JP2010506743A5 - - Google Patents

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Publication number
JP2010506743A5
JP2010506743A5 JP2009533335A JP2009533335A JP2010506743A5 JP 2010506743 A5 JP2010506743 A5 JP 2010506743A5 JP 2009533335 A JP2009533335 A JP 2009533335A JP 2009533335 A JP2009533335 A JP 2009533335A JP 2010506743 A5 JP2010506743 A5 JP 2010506743A5
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JP
Japan
Prior art keywords
composition
glass
cerium oxide
polishing
range
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009533335A
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English (en)
Japanese (ja)
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JP2010506743A (ja
JP5448824B2 (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/US2007/022014 external-priority patent/WO2008048562A1/en
Publication of JP2010506743A publication Critical patent/JP2010506743A/ja
Publication of JP2010506743A5 publication Critical patent/JP2010506743A5/ja
Application granted granted Critical
Publication of JP5448824B2 publication Critical patent/JP5448824B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009533335A 2006-10-16 2007-10-16 ガラス研磨組成物および方法 Expired - Fee Related JP5448824B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US85245106P 2006-10-16 2006-10-16
US60/852,451 2006-10-16
US93039907P 2007-05-16 2007-05-16
US60/930,399 2007-05-16
PCT/US2007/022014 WO2008048562A1 (en) 2006-10-16 2007-10-16 Glass polishing compositions and methods

Publications (3)

Publication Number Publication Date
JP2010506743A JP2010506743A (ja) 2010-03-04
JP2010506743A5 true JP2010506743A5 (enExample) 2010-12-02
JP5448824B2 JP5448824B2 (ja) 2014-03-19

Family

ID=39314335

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009533335A Expired - Fee Related JP5448824B2 (ja) 2006-10-16 2007-10-16 ガラス研磨組成物および方法

Country Status (7)

Country Link
US (1) US20100022171A1 (enExample)
JP (1) JP5448824B2 (enExample)
KR (1) KR101477826B1 (enExample)
CN (1) CN101528882B (enExample)
DE (1) DE112007002470T5 (enExample)
SG (1) SG175636A1 (enExample)
WO (1) WO2008048562A1 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5362319B2 (ja) * 2008-10-21 2013-12-11 花王株式会社 研磨液組成物
EP2419486A4 (en) * 2009-04-15 2013-07-10 Rhodia China Co Ltd CER BASED PARTICLE COMPOSITION AND ITS MANUFACTURE
US9550264B2 (en) * 2009-06-04 2017-01-24 Sumco Corporation Fixed abrasive-grain processing device, method of fixed abrasive-grain processing, and method for producing semiconductor wafer
CN102101976A (zh) * 2009-12-18 2011-06-22 安集微电子（上海）有限公司 一种化学机械抛光液
US20130192304A1 (en) * 2010-09-30 2013-08-01 Hazuki Nakae Manufacturing Method for Glass Substrate for Information Recording Medium
WO2012063757A1 (ja) * 2010-11-08 2012-05-18 株式会社 フジミインコーポレーテッド 研磨用組成物およびそれを用いた半導体基板の研磨方法
JP2013159531A (ja) * 2012-02-07 2013-08-19 Panasonic Liquid Crystal Display Co Ltd 液晶表示素子の製造方法
CN102585708A (zh) * 2012-03-13 2012-07-18 上海华明高纳稀土新材料有限公司 稀土抛光材料及其制备方法
US9358659B2 (en) 2013-03-04 2016-06-07 Cabot Microelectronics Corporation Composition and method for polishing glass
KR102659674B1 (ko) * 2014-05-30 2024-04-19 가부시끼가이샤 레조낙 Cmp용 연마액, cmp용 연마액 세트 및 연마 방법
JP2017002166A (ja) * 2015-06-09 2017-01-05 テイカ株式会社 ガラス及びセラミック研磨用組成物
CN106189873A (zh) * 2016-07-22 2016-12-07 清华大学 一种抛光组合物
JP6262836B1 (ja) * 2016-07-28 2018-01-17 株式会社バイコウスキージャパン 研磨砥粒、その製造方法、それを含む研磨スラリー及びそれを用いる研磨方法
WO2018100324A1 (fr) * 2016-12-02 2018-06-07 Rhodia Operations Suspension d'oxyde de cerium
FR3059660B1 (fr) * 2016-12-02 2019-03-15 Rhodia Operations Suspension d'oxyde de cerium
CN109439282A (zh) * 2018-10-23 2019-03-08 蓝思科技（长沙）有限公司 复合纳米磨料、抛光液及其制备方法、玻璃晶片和电子设备
CN109135580B (zh) * 2018-10-25 2021-04-02 蓝思科技（长沙）有限公司 一种玻璃用抛光液及其制备方法
US10787592B1 (en) * 2019-05-16 2020-09-29 Rohm And Haas Electronic Materials Cmp Holdings, I Chemical mechanical polishing compositions and methods having enhanced defect inhibition and selectively polishing silicon nitride over silicon dioxide in an acid environment
KR20230090768A (ko) * 2021-12-15 2023-06-22 인오켐 주식회사 디스플레이 유리기판 연마용 조성물의 제조방법 및 상기 조성물을 이용한 디스플레이 기판을 연마하는 방법

Family Cites Families (21)

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Publication number Priority date Publication date Assignee Title
JPH04135162A (ja) * 1990-09-21 1992-05-08 Asahi Glass Co Ltd ガラスの高効率研磨方法
KR100420087B1 (ko) * 1996-09-30 2004-02-25 히다치 가세고교 가부시끼가이샤 산화세륨 연마제 및 기판의 연마법
US6110396A (en) * 1996-11-27 2000-08-29 International Business Machines Corporation Dual-valent rare earth additives to polishing slurries
US6248143B1 (en) * 1998-01-27 2001-06-19 Showa Denko Kabushiki Kaisha Composition for polishing glass and polishing method
US6299659B1 (en) * 1998-08-05 2001-10-09 Showa Denko K.K. Polishing material composition and polishing method for polishing LSI devices
JP4501694B2 (ja) * 1998-12-25 2010-07-14 日立化成工業株式会社 Ｃｍｐ研磨剤用添加液
JP2000256654A (ja) * 1999-03-04 2000-09-19 Hitachi Chem Co Ltd Ｃｍｐ研磨剤及び基板の研磨方法
US6350393B2 (en) * 1999-11-04 2002-02-26 Cabot Microelectronics Corporation Use of CsOH in a dielectric CMP slurry
US6454821B1 (en) * 2000-06-21 2002-09-24 Praxair S. T. Technology, Inc. Polishing composition and method
JP2002114970A (ja) * 2000-10-04 2002-04-16 Asahi Denka Kogyo Kk 水系ラップ液及び水系ラップ剤
US6726534B1 (en) * 2001-03-01 2004-04-27 Cabot Microelectronics Corporation Preequilibrium polishing method and system
US6736705B2 (en) * 2001-04-27 2004-05-18 Hitachi Global Storage Technologies Polishing process for glass or ceramic disks used in disk drive data storage devices
US20030162398A1 (en) * 2002-02-11 2003-08-28 Small Robert J. Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same
AU2003275655A1 (en) * 2002-10-25 2004-05-13 Showa Denko K.K. Polishing slurry and polished substrate
US20050066687A1 (en) * 2003-09-30 2005-03-31 Mr. Chi-Fu Hsueh Methods for the production of marble-like crystallized glass panel wih embossed surface
JP2004291232A (ja) * 2004-07-20 2004-10-21 Hitachi Chem Co Ltd 酸化セリウム研磨剤及び基板の研磨法
JP2006041034A (ja) * 2004-07-23 2006-02-09 Hitachi Chem Co Ltd Ｃｍｐ研磨剤及び基板の研磨方法
US20070218811A1 (en) * 2004-09-27 2007-09-20 Hitachi Chemical Co., Ltd. Cmp polishing slurry and method of polishing substrate
JP2006175552A (ja) * 2004-12-22 2006-07-06 Hitachi Chem Co Ltd 有機材料用ｃｍｐ研磨剤及び有機材料の研磨方法
JP4463134B2 (ja) * 2005-03-29 2010-05-12 三井金属鉱業株式会社 セリウム系研摩材及びその中間体並びにこれらの製造方法
JP4776387B2 (ja) * 2006-02-06 2011-09-21 日立化成工業株式会社 酸化セリウム研磨剤および基板の研磨法

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