JP2005529485A5 - - Google Patents

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Publication number
JP2005529485A5
JP2005529485A5 JP2004511407A JP2004511407A JP2005529485A5 JP 2005529485 A5 JP2005529485 A5 JP 2005529485A5 JP 2004511407 A JP2004511407 A JP 2004511407A JP 2004511407 A JP2004511407 A JP 2004511407A JP 2005529485 A5 JP2005529485 A5 JP 2005529485A5
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JP
Japan
Prior art keywords
abrasive
surfactants
polishing pad
liquid carrier
suspended
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JP2004511407A
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Japanese (ja)
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JP4773091B2 (ja
JP2005529485A (ja
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Priority claimed from US10/165,100 external-priority patent/US6974777B2/en
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Publication of JP2005529485A5 publication Critical patent/JP2005529485A5/ja
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Publication of JP4773091B2 publication Critical patent/JP4773091B2/ja
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JP2004511407A 2002-06-07 2003-05-26 ｌｏｗ−ｋ絶縁材料用のＣＭＰ組成物 Expired - Fee Related JP4773091B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/165,100 US6974777B2 (en) 2002-06-07 2002-06-07 CMP compositions for low-k dielectric materials
US10/165,100 2002-06-07
PCT/IB2003/002266 WO2003104343A2 (en) 2002-06-07 2003-05-26 Method for chemical mechanical polishing (cmp) of low-k dielectric materials

Publications (3)

Publication Number Publication Date
JP2005529485A JP2005529485A (ja) 2005-09-29
JP2005529485A5 true JP2005529485A5 (enExample) 2009-10-15
JP4773091B2 JP4773091B2 (ja) 2011-09-14

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JP2004511407A Expired - Fee Related JP4773091B2 (ja) 2002-06-07 2003-05-26 ｌｏｗ−ｋ絶縁材料用のＣＭＰ組成物

Country Status (11)

Country Link
US (1) US6974777B2 (enExample)
EP (1) EP1534795B1 (enExample)
JP (1) JP4773091B2 (enExample)
KR (1) KR100729331B1 (enExample)
CN (1) CN1305984C (enExample)
AT (1) ATE334176T1 (enExample)
AU (1) AU2003274812A1 (enExample)
DE (1) DE60307111T2 (enExample)
SG (1) SG108491A1 (enExample)
TW (1) TWI227728B (enExample)
WO (1) WO2003104343A2 (enExample)

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