JP2007324606A5 - - Google Patents
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- Publication number
- JP2007324606A5 JP2007324606A5 JP2007148759A JP2007148759A JP2007324606A5 JP 2007324606 A5 JP2007324606 A5 JP 2007324606A5 JP 2007148759 A JP2007148759 A JP 2007148759A JP 2007148759 A JP2007148759 A JP 2007148759A JP 2007324606 A5 JP2007324606 A5 JP 2007324606A5
- Authority
- JP
- Japan
- Prior art keywords
- hydroxide
- aqueous solution
- slurry
- carboxylic acid
- ion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims 13
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 claims 12
- 239000007864 aqueous solution Substances 0.000 claims 10
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims 8
- 229920000642 polymer Polymers 0.000 claims 8
- 239000002002 slurry Substances 0.000 claims 8
- 238000005498 polishing Methods 0.000 claims 7
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims 6
- 150000003856 quaternary ammonium compounds Chemical class 0.000 claims 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 4
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical group O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 claims 4
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 claims 4
- 229910021529 ammonia Inorganic materials 0.000 claims 3
- 239000002245 particle Substances 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 claims 2
- 229910052581 Si3N4 Inorganic materials 0.000 claims 2
- 239000006061 abrasive grain Substances 0.000 claims 2
- 150000001768 cations Chemical class 0.000 claims 2
- 239000003456 ion exchange resin Substances 0.000 claims 2
- 229920003303 ion-exchange polymer Polymers 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000000377 silicon dioxide Substances 0.000 claims 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 2
- 239000000126 substance Substances 0.000 claims 2
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 claims 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims 2
- OQZAQBGJENJMHT-UHFFFAOYSA-N 1,3-dibromo-5-methoxybenzene Chemical compound COC1=CC(Br)=CC(Br)=C1 OQZAQBGJENJMHT-UHFFFAOYSA-N 0.000 claims 1
- 238000001514 detection method Methods 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 238000012544 monitoring process Methods 0.000 claims 1
- 125000005498 phthalate group Chemical class 0.000 claims 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 claims 1
- 150000003021 phthalic acid derivatives Chemical class 0.000 claims 1
- IWZKICVEHNUQTL-UHFFFAOYSA-M potassium hydrogen phthalate Chemical group [K+].OC(=O)C1=CC=CC=C1C([O-])=O IWZKICVEHNUQTL-UHFFFAOYSA-M 0.000 claims 1
- CPOUUWYFNYIYLQ-UHFFFAOYSA-M tetra(propan-2-yl)azanium;hydroxide Chemical compound [OH-].CC(C)[N+](C(C)C)(C(C)C)C(C)C CPOUUWYFNYIYLQ-UHFFFAOYSA-M 0.000 claims 1
- HBCNJOTXLRLIAB-UHFFFAOYSA-M tetracyclohexylazanium;hydroxide Chemical compound [OH-].C1CCCCC1[N+](C1CCCCC1)(C1CCCCC1)C1CCCCC1 HBCNJOTXLRLIAB-UHFFFAOYSA-M 0.000 claims 1
- YZTANSPZKPAMGE-UHFFFAOYSA-M tetracyclopentylazanium;hydroxide Chemical compound [OH-].C1CCCC1[N+](C1CCCC1)(C1CCCC1)C1CCCC1 YZTANSPZKPAMGE-UHFFFAOYSA-M 0.000 claims 1
- DOYCTBKOGNQSAL-UHFFFAOYSA-M tetracyclopropylazanium;hydroxide Chemical compound [OH-].C1CC1[N+](C1CC1)(C1CC1)C1CC1 DOYCTBKOGNQSAL-UHFFFAOYSA-M 0.000 claims 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 claims 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 claims 1
- RROIKUJKYDVRRG-UHFFFAOYSA-M tetrakis(2-methylpropyl)azanium;hydroxide Chemical compound [OH-].CC(C)C[N+](CC(C)C)(CC(C)C)CC(C)C RROIKUJKYDVRRG-UHFFFAOYSA-M 0.000 claims 1
- JVOPCCBEQRRLOJ-UHFFFAOYSA-M tetrapentylazanium;hydroxide Chemical compound [OH-].CCCCC[N+](CCCCC)(CCCCC)CCCCC JVOPCCBEQRRLOJ-UHFFFAOYSA-M 0.000 claims 1
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 claims 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/446,936 US7297633B1 (en) | 2006-06-05 | 2006-06-05 | Compositions for chemical mechanical polishing silica and silicon nitride having improved endpoint detection |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007324606A JP2007324606A (ja) | 2007-12-13 |
| JP2007324606A5 true JP2007324606A5 (enExample) | 2010-07-22 |
Family
ID=38650726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007148759A Pending JP2007324606A (ja) | 2006-06-05 | 2007-06-05 | 改良された終点検出を有する、シリカ及び窒化ケイ素をケミカルメカニカル研磨するための組成物 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7297633B1 (enExample) |
| JP (1) | JP2007324606A (enExample) |
| KR (1) | KR20070116543A (enExample) |
| CN (1) | CN101085902B (enExample) |
| DE (1) | DE102007024142A1 (enExample) |
| FR (1) | FR2901802B1 (enExample) |
| SG (1) | SG137837A1 (enExample) |
| TW (1) | TW200804577A (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008032794A1 (en) * | 2006-09-15 | 2008-03-20 | Hitachi Chemical Co., Ltd. | Cmp polishing agent, additive solution for cmp polishing agent, and method for polishing substrate by using the polishing agent and the additive solution |
| US20090181475A1 (en) * | 2008-01-11 | 2009-07-16 | Novellus Systems, Inc. | Detecting the presence of a workpiece relative to a carrier head |
| US8366959B2 (en) * | 2008-09-26 | 2013-02-05 | Rhodia Operations | Abrasive compositions for chemical mechanical polishing and methods for using same |
| US8735293B2 (en) * | 2008-11-05 | 2014-05-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing composition and methods relating thereto |
| EP2460176A1 (de) | 2009-12-18 | 2012-06-06 | RENA GmbH | Verfahren zum abtragen von substratschichten |
| US8671685B2 (en) * | 2010-03-08 | 2014-03-18 | Tma Power, Llc | Microturbine Sun Tracker |
| CN102464946B (zh) * | 2010-11-19 | 2015-05-27 | 安集微电子（上海）有限公司 | 一种化学机械抛光液及其应用 |
| JP5333571B2 (ja) * | 2010-12-24 | 2013-11-06 | 日立化成株式会社 | 研磨液及びこの研磨液を用いた基板の研磨方法 |
| US8808573B2 (en) * | 2011-04-15 | 2014-08-19 | Cabot Microelectronics Corporation | Compositions and methods for selective polishing of silicon nitride materials |
| DE112023000723T5 (de) * | 2022-01-28 | 2024-11-14 | AGC Inc. | Poliermittel, flüssiges additiv für ein poliermittel und polierverfahren |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05269460A (ja) * | 1992-03-27 | 1993-10-19 | Kurita Water Ind Ltd | アンモニアおよびアルカリ土類金属イオン含有水の処理方法 |
| US6126848A (en) | 1998-05-06 | 2000-10-03 | International Business Machines Corporation | Indirect endpoint detection by chemical reaction and chemiluminescence |
| US6228280B1 (en) * | 1998-05-06 | 2001-05-08 | International Business Machines Corporation | Endpoint detection by chemical reaction and reagent |
| JP3449600B2 (ja) * | 1998-05-06 | 2003-09-22 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 化学反応による終点の検出 |
| EP0957086A3 (en) * | 1998-05-14 | 2003-02-12 | Haldor Topsoe A/S | Process for the removal of metal compounds from an aqueous acid solution |
| US6021679A (en) | 1998-08-04 | 2000-02-08 | International Business Machines Corporation | Probe for slurry gas sampling |
| US6899784B1 (en) | 2002-06-27 | 2005-05-31 | International Business Machines Corporation | Apparatus for detecting CMP endpoint in acidic slurries |
| US20050108947A1 (en) * | 2003-11-26 | 2005-05-26 | Mueller Brian L. | Compositions and methods for chemical mechanical polishing silica and silicon nitride |
-
2006
- 2006-06-05 US US11/446,936 patent/US7297633B1/en not_active Expired - Fee Related
-
2007
- 2007-05-23 TW TW096118311A patent/TW200804577A/zh unknown
- 2007-05-24 DE DE102007024142A patent/DE102007024142A1/de not_active Withdrawn
- 2007-05-30 KR KR1020070052556A patent/KR20070116543A/ko not_active Ceased
- 2007-06-05 FR FR0755483A patent/FR2901802B1/fr not_active Expired - Fee Related
- 2007-06-05 SG SG200704055-3A patent/SG137837A1/en unknown
- 2007-06-05 CN CN2007101098948A patent/CN101085902B/zh not_active Expired - Fee Related
- 2007-06-05 JP JP2007148759A patent/JP2007324606A/ja active Pending
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