AU2003275237A1 - Polishing pad with window for planarization - Google Patents

Polishing pad with window for planarization

Info

Publication number
AU2003275237A1
AU2003275237A1 AU2003275237A AU2003275237A AU2003275237A1 AU 2003275237 A1 AU2003275237 A1 AU 2003275237A1 AU 2003275237 A AU2003275237 A AU 2003275237A AU 2003275237 A AU2003275237 A AU 2003275237A AU 2003275237 A1 AU2003275237 A1 AU 2003275237A1
Authority
AU
Australia
Prior art keywords
planarization
window
polishing pad
polishing
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003275237A
Inventor
William C. Allison
Robert Swisher
Alan E. Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PPG Industries Ohio Inc
Original Assignee
PPG Industries Ohio Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PPG Industries Ohio Inc filed Critical PPG Industries Ohio Inc
Publication of AU2003275237A1 publication Critical patent/AU2003275237A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
AU2003275237A 2002-09-25 2003-09-18 Polishing pad with window for planarization Abandoned AU2003275237A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US41336702P 2002-09-25 2002-09-25
US60/413,367 2002-09-25
PCT/US2003/030139 WO2004028744A1 (en) 2002-09-25 2003-09-18 Polishing pad with window for planarization

Publications (1)

Publication Number Publication Date
AU2003275237A1 true AU2003275237A1 (en) 2004-04-19

Family

ID=32043244

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003275237A Abandoned AU2003275237A1 (en) 2002-09-25 2003-09-18 Polishing pad with window for planarization

Country Status (8)

Country Link
US (1) US20040102141A1 (en)
EP (1) EP1542832A1 (en)
JP (2) JP2005538571A (en)
KR (1) KR20050052513A (en)
CN (1) CN100417493C (en)
AU (1) AU2003275237A1 (en)
TW (1) TWI287836B (en)
WO (1) WO2004028744A1 (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070010169A1 (en) * 2002-09-25 2007-01-11 Ppg Industries Ohio, Inc. Polishing pad with window for planarization
US6676483B1 (en) * 2003-02-03 2004-01-13 Rodel Holdings, Inc. Anti-scattering layer for polishing pad windows
US20040209066A1 (en) * 2003-04-17 2004-10-21 Swisher Robert G. Polishing pad with window for planarization
US6984163B2 (en) * 2003-11-25 2006-01-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with high optical transmission window
US20060019417A1 (en) * 2004-07-26 2006-01-26 Atsushi Shigeta Substrate processing method and substrate processing apparatus
US20060089095A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089093A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089094A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
CN101426618B (en) 2006-04-19 2013-05-15 东洋橡胶工业株式会社 Manufacturing method of polishing pad
JP4943233B2 (en) * 2007-05-31 2012-05-30 東洋ゴム工業株式会社 Polishing pad manufacturing method
US7635290B2 (en) * 2007-08-15 2009-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interpenetrating network for chemical mechanical polishing
TWI411495B (en) * 2007-08-16 2013-10-11 Cabot Microelectronics Corp Polishing pad
EP2227350A4 (en) * 2007-11-30 2011-01-12 Innopad Inc Chemical-mechanical planarization pad having end point detection window
JP5233621B2 (en) * 2008-12-02 2013-07-10 旭硝子株式会社 Glass substrate for magnetic disk and method for producing the same.
KR101855073B1 (en) * 2009-12-22 2018-05-09 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Polishing pad and method of making the same
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US9156124B2 (en) * 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US8758659B2 (en) 2010-09-29 2014-06-24 Fns Tech Co., Ltd. Method of grooving a chemical-mechanical planarization pad
JP5893479B2 (en) * 2011-04-21 2016-03-23 東洋ゴム工業株式会社 Laminated polishing pad
JP5858576B2 (en) * 2011-04-21 2016-02-10 東洋ゴム工業株式会社 Hot melt adhesive sheet for laminated polishing pad and support layer with adhesive layer for laminated polishing pad
JP2014094424A (en) * 2012-11-08 2014-05-22 Toyo Tire & Rubber Co Ltd Laminated polishing pad
CN111069994B (en) * 2019-12-11 2021-11-16 江苏月生达机械制造有限公司 Accurate processing equipment for bridge reinforcing steel plate
JP7105334B2 (en) * 2020-03-17 2022-07-22 エスケーシー ソルミックス カンパニー，リミテッド Polishing pad and method for manufacturing semiconductor device using the same

Family Cites Families (28)

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Publication number Priority date Publication date Assignee Title
US3572232A (en) * 1968-04-01 1971-03-23 Itek Corp Photographic film processing material
US5257478A (en) * 1990-03-22 1993-11-02 Rodel, Inc. Apparatus for interlayer planarization of semiconductor material
US6120860A (en) * 1990-08-23 2000-09-19 American National Can Company Multilayer film structure and packages therefrom for organics
US5212910A (en) * 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process
US6017265A (en) * 1995-06-07 2000-01-25 Rodel, Inc. Methods for using polishing pads
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
EP0844265B1 (en) * 1995-08-11 2002-11-20 Daikin Industries, Limited Silicon-containing organic fluoropolymers and use of the same
JPH10156705A (en) * 1996-11-29 1998-06-16 Sumitomo Metal Ind Ltd Polishing device and polishing method
US6126532A (en) * 1997-04-18 2000-10-03 Cabot Corporation Polishing pads for a semiconductor substrate
TW377467B (en) * 1997-04-22 1999-12-21 Sony Corp Polishing system, polishing method, polishing pad, and method of forming polishing pad
JPH11277408A (en) * 1998-01-29 1999-10-12 Shin Etsu Handotai Co Ltd Cloth, method and device for polishing mirror finished surface of semi-conductor wafer
US6068539A (en) * 1998-03-10 2000-05-30 Lam Research Corporation Wafer polishing device with movable window
US6585574B1 (en) * 1998-06-02 2003-07-01 Brian Lombardo Polishing pad with reduced moisture absorption
US6159073A (en) * 1998-11-02 2000-12-12 Applied Materials, Inc. Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
US6231428B1 (en) * 1999-03-03 2001-05-15 Mitsubishi Materials Corporation Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
US6213845B1 (en) * 1999-04-26 2001-04-10 Micron Technology, Inc. Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same
US6261168B1 (en) * 1999-05-21 2001-07-17 Lam Research Corporation Chemical mechanical planarization or polishing pad with sections having varied groove patterns
US6439968B1 (en) * 1999-06-30 2002-08-27 Agere Systems Guardian Corp. Polishing pad having a water-repellant film theron and a method of manufacture therefor
DE60030752T2 (en) * 1999-09-21 2007-09-06 Honeywell HomMed LLC, Brookfield HOME PATIENT MONITORING SYSTEM
US6402591B1 (en) * 2000-03-31 2002-06-11 Lam Research Corporation Planarization system for chemical-mechanical polishing
US6561891B2 (en) * 2000-05-23 2003-05-13 Rodel Holdings, Inc. Eliminating air pockets under a polished pad
US6685537B1 (en) * 2000-06-05 2004-02-03 Speedfam-Ipec Corporation Polishing pad window for a chemical mechanical polishing tool
US6477926B1 (en) * 2000-09-15 2002-11-12 Ppg Industries Ohio, Inc. Polishing pad
US20030094593A1 (en) * 2001-06-14 2003-05-22 Hellring Stuart D. Silica and a silica-based slurry
JP4131632B2 (en) * 2001-06-15 2008-08-13 株式会社荏原製作所 Polishing apparatus and polishing pad
US6722249B2 (en) * 2001-11-06 2004-04-20 Rodel Holdings, Inc Method of fabricating a polishing pad having an optical window
US7097549B2 (en) * 2001-12-20 2006-08-29 Ppg Industries Ohio, Inc. Polishing pad
JP2005539398A (en) * 2002-09-25 2005-12-22 ピーピージー インダストリーズ オハイオ， インコーポレイテッド Polishing pad for flattening

Also Published As

Publication number Publication date
TWI287836B (en) 2007-10-01
JP2008229843A (en) 2008-10-02
CN1684798A (en) 2005-10-19
KR20050052513A (en) 2005-06-02
JP2005538571A (en) 2005-12-15
TW200522185A (en) 2005-07-01
US20040102141A1 (en) 2004-05-27
EP1542832A1 (en) 2005-06-22
WO2004028744A1 (en) 2004-04-08
CN100417493C (en) 2008-09-10

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase