JP2005529485A - low−k絶縁材料用のCMP組成物 - Google Patents
low−k絶縁材料用のCMP組成物 Download PDFInfo
- Publication number
- JP2005529485A JP2005529485A JP2004511407A JP2004511407A JP2005529485A JP 2005529485 A JP2005529485 A JP 2005529485A JP 2004511407 A JP2004511407 A JP 2004511407A JP 2004511407 A JP2004511407 A JP 2004511407A JP 2005529485 A JP2005529485 A JP 2005529485A
- Authority
- JP
- Japan
- Prior art keywords
- polyoxyethylene
- polishing
- nonionic surfactant
- alkyl
- amphiphilic nonionic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims description 65
- 239000011810 insulating material Substances 0.000 title description 13
- 238000005498 polishing Methods 0.000 claims abstract description 119
- 239000002736 nonionic surfactant Substances 0.000 claims abstract description 59
- 239000000758 substrate Substances 0.000 claims abstract description 55
- 239000007788 liquid Substances 0.000 claims abstract description 17
- 238000007517 polishing process Methods 0.000 claims abstract 2
- -1 polyoxyethylene Polymers 0.000 claims description 88
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 74
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 36
- 239000000377 silicon dioxide Substances 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 33
- 235000012239 silicon dioxide Nutrition 0.000 claims description 29
- 125000000217 alkyl group Chemical group 0.000 claims description 27
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 20
- 239000000126 substance Substances 0.000 claims description 18
- 229910052715 tantalum Inorganic materials 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 229920006395 saturated elastomer Polymers 0.000 claims description 13
- 150000001875 compounds Chemical class 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 229920001214 Polysorbate 60 Polymers 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 150000002148 esters Chemical class 0.000 claims description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 8
- 229920001451 polypropylene glycol Polymers 0.000 claims description 7
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims description 6
- 239000004698 Polyethylene Substances 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 6
- 229910044991 metal oxide Inorganic materials 0.000 claims description 5
- 150000004706 metal oxides Chemical class 0.000 claims description 5
- 229920000573 polyethylene Polymers 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 125000005037 alkyl phenyl group Chemical group 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- 229920001400 block copolymer Polymers 0.000 claims description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 4
- SUHUKEQAOUOUJO-UHFFFAOYSA-N ethane-1,2-diol;2,4,7,9-tetramethyldec-5-yne-4,7-diol Chemical group OCCO.CC(C)CC(C)(O)C#CC(C)(O)CC(C)C SUHUKEQAOUOUJO-UHFFFAOYSA-N 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- JNYAEWCLZODPBN-JGWLITMVSA-N (2r,3r,4s)-2-[(1r)-1,2-dihydroxyethyl]oxolane-3,4-diol Chemical compound OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O JNYAEWCLZODPBN-JGWLITMVSA-N 0.000 claims description 2
- FFJCNSLCJOQHKM-CLFAGFIQSA-N (z)-1-[(z)-octadec-9-enoxy]octadec-9-ene Chemical compound CCCCCCCC\C=C/CCCCCCCCOCCCCCCCC\C=C/CCCCCCCC FFJCNSLCJOQHKM-CLFAGFIQSA-N 0.000 claims description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 150000003973 alkyl amines Chemical class 0.000 claims description 2
- 150000005215 alkyl ethers Chemical class 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 229920000578 graft copolymer Polymers 0.000 claims description 2
- 229910052741 iridium Inorganic materials 0.000 claims description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229920000259 polyoxyethylene lauryl ether Polymers 0.000 claims description 2
- 229910052703 rhodium Inorganic materials 0.000 claims description 2
- 239000010948 rhodium Substances 0.000 claims description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052707 ruthenium Inorganic materials 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000010937 tungsten Substances 0.000 claims description 2
- ZWCFESDUEDTZMQ-UHFFFAOYSA-N 2-octadecanoylperoxyethyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCOOC(=O)CCCCCCCCCCCCCCCCC ZWCFESDUEDTZMQ-UHFFFAOYSA-N 0.000 claims 1
- OCDXZFSOHJRGIL-UHFFFAOYSA-N cyclohexyloxycyclohexane Chemical compound C1CCCCC1OC1CCCCC1 OCDXZFSOHJRGIL-UHFFFAOYSA-N 0.000 claims 1
- 239000004094 surface-active agent Substances 0.000 description 59
- 239000000463 material Substances 0.000 description 16
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 10
- 239000007800 oxidant agent Substances 0.000 description 10
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical group OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 7
- 229910052799 carbon Inorganic materials 0.000 description 7
- 239000002738 chelating agent Substances 0.000 description 7
- 238000005260 corrosion Methods 0.000 description 7
- 230000007797 corrosion Effects 0.000 description 7
- 230000002209 hydrophobic effect Effects 0.000 description 7
- 239000003112 inhibitor Substances 0.000 description 7
- 239000002002 slurry Substances 0.000 description 7
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 6
- 239000012964 benzotriazole Substances 0.000 description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 6
- 239000008139 complexing agent Substances 0.000 description 6
- 239000003989 dielectric material Substances 0.000 description 6
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 6
- 230000009467 reduction Effects 0.000 description 6
- 150000003839 salts Chemical class 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- 239000003945 anionic surfactant Substances 0.000 description 5
- 230000008901 benefit Effects 0.000 description 5
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 5
- 125000002091 cationic group Chemical group 0.000 description 5
- CUNWUEBNSZSNRX-RKGWDQTMSA-N (2r,3r,4r,5s)-hexane-1,2,3,4,5,6-hexol;(z)-octadec-9-enoic acid Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO.OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO.CCCCCCCC\C=C/CCCCCCCC(O)=O.CCCCCCCC\C=C/CCCCCCCC(O)=O.CCCCCCCC\C=C/CCCCCCCC(O)=O CUNWUEBNSZSNRX-RKGWDQTMSA-N 0.000 description 4
- 239000004147 Sorbitan trioleate Substances 0.000 description 4
- PRXRUNOAOLTIEF-ADSICKODSA-N Sorbitan trioleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OC[C@@H](OC(=O)CCCCCCC\C=C/CCCCCCCC)[C@H]1OC[C@H](O)[C@H]1OC(=O)CCCCCCC\C=C/CCCCCCCC PRXRUNOAOLTIEF-ADSICKODSA-N 0.000 description 4
- 125000000129 anionic group Chemical group 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 4
- 239000003139 biocide Substances 0.000 description 4
- 239000008119 colloidal silica Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000002270 dispersing agent Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- LLYCMZGLHLKPPU-UHFFFAOYSA-M perbromate Chemical compound [O-]Br(=O)(=O)=O LLYCMZGLHLKPPU-UHFFFAOYSA-M 0.000 description 4
- 229920001983 poloxamer Polymers 0.000 description 4
- 229960005078 sorbitan sesquioleate Drugs 0.000 description 4
- 235000019337 sorbitan trioleate Nutrition 0.000 description 4
- 229960000391 sorbitan trioleate Drugs 0.000 description 4
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 description 3
- XZIIFPSPUDAGJM-UHFFFAOYSA-N 6-chloro-2-n,2-n-diethylpyrimidine-2,4-diamine Chemical compound CCN(CC)C1=NC(N)=CC(Cl)=N1 XZIIFPSPUDAGJM-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- IYFATESGLOUGBX-YVNJGZBMSA-N Sorbitan monopalmitate Chemical compound CCCCCCCCCCCCCCCC(=O)OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O IYFATESGLOUGBX-YVNJGZBMSA-N 0.000 description 3
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 3
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 3
- 239000002280 amphoteric surfactant Substances 0.000 description 3
- 239000002518 antifoaming agent Substances 0.000 description 3
- 230000003115 biocidal effect Effects 0.000 description 3
- 150000007942 carboxylates Chemical class 0.000 description 3
- 239000003093 cationic surfactant Substances 0.000 description 3
- 229910000420 cerium oxide Inorganic materials 0.000 description 3
- 235000014113 dietary fatty acids Nutrition 0.000 description 3
- 239000000194 fatty acid Substances 0.000 description 3
- 229930195729 fatty acid Natural products 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Chemical group OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- GSGDTSDELPUTKU-UHFFFAOYSA-N nonoxybenzene Chemical compound CCCCCCCCCOC1=CC=CC=C1 GSGDTSDELPUTKU-UHFFFAOYSA-N 0.000 description 3
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229940035044 sorbitan monolaurate Drugs 0.000 description 3
- 239000001570 sorbitan monopalmitate Substances 0.000 description 3
- 235000011071 sorbitan monopalmitate Nutrition 0.000 description 3
- 229940031953 sorbitan monopalmitate Drugs 0.000 description 3
- 229910001936 tantalum oxide Inorganic materials 0.000 description 3
- ZVZFHCZCIBYFMZ-UHFFFAOYSA-N 6-methylheptoxybenzene Chemical compound CC(C)CCCCCOC1=CC=CC=C1 ZVZFHCZCIBYFMZ-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 239000012425 OXONE® Substances 0.000 description 2
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 2
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 229920001213 Polysorbate 20 Polymers 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000001408 amides Chemical group 0.000 description 2
- 150000001412 amines Chemical group 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 229920006187 aquazol Polymers 0.000 description 2
- 239000012861 aquazol Substances 0.000 description 2
- 239000008365 aqueous carrier Substances 0.000 description 2
- 239000000872 buffer Substances 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 description 2
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium dioxide Chemical compound O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 150000002823 nitrates Chemical class 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Inorganic materials [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 description 2
- KHIWWQKSHDUIBK-UHFFFAOYSA-N periodic acid Chemical compound OI(=O)(=O)=O KHIWWQKSHDUIBK-UHFFFAOYSA-N 0.000 description 2
- 125000000864 peroxy group Chemical group O(O*)* 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920000412 polyarylene Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000000256 polyoxyethylene sorbitan monolaurate Substances 0.000 description 2
- 235000010486 polyoxyethylene sorbitan monolaurate Nutrition 0.000 description 2
- 239000000249 polyoxyethylene sorbitan monopalmitate Substances 0.000 description 2
- 235000010483 polyoxyethylene sorbitan monopalmitate Nutrition 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 2
- GPRLSGONYQIRFK-MNYXATJNSA-N triton Chemical compound [3H+] GPRLSGONYQIRFK-MNYXATJNSA-N 0.000 description 2
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 1
- QGLWBTPVKHMVHM-KTKRTIGZSA-N (z)-octadec-9-en-1-amine Chemical compound CCCCCCCC\C=C/CCCCCCCCN QGLWBTPVKHMVHM-KTKRTIGZSA-N 0.000 description 1
- ZORQXIQZAOLNGE-UHFFFAOYSA-N 1,1-difluorocyclohexane Chemical compound FC1(F)CCCCC1 ZORQXIQZAOLNGE-UHFFFAOYSA-N 0.000 description 1
- TUSDEZXZIZRFGC-UHFFFAOYSA-N 1-O-galloyl-3,6-(R)-HHDP-beta-D-glucose Natural products OC1C(O2)COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC1C(O)C2OC(=O)C1=CC(O)=C(O)C(O)=C1 TUSDEZXZIZRFGC-UHFFFAOYSA-N 0.000 description 1
- QWENRTYMTSOGBR-UHFFFAOYSA-N 1H-1,2,3-Triazole Chemical compound C=1C=NNN=1 QWENRTYMTSOGBR-UHFFFAOYSA-N 0.000 description 1
- KAESVJOAVNADME-UHFFFAOYSA-N 1H-pyrrole Natural products C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 1
- LXOFYPKXCSULTL-UHFFFAOYSA-N 2,4,7,9-tetramethyldec-5-yne-4,7-diol Chemical compound CC(C)CC(C)(O)C#CC(C)(O)CC(C)C LXOFYPKXCSULTL-UHFFFAOYSA-N 0.000 description 1
- KATSEJZYPZQRBH-UHFFFAOYSA-N 4,4,5-trimethylundec-2-yne Chemical group CCCCCCC(C)C(C)(C)C#CC KATSEJZYPZQRBH-UHFFFAOYSA-N 0.000 description 1
- NSPMIYGKQJPBQR-UHFFFAOYSA-N 4H-1,2,4-triazole Chemical compound C=1N=CNN=1 NSPMIYGKQJPBQR-UHFFFAOYSA-N 0.000 description 1
- 125000002373 5 membered heterocyclic group Chemical group 0.000 description 1
- 125000004070 6 membered heterocyclic group Chemical group 0.000 description 1
- DYZHZLQEGSYGDH-UHFFFAOYSA-N 7-bicyclo[4.2.0]octa-1,3,5-trienyl-[[7,8-bis(ethenyl)-7-bicyclo[4.2.0]octa-1,3,5-trienyl]oxy]silane Chemical compound C1C2=CC=CC=C2C1[SiH2]OC1(C=C)C2=CC=CC=C2C1C=C DYZHZLQEGSYGDH-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
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- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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Abstract
を含む化学的機械的研磨系に接触させる工程;ならびに(ii)基板の少なくとも1部分を摩耗させて前記絶縁層を研磨する工程を含んでなる基板の研磨方法を提供する。
Description
例1
本例は、銅、タンタルおよび二酸化ケイ素材料の除去速度に比較して、low−k誘電率材料除去の基板除去選択性に対する両親媒性非イオン界面活性剤の利点を説明する。
この例は、界面活性剤濃度の関数としてlow−k誘電率材料の基板除去速度に対する両親媒性非イオン界面活性剤の影響を示す。
この例は、界面活性剤HLB値の関数として、low−k誘電率材料の基板除去速度に与える両親媒性非イオン界面活性剤の影響を示している。
この例は、1つのヘッド基および2つのテール基を有する両親媒性非イオン界面活性剤が、タンタルおよび二酸化ケイ素材料の除去速度と比較したlow−k誘電率材料除去の基板除去選択性に与える利点を示している。
この例は、タンタルおよび二酸化ケイ素材料の除去速度と比較しlow−k誘電率材料除去の基板除去選択性に対する両親媒性非イオン界面活性剤の利点を示す。
Claims (26)
- (i)絶縁層を含んでなる基板を、
(a)研磨剤、研磨パッド、またはそれらの組み合わせ;
(b)両親媒性非イオン界面活性剤;および
(c)液体キャリア
を含む化学的機械的研磨系に接触させる工程;ならびに
(ii)基板の少なくとも1部分を摩耗させて前記絶縁層を研磨する工程
を含んでなる基板の研磨方法であって、
前記絶縁層が3.5以下の誘電率を有している、基板の研磨方法。 - 前記両親媒性非イオン界面活性剤が7以上のHLBを有する、請求項1に記載の方法。
- 前記両親媒性非イオン界面活性剤がヘッド基およびテール基を含んでなる、請求項1に記載の方法。
- 前記テール基が4以上のエチレンオキシド反復単位を有するポリオキシエチレン、ソルビタン、またはこれらの混合物を含んでなる、請求項3に記載の方法。
- 前記ヘッド基が、ポリシロキサン、テトラ−C1-4−アルキルデシン、飽和または部分的に不飽和のC6-30アルキル、ポリオキシプロピレン、C6-12アルキルフェニル、C6-12アルキルシクロヘキシル、ポリエチレン、またはこれらの混合物を含んでなる、請求項3に記載の方法。
- 前記両親媒性非イオン界面活性剤が、2,4,7,9−テトラメチル−5−デシン−4,7−ジオールエトキシレートである、請求項5に記載の方法。
- 前記両親媒性非イオン界面活性剤が、アルキルがC6-30アルキルであり、飽和でも部分的に不飽和でもよく、任意に分岐している、ポリオキシエチレンアルキルエーテルおよびポリオキシエチレンアルキル酸エステルからなる群から選択される、請求項4に記載の方法。
- 前記両親媒性非イオン界面活性剤が、ポリオキシエチレンラウリルエーテル、ポリオキシエチレンセチルエーテル、ポリオキシエチレンステアリルエーテル、ポリオキシエチレンオレイルエーテル、ポリオキシエチレンモノラウレート、ポリオキシエチレンモノステアレート、ポリオキシエチレンジステアレート、ポリオキシエチレンモノオレエート、またはこれらの組み合わせである、請求項7に記載の方法。
- 前記両親媒性非イオン界面活性剤が、アルキルがC6-30アルキルであり、飽和でも部分的に不飽和でもよく、任意に分岐していてよい、ポリオキシエチレンアルキルフェニルエーテルまたはポリオキシエチレンアルキルシクロヘキシルエーテルである、請求項7に記載の方法。
- 前記両親媒性非イオン界面活性剤が、アルキルがC6-30アルキルであり、飽和でも部分的に不飽和でもよく、任意に分岐していてよいポリオキシエチレンソルビタンアルキル酸エステルである、請求項4に記載の方法。
- 前記両親媒性非イオン界面活性剤が、ポリジメチルシロキサンおよびポリオキシエチレンを含んでなるブロックまたはグラフトコポリマーである、請求項4に記載の方法。
- 前記両親媒性非イオン界面活性剤が、ポリオキシエチレンおよびポリオキシプロピレンまたはポリオキシエチレンおよびポリエチレンを含んでなるブロックコポリマーである、請求項4に記載の方法。
- 前記両親媒性非イオン界面活性剤が、ポリオキシエチレンアルキルアミン、ポリオキシエチレンアルキルアルカノールアミド、およびこれらの組み合わせからなる群から選択される、請求項4に記載の方法。
- 前記系が6以上のpHを有する、請求項1に記載の方法。
- 前記系が研磨剤を含んでなる、請求項1に記載の方法。
- 前記研磨剤が、アルミナ、シリカ、これらの同時形成生成物、コーティングされた金属酸化物粒子、ポリマー粒子、およびこれらの組み合わせからなる群から選択される、請求項10に記載の方法。
- 前記研磨剤が液体キャリア中に懸濁している、請求項10に記載の方法。
- 前記系がさらに研磨パッドを含んでなる、請求項10に記載の方法。
- 前記液体キャリアが水を含んでなる、請求項1に記載の方法。
- 前記研磨系が、液体キャリアおよびその中に溶解または懸濁している化合物の重量に対して、0.005重量%以上の両親媒性非イオン界面活性剤を含んでなる、請求項1に記載の方法。
- 前記研磨系が、液体キャリアおよびその中に溶解または懸濁している化合物の重量に対して、0.005重量%〜0.05重量%の両親媒性非イオン界面活性剤を含んでなる、請求項15に記載の方法。
- 前記絶縁層が有機改質ケイ素ガラスである、請求項1に記載の方法。
- 前記絶縁層が炭素ドープ二酸化ケイ素である、請求項17に記載の方法。
- 前記基板がさらに金属層を含んでなる、請求項1に記載の方法。
- 前記金属層が、銅、タンタル、チタン、タングステン、アルミニウム、ニッケル、白金、ルテニウム、イリジウム、またはロジウムを含んでなる、請求項24に記載の方法。
- 前記金属層が銅またはタンタルを含んでなる、請求項25に記載の方法。
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US10/165,100 | 2002-06-07 | ||
PCT/IB2003/002266 WO2003104343A2 (en) | 2002-06-07 | 2003-05-26 | Method for chemical mechanical polishing (cmp) of low-k dielectric materials |
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JP2020515043A (ja) * | 2016-12-30 | 2020-05-21 | フジフィルム・エレクトロニック・マテリアルズ・ユーエスエイ・インコーポレイテッドFujiFilm Electronic Materials USA, Inc. | 研磨組成物 |
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JP2021009885A (ja) * | 2019-06-28 | 2021-01-28 | 東京応化工業株式会社 | シリコンエッチング液、シリコンエッチング方法、及びシリコンフィン構造体の製造方法 |
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US11802240B2 (en) | 2019-06-28 | 2023-10-31 | Tokyo Ohka Kogyo Co., Ltd. | Silicon etching solution, silicon etching method, and method of producing silicon fin structure |
Also Published As
Publication number | Publication date |
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AU2003274812A1 (en) | 2003-12-22 |
DE60307111D1 (de) | 2006-09-07 |
TW200401819A (en) | 2004-02-01 |
JP4773091B2 (ja) | 2011-09-14 |
CN1659249A (zh) | 2005-08-24 |
KR100729331B1 (ko) | 2007-06-15 |
EP1534795B1 (en) | 2006-07-26 |
TWI227728B (en) | 2005-02-11 |
WO2003104343A3 (en) | 2004-02-26 |
US20030228762A1 (en) | 2003-12-11 |
EP1534795A2 (en) | 2005-06-01 |
ATE334176T1 (de) | 2006-08-15 |
KR20050005543A (ko) | 2005-01-13 |
WO2003104343A2 (en) | 2003-12-18 |
CN1305984C (zh) | 2007-03-21 |
AU2003274812A8 (en) | 2003-12-22 |
DE60307111T2 (de) | 2006-11-23 |
US6974777B2 (en) | 2005-12-13 |
SG108491A1 (en) | 2007-01-31 |
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