JP2009510797A5 - - Google Patents

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Publication number
JP2009510797A5
JP2009510797A5 JP2008534569A JP2008534569A JP2009510797A5 JP 2009510797 A5 JP2009510797 A5 JP 2009510797A5 JP 2008534569 A JP2008534569 A JP 2008534569A JP 2008534569 A JP2008534569 A JP 2008534569A JP 2009510797 A5 JP2009510797 A5 JP 2009510797A5
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Japan
Prior art keywords
liquid carrier
abrasive
suspended
polishing
substrate
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JP2008534569A
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English (en)
Japanese (ja)
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JP2009510797A (ja
JP5689581B2 (ja
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Priority claimed from US11/243,140 external-priority patent/US20070077865A1/en
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Publication of JP2009510797A5 publication Critical patent/JP2009510797A5/ja
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Publication of JP5689581B2 publication Critical patent/JP5689581B2/ja
Expired - Fee Related legal-status Critical Current
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JP2008534569A 2005-10-04 2006-09-29 ポリシリコンの除去を制御するための方法 Expired - Fee Related JP5689581B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/243,140 2005-10-04
US11/243,140 US20070077865A1 (en) 2005-10-04 2005-10-04 Method for controlling polysilicon removal
PCT/US2006/037831 WO2007041203A1 (en) 2005-10-04 2006-09-29 Method for controlling polysilicon removal

Publications (3)

Publication Number Publication Date
JP2009510797A JP2009510797A (ja) 2009-03-12
JP2009510797A5 true JP2009510797A5 (enExample) 2009-11-05
JP5689581B2 JP5689581B2 (ja) 2015-03-25

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JP2008534569A Expired - Fee Related JP5689581B2 (ja) 2005-10-04 2006-09-29 ポリシリコンの除去を制御するための方法

Country Status (6)

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US (1) US20070077865A1 (enExample)
JP (1) JP5689581B2 (enExample)
KR (1) KR101165875B1 (enExample)
CN (1) CN101322227B (enExample)
TW (1) TWI316272B (enExample)
WO (1) WO2007041203A1 (enExample)

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