TW200736375A - Compositions for chemical mechanical polishing silicon dioxide and silicon nitride - Google Patents

Compositions for chemical mechanical polishing silicon dioxide and silicon nitride

Info

Publication number
TW200736375A
TW200736375A TW096105646A TW96105646A TW200736375A TW 200736375 A TW200736375 A TW 200736375A TW 096105646 A TW096105646 A TW 096105646A TW 96105646 A TW96105646 A TW 96105646A TW 200736375 A TW200736375 A TW 200736375A
Authority
TW
Taiwan
Prior art keywords
compositions
silicon nitride
mechanical polishing
chemical mechanical
silicon dioxide
Prior art date
Application number
TW096105646A
Other languages
English (en)
Chinese (zh)
Inventor
Sarah J Lane
Charles Yu
Original Assignee
Rohm & Haas Elect Mat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas Elect Mat filed Critical Rohm & Haas Elect Mat
Publication of TW200736375A publication Critical patent/TW200736375A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H10P95/062—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW096105646A 2006-03-08 2007-02-15 Compositions for chemical mechanical polishing silicon dioxide and silicon nitride TW200736375A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/372,321 US20070210278A1 (en) 2006-03-08 2006-03-08 Compositions for chemical mechanical polishing silicon dioxide and silicon nitride

Publications (1)

Publication Number Publication Date
TW200736375A true TW200736375A (en) 2007-10-01

Family

ID=38336245

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096105646A TW200736375A (en) 2006-03-08 2007-02-15 Compositions for chemical mechanical polishing silicon dioxide and silicon nitride

Country Status (7)

Country Link
US (1) US20070210278A1 (enExample)
JP (1) JP2007273973A (enExample)
KR (1) KR20070092109A (enExample)
CN (1) CN101054498A (enExample)
DE (1) DE102007008997A1 (enExample)
FR (1) FR2898361A1 (enExample)
TW (1) TW200736375A (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008182179A (ja) * 2006-12-27 2008-08-07 Hitachi Chem Co Ltd 研磨剤用添加剤、研磨剤、基板の研磨方法及び電子部品
DE102006061891A1 (de) * 2006-12-28 2008-07-03 Basf Se Zusammensetzung zum Polieren von Oberflächen aus Siliziumdioxid
TW201038690A (en) * 2008-09-26 2010-11-01 Rhodia Operations Abrasive compositions for chemical mechanical polishing and methods for using same
JP5878020B2 (ja) 2009-11-11 2016-03-08 株式会社クラレ 化学的機械的研磨用スラリー並びにそれを用いる基板の研磨方法
CN102464946B (zh) * 2010-11-19 2015-05-27 安集微电子（上海）有限公司 一种化学机械抛光液及其应用
TWI573864B (zh) * 2012-03-14 2017-03-11 卡博特微電子公司 具有高移除率及低缺陷率之對氧化物及氮化物有選擇性之ｃｍｐ組成物
CN104471684B (zh) * 2012-05-30 2018-01-23 可乐丽股份有限公司 用于化学机械抛光的浆料和化学机械抛光方法
US9281210B2 (en) * 2013-10-10 2016-03-08 Cabot Microelectronics Corporation Wet-process ceria compositions for polishing substrates, and methods related thereto
JP6268069B2 (ja) * 2014-09-12 2018-01-24 信越化学工業株式会社 研磨組成物及び研磨方法
KR20170134963A (ko) * 2015-03-30 2017-12-07 제이에스알 가부시끼가이샤 화학 기계 연마용 처리 조성물, 화학 기계 연마 방법 및 세정 방법
CN108431931B (zh) * 2015-12-22 2023-08-18 巴斯夫欧洲公司 用于化学机械抛光后清洁的组合物
CN108117840B (zh) * 2016-11-29 2021-09-21 安集微电子科技（上海）股份有限公司 一种氮化硅化学机械抛光液
US10954411B2 (en) * 2019-05-16 2021-03-23 Rohm And Haas Electronic Materials Cmp Holdings Chemical mechanical polishing composition and method of polishing silicon nitride over silicon dioxide and simultaneously inhibiting damage to silicon dioxide
CN120098551A (zh) * 2023-11-29 2025-06-06 安集微电子科技（上海）股份有限公司 一种化学机械抛光组合物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6436835B1 (en) * 1998-02-24 2002-08-20 Showa Denko K.K. Composition for polishing a semiconductor device and process for manufacturing a semiconductor device using the same
GB9924502D0 (en) * 1999-10-15 1999-12-15 Biocompatibles Ltd Polymer blend materials
US6641632B1 (en) * 2002-11-18 2003-11-04 International Business Machines Corporation Polishing compositions and use thereof
US20050090104A1 (en) * 2003-10-27 2005-04-28 Kai Yang Slurry compositions for chemical mechanical polishing of copper and barrier films
US20050108947A1 (en) * 2003-11-26 2005-05-26 Mueller Brian L. Compositions and methods for chemical mechanical polishing silica and silicon nitride
US20060021972A1 (en) * 2004-07-28 2006-02-02 Lane Sarah J Compositions and methods for chemical mechanical polishing silicon dioxide and silicon nitride
US20060083694A1 (en) * 2004-08-07 2006-04-20 Cabot Corporation Multi-component particles comprising inorganic nanoparticles distributed in an organic matrix and processes for making and using same
JP2006100538A (ja) * 2004-09-29 2006-04-13 Fuji Photo Film Co Ltd 研磨用組成物及びそれを用いた研磨方法
US20070176141A1 (en) * 2006-01-30 2007-08-02 Lane Sarah J Compositions and methods for chemical mechanical polishing interlevel dielectric layers

Also Published As

Publication number Publication date
US20070210278A1 (en) 2007-09-13
KR20070092109A (ko) 2007-09-12
FR2898361A1 (fr) 2007-09-14
DE102007008997A1 (de) 2007-09-13
CN101054498A (zh) 2007-10-17
JP2007273973A (ja) 2007-10-18

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