KR20060076689A - 실리콘 디옥사이드와 실리콘 니트리드를 화학적 기계적연마하는 다단계 방법 - Google Patents

실리콘 디옥사이드와 실리콘 니트리드를 화학적 기계적연마하는 다단계 방법 Download PDF

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Publication number
KR20060076689A
KR20060076689A KR1020050129996A KR20050129996A KR20060076689A KR 20060076689 A KR20060076689 A KR 20060076689A KR 1020050129996 A KR1020050129996 A KR 1020050129996A KR 20050129996 A KR20050129996 A KR 20050129996A KR 20060076689 A KR20060076689 A KR 20060076689A
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KR
South Korea
Prior art keywords
ammonium hydroxide
silica
weight
weight percent
abrasive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020050129996A
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English (en)
Korean (ko)
Inventor
사라 제이. 레인
앤드류 스콧 로윙
브라이언 엘. 뮬러
찰스 유
Original Assignee
롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 filed Critical 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드
Publication of KR20060076689A publication Critical patent/KR20060076689A/ko
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020050129996A 2004-12-28 2005-12-26 실리콘 디옥사이드와 실리콘 니트리드를 화학적 기계적연마하는 다단계 방법 Withdrawn KR20060076689A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/023,862 US7291280B2 (en) 2004-12-28 2004-12-28 Multi-step methods for chemical mechanical polishing silicon dioxide and silicon nitride
US11/023,862 2004-12-28

Publications (1)

Publication Number Publication Date
KR20060076689A true KR20060076689A (ko) 2006-07-04

Family

ID=36585777

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050129996A Withdrawn KR20060076689A (ko) 2004-12-28 2005-12-26 실리콘 디옥사이드와 실리콘 니트리드를 화학적 기계적연마하는 다단계 방법

Country Status (7)

Country Link
US (1) US7291280B2 (enExample)
JP (1) JP5016220B2 (enExample)
KR (1) KR20060076689A (enExample)
CN (1) CN1822325A (enExample)
DE (1) DE102005058272A1 (enExample)
FR (2) FR2880188A1 (enExample)
TW (1) TW200633041A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100821488B1 (ko) * 2006-12-28 2008-04-14 동부일렉트로닉스 주식회사 반도체 소자의 격리막 형성방법
KR101406487B1 (ko) * 2006-10-06 2014-06-12 제이에스알 가부시끼가이샤 화학 기계 연마용 수계 분산체 및 반도체 장치의 화학 기계연마 방법

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050189322A1 (en) * 2004-02-27 2005-09-01 Lane Sarah J. Compositions and methods for chemical mechanical polishing silica and silicon nitride
US20060021972A1 (en) * 2004-07-28 2006-02-02 Lane Sarah J Compositions and methods for chemical mechanical polishing silicon dioxide and silicon nitride
KR101134590B1 (ko) * 2005-03-28 2012-04-09 삼성코닝정밀소재 주식회사 분산 안정성이 우수한 연마 슬러리의 제조방법
US7365045B2 (en) * 2005-03-30 2008-04-29 Advanced Tehnology Materials, Inc. Aqueous cleaner with low metal etch rate comprising alkanolamine and tetraalkylammonium hydroxide
US20070269908A1 (en) * 2006-05-17 2007-11-22 Hsin-Kun Chu Method for in-line controlling hybrid chemical mechanical polishing process
US7544618B2 (en) * 2006-05-18 2009-06-09 Macronix International Co., Ltd. Two-step chemical mechanical polishing process
JP5204960B2 (ja) * 2006-08-24 2013-06-05 株式会社フジミインコーポレーテッド 研磨用組成物及び研磨方法
DE102006061891A1 (de) 2006-12-28 2008-07-03 Basf Se Zusammensetzung zum Polieren von Oberflächen aus Siliziumdioxid
US20100087065A1 (en) * 2007-01-31 2010-04-08 Advanced Technology Materials, Inc. Stabilization of polymer-silica dispersions for chemical mechanical polishing slurry applications
KR100949250B1 (ko) 2007-10-10 2010-03-25 제일모직주식회사 금속 ｃｍｐ 슬러리 조성물 및 이를 이용한 연마 방법
JP5186296B2 (ja) * 2008-06-30 2013-04-17 信越半導体株式会社 ウェーハの研磨方法及び半導体素子の製造方法
JP5261065B2 (ja) * 2008-08-08 2013-08-14 シャープ株式会社 半導体装置の製造方法
WO2010036358A1 (en) * 2008-09-26 2010-04-01 Rhodia Operations Abrasive compositions for chemical mechanical polishing and methods for using same
JP5759904B2 (ja) * 2010-01-29 2015-08-05 株式会社フジミインコーポレーテッド 半導体ウェーハの再生方法及び研磨用組成物
KR20120135870A (ko) * 2011-06-07 2012-12-17 동우 화인켐 주식회사 단결정 실리콘 웨이퍼 및 그 제조방법
JP2014534630A (ja) * 2011-10-19 2014-12-18 ドングウー ファイン−ケム カンパニー、 リミテッドＤｏｎｇｗｏｏ Ｆｉｎｅ−Ｃｈｅｍ Ｃｏ．， Ｌｔｄ． 結晶性シリコンウェハーのテクスチャエッチング液組成物及びテクスチャエッチング方法
EP2662885A1 (en) 2012-05-07 2013-11-13 Basf Se A process for the manufacture of semiconductor devices comprising the chemical mechanical polishing (cmp) of iii-v material in the presence of a cmp composition comprising a compound containing an n-heterocycle
US8821215B2 (en) * 2012-09-07 2014-09-02 Cabot Microelectronics Corporation Polypyrrolidone polishing composition and method
JP7356932B2 (ja) * 2019-09-26 2023-10-05 株式会社フジミインコーポレーテッド 研磨用組成物及び研磨方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5391258A (en) * 1993-05-26 1995-02-21 Rodel, Inc. Compositions and methods for polishing
EP0853335A3 (en) * 1997-01-10 1999-01-07 Texas Instruments Incorporated Slurry and process for the mechano-chemical polishing of semiconductor devices
US6019806A (en) * 1998-01-08 2000-02-01 Sees; Jennifer A. High selectivity slurry for shallow trench isolation processing
US20020019202A1 (en) * 1998-06-10 2002-02-14 Thomas Terence M. Control of removal rates in CMP
US6293845B1 (en) * 1999-09-04 2001-09-25 Mitsubishi Materials Corporation System and method for end-point detection in a multi-head CMP tool using real-time monitoring of motor current
US20040055993A1 (en) * 1999-10-12 2004-03-25 Moudgil Brij M. Materials and methods for control of stability and rheological behavior of particulate suspensions
JP2001332516A (ja) * 2000-05-19 2001-11-30 Hitachi Chem Co Ltd Ｃｍｐ研磨剤及び基板の研磨方法
US6593240B1 (en) * 2000-06-28 2003-07-15 Infineon Technologies, North America Corp Two step chemical mechanical polishing process
US6307628B1 (en) * 2000-08-18 2001-10-23 Taiwan Semiconductor Manufacturing Company, Ltd Method and apparatus for CMP end point detection using confocal optics
US20030176151A1 (en) * 2002-02-12 2003-09-18 Applied Materials, Inc. STI polish enhancement using fixed abrasives with amino acid additives
US6910951B2 (en) * 2003-02-24 2005-06-28 Dow Global Technologies, Inc. Materials and methods for chemical-mechanical planarization
JP2004349426A (ja) 2003-05-21 2004-12-09 Jsr Corp Ｓｔｉ用化学機械研磨方法
US20050028450A1 (en) * 2003-08-07 2005-02-10 Wen-Qing Xu CMP slurry

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101406487B1 (ko) * 2006-10-06 2014-06-12 제이에스알 가부시끼가이샤 화학 기계 연마용 수계 분산체 및 반도체 장치의 화학 기계연마 방법
KR100821488B1 (ko) * 2006-12-28 2008-04-14 동부일렉트로닉스 주식회사 반도체 소자의 격리막 형성방법

Also Published As

Publication number Publication date
FR2880188A1 (fr) 2006-06-30
DE102005058272A1 (de) 2006-07-13
JP2006191078A (ja) 2006-07-20
CN1822325A (zh) 2006-08-23
TW200633041A (en) 2006-09-16
JP5016220B2 (ja) 2012-09-05
US7291280B2 (en) 2007-11-06
FR2885450A1 (fr) 2006-11-10
US20060138086A1 (en) 2006-06-29

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PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20051226

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid