KR101396000B1 - 규소-함유 기판을 연마하기 위한 방법 및 조성물 - Google Patents

규소-함유 기판을 연마하기 위한 방법 및 조성물 Download PDF

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Publication number
KR101396000B1
KR101396000B1 KR1020117004512A KR20117004512A KR101396000B1 KR 101396000 B1 KR101396000 B1 KR 101396000B1 KR 1020117004512 A KR1020117004512 A KR 1020117004512A KR 20117004512 A KR20117004512 A KR 20117004512A KR 101396000 B1 KR101396000 B1 KR 101396000B1
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South Korea
Prior art keywords
polishing
acid
silicon
substrate
cmp
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Korean (ko)
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KR20110053438A (ko
Inventor
프란시스코 드 레게 테사우로
잔 첸
Original Assignee
캐보트 마이크로일렉트로닉스 코포레이션
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020117004512A 2008-07-30 2009-07-23 규소-함유 기판을 연마하기 위한 방법 및 조성물 Active KR101396000B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/221,023 US8247327B2 (en) 2008-07-30 2008-07-30 Methods and compositions for polishing silicon-containing substrates
US12/221,023 2008-07-30
PCT/US2009/004281 WO2010014180A2 (en) 2008-07-30 2009-07-23 Methods and compositions for polishing silicon-containing substrates

Publications (2)

Publication Number Publication Date
KR20110053438A KR20110053438A (ko) 2011-05-23
KR101396000B1 true KR101396000B1 (ko) 2014-05-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117004512A Active KR101396000B1 (ko) 2008-07-30 2009-07-23 규소-함유 기판을 연마하기 위한 방법 및 조성물

Country Status (10)

Country Link
US (2) US8247327B2 (enExample)
EP (1) EP2331649B1 (enExample)
JP (2) JP5628802B2 (enExample)
KR (1) KR101396000B1 (enExample)
CN (1) CN102149783B (enExample)
IL (1) IL210029A (enExample)
MY (1) MY149727A (enExample)
SG (1) SG189801A1 (enExample)
TW (1) TWI398917B (enExample)
WO (1) WO2010014180A2 (enExample)

Cited By (1)

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KR20230037833A (ko) * 2021-09-10 2023-03-17 성균관대학교산학협력단 연마 조성물 및 이를 이용한 연마 방법

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CN113004798B (zh) * 2019-12-19 2024-04-12 安集微电子（上海）有限公司 一种化学机械抛光液
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Also Published As

Publication number Publication date
CN102149783A (zh) 2011-08-10
US8247327B2 (en) 2012-08-21
SG189801A1 (en) 2013-05-31
TWI398917B (zh) 2013-06-11
KR20110053438A (ko) 2011-05-23
TW201011826A (en) 2010-03-16
US8597540B2 (en) 2013-12-03
EP2331649A2 (en) 2011-06-15
CN102149783B (zh) 2013-06-12
EP2331649B1 (en) 2018-06-13
JP5952352B2 (ja) 2016-07-13
IL210029A (en) 2015-07-30
WO2010014180A3 (en) 2010-04-22
IL210029A0 (en) 2011-02-28
US20120280170A1 (en) 2012-11-08
JP5628802B2 (ja) 2014-11-19
JP2011530166A (ja) 2011-12-15
JP2014209662A (ja) 2014-11-06
US20100029181A1 (en) 2010-02-04
WO2010014180A2 (en) 2010-02-04
EP2331649A4 (en) 2013-07-03
MY149727A (en) 2013-10-14

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