JP4740622B2 - 化学的機械的研磨スラリー - Google Patents
化学的機械的研磨スラリー Download PDFInfo
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- JP4740622B2 JP4740622B2 JP2005088333A JP2005088333A JP4740622B2 JP 4740622 B2 JP4740622 B2 JP 4740622B2 JP 2005088333 A JP2005088333 A JP 2005088333A JP 2005088333 A JP2005088333 A JP 2005088333A JP 4740622 B2 JP4740622 B2 JP 4740622B2
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- dielectric constant
- abrasive
- polishing
- low dielectric
- constant film
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Description
すなわち、本発明は、疎水基を含む低誘電率膜の研磨に使用される化学的機械的研磨スラリーにおいて、粒子状の研磨材と、該研磨材の表面と水素結合する親水基及び前記低誘電率膜と物理吸着する疎水基を含む非イオン系界面活性剤としてエチレングリコールモノブチルエーテル及び/又はジエチレングリコールモノブチルエーテルを含有し、前記研磨材のゼータ電位が−15mV〜+15mVの範囲内になるようにpH調整されており、前記非イオン性界面活性剤のHLBが6〜12の範囲にあることを特徴とする化学的機械的研磨スラリーである。
非イオン系界面活性剤の添加効果を示すために、表1に示した各CMPスラリーを用いてCMPを行い、それぞれの研磨速度を測定した。なお、比較例1として、非イオン系界面活性剤を含まないこと以外は実施例1〜5と同様な研磨スラリーを作製し、CMPを行った。
非イオン系界面活性剤と研磨材の作用効果を示すために、表2に示した各CMPスラリーを用いてCMPを行い、それぞれの研磨速度を測定した。実施例6から10は研磨材の比表面積がそれぞれ、350m2/g、200m2/g、150m2/g、110m2/g、80m2/gのコロイダルシリカをCMPスラリー全体に対して5質量%含有させて研磨を行った。なお、比較例2として、比表面積が50m2/gのコロイダルシリカを含有すること以外は実施例6〜10と同様なスラリーを作製し、CMPを行った。
非イオン系界面活性剤による低誘電率膜に対する研磨速度増大の効果と研磨材のゼータ電位の関係を示すために、表3に示した各CMPスラリーを用いてCMPを行い、それぞれの研磨速度を測定した。なお、比較例3として、ゼータ電位が異なる以外は実施例11〜13と同様な研磨スラリーを作製し、CMPを行った。
Claims (1)
- 疎水基を含む低誘電率膜の研磨に使用される化学的機械的研磨スラリーにおいて、粒子状の研磨材と、該研磨材の表面と水素結合する親水基及び前記低誘電率膜と物理吸着する疎水基を含む非イオン系界面活性剤としてエチレングリコールモノブチルエーテル及び/又はジエチレングリコールモノブチルエーテルを含有し、前記研磨材のゼータ電位が−15mV〜+15mVの範囲内になるようにpH調整されており、前記非イオン性界面活性剤のHLBが6〜12の範囲にあることを特徴とする化学的機械的研磨スラリー。
Priority Applications (1)
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JP2005088333A JP4740622B2 (ja) | 2005-03-25 | 2005-03-25 | 化学的機械的研磨スラリー |
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JP2005088333A JP4740622B2 (ja) | 2005-03-25 | 2005-03-25 | 化学的機械的研磨スラリー |
Publications (2)
Publication Number | Publication Date |
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JP2006269908A JP2006269908A (ja) | 2006-10-05 |
JP4740622B2 true JP4740622B2 (ja) | 2011-08-03 |
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JP2005088333A Expired - Fee Related JP4740622B2 (ja) | 2005-03-25 | 2005-03-25 | 化学的機械的研磨スラリー |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2016141765A (ja) * | 2015-02-04 | 2016-08-08 | ニッタ・ハース株式会社 | 研磨用組成物 |
WO2017191671A1 (ja) * | 2016-05-02 | 2017-11-09 | ニッタ・ハース株式会社 | 研磨用組成物 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2003282500A (ja) * | 2002-03-25 | 2003-10-03 | Asahi Kasei Corp | 半導体基板の製造方法 |
US6974777B2 (en) * | 2002-06-07 | 2005-12-13 | Cabot Microelectronics Corporation | CMP compositions for low-k dielectric materials |
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2005
- 2005-03-25 JP JP2005088333A patent/JP4740622B2/ja not_active Expired - Fee Related
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JP2006269908A (ja) | 2006-10-05 |
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