JP2012039087A5 - - Google Patents

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Publication number
JP2012039087A5
JP2012039087A5 JP2011133174A JP2011133174A JP2012039087A5 JP 2012039087 A5 JP2012039087 A5 JP 2012039087A5 JP 2011133174 A JP2011133174 A JP 2011133174A JP 2011133174 A JP2011133174 A JP 2011133174A JP 2012039087 A5 JP2012039087 A5 JP 2012039087A5
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JP
Japan
Prior art keywords
chemical mechanical
mechanical polishing
formula
group
anion
Prior art date
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Application number
JP2011133174A
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English (en)
Japanese (ja)
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JP2012039087A (ja
JP5843093B2 (ja
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Publication date
Priority claimed from US12/815,564 external-priority patent/US8232208B2/en
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Publication of JP2012039087A publication Critical patent/JP2012039087A/ja
Publication of JP2012039087A5 publication Critical patent/JP2012039087A5/ja
Application granted granted Critical
Publication of JP5843093B2 publication Critical patent/JP5843093B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011133174A 2010-06-15 2011-06-15 安定化されたケミカルメカニカルポリッシング組成物及び基板を研磨する方法 Expired - Fee Related JP5843093B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/815,564 US8232208B2 (en) 2010-06-15 2010-06-15 Stabilized chemical mechanical polishing composition and method of polishing a substrate
US12/815,564 2010-06-15

Publications (3)

Publication Number Publication Date
JP2012039087A JP2012039087A (ja) 2012-02-23
JP2012039087A5 true JP2012039087A5 (enExample) 2014-07-24
JP5843093B2 JP5843093B2 (ja) 2016-01-13

Family

ID=45047467

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011133174A Expired - Fee Related JP5843093B2 (ja) 2010-06-15 2011-06-15 安定化されたケミカルメカニカルポリッシング組成物及び基板を研磨する方法

Country Status (7)

Country Link
US (2) US8232208B2 (enExample)
JP (1) JP5843093B2 (enExample)
KR (1) KR101718798B1 (enExample)
CN (1) CN102363713B (enExample)
DE (1) DE102011104161B4 (enExample)
FR (1) FR2961214B1 (enExample)
TW (1) TWI480368B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8232208B2 (en) * 2010-06-15 2012-07-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Stabilized chemical mechanical polishing composition and method of polishing a substrate
US8865013B2 (en) * 2011-08-15 2014-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing tungsten
US9293339B1 (en) * 2015-09-24 2016-03-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of polishing semiconductor substrate
US9803108B1 (en) 2016-10-19 2017-10-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aqueous compositions of stabilized aminosilane group containing silica particles
CN111318956A (zh) * 2018-12-13 2020-06-23 夏泰鑫半导体(青岛)有限公司 聚氨酯研磨垫及其制造方法、及化学机械研磨装置
JP7681402B2 (ja) * 2021-01-14 2025-05-22 株式会社フジミインコーポレーテッド 研磨用組成物、研磨用組成物の製造方法、研磨方法、基板の製造方法
JP7778621B2 (ja) * 2021-03-31 2025-12-02 株式会社フジミインコーポレーテッド 第四級アンモニウム系表面修飾シリカ、その組成物、作製方法、および使用方法

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JP3440419B2 (ja) * 2001-02-02 2003-08-25 株式会社フジミインコーポレーテッド 研磨用組成物およびそれを用いた研磨方法
US7316603B2 (en) * 2002-01-22 2008-01-08 Cabot Microelectronics Corporation Compositions and methods for tantalum CMP
US7005382B2 (en) * 2002-10-31 2006-02-28 Jsr Corporation Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing process, production process of semiconductor device and material for preparing an aqueous dispersion for chemical mechanical polishing
US7018560B2 (en) * 2003-08-05 2006-03-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Composition for polishing semiconductor layers
KR101045658B1 (ko) * 2003-11-17 2011-07-01 쎄데르마 테트라펩티드 및 트리펩티드 혼합물을 포함하는 조성물
US20050108947A1 (en) * 2003-11-26 2005-05-26 Mueller Brian L. Compositions and methods for chemical mechanical polishing silica and silicon nitride
KR100611064B1 (ko) * 2004-07-15 2006-08-10 삼성전자주식회사 화학 기계적 연마 공정용 슬러리 조성물, 상기 슬러리조성물을 이용한 화학 기계적 연마 방법 및 상기 방법을이용한 게이트 패턴의 형성 방법
JP4814502B2 (ja) * 2004-09-09 2011-11-16 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
US20060205219A1 (en) * 2005-03-08 2006-09-14 Baker Arthur R Iii Compositions and methods for chemical mechanical polishing interlevel dielectric layers
WO2007029465A1 (ja) * 2005-09-09 2007-03-15 Asahi Glass Company, Limited 研磨剤、被研磨面の研磨方法および半導体集積回路装置の製造方法
US20070077865A1 (en) 2005-10-04 2007-04-05 Cabot Microelectronics Corporation Method for controlling polysilicon removal
US7842192B2 (en) 2006-02-08 2010-11-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multi-component barrier polishing solution
US20080220610A1 (en) 2006-06-29 2008-09-11 Cabot Microelectronics Corporation Silicon oxide polishing method utilizing colloidal silica
CN101168647A (zh) * 2006-10-27 2008-04-30 安集微电子（上海）有限公司 一种用于抛光多晶硅的化学机械抛光液
KR100827591B1 (ko) * 2006-11-27 2008-05-07 제일모직주식회사 화학적 기계적 연마용 슬러리 조성물 및 그 전구체 조성물
JP5322455B2 (ja) * 2007-02-26 2013-10-23 富士フイルム株式会社 研磨液及び研磨方法
US20080314872A1 (en) * 2007-06-19 2008-12-25 Ferro Corporation Chemical-Mechanical Polishing Compositions Containing Aspartame And Methods Of Making And Using The Same
CN101451049A (zh) * 2007-11-30 2009-06-10 安集微电子（上海）有限公司 一种化学机械抛光液
JP5403922B2 (ja) * 2008-02-26 2014-01-29 富士フイルム株式会社 研磨液および研磨方法
JP2009278061A (ja) * 2008-04-16 2009-11-26 Hitachi Chem Co Ltd Ｃｍｐ用研磨液及び研磨方法
CN101665662A (zh) * 2008-09-05 2010-03-10 安集微电子科技(上海)有限公司 一种化学机械抛光液
US8735293B2 (en) * 2008-11-05 2014-05-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition and methods relating thereto
US8119529B2 (en) 2009-04-29 2012-02-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing a substrate
US8232208B2 (en) * 2010-06-15 2012-07-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Stabilized chemical mechanical polishing composition and method of polishing a substrate
US8568610B2 (en) 2010-09-20 2013-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Stabilized, concentratable chemical mechanical polishing composition and method of polishing a substrate
US8513126B2 (en) 2010-09-22 2013-08-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Slurry composition having tunable dielectric polishing selectivity and method of polishing a substrate

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