SG11201505490RA - Surface selective polishing compositions - Google Patents
Surface selective polishing compositionsInfo
- Publication number
- SG11201505490RA SG11201505490RA SG11201505490RA SG11201505490RA SG11201505490RA SG 11201505490R A SG11201505490R A SG 11201505490RA SG 11201505490R A SG11201505490R A SG 11201505490RA SG 11201505490R A SG11201505490R A SG 11201505490RA SG 11201505490R A SG11201505490R A SG 11201505490RA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing compositions
- selective polishing
- surface selective
- compositions
- selective
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/06—Other polishing compositions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361759956P | 2013-02-01 | 2013-02-01 | |
| PCT/JP2014/000461 WO2014119301A1 (en) | 2013-02-01 | 2014-01-29 | Surface-selective polishing composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201505490RA true SG11201505490RA (en) | 2015-08-28 |
Family
ID=51259567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201505490RA SG11201505490RA (en) | 2013-02-01 | 2014-01-29 | Surface selective polishing compositions |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20140220779A1 (en) |
| EP (1) | EP2952550A4 (en) |
| JP (1) | JP6050839B2 (en) |
| KR (1) | KR20150113956A (en) |
| CN (1) | CN104968754A (en) |
| SG (1) | SG11201505490RA (en) |
| TW (1) | TW201431990A (en) |
| WO (1) | WO2014119301A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9309442B2 (en) * | 2014-03-21 | 2016-04-12 | Cabot Microelectronics Corporation | Composition for tungsten buffing |
| US10703936B2 (en) | 2016-03-30 | 2020-07-07 | Fujimi Incorporated | Polishing composition |
| US10626298B1 (en) | 2019-03-20 | 2020-04-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing compositions and methods for suppressing the removal rate of amorphous silicon |
| KR20220010528A (en) * | 2019-06-20 | 2022-01-25 | 후지필름 가부시키가이샤 | Polishing liquid, and chemical mechanical polishing method |
| JP7235164B2 (en) * | 2021-01-06 | 2023-03-08 | 株式会社レゾナック | Polishing liquid, polishing liquid set and polishing method |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11176773A (en) | 1997-12-12 | 1999-07-02 | Toshiba Corp | Polishing method |
| JP2001102333A (en) * | 1999-09-29 | 2001-04-13 | Hitachi Ltd | Chemical machine polishing method, manufacturing method of semiconductor device, and slurry for polishing |
| SG144688A1 (en) * | 2001-07-23 | 2008-08-28 | Fujimi Inc | Polishing composition and polishing method employing it |
| JP2003176479A (en) * | 2001-09-27 | 2003-06-24 | Sanyo Chem Ind Ltd | Polishing composition for cmp process |
| US6974777B2 (en) * | 2002-06-07 | 2005-12-13 | Cabot Microelectronics Corporation | CMP compositions for low-k dielectric materials |
| JP2004172606A (en) * | 2002-11-08 | 2004-06-17 | Sumitomo Chem Co Ltd | Metal polishing material composition and polishing method |
| KR100627510B1 (en) | 2002-12-30 | 2006-09-22 | 주식회사 하이닉스반도체 | CMP slurry for nitride |
| US7044836B2 (en) * | 2003-04-21 | 2006-05-16 | Cabot Microelectronics Corporation | Coated metal oxide particles for CMP |
| KR100640600B1 (en) * | 2003-12-12 | 2006-11-01 | 삼성전자주식회사 | Slurry compositions, and fabrication method of semiconductor device including CMPchemical mechanical polishing process using the same |
| US6979252B1 (en) * | 2004-08-10 | 2005-12-27 | Dupont Air Products Nanomaterials Llc | Low defectivity product slurry for CMP and associated production method |
| EP2437285A2 (en) * | 2007-03-26 | 2012-04-04 | JSR Corporation | Chemical mechanical polishing method for semiconductor device using an aqueous dispersion |
| JP2009099819A (en) * | 2007-10-18 | 2009-05-07 | Daicel Chem Ind Ltd | Polishing composition for cmp, and method of manufacturing device wafer using the polishing composition for cmp |
| JP5444625B2 (en) * | 2008-03-05 | 2014-03-19 | 日立化成株式会社 | CMP polishing liquid, substrate polishing method, and electronic component |
| JP2009289885A (en) * | 2008-05-28 | 2009-12-10 | Fujifilm Corp | Polishing liquid and polishing method |
| JP5467804B2 (en) | 2008-07-11 | 2014-04-09 | 富士フイルム株式会社 | Polishing liquid for silicon nitride and polishing method |
| US8247327B2 (en) * | 2008-07-30 | 2012-08-21 | Cabot Microelectronics Corporation | Methods and compositions for polishing silicon-containing substrates |
| WO2011093153A1 (en) * | 2010-02-01 | 2011-08-04 | Jsr株式会社 | Aqueous dispersion for chemical mechanical polishing, and chemical mechanical polishing method using same |
| JP5601922B2 (en) * | 2010-07-29 | 2014-10-08 | 富士フイルム株式会社 | Polishing liquid and polishing method |
| JP5695367B2 (en) | 2010-08-23 | 2015-04-01 | 株式会社フジミインコーポレーテッド | Polishing composition and polishing method using the same |
| JP6407503B2 (en) * | 2011-06-14 | 2018-10-17 | 株式会社フジミインコーポレーテッド | Polishing composition |
| US9640407B2 (en) * | 2011-06-14 | 2017-05-02 | Fujimi Incorporated | Polishing composition |
-
2014
- 2014-01-29 WO PCT/JP2014/000461 patent/WO2014119301A1/en active Application Filing
- 2014-01-29 KR KR1020157019931A patent/KR20150113956A/en not_active Application Discontinuation
- 2014-01-29 CN CN201480007078.4A patent/CN104968754A/en active Pending
- 2014-01-29 SG SG11201505490RA patent/SG11201505490RA/en unknown
- 2014-01-29 JP JP2014559578A patent/JP6050839B2/en active Active
- 2014-01-29 EP EP14746160.2A patent/EP2952550A4/en not_active Withdrawn
- 2014-01-31 US US14/170,365 patent/US20140220779A1/en not_active Abandoned
- 2014-02-05 TW TW103103752A patent/TW201431990A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP6050839B2 (en) | 2016-12-21 |
| TW201431990A (en) | 2014-08-16 |
| CN104968754A (en) | 2015-10-07 |
| KR20150113956A (en) | 2015-10-08 |
| WO2014119301A1 (en) | 2014-08-07 |
| EP2952550A4 (en) | 2016-09-28 |
| EP2952550A1 (en) | 2015-12-09 |
| JPWO2014119301A1 (en) | 2017-01-26 |
| US20140220779A1 (en) | 2014-08-07 |
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