JP2017525796A5 - - Google Patents
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- JP2017525796A5 JP2017525796A5 JP2016575222A JP2016575222A JP2017525796A5 JP 2017525796 A5 JP2017525796 A5 JP 2017525796A5 JP 2016575222 A JP2016575222 A JP 2016575222A JP 2016575222 A JP2016575222 A JP 2016575222A JP 2017525796 A5 JP2017525796 A5 JP 2017525796A5
- Authority
- JP
- Japan
- Prior art keywords
- colloidal silica
- polishing
- copper
- composition
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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| CN110997856B (zh) * | 2017-08-09 | 2021-10-29 | 昭和电工材料株式会社 | 研磨液和研磨方法 |
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| KR102525287B1 (ko) * | 2019-10-18 | 2023-04-24 | 삼성에스디아이 주식회사 | 구리 막 연마용 cmp 슬러리 조성물 및 이를 이용한 구리 막 연마 방법 |
| KR102570805B1 (ko) * | 2019-11-01 | 2023-08-24 | 삼성에스디아이 주식회사 | 텅스텐 패턴 웨이퍼 연마용 cmp 슬러리 조성물 및 이를 이용한 텅스텐 패턴 웨이퍼 연마 방법 |
| KR102367056B1 (ko) * | 2020-02-27 | 2022-02-25 | 주식회사 케이씨텍 | 화학적 기계적 연마용 슬러리 조성물 |
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| CN113249175B (zh) * | 2021-04-27 | 2023-03-24 | 上海新阳半导体材料股份有限公司 | 一种化学机械抛光后清洗液的应用 |
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| KR102773634B1 (ko) * | 2022-04-13 | 2025-02-25 | 에스케이엔펄스 주식회사 | 반도체 공정용 조성물 및 이를 이용한 반도체 소자의 연마방법 |
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2015
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- 2015-06-25 EP EP15811236.7A patent/EP3161095B8/en active Active
- 2015-06-25 CN CN201580046257.3A patent/CN106661431B/zh active Active
- 2015-06-25 WO PCT/US2015/037772 patent/WO2015200684A1/en not_active Ceased
- 2015-06-25 KR KR1020177001865A patent/KR102444548B1/ko active Active
- 2015-06-25 TW TW104120493A patent/TWI564380B/zh active
- 2015-06-25 SG SG11201610332PA patent/SG11201610332PA/en unknown
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