JP5448824B2 - ガラス研磨組成物および方法 - Google Patents

ガラス研磨組成物および方法 Download PDF

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Publication number
JP5448824B2
JP5448824B2 JP2009533335A JP2009533335A JP5448824B2 JP 5448824 B2 JP5448824 B2 JP 5448824B2 JP 2009533335 A JP2009533335 A JP 2009533335A JP 2009533335 A JP2009533335 A JP 2009533335A JP 5448824 B2 JP5448824 B2 JP 5448824B2
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Japan
Prior art keywords
glass
polishing
composition
cerium oxide
polishing composition
Prior art date
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Expired - Fee Related
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JP2009533335A
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English (en)
Japanese (ja)
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JP2010506743A5 (enExample
JP2010506743A (ja
Inventor
ナギーブ，ネビン
モエゲンボルグ，ケビン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials LLC
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Cabot Microelectronics Corp
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Publication date
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Publication of JP2010506743A publication Critical patent/JP2010506743A/ja
Publication of JP2010506743A5 publication Critical patent/JP2010506743A5/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2009533335A 2006-10-16 2007-10-16 ガラス研磨組成物および方法 Expired - Fee Related JP5448824B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US85245106P 2006-10-16 2006-10-16
US60/852,451 2006-10-16
US93039907P 2007-05-16 2007-05-16
US60/930,399 2007-05-16
PCT/US2007/022014 WO2008048562A1 (en) 2006-10-16 2007-10-16 Glass polishing compositions and methods

Publications (3)

Publication Number Publication Date
JP2010506743A JP2010506743A (ja) 2010-03-04
JP2010506743A5 JP2010506743A5 (enExample) 2010-12-02
JP5448824B2 true JP5448824B2 (ja) 2014-03-19

Family

ID=39314335

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009533335A Expired - Fee Related JP5448824B2 (ja) 2006-10-16 2007-10-16 ガラス研磨組成物および方法

Country Status (7)

Country Link
US (1) US20100022171A1 (enExample)
JP (1) JP5448824B2 (enExample)
KR (1) KR101477826B1 (enExample)
CN (1) CN101528882B (enExample)
DE (1) DE112007002470T5 (enExample)
SG (1) SG175636A1 (enExample)
WO (1) WO2008048562A1 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5362319B2 (ja) * 2008-10-21 2013-12-11 花王株式会社 研磨液組成物
EP2419486A4 (en) * 2009-04-15 2013-07-10 Rhodia China Co Ltd CER BASED PARTICLE COMPOSITION AND ITS MANUFACTURE
KR101271444B1 (ko) * 2009-06-04 2013-06-05 가부시키가이샤 사무코 고정 연마 입자 가공 장치 및 고정 연마 입자 가공 방법, 그리고 반도체 웨이퍼 제조 방법
CN102101976A (zh) * 2009-12-18 2011-06-22 安集微电子（上海）有限公司 一种化学机械抛光液
WO2012042735A1 (ja) * 2010-09-30 2012-04-05 コニカミノルタオプト株式会社 情報記録媒体用ガラス基板の製造方法
US9090799B2 (en) * 2010-11-08 2015-07-28 Fujimi Incorporated Composition for polishing and method of polishing semiconductor substrate using same
JP2013159531A (ja) * 2012-02-07 2013-08-19 Panasonic Liquid Crystal Display Co Ltd 液晶表示素子の製造方法
CN102585708A (zh) * 2012-03-13 2012-07-18 上海华明高纳稀土新材料有限公司 稀土抛光材料及其制备方法
US9358659B2 (en) 2013-03-04 2016-06-07 Cabot Microelectronics Corporation Composition and method for polishing glass
WO2015182756A1 (ja) * 2014-05-30 2015-12-03 日立化成株式会社 Ｃｍｐ用研磨液、ｃｍｐ用研磨液セット、及び研磨方法
JP2017002166A (ja) * 2015-06-09 2017-01-05 テイカ株式会社 ガラス及びセラミック研磨用組成物
CN106189873A (zh) * 2016-07-22 2016-12-07 清华大学 一种抛光组合物
JP6262836B1 (ja) * 2016-07-28 2018-01-17 株式会社バイコウスキージャパン 研磨砥粒、その製造方法、それを含む研磨スラリー及びそれを用いる研磨方法
EP3548436A1 (fr) * 2016-12-02 2019-10-09 Rhodia Operations Suspension d'oxyde de cerium
FR3059660B1 (fr) * 2016-12-02 2019-03-15 Rhodia Operations Suspension d'oxyde de cerium
CN109439282A (zh) * 2018-10-23 2019-03-08 蓝思科技（长沙）有限公司 复合纳米磨料、抛光液及其制备方法、玻璃晶片和电子设备
CN109135580B (zh) * 2018-10-25 2021-04-02 蓝思科技（长沙）有限公司 一种玻璃用抛光液及其制备方法
US10787592B1 (en) * 2019-05-16 2020-09-29 Rohm And Haas Electronic Materials Cmp Holdings, I Chemical mechanical polishing compositions and methods having enhanced defect inhibition and selectively polishing silicon nitride over silicon dioxide in an acid environment
KR20230090768A (ko) * 2021-12-15 2023-06-22 인오켐 주식회사 디스플레이 유리기판 연마용 조성물의 제조방법 및 상기 조성물을 이용한 디스플레이 기판을 연마하는 방법

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04135162A (ja) * 1990-09-21 1992-05-08 Asahi Glass Co Ltd ガラスの高効率研磨方法
CN1323124C (zh) * 1996-09-30 2007-06-27 日立化成工业株式会社 氧化铈研磨剂以及基板的研磨方法
US6110396A (en) * 1996-11-27 2000-08-29 International Business Machines Corporation Dual-valent rare earth additives to polishing slurries
US6248143B1 (en) * 1998-01-27 2001-06-19 Showa Denko Kabushiki Kaisha Composition for polishing glass and polishing method
US6299659B1 (en) * 1998-08-05 2001-10-09 Showa Denko K.K. Polishing material composition and polishing method for polishing LSI devices
JP4501694B2 (ja) * 1998-12-25 2010-07-14 日立化成工業株式会社 Ｃｍｐ研磨剤用添加液
JP2000256654A (ja) * 1999-03-04 2000-09-19 Hitachi Chem Co Ltd Ｃｍｐ研磨剤及び基板の研磨方法
US6350393B2 (en) * 1999-11-04 2002-02-26 Cabot Microelectronics Corporation Use of CsOH in a dielectric CMP slurry
US6454821B1 (en) * 2000-06-21 2002-09-24 Praxair S. T. Technology, Inc. Polishing composition and method
JP2002114970A (ja) * 2000-10-04 2002-04-16 Asahi Denka Kogyo Kk 水系ラップ液及び水系ラップ剤
US6726534B1 (en) * 2001-03-01 2004-04-27 Cabot Microelectronics Corporation Preequilibrium polishing method and system
US6736705B2 (en) * 2001-04-27 2004-05-18 Hitachi Global Storage Technologies Polishing process for glass or ceramic disks used in disk drive data storage devices
US20030162398A1 (en) * 2002-02-11 2003-08-28 Small Robert J. Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same
WO2004037943A1 (en) * 2002-10-25 2004-05-06 Showa Denko K.K. Polishing slurry and polished substrate
US20050066687A1 (en) * 2003-09-30 2005-03-31 Mr. Chi-Fu Hsueh Methods for the production of marble-like crystallized glass panel wih embossed surface
JP2004291232A (ja) * 2004-07-20 2004-10-21 Hitachi Chem Co Ltd 酸化セリウム研磨剤及び基板の研磨法
JP2006041034A (ja) * 2004-07-23 2006-02-09 Hitachi Chem Co Ltd Ｃｍｐ研磨剤及び基板の研磨方法
US20070218811A1 (en) * 2004-09-27 2007-09-20 Hitachi Chemical Co., Ltd. Cmp polishing slurry and method of polishing substrate
JP2006175552A (ja) * 2004-12-22 2006-07-06 Hitachi Chem Co Ltd 有機材料用ｃｍｐ研磨剤及び有機材料の研磨方法
JP4463134B2 (ja) * 2005-03-29 2010-05-12 三井金属鉱業株式会社 セリウム系研摩材及びその中間体並びにこれらの製造方法
JP4776387B2 (ja) * 2006-02-06 2011-09-21 日立化成工業株式会社 酸化セリウム研磨剤および基板の研磨法

Also Published As

Publication number Publication date
SG175636A1 (en) 2011-11-28
US20100022171A1 (en) 2010-01-28
WO2008048562A1 (en) 2008-04-24
JP2010506743A (ja) 2010-03-04
CN101528882B (zh) 2014-07-16
KR20090067213A (ko) 2009-06-24
DE112007002470T5 (de) 2009-09-10
CN101528882A (zh) 2009-09-09
KR101477826B1 (ko) 2015-01-02

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