JP2011139030A5 - - Google Patents
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- Publication number
- JP2011139030A5 JP2011139030A5 JP2010253421A JP2010253421A JP2011139030A5 JP 2011139030 A5 JP2011139030 A5 JP 2011139030A5 JP 2010253421 A JP2010253421 A JP 2010253421A JP 2010253421 A JP2010253421 A JP 2010253421A JP 2011139030 A5 JP2011139030 A5 JP 2011139030A5
- Authority
- JP
- Japan
- Prior art keywords
- chemical mechanical
- mechanical polishing
- substance
- formula
- polishing composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000126 substance Substances 0.000 claims 31
- 238000005498 polishing Methods 0.000 claims 17
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 12
- 239000000463 material Substances 0.000 claims 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 6
- 239000006061 abrasive grain Substances 0.000 claims 6
- 229910052757 nitrogen Inorganic materials 0.000 claims 6
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 6
- 229910052581 Si3N4 Inorganic materials 0.000 claims 5
- 238000000034 method Methods 0.000 claims 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 5
- 229910052814 silicon oxide Inorganic materials 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 5
- 239000003002 pH adjusting agent Substances 0.000 claims 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 3
- 125000000217 alkyl group Chemical group 0.000 claims 3
- 125000004432 carbon atom Chemical group C* 0.000 claims 3
- 229910052739 hydrogen Inorganic materials 0.000 claims 3
- 239000001257 hydrogen Substances 0.000 claims 3
- 239000002002 slurry Substances 0.000 claims 3
- KYVBNYUBXIEUFW-UHFFFAOYSA-N 1,1,3,3-tetramethylguanidine Chemical group CN(C)C(=N)N(C)C KYVBNYUBXIEUFW-UHFFFAOYSA-N 0.000 claims 1
- 239000000654 additive Substances 0.000 claims 1
- 239000003139 biocide Substances 0.000 claims 1
- 239000000872 buffer Substances 0.000 claims 1
- 239000008119 colloidal silica Substances 0.000 claims 1
- 239000002270 dispersing agent Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- MBKDYNNUVRNNRF-UHFFFAOYSA-N medronic acid Chemical group OP(O)(=O)CP(O)(O)=O MBKDYNNUVRNNRF-UHFFFAOYSA-N 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 239000004094 surface-active agent Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/617,140 US8025813B2 (en) | 2009-11-12 | 2009-11-12 | Chemical mechanical polishing composition and methods relating thereto |
| US12/617,140 | 2009-11-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011139030A JP2011139030A (ja) | 2011-07-14 |
| JP2011139030A5 true JP2011139030A5 (enExample) | 2013-09-19 |
Family
ID=43877853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010253421A Pending JP2011139030A (ja) | 2009-11-12 | 2010-11-12 | ケミカルメカニカル研磨組成物及びそれに関連する方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8025813B2 (enExample) |
| JP (1) | JP2011139030A (enExample) |
| KR (1) | KR101718788B1 (enExample) |
| CN (1) | CN102061132B (enExample) |
| DE (1) | DE102010051045B4 (enExample) |
| FR (1) | FR2952376B1 (enExample) |
| TW (1) | TWI485235B (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5516184B2 (ja) * | 2010-07-26 | 2014-06-11 | 信越化学工業株式会社 | 合成石英ガラス基板の製造方法 |
| US8865013B2 (en) * | 2011-08-15 | 2014-10-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method for chemical mechanical polishing tungsten |
| US9604339B2 (en) | 2012-10-29 | 2017-03-28 | Wayne O. Duescher | Vacuum-grooved membrane wafer polishing workholder |
| US9199354B2 (en) | 2012-10-29 | 2015-12-01 | Wayne O. Duescher | Flexible diaphragm post-type floating and rigid abrading workholder |
| US8998678B2 (en) | 2012-10-29 | 2015-04-07 | Wayne O. Duescher | Spider arm driven flexible chamber abrading workholder |
| US8998677B2 (en) | 2012-10-29 | 2015-04-07 | Wayne O. Duescher | Bellows driven floatation-type abrading workholder |
| US8845394B2 (en) | 2012-10-29 | 2014-09-30 | Wayne O. Duescher | Bellows driven air floatation abrading workholder |
| US9233452B2 (en) | 2012-10-29 | 2016-01-12 | Wayne O. Duescher | Vacuum-grooved membrane abrasive polishing wafer workholder |
| US9039488B2 (en) | 2012-10-29 | 2015-05-26 | Wayne O. Duescher | Pin driven flexible chamber abrading workholder |
| US9011207B2 (en) | 2012-10-29 | 2015-04-21 | Wayne O. Duescher | Flexible diaphragm combination floating and rigid abrading workholder |
| US9012327B2 (en) * | 2013-09-18 | 2015-04-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Low defect chemical mechanical polishing composition |
| WO2015088953A1 (en) | 2013-12-09 | 2015-06-18 | 3M Innovative Properties Company | Conglomerate abrasive particles, abrasive articles including the same, and methods of making the same |
| WO2019003433A1 (ja) | 2017-06-30 | 2019-01-03 | 大塚製薬株式会社 | ベンゾアゼピン誘導体 |
| US10926378B2 (en) | 2017-07-08 | 2021-02-23 | Wayne O. Duescher | Abrasive coated disk islands using magnetic font sheet |
| CN109825199A (zh) * | 2019-04-11 | 2019-05-31 | 富地润滑科技股份有限公司 | 一种绿色环保抛光液及其制备方法 |
| US11691241B1 (en) * | 2019-08-05 | 2023-07-04 | Keltech Engineering, Inc. | Abrasive lapping head with floating and rigid workpiece carrier |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1107097C (zh) * | 1999-07-28 | 2003-04-30 | 长兴化学工业股份有限公司 | 化学机械研磨组合物及方法 |
| CN100335580C (zh) | 1999-08-13 | 2007-09-05 | 卡伯特微电子公司 | 含有阻化化合物的抛光系统及其使用方法 |
| TWI307712B (en) * | 2002-08-28 | 2009-03-21 | Kao Corp | Polishing composition |
| US7063597B2 (en) * | 2002-10-25 | 2006-06-20 | Applied Materials | Polishing processes for shallow trench isolation substrates |
| US7018560B2 (en) * | 2003-08-05 | 2006-03-28 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Composition for polishing semiconductor layers |
| US7241725B2 (en) * | 2003-09-25 | 2007-07-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Barrier polishing fluid |
| KR100795364B1 (ko) * | 2004-02-10 | 2008-01-17 | 삼성전자주식회사 | 반도체 기판용 세정액 조성물, 이를 이용한 세정 방법 및도전성 구조물의 제조 방법 |
| US7253111B2 (en) * | 2004-04-21 | 2007-08-07 | Rohm And Haas Electronic Materials Cmp Holding, Inc. | Barrier polishing solution |
| JP2005347737A (ja) * | 2004-05-07 | 2005-12-15 | Nissan Chem Ind Ltd | シリコンウェハー用研磨組成物 |
| US20060110923A1 (en) * | 2004-11-24 | 2006-05-25 | Zhendong Liu | Barrier polishing solution |
| US7790618B2 (en) * | 2004-12-22 | 2010-09-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Selective slurry for chemical mechanical polishing |
| CN101457124B (zh) * | 2007-12-14 | 2013-08-28 | 安集微电子（上海）有限公司 | 一种化学机械抛光液 |
| US8017524B2 (en) * | 2008-05-23 | 2011-09-13 | Cabot Microelectronics Corporation | Stable, high rate silicon slurry |
-
2009
- 2009-11-12 US US12/617,140 patent/US8025813B2/en active Active
-
2010
- 2010-11-08 TW TW099138302A patent/TWI485235B/zh active
- 2010-11-10 FR FR1059303A patent/FR2952376B1/fr not_active Expired - Fee Related
- 2010-11-11 CN CN201010553984.8A patent/CN102061132B/zh not_active Expired - Fee Related
- 2010-11-11 KR KR1020100112111A patent/KR101718788B1/ko not_active Expired - Fee Related
- 2010-11-11 DE DE102010051045.9A patent/DE102010051045B4/de not_active Expired - Fee Related
- 2010-11-12 JP JP2010253421A patent/JP2011139030A/ja active Pending
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