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Application filed by Skc Co LtdfiledCriticalSkc Co Ltd
Priority to MYPI20030349priorityCriticalpatent/MY137331A/en
Publication of MY137331ApublicationCriticalpatent/MY137331A/en
DISCLOSED IS A CHEMICAL MECHANICAL POLISHING PAD @FORMED AT A POLISHING SURFACE THEREOF WITH MICRO-HOLES @EACH HAVING A DESIRED CROSS-SECTIONAL AREA WHILE HAVING @A DESIRED DEPTH. THE SHAPE, SIZE, AND DENSITY OF THE @MICRO-HOLES CAN BE OPTIONALLY ADJUSTED. THE CHEMICAL @MECHANICAL POLISHING PAD PROVIDES AN EFFECT OF @MAINTAINING A DESIRED POLISHING RATE DURING A POLISHING @PROCESS. IN ACCORDANCE WITH THE PRESENT INVENTION, THE @MICRO-HOLES CAN HAVE DIVERSE ARRANGEMENTS DEPENDING ON @GIVEN PROCESS CONDITIONS.
MYPI200303492003-01-312003-01-31Chemical mechanical polishing pad with micro-holes
MY137331A
(en)