JP2011530166A5 - - Google Patents
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- Publication number
- JP2011530166A5 JP2011530166A5 JP2011521112A JP2011521112A JP2011530166A5 JP 2011530166 A5 JP2011530166 A5 JP 2011530166A5 JP 2011521112 A JP2011521112 A JP 2011521112A JP 2011521112 A JP2011521112 A JP 2011521112A JP 2011530166 A5 JP2011530166 A5 JP 2011530166A5
- Authority
- JP
- Japan
- Prior art keywords
- cmp
- cmp method
- substrate
- hydrophilic
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims 11
- -1 heterocyclic amine Chemical class 0.000 claims 7
- 238000005498 polishing Methods 0.000 claims 7
- 239000000758 substrate Substances 0.000 claims 6
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 claims 4
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 claims 4
- 239000004094 surface-active agent Substances 0.000 claims 4
- 239000000654 additive Substances 0.000 claims 3
- 230000000996 additive effect Effects 0.000 claims 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- 239000008365 aqueous carrier Substances 0.000 claims 2
- 229920001577 copolymer Polymers 0.000 claims 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 2
- 125000000524 functional group Chemical group 0.000 claims 2
- 239000002736 nonionic surfactant Substances 0.000 claims 2
- 229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000010703 silicon Substances 0.000 claims 2
- NEAQRZUHTPSBBM-UHFFFAOYSA-N 2-hydroxy-3,3-dimethyl-7-nitro-4h-isoquinolin-1-one Chemical compound C1=C([N+]([O-])=O)C=C2C(=O)N(O)C(C)(C)CC2=C1 NEAQRZUHTPSBBM-UHFFFAOYSA-N 0.000 claims 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical compound NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 150000004982 aromatic amines Chemical class 0.000 claims 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims 1
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 claims 1
- 150000002989 phenols Chemical class 0.000 claims 1
- 239000011164 primary particle Substances 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 229940124530 sulfonamide Drugs 0.000 claims 1
- 150000003456 sulfonamides Chemical class 0.000 claims 1
- 150000003573 thiols Chemical class 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/221,023 | 2008-07-30 | ||
| US12/221,023 US8247327B2 (en) | 2008-07-30 | 2008-07-30 | Methods and compositions for polishing silicon-containing substrates |
| PCT/US2009/004281 WO2010014180A2 (en) | 2008-07-30 | 2009-07-23 | Methods and compositions for polishing silicon-containing substrates |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014152992A Division JP5952352B2 (ja) | 2008-07-30 | 2014-07-28 | シリコン含有基材を研磨するための方法及び組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011530166A JP2011530166A (ja) | 2011-12-15 |
| JP2011530166A5 true JP2011530166A5 (enExample) | 2012-02-02 |
| JP5628802B2 JP5628802B2 (ja) | 2014-11-19 |
Family
ID=41608845
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011521112A Expired - Fee Related JP5628802B2 (ja) | 2008-07-30 | 2009-07-23 | シリコン含有基材を研磨するための方法及び組成物 |
| JP2014152992A Active JP5952352B2 (ja) | 2008-07-30 | 2014-07-28 | シリコン含有基材を研磨するための方法及び組成物 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014152992A Active JP5952352B2 (ja) | 2008-07-30 | 2014-07-28 | シリコン含有基材を研磨するための方法及び組成物 |
Country Status (10)
| Country | Link |
|---|---|
| US (2) | US8247327B2 (enExample) |
| EP (1) | EP2331649B1 (enExample) |
| JP (2) | JP5628802B2 (enExample) |
| KR (1) | KR101396000B1 (enExample) |
| CN (1) | CN102149783B (enExample) |
| IL (1) | IL210029A (enExample) |
| MY (1) | MY149727A (enExample) |
| SG (1) | SG189801A1 (enExample) |
| TW (1) | TWI398917B (enExample) |
| WO (1) | WO2010014180A2 (enExample) |
Families Citing this family (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101268615B1 (ko) | 2008-12-11 | 2013-06-04 | 히타치가세이가부시끼가이샤 | Ｃｍｐ용 연마액 및 이것을 이용한 연마 방법 |
| JP5492603B2 (ja) * | 2010-03-02 | 2014-05-14 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びそれを用いた研磨方法 |
| JP5648567B2 (ja) * | 2010-05-07 | 2015-01-07 | 日立化成株式会社 | Ｃｍｐ用研磨液及びこれを用いた研磨方法 |
| US9070632B2 (en) * | 2010-10-07 | 2015-06-30 | Basf Se | Aqueous polishing composition and process for chemically mechanically polishing substrates having patterned or unpatterned low-k dielectric layers |
| EP2663604B1 (en) * | 2011-01-11 | 2020-07-01 | Cabot Microelectronics Corporation | Metal-passivating cmp compositions and methods |
| CN102816530B (zh) * | 2011-06-08 | 2016-01-27 | 安集微电子（上海）有限公司 | 一种化学机械抛光液 |
| SG11201407520XA (en) * | 2012-05-23 | 2014-12-30 | Basf Se | A process for the manufacture of semiconductor devices comprising the chemical mechanical polishing (cmp) of iii-v material in the presence of a cmp composition comprising a specific non-ionic surfact |
| CN104582899B (zh) * | 2012-08-30 | 2018-11-09 | 日立化成株式会社 | 研磨剂、研磨剂套剂及基体的研磨方法 |
| KR20150113956A (ko) * | 2013-02-01 | 2015-10-08 | 가부시키가이샤 후지미인코퍼레이티드 | 표면 선택성 연마 조성물 |
| JP5820404B2 (ja) * | 2013-02-05 | 2015-11-24 | 株式会社東芝 | 平坦化方法及び平坦化装置 |
| JP6209845B2 (ja) * | 2013-04-11 | 2017-10-11 | 日立化成株式会社 | 研磨液、研磨液セット及び基体の研磨方法 |
| US10155886B2 (en) | 2013-06-12 | 2018-12-18 | Hitachi Chemical Company, Ltd. | Polishing liquid for CMP, and polishing method |
| EP2826827B1 (en) * | 2013-07-18 | 2019-06-12 | Basf Se | CMP composition comprising abrasive particles containing ceria |
| JP2016175949A (ja) * | 2013-08-09 | 2016-10-06 | コニカミノルタ株式会社 | Ｃｍｐ用研磨液 |
| US9281210B2 (en) * | 2013-10-10 | 2016-03-08 | Cabot Microelectronics Corporation | Wet-process ceria compositions for polishing substrates, and methods related thereto |
| US9279067B2 (en) * | 2013-10-10 | 2016-03-08 | Cabot Microelectronics Corporation | Wet-process ceria compositions for polishing substrates, and methods related thereto |
| CN104745085B (zh) * | 2013-12-25 | 2018-08-21 | 安集微电子（上海）有限公司 | 一种用于钴阻挡层抛光的化学机械抛光液 |
| WO2016006553A1 (ja) * | 2014-07-09 | 2016-01-14 | 日立化成株式会社 | Ｃｍｐ用研磨液及び研磨方法 |
| US20160053381A1 (en) * | 2014-08-22 | 2016-02-25 | Cabot Microelectronics Corporation | Germanium chemical mechanical polishing |
| JP6456633B2 (ja) * | 2014-09-05 | 2019-01-23 | 三菱重工サーマルシステムズ株式会社 | ターボ冷凍機 |
| US9530655B2 (en) * | 2014-09-08 | 2016-12-27 | Taiwan Semiconductor Manufacting Company, Ltd. | Slurry composition for chemical mechanical polishing of Ge-based materials and devices |
| JP6396740B2 (ja) * | 2014-09-29 | 2018-09-26 | 株式会社フジミインコーポレーテッド | 研磨用組成物及び研磨方法 |
| KR102690419B1 (ko) * | 2015-07-13 | 2024-08-01 | 씨엠씨 머티리얼즈 엘엘씨 | 유전체 기판을 가공하기 위한 방법 및 조성물 |
| US10619075B2 (en) | 2015-07-13 | 2020-04-14 | Cabot Microelectronics Corporation | Self-stopping polishing composition and method for bulk oxide planarization |
| JP6599176B2 (ja) | 2015-08-28 | 2019-10-30 | 三菱重工サーマルシステムズ株式会社 | ターボ冷凍装置 |
| EP3344716A4 (en) * | 2015-09-03 | 2019-04-10 | Cabot Microelectronics Corporation | METHODS AND COMPOSITIONS FOR TREATING DIELECTRIC SUBSTRATE |
| JP6960336B2 (ja) * | 2015-10-23 | 2021-11-05 | ニッタ・デュポン株式会社 | 研磨用組成物 |
| KR102574851B1 (ko) * | 2015-12-17 | 2023-09-06 | 솔브레인 주식회사 | 화학기계적 연마 슬러리 조성물 |
| US10286518B2 (en) * | 2017-01-31 | 2019-05-14 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing method for tungsten |
| US20180244955A1 (en) | 2017-02-28 | 2018-08-30 | Versum Materials Us, Llc | Chemical Mechanical Planarization of Films Comprising Elemental Silicon |
| JP7028592B2 (ja) * | 2017-09-19 | 2022-03-02 | 株式会社フジミインコーポレーテッド | 表面処理組成物、表面処理組成物の製造方法、表面処理方法、および半導体基板の製造方法 |
| WO2019069370A1 (ja) * | 2017-10-03 | 2019-04-11 | 日立化成株式会社 | 研磨液、研磨液セット、研磨方法及び欠陥抑制方法 |
| KR102676957B1 (ko) * | 2019-04-02 | 2024-06-19 | 가부시끼가이샤 레조낙 | 연마액, 연마액 세트, 연마 방법 및 결함 억제 방법 |
| CN113811362A (zh) | 2019-05-10 | 2021-12-17 | 加利福尼亚大学董事会 | 修饰的多能细胞 |
| US11162079B2 (en) | 2019-05-10 | 2021-11-02 | The Regents Of The University Of California | Blood type O Rh-hypo-immunogenic pluripotent cells |
| CN113004798B (zh) * | 2019-12-19 | 2024-04-12 | 安集微电子（上海）有限公司 | 一种化学机械抛光液 |
| JP7596653B2 (ja) * | 2020-06-29 | 2024-12-10 | Ａｇｃ株式会社 | 研磨剤及び研磨方法 |
| KR102731706B1 (ko) * | 2021-09-10 | 2024-11-15 | 성균관대학교산학협력단 | 연마 조성물 및 이를 이용한 연마 방법 |
| CN114350264B (zh) * | 2022-02-18 | 2023-06-02 | 河北工业大学 | 一种用于钴互连结构钴膜cmp粗抛的碱性抛光液及其制备方法 |
| CN115851134B (zh) * | 2022-10-27 | 2024-09-10 | 万华化学集团电子材料有限公司 | 一种高精度硅片抛光组合物及其应用 |
| CN119039991B (zh) * | 2024-10-30 | 2025-06-03 | 西安蓝桥新能源科技有限公司 | 一种用于硅片碱刻蚀抛光的添加剂、反应液及方法与应用 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MY114512A (en) * | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
| US6022264A (en) * | 1997-02-10 | 2000-02-08 | Rodel Inc. | Polishing pad and methods relating thereto |
| ATE474899T1 (de) * | 1998-10-23 | 2010-08-15 | Fujifilm Electronic Materials | Eine chemisch-mechanisch polierende aufschlämmung,eine beschleunigerlösung enthaltend |
| JP2001007059A (ja) * | 1999-06-18 | 2001-01-12 | Hitachi Chem Co Ltd | Ｃｍｐ研磨剤及び基板の研磨方法 |
| CN1746255B (zh) | 2001-02-20 | 2010-11-10 | 日立化成工业株式会社 | 抛光剂及基片的抛光方法 |
| US20030162398A1 (en) | 2002-02-11 | 2003-08-28 | Small Robert J. | Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same |
| US6936543B2 (en) | 2002-06-07 | 2005-08-30 | Cabot Microelectronics Corporation | CMP method utilizing amphiphilic nonionic surfactants |
| US6974777B2 (en) * | 2002-06-07 | 2005-12-13 | Cabot Microelectronics Corporation | CMP compositions for low-k dielectric materials |
| US7071105B2 (en) * | 2003-02-03 | 2006-07-04 | Cabot Microelectronics Corporation | Method of polishing a silicon-containing dielectric |
| JP2004247605A (ja) * | 2003-02-14 | 2004-09-02 | Toshiba Corp | Ｃｍｐ用スラリーおよび半導体装置の製造方法 |
| JP4267546B2 (ja) * | 2004-04-06 | 2009-05-27 | 花王株式会社 | 基板の製造方法 |
| JP2006269910A (ja) * | 2005-03-25 | 2006-10-05 | Fuji Photo Film Co Ltd | 金属用研磨液及びこれを用いた研磨方法 |
| US7662753B2 (en) * | 2005-05-12 | 2010-02-16 | Halliburton Energy Services, Inc. | Degradable surfactants and methods for use |
| JPWO2008013226A1 (ja) * | 2006-07-28 | 2009-12-17 | 昭和電工株式会社 | 研磨組成物 |
| KR100814416B1 (ko) * | 2006-09-28 | 2008-03-18 | 삼성전자주식회사 | 고 평탄화 슬러리 조성물 및 이를 이용한 화학 기계적 연마방법 |
| US7456107B2 (en) * | 2006-11-09 | 2008-11-25 | Cabot Microelectronics Corporation | Compositions and methods for CMP of low-k-dielectric materials |
-
2008
- 2008-07-30 US US12/221,023 patent/US8247327B2/en active Active
-
2009
- 2009-06-30 TW TW098122070A patent/TWI398917B/zh active
- 2009-07-23 CN CN200980130098XA patent/CN102149783B/zh active Active
- 2009-07-23 KR KR1020117004512A patent/KR101396000B1/ko active Active
- 2009-07-23 WO PCT/US2009/004281 patent/WO2010014180A2/en not_active Ceased
- 2009-07-23 JP JP2011521112A patent/JP5628802B2/ja not_active Expired - Fee Related
- 2009-07-23 SG SG2013029426A patent/SG189801A1/en unknown
- 2009-07-23 MY MYPI2011000348A patent/MY149727A/en unknown
- 2009-07-23 EP EP09803244.4A patent/EP2331649B1/en not_active Not-in-force
-
2010
- 2010-12-15 IL IL210029A patent/IL210029A/en not_active IP Right Cessation
-
2012
- 2012-07-20 US US13/554,829 patent/US8597540B2/en active Active
-
2014
- 2014-07-28 JP JP2014152992A patent/JP5952352B2/ja active Active
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