動を加工条件に応じて効率よく利
したものであり、本願はかかる知見に基づいてなされ
た新規な発明である。
In the grinding process, there is a method of utilizing high frequency vibration (for example, Japanese Patent Application Laid-Open No. 62-162451) or a method of superposing ultrasonic vibration and low frequency vibration (Japanese Patent Application Laid-Open No. 63-62661). However, unlike the present invention, when high frequency vibration is used, the frequency is 10 KHz or more and the amplitude is 0.03 to 0.12 mm / min, which is fine vibration, and is intended to prevent welding, reduce cutting torque, and perform high-efficiency processing. It is what it was. Further, the structure becomes complicated to generate high frequency and low frequency. The present invention relates to a reamer processing method as described above, and finishes a hard material while applying low-frequency vibration to a work or a reamer in the axial direction of the reamer. Further, the frequency and amplitude of the first processing step are reduced. , Second
The frequency and amplitude of the machining process
Ri is obtained by utilizing efficiently depending on the processing conditions an effective low-frequency vibration to cutting action of the chips in the reaming process is a cutting process, the present application is a novel invention has been completed based on this finding.

【0007】なお、本発明における低周波振動は、振動
数が5Hzから500Hz、振幅0.1mmから3.0
mmが好ましい。また、加工孔が小径でこれに用いられ
るリーマの刃部外径が2mm以下の場合には、刃部の剛
性が小さく切り屑の分断ができなくて切れ刃砥粒間に切
り屑が詰まってしまい、加工が不可能になるので、振幅
0.1mm、振動数を5Hz、リーマの回転速度10m
/minを下限とするのが好ましい。また、ワークの孔
径が大径でリーマの刃部外径が100mm以上になると
研削代が大きくなり、かつ振幅を3.0mm以上にする
と加工孔の精度、面粗度が非常に悪くなるので、振幅
3.0mm、振動数を500Hzの低周波振動とし、リ
ーマの回転速度300m/minを上限とするのが好ま
しい。
[0007] The low frequency vibration in the present invention is a vibration.
Number is 5Hz to 500Hz, amplitude is 0.1mm to 3.0
mm is preferred. Also, the processing hole has a small diameter and is used for this.
If the outer diameter of the blade of the reamer is
The cutting performance is too small to cut chips.
Chips are clogged and processing becomes impossible.
0.1mm, frequency 5Hz, reamer rotation speed 10m
/ Min is preferably the lower limit. Also, holes in the work
When the diameter is large and the outer diameter of the reamer blade is 100 mm or more
Grinding allowance increases and amplitude is set to 3.0 mm or more
The accuracy and surface roughness of the machined hole and surface roughness are very poor,
3.0 mm, the frequency is low frequency vibration of 500 Hz.
It is preferable to set the upper limit of the rotation speed of the motor to 300 m / min.
New

【0008】[0008]

【作用】リ−マ、ワ−クのうちのいずれか一方に軸方向
の低周波振動を与え、かつ回転を与えると、砥粒で研削
された細長い切り屑は分断され、小さな細かい切り屑と
なって砥粒間に詰まることなく外部に排出される。この
とき、第1の加工工程の振動数及び振幅を、第2の加工
工程の振動数及び振幅よりも大きくすることにより、そ
れぞれの加工状況に応じて適切な切り屑の排出条件を与
えることができ、第1の加工工程で取り代のかなりの部
分を除去し、第2の加工工程で面粗度を向上させる。リ
ーマに荒加工部と仕上げ部とを設け、第1の加工工程を
リーマの荒加工部(食いつき部)における加工とし、第
2の加工工をリーマの仕上げ部(円筒部)における加工
とすれば、加工孔精度、位置精度が確保される。
When a low frequency vibration in the axial direction is applied to one of the reamer and the work and the rotation is applied, the elongated chips ground by the abrasive grains are divided, and the small chips are removed. And is discharged outside without clogging between the abrasive grains. At this time, the frequency and amplitude of the first processing
By increasing the frequency and amplitude of the process,
Set appropriate chip discharge conditions according to the respective machining conditions.
Can be obtained, and a considerable part of the allowance is
Then, the surface roughness is improved in the second processing step. Re
A roughing part and a finishing part are provided on the
Processing at the roughing part (biting part) of the reamer
2 processing in the finishing part (cylindrical part) of the reamer
In this case, the accuracy of the processing hole and the accuracy of the position are ensured.

【0009】[0009]

【実施例】次に本発明の方法を実施するための装置の一
例を図1について説明する。図1は刃部に硬質砥粒を固
着したリーマ回転及び上下運動させることで高硬度材の
孔を仕上げ加工する加工装置であって、1はワーク支持
手段であるワーク支持板3に載置され固定された円板状
のワ−クである。ワ−ク支持板3にはワーク1に穿設さ
れた孔2と連通する工具逃げ孔4が穿設され、さらに
周波振動付与手段である振動テーブル5に支承されてい
る。本発明に用いられるリーマ6は、逃げ部7a、ワー
クの孔2よりも僅かに大径の仕上げ部である円筒部7
b、先端から円筒部7bに向けて大径となるテ−パ状の
荒加工部である食いつき部7cを有する刃部7、及び該
刃部7に連続する円柱状の柄8とから構成されている。
さらに刃部7にはその外周に硬質砥粒(CBN,ダイヤ
モンド等)が電着されている。シャンク8は前記のワー
ク支持板3、振動テーブル5の上方に位置するフロ−テ
ィングチヤック9により把持されている。振動テーブル
5は仕上げ部による加工時と粗加工部による加工時の低
周波振動条件が異なるようにされている。
FIG. 1 shows an example of an apparatus for carrying out the method of the present invention. Fig. 1 shows hard abrasive grains fixed on the blade.
By rotating the reamer and moving it up and down,
A processing device that finishes a hole.
This is a disk-shaped work placed and fixed on the work support plate 3 as a means . Wa - the click support plate 3 is formed in the workpiece 1
The hole 2 and the tool relief hole 4 communicating is bored, even lower
It is supported by a vibration table 5 which is a frequency vibration applying means . The reamer 6 used in the present invention has a relief portion 7a and a cylindrical portion 7 which is a finished portion having a slightly larger diameter than the hole 2 of the work.
b, a tapered shape having a large diameter from the tip toward the cylindrical portion 7b
It comprises a blade 7 having a biting portion 7c which is a rough processing portion , and a cylindrical handle 8 continuous with the blade 7.
Further, hard abrasive grains (CBN, diamond, etc.) are electrodeposited on the outer periphery of the blade portion 7. The shank 8 is held by a floating chuck 9 located above the work support plate 3 and the vibration table 5. Vibrating table
5 is low when processing by the finishing part and when processing by the rough processing part
The frequency oscillation conditions are different.

【0010】リーマ仕上げ加工を行うには、まず、図示
しない位置合わせ手段によりワークの孔2の位置決めを
行う。即ち、ワ−クの孔2をワ−ク支持板3の孔4に臨
ませてから、リーマ6の軸芯L−Lに合致する図示しな
い昇降自在な案内部を振動テ−ブル5からワーク支持板
3の孔4とワ−ク貫通孔2に突き通してワ−ク孔2の位
置決めをする。次いで、ワ−ク1をワ−ク支持板3に固
定する。ワ−ク1の固定が完了したら、図示しない案内
部を振動テ−ブル5まで下げる。次いで、リーマ6を回
転させながらワ−ク孔1の貫通孔2を研削仕上げ加工し
ながら徐々にリーマ6を通過させ、刃部7がワーク1の
貫通孔2を通過完了した時点で加工を完了する。
[0010] To perform the reaming finish processing, first,
Positioning of the hole 2 of the workpiece by the non-aligning means
Do. That is, after the hole 2 of the work is made to face the hole 4 of the work support plate 3, a vertically movable guide (not shown) that matches the axis LL of the reamer 6 is moved from the vibration table 5 to the work. The work hole 2 is positioned by penetrating the hole 4 of the support plate 3 and the work through hole 2. Next, the work 1 is fixed to the work support plate 3. When the work 1 is completely fixed, the guide (not shown) is lowered to the vibration table 5. Next, while the reamer 6 is being rotated, the through hole 2 of the work hole 1 is gradually passed through the reamer 6 while grinding and finishing, and the processing is completed when the blade portion 7 has completed passing through the through hole 2 of the work 1. I do.

【0011】(実施例1) 例えばクロム鋼鋼材であるSCr420製のワ−ク1の
孔2の内周面を研削仕上げ加工するには、まずワ−ク1
を支持板3に固定し、リーマ6に矢印Bに示すように切
削速度10m/minから300m/minの回転を与
え、さらに矢印A方向に送ると同時に振動テ−ブル5に
軸方向の振幅0.1mm〜3.0mm、振動数5Hzか
ら500Hzの低周波振動を与えた。
(Example 1) For example, in order to finish the inner peripheral surface of the hole 2 of the work 1 made of chromium steel material SCr420, the work 1
Is fixed to the support plate 3, and the reamer 6 is rotated at a cutting speed of 10 m / min to 300 m / min as shown by the arrow B, and is further fed in the direction of the arrow A, and at the same time the amplitude of the axial A low frequency vibration of 0.1 mm to 3.0 mm and a frequency of 5 Hz to 500 Hz was applied.

【0012】これを具体的に示すと、ワーク諸元が硬さ
HRc60、加工孔径φ15.4mm、加工孔長さ28
mm、取り代0.002〜0.05mmのSCr420
材を、振動数50Hz、片振幅0.8mm、移動速度4
0mm/min、回転数800rpmの加工条件で加工
したところ、トルク40〜52.5kgf・cm,スラ
スト10〜22.5kgfで支障なく加工ができた。こ
の場合に切り屑が細かく分断していることが確認され
た。また、加工精度は面粗度0.9〜1.5Rz,真円
度1〜2.5μm,加工孔径のバラツキ8μm,振れ1
5μm(MAX)と向上した。
[0012] shows this in detail, word over click specifications hardness HRC60, processing hole diameter Fai15.4Mm, machining hole length 28
mm, SCr420 with a stock removal of 0.002 to 0.05 mm
The material was subjected to a frequency of 50 Hz, a single amplitude of 0.8 mm, and a moving speed of 4.
When processing was performed under the processing conditions of 0 mm / min and a rotation speed of 800 rpm, processing was successfully performed at a torque of 40 to 52.5 kgf · cm 2 and a thrust of 10 to 22.5 kgf . In this case, it was confirmed that the chips were finely divided. The processing accuracy was 0.9 to 1.5 Rz, the roundness was 1 to 2.5 μm, the variation in the processing hole diameter was 8 μm, and the runout was 1
It improved to 5 μm (MAX).

【0013】一方、試みに、上記と同一の材料を用いて
振動を与えずに移動速度40mm/min,回転数80
0rpmの加工条件で仕上げ加工したところ、トルク1
38kgf・cm,スラスト40kgfで切り屑が分断
せず、リーマに溶着が発生したために異常音が発生した
ため1個も加工できなかった。本発明においては、さら
に加工面の向上をはかるため次のようにした。
On the other hand, in the trial, the same material as described above was used, without applying vibration, at a moving speed of 40 mm / min and a rotation speed of 80.
After finishing at 0 rpm, torque 1
At 38 kgf · cm 2 and thrust 40 kgf, the chips were not divided, and welding was generated on the reamer, and an abnormal sound was generated. In the present invention,
In order to improve the machined surface, the following was done.

【0014】(実施例2) 次に、先ず、食いつき部7c(荒加工部)において振動
数50Hz、振幅0.8mm、回転数800rpm、送
り40mm/minで加工を行い、前記食いつき部7c
を通過した後、大径の円筒部7bに入ると、振動数を2
0Hz、振幅を0.4mmとして、回転数と送りは変え
ずにそのまま加工を行ったところ、仕上げ面粗さが0.
7Rzと向上した。これは、荒加工部である食いつき部
7cにおいて取り代のかなり部分が除去され、仕上げ部
である大径の円筒部7bにおいては、面粗度向上作用を
果たすことに起因するのである。
(Embodiment 2) Next, the biting portion 7c (rough processing portion) is processed at a frequency of 50 Hz, an amplitude of 0.8 mm, a rotation speed of 800 rpm, and a feed of 40 mm / min.
After passing through the large-diameter cylindrical portion 7b, the vibration frequency becomes 2
When the processing was carried out as it was without changing the number of revolutions and feed at 0 Hz and an amplitude of 0.4 mm, the finished surface roughness was 0.4 mm.
Improved to 7Rz. This is due to the fact that a considerable portion of the allowance is removed in the biting portion 7c, which is a rough processing portion, and the large-diameter cylindrical portion 7b, which is a finishing portion, has a surface roughness improving effect.

【0015】なお、実施例ではリ−マの刃部7は先端に
食いつき7cを設けた円筒部7bの外周に硬質砥粒を固
着した工具を使用しているが、これに限らず円筒部の外
周に軸方向の溝、ねじれ溝を設けたり、あるいは普通形
状のリ−マに硬質砥粒を固着したものを用いることがで
きることは言うまでもでもない。さらに、上記実施例
は、テ−ブルに低周波振動を与えたものであるが、これ
に代えるにリーマ側に、つまりチヤックに低周波振動を
与え回転させて孔仕上げ加工をしても同様に良好な結果
が得られた。チャックも実施例ではフロ−ティングチヤ
ックを使用しているが、この他に固定軸チヤックを使用
してもよい。
In the embodiment, the blade 7 of the reamer uses a tool having hard abrasive grains fixed to the outer periphery of a cylindrical portion 7b having a bite 7c at the tip. However, the present invention is not limited to this. It goes without saying that an axial groove or a twist groove may be provided on the outer periphery or a hardened abrasive grain fixed to a regular-shaped reamer may be used. Further, in the above embodiment, the table is given low-frequency vibration. Alternatively, the hole can be finished by rotating the table on the reamer side, that is, by giving low-frequency vibration to the chuck and rotating the table. Good results were obtained. Although the chuck uses a floating chuck in the embodiment, a fixed shaft chuck may be used instead.

【0016】[0016]

【効果】本発明に係る高硬度材の振動仕上げ加工方法
は、上記の通り工具を回転させ、ワ−ク又は工具に低周
波振動させ、さらに、第1の加工工程の振動数及び振幅
を、第2の加工工程の振動数及び振幅よりも大きくさせ
て、研削加工を行うので、加工条件に応じて最適な条件
で硬質砥粒で切られた細長い研削屑を分断し、細分化さ
せて研削ができ、第1の加工工程で効率よく取り代のか
なりの部分が除去され、第2の加工工程で面粗度を向上
させるので、実施例に示すように切り屑づまりもなく高
精度の孔仕上げができ、工具寿命を長くすることが出来
るなどの多くの優れた効果が得られた。さらに、リーマ
に荒加工部と仕上げ部とを設け、第1の加工工程を荒加
工とし、第2の加工工を仕上げ加工とすれば、さらに加
工孔精度、位置精度が確保され加工能率が向上するもの
となった。また、低周波振動のみを変化させて使用する
ので高周波と低周波とを組み合わせたものに比べ構造も
簡単で制御のし易いものとなった。
According to the vibration finishing method for a hard material according to the present invention, the tool is rotated as described above to cause the work or the tool to vibrate at a low frequency, and further, the frequency and amplitude of the first processing step are performed.
Is made larger than the frequency and amplitude of the second processing step.
And grinding, so that the optimal conditions
To separate slender grinding chips cut with hard abrasive grains
Can be removed and efficiently removed in the first processing step?
Removed part of the surface, improving surface roughness in the second processing step
Therefore, as shown in the examples, many excellent effects were obtained, such as high-precision hole finishing without chip clogging and prolonging the tool life. In addition, reamer
Rough processing part and finishing part are provided in the first processing step.
If the second processing step is a finishing step,
The one that secures hole accuracy and position accuracy and improves machining efficiency
It became. Further, since only low-frequency vibration is used, the structure is simpler and easier to control than a combination of high frequency and low frequency.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明方法を実施するために用いられる装置と
ワ−クとの関係を示す断面図である。
FIG. 1 is a cross-sectional view showing a relationship between an apparatus used to carry out the method of the present invention and a work.

【符号の説明】[Explanation of symbols]

1.......ワーク 2.......ワークの孔 3.......ワーク支持手段(ワーク支持板) 4.......工具逃げ孔 5.......振動テーブル 6.......リーマ 7.......刃部7b......仕上げ部(円筒部) 7c......荒加工部(食いつき部) 8.......シャンク 9.......チャック1. . . . . . . Work 2. . . . . . . Work hole 3. . . . . . . 3. Work support means (work support plate) . . . . . . Tool relief hole 5. . . . . . . Vibration table 6. . . . . . . Reamer 7. . . . . . . Blade part 7b. . . . . . Finishing part (cylindrical part) 7c. . . . . . Rough processing part (biting part) . . . . . . Shank 9. . . . . . . Chuck

───────────────────────────────────────────────────── フロントページの続き (72)発明者 五十嵐 秀雄 富山県富山市石金20番地 株式会社不二 越内 (72)発明者 松井 忠夫 富山県富山市石金20番地 株式会社不二 越内 (56)参考文献 特開 平2−106237(JP,A) 特公 昭58−27063(JP,B2) 特公 昭50−20716(JP,B1) 特公 昭62−40123(JP,B2) 実公 昭37−21795(JP,Y1) (58)調査した分野(Int.Cl.7,DB名) B23D 75/00 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Hideo Igarashi 20 Ishigane, Toyama City, Toyama Prefecture Fuji Koshiuchi Co., Ltd. (72) Inventor Tadao Matsui 20 Ishikin, Toyama City, Toyama Prefecture Fuji Koshiuchi Co., Ltd. 56) References JP-A-2-106237 (JP, A) JP-B-58-27063 (JP, B2) JP-B-50-20716 (JP, B1) JP-B 62-40123 (JP, B2) 37-21595 (JP, Y1) (58) Fields investigated (Int. Cl. 7 , DB name) B23D 75/00

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 刃部に硬質砥粒を固着したリーマにより
高硬度材の孔を仕上げ加工する加工方法であって、孔を
仕上げ加工する際に第1の加工工程と第2の加工工程と
を有し、前記第1の加工工程と第2の加工工程において
ワークとリーマの少なくとも一方を低周波振動させると
ともに、前記第1の加工工程の振動数及び振幅を、前記
第2の加工工程の振動数及び振幅よりも大きくしたこと
を特徴とする高硬度材の孔の仕上げ加工方法。
1. A processing method for finishing a hole of a high-hardness material using a reamer in which hard abrasive grains are fixed to a blade portion, wherein when finishing the hole, a first processing step and a second processing step are performed. In the first processing step and the second processing step, at least one of the workpiece and the reamer is subjected to low frequency vibration, and the frequency and amplitude of the first processing step are
A method for finishing a hole in a hardened material, wherein the frequency and amplitude are made larger than the frequency and amplitude of the second processing step .
【請求項2】 前記リーマは荒加工部と仕上げ部とを有
し、前記第1の加工工程は前記リーマの荒加工部におけ
る加工であり、前記第2の加工工程は前記リーマの仕上
げ部における加工であることを特徴とする請求項1記載
の高硬度材の孔の仕上げ加工方法。
2. The reamer has a rough processing part and a finishing part, the first processing step is processing in a rough processing part of the reamer, and the second processing step is processing in a finishing part of the reamer. finishing method of the high-hardness material of the hole according to claim 1, wherein the machining der Rukoto.
【請求項3】 刃部に硬質砥粒を固着したリーマを回
及び上下運動させることで高硬度材の孔を仕上げ加工す
る加工装置であって、ワークを支持するワーク支持手段
と、荒加工部と仕上げ部を有するリーマと、ワークに穿
設された孔と前記リーマの軸芯の位置合わせを行う位置
合わせ手段と、前記ワークと前記リーマの少なくとも一
方に、前記リーマの荒加工部による加工時と仕上げ部に
よる加工時とは異なる低周波振動を与える低周波振動付
与手段と、を具備することを特徴とする高硬度材の孔の
仕上げ加工装置。
3. A processing apparatus for finishing a hole having a high hardness material by causing the Lee Ma that fixing the hard abrasive grains times are rotation and vertical movement to the blade portion, a workpiece support means for supporting the workpiece, rough A reamer having a processing part and a finishing part, positioning means for positioning a hole formed in a work and an axis of the reamer, and at least one of the work and the reamer, a rough processing part of the reamer. And a low-frequency vibration applying means for applying a low-frequency vibration different from that during processing and during processing by the finishing unit.
JP35050591A 1991-12-11 1991-12-11 Finishing method and processing device for holes of high hardness material Expired - Lifetime JP3088537B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP35050591A JP3088537B2 (en) 1991-12-11 1991-12-11 Finishing method and processing device for holes of high hardness material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP35050591A JP3088537B2 (en) 1991-12-11 1991-12-11 Finishing method and processing device for holes of high hardness material

Publications (2)

Publication Number Publication Date
JPH05162012A JPH05162012A (en) 1993-06-29
JP3088537B2 true JP3088537B2 (en) 2000-09-18

Family

ID=18410949

Family Applications (1)

Application Number Title Priority Date Filing Date
JP35050591A Expired - Lifetime JP3088537B2 (en) 1991-12-11 1991-12-11 Finishing method and processing device for holes of high hardness material

Country Status (1)

Country Link
JP (1) JP3088537B2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004062858A1 (en) * 2004-12-21 2006-08-10 C. & E. Fein Gmbh Method and device for producing bores
EP1815944B1 (en) * 2006-02-02 2010-07-14 NAGEL Maschinen- und Werkzeugfabrik GmbH Method and apparatus for honing bore holes.
WO2013114527A1 (en) * 2012-01-30 2013-08-08 株式会社 ダイニチ Honing tool
CN103770033B (en) * 2013-10-31 2016-08-17 郑州磨料磨具磨削研究所有限公司 Emery wheel endoporus edge hole machine
TWI657889B (en) * 2014-09-22 2019-05-01 日商西鐵城時計股份有限公司 Machine tool and its control device
CN115213754B (en) * 2022-06-23 2023-06-13 鹰普航空科技有限公司 Chromium plating blind hole processing technology
CN115890282B (en) * 2022-12-15 2023-06-06 济南力宽机械配件有限公司 Pneumatic reaming jig

Also Published As

Publication number Publication date
JPH05162012A (en) 1993-06-29

Similar Documents

Publication Publication Date Title
US7121928B2 (en) High smoothness grinding process and apparatus for metal material
JP3088537B2 (en) Finishing method and processing device for holes of high hardness material
Moriwaki et al. Development of a elliptical vibration milling machine
KR100491625B1 (en) Ultrasonic vibration composite grinding tool
JP3071640B2 (en) Deep hole inner surface grinding method for workpieces
JPS6246281B2 (en)
JPH0575560B2 (en)
JP4929790B2 (en) Truing method of grinding wheel
JPH11123365A (en) Ultrasonic vibrating combined processing tool
JP2002307210A (en) Single crystal diamond cutting tool and its manufacturing method
JP2008229764A (en) Rotary tool and machining method
JP2007260880A (en) Method of truing grinding wheel, and grinding machine
JPH0624692B2 (en) Precision groove grinding method by compound vibration of grindstone
JP3072366B2 (en) Manufacturing method of multi-blade grinding tool
JPH03161280A (en) Tool for piercing hard brittle material
JPS6362658A (en) Precise finishing method with complex vibration grinding wheel
CN106425708A (en) Grinding method for superfine five-edge reamer
JP2831966B2 (en) Processing method of silicon nitride ceramics
JPS6362657A (en) Precise finishing method with complex vibration grinding wheel
JPH03111166A (en) Cut off grinding method
JPH07164288A (en) Ultrasonic vibration grinding method, ultrasonic vibration grinding tool, and ultrasonic vibration grinding device
JPS6240123B2 (en)
JPH0253517A (en) Thread grooving method and device by overlapping ultrasonic and low frequency vibration of interrupted pulse cutting force waveform
JP2564163Y2 (en) Super finishing equipment that enables burring
JPS63283810A (en) Hybrid tool for cutting and grinding

Legal Events

Date Code Title Description
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20000704

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080714

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080714

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090714

Year of fee payment: 9

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090714

Year of fee payment: 9

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100714

Year of fee payment: 10