JP2006191078A5 - - Google Patents
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- JP2006191078A5 JP2006191078A5 JP2005376842A JP2005376842A JP2006191078A5 JP 2006191078 A5 JP2006191078 A5 JP 2006191078A5 JP 2005376842 A JP2005376842 A JP 2005376842A JP 2005376842 A JP2005376842 A JP 2005376842A JP 2006191078 A5 JP2006191078 A5 JP 2006191078A5
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- JP
- Japan
- Prior art keywords
- weight
- hydroxide
- silica
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- Prior art date
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Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/023,862 | 2004-12-28 | ||
| US11/023,862 US7291280B2 (en) | 2004-12-28 | 2004-12-28 | Multi-step methods for chemical mechanical polishing silicon dioxide and silicon nitride |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006191078A JP2006191078A (ja) | 2006-07-20 |
| JP2006191078A5 true JP2006191078A5 (enExample) | 2012-01-05 |
| JP5016220B2 JP5016220B2 (ja) | 2012-09-05 |
Family
ID=36585777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005376842A Expired - Fee Related JP5016220B2 (ja) | 2004-12-28 | 2005-12-28 | 窒化ケイ素上の二酸化ケイ素をケミカルメカニカル研磨するための多工程法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7291280B2 (enExample) |
| JP (1) | JP5016220B2 (enExample) |
| KR (1) | KR20060076689A (enExample) |
| CN (1) | CN1822325A (enExample) |
| DE (1) | DE102005058272A1 (enExample) |
| FR (2) | FR2880188A1 (enExample) |
| TW (1) | TW200633041A (enExample) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050189322A1 (en) * | 2004-02-27 | 2005-09-01 | Lane Sarah J. | Compositions and methods for chemical mechanical polishing silica and silicon nitride |
| US20060021972A1 (en) * | 2004-07-28 | 2006-02-02 | Lane Sarah J | Compositions and methods for chemical mechanical polishing silicon dioxide and silicon nitride |
| US20060213126A1 (en) * | 2005-03-28 | 2006-09-28 | Cho Yun J | Method for preparing a polishing slurry having high dispersion stability |
| US7365045B2 (en) * | 2005-03-30 | 2008-04-29 | Advanced Tehnology Materials, Inc. | Aqueous cleaner with low metal etch rate comprising alkanolamine and tetraalkylammonium hydroxide |
| US20070269908A1 (en) * | 2006-05-17 | 2007-11-22 | Hsin-Kun Chu | Method for in-line controlling hybrid chemical mechanical polishing process |
| US7544618B2 (en) * | 2006-05-18 | 2009-06-09 | Macronix International Co., Ltd. | Two-step chemical mechanical polishing process |
| JP5204960B2 (ja) * | 2006-08-24 | 2013-06-05 | 株式会社フジミインコーポレーテッド | 研磨用組成物及び研磨方法 |
| KR101406487B1 (ko) | 2006-10-06 | 2014-06-12 | 제이에스알 가부시끼가이샤 | 화학 기계 연마용 수계 분산체 및 반도체 장치의 화학 기계연마 방법 |
| DE102006061891A1 (de) | 2006-12-28 | 2008-07-03 | Basf Se | Zusammensetzung zum Polieren von Oberflächen aus Siliziumdioxid |
| KR100821488B1 (ko) * | 2006-12-28 | 2008-04-14 | 동부일렉트로닉스 주식회사 | 반도체 소자의 격리막 형성방법 |
| WO2008095078A1 (en) * | 2007-01-31 | 2008-08-07 | Advanced Technology Materials, Inc. | Stabilization of polymer-silica dispersions for chemical mechanical polishing slurry applications |
| KR100949250B1 (ko) | 2007-10-10 | 2010-03-25 | 제일모직주식회사 | 금속 ｃｍｐ 슬러리 조성물 및 이를 이용한 연마 방법 |
| JP5186296B2 (ja) * | 2008-06-30 | 2013-04-17 | 信越半導体株式会社 | ウェーハの研磨方法及び半導体素子の製造方法 |
| JP5261065B2 (ja) * | 2008-08-08 | 2013-08-14 | シャープ株式会社 | 半導体装置の製造方法 |
| US8366959B2 (en) * | 2008-09-26 | 2013-02-05 | Rhodia Operations | Abrasive compositions for chemical mechanical polishing and methods for using same |
| CN102725374B (zh) * | 2010-01-29 | 2016-04-27 | 福吉米株式会社 | 半导体晶片的再生方法和研磨用组合物 |
| KR20120135870A (ko) * | 2011-06-07 | 2012-12-17 | 동우 화인켐 주식회사 | 단결정 실리콘 웨이퍼 및 그 제조방법 |
| JP2014534630A (ja) * | 2011-10-19 | 2014-12-18 | ドングウー ファイン−ケム カンパニー、 リミテッドＤｏｎｇｗｏｏ Ｆｉｎｅ−Ｃｈｅｍ Ｃｏ．， Ｌｔｄ． | 結晶性シリコンウェハーのテクスチャエッチング液組成物及びテクスチャエッチング方法 |
| EP2662885A1 (en) | 2012-05-07 | 2013-11-13 | Basf Se | A process for the manufacture of semiconductor devices comprising the chemical mechanical polishing (cmp) of iii-v material in the presence of a cmp composition comprising a compound containing an n-heterocycle |
| US8821215B2 (en) * | 2012-09-07 | 2014-09-02 | Cabot Microelectronics Corporation | Polypyrrolidone polishing composition and method |
| JP7356932B2 (ja) * | 2019-09-26 | 2023-10-05 | 株式会社フジミインコーポレーテッド | 研磨用組成物及び研磨方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5391258A (en) * | 1993-05-26 | 1995-02-21 | Rodel, Inc. | Compositions and methods for polishing |
| EP0853335A3 (en) * | 1997-01-10 | 1999-01-07 | Texas Instruments Incorporated | Slurry and process for the mechano-chemical polishing of semiconductor devices |
| US6019806A (en) * | 1998-01-08 | 2000-02-01 | Sees; Jennifer A. | High selectivity slurry for shallow trench isolation processing |
| US20020019202A1 (en) * | 1998-06-10 | 2002-02-14 | Thomas Terence M. | Control of removal rates in CMP |
| US6293845B1 (en) * | 1999-09-04 | 2001-09-25 | Mitsubishi Materials Corporation | System and method for end-point detection in a multi-head CMP tool using real-time monitoring of motor current |
| US20040055993A1 (en) * | 1999-10-12 | 2004-03-25 | Moudgil Brij M. | Materials and methods for control of stability and rheological behavior of particulate suspensions |
| JP2001332516A (ja) * | 2000-05-19 | 2001-11-30 | Hitachi Chem Co Ltd | Ｃｍｐ研磨剤及び基板の研磨方法 |
| US6593240B1 (en) * | 2000-06-28 | 2003-07-15 | Infineon Technologies, North America Corp | Two step chemical mechanical polishing process |
| US6307628B1 (en) * | 2000-08-18 | 2001-10-23 | Taiwan Semiconductor Manufacturing Company, Ltd | Method and apparatus for CMP end point detection using confocal optics |
| US20030176151A1 (en) * | 2002-02-12 | 2003-09-18 | Applied Materials, Inc. | STI polish enhancement using fixed abrasives with amino acid additives |
| US6910951B2 (en) * | 2003-02-24 | 2005-06-28 | Dow Global Technologies, Inc. | Materials and methods for chemical-mechanical planarization |
| JP2004349426A (ja) * | 2003-05-21 | 2004-12-09 | Jsr Corp | Ｓｔｉ用化学機械研磨方法 |
| US20050028450A1 (en) * | 2003-08-07 | 2005-02-10 | Wen-Qing Xu | CMP slurry |
-
2004
- 2004-12-28 US US11/023,862 patent/US7291280B2/en not_active Expired - Fee Related
-
2005
- 2005-12-06 DE DE102005058272A patent/DE102005058272A1/de not_active Withdrawn
- 2005-12-15 TW TW094144406A patent/TW200633041A/zh unknown
- 2005-12-26 KR KR1020050129996A patent/KR20060076689A/ko not_active Withdrawn
- 2005-12-27 CN CNA2005101381482A patent/CN1822325A/zh active Pending
- 2005-12-27 FR FR0554114A patent/FR2880188A1/fr not_active Withdrawn
- 2005-12-28 JP JP2005376842A patent/JP5016220B2/ja not_active Expired - Fee Related
-
2006
- 2006-05-24 FR FR0604741A patent/FR2885450A1/fr not_active Withdrawn
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