JP2013042131A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2013042131A5 JP2013042131A5 JP2012173339A JP2012173339A JP2013042131A5 JP 2013042131 A5 JP2013042131 A5 JP 2013042131A5 JP 2012173339 A JP2012173339 A JP 2012173339A JP 2012173339 A JP2012173339 A JP 2012173339A JP 2013042131 A5 JP2013042131 A5 JP 2013042131A5
- Authority
- JP
- Japan
- Prior art keywords
- chemical mechanical
- mechanical polishing
- substrate
- removal rate
- minute
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims 48
- 239000000126 substance Substances 0.000 claims 39
- 239000000758 substrate Substances 0.000 claims 22
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 16
- 229910052721 tungsten Inorganic materials 0.000 claims 16
- 239000010937 tungsten Substances 0.000 claims 16
- 238000000034 method Methods 0.000 claims 13
- 150000001450 anions Chemical class 0.000 claims 6
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims 5
- 239000002002 slurry Substances 0.000 claims 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims 4
- 150000001875 compounds Chemical class 0.000 claims 3
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 claims 3
- 229920002635 polyurethane Polymers 0.000 claims 3
- 239000004814 polyurethane Substances 0.000 claims 3
- JLKDVMWYMMLWTI-UHFFFAOYSA-M potassium iodate Chemical compound [K+].[O-]I(=O)=O JLKDVMWYMMLWTI-UHFFFAOYSA-M 0.000 claims 3
- 239000001230 potassium iodate Substances 0.000 claims 3
- 229940093930 potassium iodate Drugs 0.000 claims 3
- 235000006666 potassium iodate Nutrition 0.000 claims 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 3
- 125000006732 (C1-C15) alkyl group Chemical group 0.000 claims 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 239000002253 acid Substances 0.000 claims 2
- OSKNUZYLXFBIHL-UHFFFAOYSA-N azanium;hydron;phthalate Chemical compound N.OC(=O)C1=CC=CC=C1C(O)=O OSKNUZYLXFBIHL-UHFFFAOYSA-N 0.000 claims 2
- 150000001768 cations Chemical class 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 239000008119 colloidal silica Substances 0.000 claims 2
- 238000005260 corrosion Methods 0.000 claims 2
- 230000007797 corrosion Effects 0.000 claims 2
- 239000003112 inhibitor Substances 0.000 claims 2
- 229910017604 nitric acid Inorganic materials 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- 229920006395 saturated elastomer Polymers 0.000 claims 2
- 230000003068 static effect Effects 0.000 claims 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 claims 1
- 239000006061 abrasive grain Substances 0.000 claims 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
- 239000007800 oxidant agent Substances 0.000 claims 1
- 230000001590 oxidative effect Effects 0.000 claims 1
- 125000000864 peroxy group Chemical group O(O*)* 0.000 claims 1
- 150000003021 phthalic acid derivatives Chemical class 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/209,749 | 2011-08-15 | ||
| US13/209,749 US8865013B2 (en) | 2011-08-15 | 2011-08-15 | Method for chemical mechanical polishing tungsten |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013042131A JP2013042131A (ja) | 2013-02-28 |
| JP2013042131A5 true JP2013042131A5 (enExample) | 2015-09-17 |
| JP6137793B2 JP6137793B2 (ja) | 2017-05-31 |
Family
ID=47625347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012173339A Active JP6137793B2 (ja) | 2011-08-15 | 2012-08-03 | タングステンをケミカルメカニカルポリッシングするための方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8865013B2 (enExample) |
| JP (1) | JP6137793B2 (enExample) |
| KR (1) | KR101992132B1 (enExample) |
| CN (1) | CN103042464B (enExample) |
| DE (1) | DE102012015825A1 (enExample) |
| FR (1) | FR2979069B1 (enExample) |
| TW (1) | TWI550044B (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG11201403505UA (en) * | 2011-12-21 | 2014-07-30 | Basf Se | Method for manufacturing cmp composition and application thereof |
| CN103265893B (zh) * | 2013-06-04 | 2015-12-09 | 复旦大学 | 一种基于金属Mo的抛光工艺的抛光液、其制备方法及应用 |
| US9303188B2 (en) * | 2014-03-11 | 2016-04-05 | Cabot Microelectronics Corporation | Composition for tungsten CMP |
| US9275899B2 (en) * | 2014-06-27 | 2016-03-01 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing composition and method for polishing tungsten |
| CN107075310B (zh) | 2014-10-21 | 2019-04-02 | 嘉柏微电子材料股份公司 | 钴凹陷控制剂 |
| US9944828B2 (en) | 2014-10-21 | 2018-04-17 | Cabot Microelectronics Corporation | Slurry for chemical mechanical polishing of cobalt |
| WO2016065060A1 (en) | 2014-10-21 | 2016-04-28 | Cabot Microelectronics Corporation | Cobalt polishing accelerators |
| TWI611049B (zh) | 2014-10-21 | 2018-01-11 | 卡博特微電子公司 | 腐蝕抑制劑及相關組合物及方法 |
| JP6538368B2 (ja) * | 2015-02-24 | 2019-07-03 | 株式会社フジミインコーポレーテッド | 研磨用組成物及び研磨方法 |
| US9803108B1 (en) * | 2016-10-19 | 2017-10-31 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Aqueous compositions of stabilized aminosilane group containing silica particles |
| US10181408B2 (en) * | 2017-01-31 | 2019-01-15 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing method for tungsten using polyglycols and polyglycol derivatives |
| WO2021210310A1 (ja) * | 2020-04-16 | 2021-10-21 | 富士フイルムエレクトロニクスマテリアルズ株式会社 | 処理液、化学的機械的研磨方法、半導体基板の処理方法 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10163142A (ja) * | 1996-12-02 | 1998-06-19 | Fujimi Inkooporeetetsudo:Kk | タングステンの研磨用組成物 |
| US6083419A (en) | 1997-07-28 | 2000-07-04 | Cabot Corporation | Polishing composition including an inhibitor of tungsten etching |
| JP3805588B2 (ja) | 1999-12-27 | 2006-08-02 | 株式会社日立製作所 | 半導体装置の製造方法 |
| US6409781B1 (en) | 2000-05-01 | 2002-06-25 | Advanced Technology Materials, Inc. | Polishing slurries for copper and associated materials |
| US6569770B2 (en) | 2001-06-28 | 2003-05-27 | Chartered Semiconductor Manufacturing Ltd. | Method for improving oxide erosion of tungsten CMP operations |
| FR2835844B1 (fr) * | 2002-02-13 | 2006-12-15 | Clariant | Procede de polissage mecano-chimique de substrats metalliques |
| US6641630B1 (en) * | 2002-06-06 | 2003-11-04 | Cabot Microelectronics Corp. | CMP compositions containing iodine and an iodine vapor-trapping agent |
| EP1567606A1 (en) | 2002-10-22 | 2005-08-31 | Psiloquest, Inc. | A corrosion retarding polishing slurry for the chemical mechanical polishing of copper surfaces |
| TWI347969B (en) * | 2003-09-30 | 2011-09-01 | Fujimi Inc | Polishing composition |
| EP1899111A2 (en) * | 2005-06-06 | 2008-03-19 | Advanced Technology Materials, Inc. | Integrated chemical mechanical polishing composition and process for single platen processing |
| US8512593B2 (en) * | 2005-11-04 | 2013-08-20 | Cheil Industries, Inc. | Chemical mechanical polishing slurry compositions, methods of preparing the same and methods of using the same |
| US20080020680A1 (en) * | 2006-07-24 | 2008-01-24 | Cabot Microelectronics Corporation | Rate-enhanced CMP compositions for dielectric films |
| JP5322455B2 (ja) | 2007-02-26 | 2013-10-23 | 富士フイルム株式会社 | 研磨液及び研磨方法 |
| JP2009081200A (ja) * | 2007-09-25 | 2009-04-16 | Fujifilm Corp | 研磨液 |
| JP5314329B2 (ja) * | 2008-06-12 | 2013-10-16 | 富士フイルム株式会社 | 研磨液 |
| US8506831B2 (en) | 2008-12-23 | 2013-08-13 | Air Products And Chemicals, Inc. | Combination, method, and composition for chemical mechanical planarization of a tungsten-containing substrate |
| US8119529B2 (en) * | 2009-04-29 | 2012-02-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method for chemical mechanical polishing a substrate |
| US8025813B2 (en) * | 2009-11-12 | 2011-09-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing composition and methods relating thereto |
| US8232208B2 (en) * | 2010-06-15 | 2012-07-31 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Stabilized chemical mechanical polishing composition and method of polishing a substrate |
| US8568610B2 (en) * | 2010-09-20 | 2013-10-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Stabilized, concentratable chemical mechanical polishing composition and method of polishing a substrate |
-
2011
- 2011-08-15 US US13/209,749 patent/US8865013B2/en active Active
-
2012
- 2012-08-03 JP JP2012173339A patent/JP6137793B2/ja active Active
- 2012-08-07 TW TW101128396A patent/TWI550044B/zh active
- 2012-08-09 DE DE102012015825A patent/DE102012015825A1/de not_active Withdrawn
- 2012-08-14 KR KR1020120089111A patent/KR101992132B1/ko active Active
- 2012-08-14 CN CN201210289371.7A patent/CN103042464B/zh active Active
- 2012-08-16 FR FR1257820A patent/FR2979069B1/fr not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2013042131A5 (enExample) | ||
| KR102511928B1 (ko) | 텅스텐 화학적-기계적 연마 조성물 | |
| KR102444548B1 (ko) | 구리 배리어 화학적-기계적 연마 조성물 | |
| KR102774705B1 (ko) | 양이온성 계면활성제를 함유하는 텅스텐-가공 슬러리 | |
| JP2015188093A5 (enExample) | ||
| JP7148395B2 (ja) | タングステン含有表面を処理するのに有用な化学機械研磨組成物及びタングステンを含む表面を含む基材を化学機械研磨する方法 | |
| KR102408747B1 (ko) | 혼합 마모제 텅스텐 cmp 조성물 | |
| JP6603234B2 (ja) | タングステン材料のｃｍｐ用組成物及び方法 | |
| JP2010267960A5 (enExample) | ||
| EP3120380B1 (en) | Composition for tungsten buffing | |
| JP2012094838A5 (enExample) | ||
| JP2011139030A5 (enExample) | ||
| EP3117451A1 (en) | Composition for tungsten cmp | |
| KR20170021323A (ko) | 콜로이드성 실리카 화학적-기계적 연마 농축액 | |
| KR20170074869A (ko) | 연마용 조성물 | |
| WO2015138301A1 (en) | Composition for tungsten cmp | |
| JP2011192995A5 (enExample) | ||
| JP2010114446A5 (enExample) | ||
| JP2010153853A5 (enExample) | ||
| JP2013042132A5 (enExample) | ||
| JP2011205096A5 (enExample) | ||
| JP2012235111A5 (enExample) | ||
| JP2012039087A5 (enExample) | ||
| JP2011216873A5 (enExample) | ||
| JP2012235110A5 (enExample) |