JP2007273973A5 - - Google Patents
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- Publication number
- JP2007273973A5 JP2007273973A5 JP2007058028A JP2007058028A JP2007273973A5 JP 2007273973 A5 JP2007273973 A5 JP 2007273973A5 JP 2007058028 A JP2007058028 A JP 2007058028A JP 2007058028 A JP2007058028 A JP 2007058028A JP 2007273973 A5 JP2007273973 A5 JP 2007273973A5
- Authority
- JP
- Japan
- Prior art keywords
- aqueous composition
- weight
- trench isolation
- shallow trench
- polyvinylpyrrolidone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002955 isolation Methods 0.000 claims 9
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims 9
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims 9
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims 9
- 235000012431 wafers Nutrition 0.000 claims 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 6
- 238000005498 polishing Methods 0.000 claims 6
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims 4
- 229920000642 polymer Polymers 0.000 claims 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims 3
- 150000001767 cationic compounds Chemical class 0.000 claims 3
- 150000001875 compounds Chemical class 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- 229920002635 polyurethane Polymers 0.000 claims 3
- 239000004814 polyurethane Substances 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 3
- 239000000377 silicon dioxide Substances 0.000 claims 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 3
- -1 0.02-6 wt% abrasive Polymers 0.000 claims 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 2
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical group O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 claims 2
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 claims 2
- 229910052739 hydrogen Inorganic materials 0.000 claims 2
- 239000001257 hydrogen Substances 0.000 claims 2
- KWIUHFFTVRNATP-UHFFFAOYSA-N Betaine Natural products C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 claims 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- KWIUHFFTVRNATP-UHFFFAOYSA-O N,N,N-trimethylglycinium Chemical compound C[N+](C)(C)CC(O)=O KWIUHFFTVRNATP-UHFFFAOYSA-O 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 229920002125 Sokalan® Polymers 0.000 claims 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims 1
- 150000003973 alkyl amines Chemical class 0.000 claims 1
- 150000004982 aromatic amines Chemical class 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 229960003237 betaine Drugs 0.000 claims 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 1
- 150000002431 hydrogen Chemical class 0.000 claims 1
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
- 239000004584 polyacrylic acid Substances 0.000 claims 1
- 150000003856 quaternary ammonium compounds Chemical class 0.000 claims 1
- 125000001424 substituent group Chemical group 0.000 claims 1
- 125000004434 sulfur atom Chemical group 0.000 claims 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/372,321 US20070210278A1 (en) | 2006-03-08 | 2006-03-08 | Compositions for chemical mechanical polishing silicon dioxide and silicon nitride |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007273973A JP2007273973A (ja) | 2007-10-18 |
| JP2007273973A5 true JP2007273973A5 (enExample) | 2010-04-02 |
Family
ID=38336245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007058028A Pending JP2007273973A (ja) | 2006-03-08 | 2007-03-08 | 二酸化ケイ素および窒化ケイ素のケミカルメカニカルポリッシングのための組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20070210278A1 (enExample) |
| JP (1) | JP2007273973A (enExample) |
| KR (1) | KR20070092109A (enExample) |
| CN (1) | CN101054498A (enExample) |
| DE (1) | DE102007008997A1 (enExample) |
| FR (1) | FR2898361A1 (enExample) |
| TW (1) | TW200736375A (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008182179A (ja) * | 2006-12-27 | 2008-08-07 | Hitachi Chem Co Ltd | 研磨剤用添加剤、研磨剤、基板の研磨方法及び電子部品 |
| DE102006061891A1 (de) * | 2006-12-28 | 2008-07-03 | Basf Se | Zusammensetzung zum Polieren von Oberflächen aus Siliziumdioxid |
| TW201038690A (en) * | 2008-09-26 | 2010-11-01 | Rhodia Operations | Abrasive compositions for chemical mechanical polishing and methods for using same |
| JP5878020B2 (ja) | 2009-11-11 | 2016-03-08 | 株式会社クラレ | 化学的機械的研磨用スラリー並びにそれを用いる基板の研磨方法 |
| CN102464946B (zh) * | 2010-11-19 | 2015-05-27 | 安集微电子（上海）有限公司 | 一种化学机械抛光液及其应用 |
| TWI573864B (zh) * | 2012-03-14 | 2017-03-11 | 卡博特微電子公司 | 具有高移除率及低缺陷率之對氧化物及氮化物有選擇性之ｃｍｐ組成物 |
| CN104471684B (zh) * | 2012-05-30 | 2018-01-23 | 可乐丽股份有限公司 | 用于化学机械抛光的浆料和化学机械抛光方法 |
| US9281210B2 (en) * | 2013-10-10 | 2016-03-08 | Cabot Microelectronics Corporation | Wet-process ceria compositions for polishing substrates, and methods related thereto |
| JP6268069B2 (ja) * | 2014-09-12 | 2018-01-24 | 信越化学工業株式会社 | 研磨組成物及び研磨方法 |
| KR20170134963A (ko) * | 2015-03-30 | 2017-12-07 | 제이에스알 가부시끼가이샤 | 화학 기계 연마용 처리 조성물, 화학 기계 연마 방법 및 세정 방법 |
| CN108431931B (zh) * | 2015-12-22 | 2023-08-18 | 巴斯夫欧洲公司 | 用于化学机械抛光后清洁的组合物 |
| CN108117840B (zh) * | 2016-11-29 | 2021-09-21 | 安集微电子科技（上海）股份有限公司 | 一种氮化硅化学机械抛光液 |
| US10954411B2 (en) * | 2019-05-16 | 2021-03-23 | Rohm And Haas Electronic Materials Cmp Holdings | Chemical mechanical polishing composition and method of polishing silicon nitride over silicon dioxide and simultaneously inhibiting damage to silicon dioxide |
| CN120098551A (zh) * | 2023-11-29 | 2025-06-06 | 安集微电子科技（上海）股份有限公司 | 一种化学机械抛光组合物 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6436835B1 (en) * | 1998-02-24 | 2002-08-20 | Showa Denko K.K. | Composition for polishing a semiconductor device and process for manufacturing a semiconductor device using the same |
| GB9924502D0 (en) * | 1999-10-15 | 1999-12-15 | Biocompatibles Ltd | Polymer blend materials |
| US6641632B1 (en) * | 2002-11-18 | 2003-11-04 | International Business Machines Corporation | Polishing compositions and use thereof |
| US20050090104A1 (en) * | 2003-10-27 | 2005-04-28 | Kai Yang | Slurry compositions for chemical mechanical polishing of copper and barrier films |
| US20050108947A1 (en) * | 2003-11-26 | 2005-05-26 | Mueller Brian L. | Compositions and methods for chemical mechanical polishing silica and silicon nitride |
| US20060021972A1 (en) * | 2004-07-28 | 2006-02-02 | Lane Sarah J | Compositions and methods for chemical mechanical polishing silicon dioxide and silicon nitride |
| US20060083694A1 (en) * | 2004-08-07 | 2006-04-20 | Cabot Corporation | Multi-component particles comprising inorganic nanoparticles distributed in an organic matrix and processes for making and using same |
| JP2006100538A (ja) * | 2004-09-29 | 2006-04-13 | Fuji Photo Film Co Ltd | 研磨用組成物及びそれを用いた研磨方法 |
| US20070176141A1 (en) * | 2006-01-30 | 2007-08-02 | Lane Sarah J | Compositions and methods for chemical mechanical polishing interlevel dielectric layers |
-
2006
- 2006-03-08 US US11/372,321 patent/US20070210278A1/en not_active Abandoned
-
2007
- 2007-02-15 TW TW096105646A patent/TW200736375A/zh unknown
- 2007-02-23 DE DE102007008997A patent/DE102007008997A1/de not_active Withdrawn
- 2007-03-02 KR KR1020070020879A patent/KR20070092109A/ko not_active Withdrawn
- 2007-03-07 CN CNA2007100877140A patent/CN101054498A/zh active Pending
- 2007-03-08 JP JP2007058028A patent/JP2007273973A/ja active Pending
- 2007-03-08 FR FR0753722A patent/FR2898361A1/fr not_active Withdrawn
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