JP2010514222A5 - - Google Patents

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Publication number
JP2010514222A5
JP2010514222A5 JP2009543056A JP2009543056A JP2010514222A5 JP 2010514222 A5 JP2010514222 A5 JP 2010514222A5 JP 2009543056 A JP2009543056 A JP 2009543056A JP 2009543056 A JP2009543056 A JP 2009543056A JP 2010514222 A5 JP2010514222 A5 JP 2010514222A5
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JP
Japan
Prior art keywords
working liquid
proline
fluorochemical surfactant
wafer
optionally
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009543056A
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English (en)
Japanese (ja)
Other versions
JP5363338B2 (ja
JP2010514222A (ja
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Publication date
Priority claimed from US11/613,646 external-priority patent/US8591764B2/en
Application filed filed Critical
Publication of JP2010514222A publication Critical patent/JP2010514222A/ja
Publication of JP2010514222A5 publication Critical patent/JP2010514222A5/ja
Application granted granted Critical
Publication of JP5363338B2 publication Critical patent/JP5363338B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009543056A 2006-12-20 2007-12-10 化学機械平坦化組成物、システム、及びその使用方法 Expired - Fee Related JP5363338B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/613,646 2006-12-20
US11/613,646 US8591764B2 (en) 2006-12-20 2006-12-20 Chemical mechanical planarization composition, system, and method of use
PCT/US2007/086955 WO2008079651A1 (en) 2006-12-20 2007-12-10 Chemical mechanical planarization composition, system, and method of use

Publications (3)

Publication Number Publication Date
JP2010514222A JP2010514222A (ja) 2010-04-30
JP2010514222A5 true JP2010514222A5 (enExample) 2011-02-10
JP5363338B2 JP5363338B2 (ja) 2013-12-11

Family

ID=39543526

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009543056A Expired - Fee Related JP5363338B2 (ja) 2006-12-20 2007-12-10 化学機械平坦化組成物、システム、及びその使用方法

Country Status (7)

Country Link
US (1) US8591764B2 (enExample)
EP (1) EP2109648B1 (enExample)
JP (1) JP5363338B2 (enExample)
KR (1) KR101432852B1 (enExample)
CN (1) CN101568613B (enExample)
TW (1) TWI437084B (enExample)
WO (1) WO2008079651A1 (enExample)

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US20090023362A1 (en) * 2007-07-17 2009-01-22 Tzu-Shin Chen Retaining ring for chemical mechanical polishing, its operational method and application system
DE102009025243B4 (de) 2009-06-17 2011-11-17 Siltronic Ag Verfahren zur Herstellung und Verfahren zur Bearbeitung einer Halbleiterscheibe aus Silicium
EA026288B1 (ru) * 2011-07-22 2017-03-31 Сатисло Аг Оптическое изделие, содержащее незапотевающее покрытие с улучшенной долговечностью на основе поверхностно-активных веществ
CN104822495A (zh) * 2012-09-21 2015-08-05 3M创新有限公司 向固定磨料幅材中引入添加剂以改善cmp性能
TWI530557B (zh) * 2014-05-29 2016-04-21 卡博特微電子公司 具高移除速率及低缺陷率之對氧化物與多晶矽及氮化物具有選擇性的ｃｍｐ組合物
US10955332B2 (en) 2016-12-22 2021-03-23 Illumina, Inc. Flow cell package and method for making the same
CN108250975A (zh) * 2016-12-28 2018-07-06 安集微电子科技（上海）股份有限公司 一种化学机械抛光液及其应用
TW202035361A (zh) * 2018-12-12 2020-10-01 美商3M新設資產公司 氟化胺氧化物界面活性劑

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