JP5689581B2 - ポリシリコンの除去を制御するための方法 - Google Patents
ポリシリコンの除去を制御するための方法 Download PDFInfo
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- JP5689581B2 JP5689581B2 JP2008534569A JP2008534569A JP5689581B2 JP 5689581 B2 JP5689581 B2 JP 5689581B2 JP 2008534569 A JP2008534569 A JP 2008534569A JP 2008534569 A JP2008534569 A JP 2008534569A JP 5689581 B2 JP5689581 B2 JP 5689581B2
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- Prior art keywords
- polishing
- pluronic
- polysilicon
- substrate
- oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
本例は、ポリシリコン及び他のシリコン含有層の研磨除去速度に関して15以下のHLBを有するポリエチレンオキシド/ポリプロピレンオキシドコポリマーの効果を実証するものである。
本例は、本発明の方法を用いて達成することができる窒化ケイ素とポリシリコンの研磨選択性を実証するものである。
Claims (10)
- (i)ポリシリコンと、酸化ケイ素及び窒化ケイ素から選択される材料とを含む基材を
(a)研磨材と、
(b)液体キャリヤーと、
(c)該液体キャリヤー及びそれに溶解又は懸濁した任意の成分の質量に基づいて100ppm〜800ppmの、8以下のHLBを有するポリエチレンオキシド/ポリプロピレンオキシドコポリマーと、
(d)研磨パッドと
を含む化学機械研磨系と接触させる工程、
(ii)該基材に対して該研磨パッドを動かす工程、及び
(iii)該基材を該化学機械研磨系で研磨することにより該基材の少なくとも一部を除去する工程
を含み、研磨がポリシリコンに対して酸化ケイ素又は窒化ケイ素材料に選択的であり、窒化ケイ素とポリシリコンの研磨選択性が少なくとも2:1であり、二酸化ケイ素とポリシリコンの研磨選択性が少なくとも5:1である、基材を化学機械研磨する方法。 - 前記コポリマーの末端がヒドロキシル基である、請求項1に記載の方法。
- 前記研磨材が、アルミナ、セリア、シリカ、ジルコニア及びそれらの組み合わせからなる群より選択される、請求項1に記載の方法。
- 前記研磨材がヒュームドシリカである、請求項3に記載の方法。
- 前記研磨材が前記液体キャリヤー中に懸濁される、請求項1に記載の方法。
- 前記研磨材の量が、前記液体キャリヤー及びそれに溶解又は懸濁した任意の成分の質量に基づいて5wt%〜20wt%である、請求項5に記載の方法。
- pHが5〜12である、請求項5に記載の方法。
- 前記研磨系が前記液体キャリヤー中に溶解又は懸濁した錯化剤をさらに含む、請求項1に記載の方法。
- 前記研磨系が前記液体キャリヤー中に溶解又は懸濁したアミンをさらに含む、請求項1に記載の方法。
- 前記基材が酸化ケイ素と窒化ケイ素の両方を含む、請求項1に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/243,140 | 2005-10-04 | ||
US11/243,140 US20070077865A1 (en) | 2005-10-04 | 2005-10-04 | Method for controlling polysilicon removal |
PCT/US2006/037831 WO2007041203A1 (en) | 2005-10-04 | 2006-09-29 | Method for controlling polysilicon removal |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009510797A JP2009510797A (ja) | 2009-03-12 |
JP2009510797A5 JP2009510797A5 (ja) | 2009-11-05 |
JP5689581B2 true JP5689581B2 (ja) | 2015-03-25 |
Family
ID=37499658
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008534569A Expired - Fee Related JP5689581B2 (ja) | 2005-10-04 | 2006-09-29 | ポリシリコンの除去を制御するための方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20070077865A1 (ja) |
JP (1) | JP5689581B2 (ja) |
KR (1) | KR101165875B1 (ja) |
CN (1) | CN101322227B (ja) |
TW (1) | TWI316272B (ja) |
WO (1) | WO2007041203A1 (ja) |
Families Citing this family (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8092707B2 (en) | 1997-04-30 | 2012-01-10 | 3M Innovative Properties Company | Compositions and methods for modifying a surface suited for semiconductor fabrication |
WO2007038399A2 (en) * | 2005-09-26 | 2007-04-05 | Cabot Microelectronics Corporation | Metal cations for initiating chemical mechanical polishing |
AU2008279551B2 (en) * | 2007-06-25 | 2015-01-15 | Tcgi (Jersey) Ltd. | Scratch removal device and method |
TWI410481B (zh) * | 2009-04-22 | 2013-10-01 | Lg Chemical Ltd | 化學機械研磨用漿料 |
US8822339B2 (en) | 2009-10-13 | 2014-09-02 | Lg Chem, Ltd. | Slurry composition for CMP, and polishing method |
JP2011142284A (ja) * | 2009-12-10 | 2011-07-21 | Hitachi Chem Co Ltd | Cmp研磨液、基板の研磨方法及び電子部品 |
US8492277B2 (en) * | 2010-03-16 | 2013-07-23 | Rohm And Haas Electronic Materials Cmp Holdings, Inc | Method of polishing a substrate comprising polysilicon and at least one of silicon oxide and silicon nitride |
US8491808B2 (en) * | 2010-03-16 | 2013-07-23 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of polishing a substrate comprising polysilicon, silicon oxide and silicon nitride |
US8496843B2 (en) * | 2010-03-16 | 2013-07-30 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of polishing a substrate comprising polysilicon and at least one of silicon oxide and silicon nitride |
US8232208B2 (en) | 2010-06-15 | 2012-07-31 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Stabilized chemical mechanical polishing composition and method of polishing a substrate |
TWI598434B (zh) | 2010-09-08 | 2017-09-11 | 巴斯夫歐洲公司 | 含有N-取代重氮烯(diazenium)二氧化鹽及/或N’-羥基-重氮烯(diazenium)氧化鹽之水研磨組成物 |
SG188460A1 (en) | 2010-09-08 | 2013-04-30 | Basf Se | Aqueous polishing composition and process for chemically mechanically polishing substrate materials for electrical, mechanical and optical devices |
KR101894712B1 (ko) * | 2010-09-08 | 2018-09-04 | 바스프 에스이 | 산화규소 유전체 필름 및 폴리실리콘 및/또는 질화규소 필름을 함유하는 기판의 화학적 기계적 연마 방법 |
CN103097476B (zh) * | 2010-09-08 | 2016-02-17 | 巴斯夫欧洲公司 | 化学机械抛光用于电子、机械和光学器件的衬底的含水抛光组合物和方法 |
EP2428541B1 (en) | 2010-09-08 | 2019-03-06 | Basf Se | Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectric and polysilicon films |
US8568610B2 (en) | 2010-09-20 | 2013-10-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Stabilized, concentratable chemical mechanical polishing composition and method of polishing a substrate |
US8513126B2 (en) | 2010-09-22 | 2013-08-20 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Slurry composition having tunable dielectric polishing selectivity and method of polishing a substrate |
US9070632B2 (en) * | 2010-10-07 | 2015-06-30 | Basf Se | Aqueous polishing composition and process for chemically mechanically polishing substrates having patterned or unpatterned low-k dielectric layers |
TWI583755B (zh) * | 2010-12-10 | 2017-05-21 | 巴斯夫歐洲公司 | 用於將含氧化矽介電質及多晶矽薄膜之基板化學機械拋光的水性拋光組成物及方法 |
CN103249790A (zh) * | 2010-12-10 | 2013-08-14 | 巴斯夫欧洲公司 | 用于化学机械抛光包含氧化硅电介质和多晶硅膜的基底的含水抛光组合物和方法 |
WO2012123839A1 (en) | 2011-03-11 | 2012-09-20 | Basf Se | Method for forming through-base wafer vias |
CN102744668B (zh) * | 2011-04-20 | 2015-04-29 | 中芯国际集成电路制造(上海)有限公司 | 抛光方法以及浮栅的形成方法 |
US8440094B1 (en) | 2011-10-27 | 2013-05-14 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of polishing a substrate |
US8435420B1 (en) | 2011-10-27 | 2013-05-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of polishing using tunable polishing formulation |
SG11201403505UA (en) * | 2011-12-21 | 2014-07-30 | Basf Se | Method for manufacturing cmp composition and application thereof |
MY166785A (en) | 2011-12-21 | 2018-07-23 | Basf Se | Chemical mechanical polishing composition comprising polyvinyl phosphonic acid and its derivatives |
US9633863B2 (en) * | 2012-07-11 | 2017-04-25 | Cabot Microelectronics Corporation | Compositions and methods for selective polishing of silicon nitride materials |
US9337103B2 (en) * | 2012-12-07 | 2016-05-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for removing hard mask oxide and making gate structure of semiconductor devices |
CN103865400A (zh) * | 2012-12-10 | 2014-06-18 | 安集微电子(上海)有限公司 | 一种磷酸酯表面活性剂在自停止抛光中的应用 |
JP6209845B2 (ja) * | 2013-04-11 | 2017-10-11 | 日立化成株式会社 | 研磨液、研磨液セット及び基体の研磨方法 |
US9567492B2 (en) * | 2014-08-28 | 2017-02-14 | Sinmat, Inc. | Polishing of hard substrates with soft-core composite particles |
US10836856B2 (en) | 2015-01-05 | 2020-11-17 | Rhodia Operations | Amine-imino dialcohol neutralizing agents for low volatile compound aqueous organic coating compositions and methods for using same |
US9597768B1 (en) * | 2015-09-09 | 2017-03-21 | Cabot Microelectronics Corporation | Selective nitride slurries with improved stability and improved polishing characteristics |
JP6620590B2 (ja) * | 2016-02-22 | 2019-12-18 | 日立化成株式会社 | 研磨液及び研磨方法 |
KR102694174B1 (ko) | 2018-10-01 | 2024-08-13 | 솔브레인 주식회사 | 저온폴리실리콘 돌기 연마용 화학적 기계적 연마 슬러리 조성물 및 상기 연마 슬러리 조성물을 이용한 저온폴리실리콘 돌기 연마방법 |
US11342256B2 (en) | 2019-01-24 | 2022-05-24 | Applied Materials, Inc. | Method of fine redistribution interconnect formation for advanced packaging applications |
US10626298B1 (en) * | 2019-03-20 | 2020-04-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing compositions and methods for suppressing the removal rate of amorphous silicon |
IT201900006740A1 (it) | 2019-05-10 | 2020-11-10 | Applied Materials Inc | Procedimenti di strutturazione di substrati |
IT201900006736A1 (it) | 2019-05-10 | 2020-11-10 | Applied Materials Inc | Procedimenti di fabbricazione di package |
US11931855B2 (en) | 2019-06-17 | 2024-03-19 | Applied Materials, Inc. | Planarization methods for packaging substrates |
US11862546B2 (en) | 2019-11-27 | 2024-01-02 | Applied Materials, Inc. | Package core assembly and fabrication methods |
US11257790B2 (en) | 2020-03-10 | 2022-02-22 | Applied Materials, Inc. | High connectivity device stacking |
US11454884B2 (en) | 2020-04-15 | 2022-09-27 | Applied Materials, Inc. | Fluoropolymer stamp fabrication method |
US11400545B2 (en) | 2020-05-11 | 2022-08-02 | Applied Materials, Inc. | Laser ablation for package fabrication |
US11232951B1 (en) | 2020-07-14 | 2022-01-25 | Applied Materials, Inc. | Method and apparatus for laser drilling blind vias |
US11676832B2 (en) | 2020-07-24 | 2023-06-13 | Applied Materials, Inc. | Laser ablation system for package fabrication |
US11521937B2 (en) | 2020-11-16 | 2022-12-06 | Applied Materials, Inc. | Package structures with built-in EMI shielding |
US11404318B2 (en) | 2020-11-20 | 2022-08-02 | Applied Materials, Inc. | Methods of forming through-silicon vias in substrates for advanced packaging |
US11705365B2 (en) | 2021-05-18 | 2023-07-18 | Applied Materials, Inc. | Methods of micro-via formation for advanced packaging |
CN116314473B (zh) * | 2023-05-12 | 2023-11-07 | 一道新能源科技股份有限公司 | 一种p型ibc太阳能电池及其制绒方法 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6046840A (en) * | 1995-06-19 | 2000-04-04 | Reflectivity, Inc. | Double substrate reflective spatial light modulator with self-limiting micro-mechanical elements |
AU1829500A (en) * | 1998-11-25 | 2000-06-13 | Petroferm Inc. | Aqueous cleaning |
JP4075247B2 (ja) * | 1999-09-30 | 2008-04-16 | Jsr株式会社 | 化学機械研磨用水系分散体 |
US6491843B1 (en) * | 1999-12-08 | 2002-12-10 | Eastman Kodak Company | Slurry for chemical mechanical polishing silicon dioxide |
US6468910B1 (en) * | 1999-12-08 | 2002-10-22 | Ramanathan Srinivasan | Slurry for chemical mechanical polishing silicon dioxide |
US6527920B1 (en) * | 2000-05-10 | 2003-03-04 | Novellus Systems, Inc. | Copper electroplating apparatus |
KR100378180B1 (ko) * | 2000-05-22 | 2003-03-29 | 삼성전자주식회사 | 화학기계적 연마 공정용 슬러리 및 이를 이용한 반도체소자의 제조방법 |
JP4330265B2 (ja) * | 2000-10-24 | 2009-09-16 | 株式会社日本触媒 | 多孔質架橋重合体の製造方法 |
US6677239B2 (en) * | 2001-08-24 | 2004-01-13 | Applied Materials Inc. | Methods and compositions for chemical mechanical polishing |
JP3899456B2 (ja) * | 2001-10-19 | 2007-03-28 | 株式会社フジミインコーポレーテッド | 研磨用組成物およびそれを用いた研磨方法 |
US6974777B2 (en) * | 2002-06-07 | 2005-12-13 | Cabot Microelectronics Corporation | CMP compositions for low-k dielectric materials |
JP4083502B2 (ja) * | 2002-08-19 | 2008-04-30 | 株式会社フジミインコーポレーテッド | 研磨方法及びそれに用いられる研磨用組成物 |
JP4212861B2 (ja) * | 2002-09-30 | 2009-01-21 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びそれを用いたシリコンウエハの研磨方法、並びにリンス用組成物及びそれを用いたシリコンウエハのリンス方法 |
US20040092102A1 (en) * | 2002-11-12 | 2004-05-13 | Sachem, Inc. | Chemical mechanical polishing composition and method |
US7071105B2 (en) * | 2003-02-03 | 2006-07-04 | Cabot Microelectronics Corporation | Method of polishing a silicon-containing dielectric |
JP2004297035A (ja) * | 2003-03-13 | 2004-10-21 | Hitachi Chem Co Ltd | 研磨剤、研磨方法及び電子部品の製造方法 |
US7314578B2 (en) * | 2003-12-12 | 2008-01-01 | Samsung Electronics Co., Ltd. | Slurry compositions and CMP methods using the same |
KR100640600B1 (ko) * | 2003-12-12 | 2006-11-01 | 삼성전자주식회사 | 슬러리 조성물 및 이를 이용한 화학기계적연마공정를포함하는 반도체 소자의 제조방법 |
US7255810B2 (en) * | 2004-01-09 | 2007-08-14 | Cabot Microelectronics Corporation | Polishing system comprising a highly branched polymer |
US20050230354A1 (en) * | 2004-04-14 | 2005-10-20 | Hardikar Vishwas V | Method and composition of post-CMP wetting of thin films |
KR100611064B1 (ko) * | 2004-07-15 | 2006-08-10 | 삼성전자주식회사 | 화학 기계적 연마 공정용 슬러리 조성물, 상기 슬러리조성물을 이용한 화학 기계적 연마 방법 및 상기 방법을이용한 게이트 패턴의 형성 방법 |
JP4012180B2 (ja) * | 2004-08-06 | 2007-11-21 | 株式会社東芝 | Cmp用スラリー、研磨方法、および半導体装置の製造方法 |
-
2005
- 2005-10-04 US US11/243,140 patent/US20070077865A1/en not_active Abandoned
-
2006
- 2006-09-28 TW TW095136031A patent/TWI316272B/zh active
- 2006-09-29 CN CN2006800449616A patent/CN101322227B/zh not_active Expired - Fee Related
- 2006-09-29 WO PCT/US2006/037831 patent/WO2007041203A1/en active Application Filing
- 2006-09-29 JP JP2008534569A patent/JP5689581B2/ja not_active Expired - Fee Related
- 2006-09-29 KR KR1020087008090A patent/KR101165875B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JP2009510797A (ja) | 2009-03-12 |
KR101165875B1 (ko) | 2012-07-13 |
TWI316272B (en) | 2009-10-21 |
TW200731383A (en) | 2007-08-16 |
US20070077865A1 (en) | 2007-04-05 |
WO2007041203A1 (en) | 2007-04-12 |
KR20080064823A (ko) | 2008-07-09 |
CN101322227A (zh) | 2008-12-10 |
CN101322227B (zh) | 2010-12-01 |
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