JP5363338B2 - 化学機械平坦化組成物、システム、及びその使用方法 - Google Patents

化学機械平坦化組成物、システム、及びその使用方法 Download PDF

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Publication number
JP5363338B2
JP5363338B2 JP2009543056A JP2009543056A JP5363338B2 JP 5363338 B2 JP5363338 B2 JP 5363338B2 JP 2009543056 A JP2009543056 A JP 2009543056A JP 2009543056 A JP2009543056 A JP 2009543056A JP 5363338 B2 JP5363338 B2 JP 5363338B2
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JP
Japan
Prior art keywords
working liquid
wafer
proline
removal rate
abrasive
Prior art date
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Expired - Fee Related
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JP2009543056A
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English (en)
Japanese (ja)
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JP2010514222A (ja
JP2010514222A5 (enExample
Inventor
ジェイ． ガグリアルディ，ジョン
エム． サブ，パトリシア
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication date
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Publication of JP2010514222A5 publication Critical patent/JP2010514222A5/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/04—Aqueous dispersions
    • H10P95/062—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2009543056A 2006-12-20 2007-12-10 化学機械平坦化組成物、システム、及びその使用方法 Expired - Fee Related JP5363338B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/613,646 2006-12-20
US11/613,646 US8591764B2 (en) 2006-12-20 2006-12-20 Chemical mechanical planarization composition, system, and method of use
PCT/US2007/086955 WO2008079651A1 (en) 2006-12-20 2007-12-10 Chemical mechanical planarization composition, system, and method of use

Publications (3)

Publication Number Publication Date
JP2010514222A JP2010514222A (ja) 2010-04-30
JP2010514222A5 JP2010514222A5 (enExample) 2011-02-10
JP5363338B2 true JP5363338B2 (ja) 2013-12-11

Family

ID=39543526

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009543056A Expired - Fee Related JP5363338B2 (ja) 2006-12-20 2007-12-10 化学機械平坦化組成物、システム、及びその使用方法

Country Status (7)

Country Link
US (1) US8591764B2 (enExample)
EP (1) EP2109648B1 (enExample)
JP (1) JP5363338B2 (enExample)
KR (1) KR101432852B1 (enExample)
CN (1) CN101568613B (enExample)
TW (1) TWI437084B (enExample)
WO (1) WO2008079651A1 (enExample)

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US20080261402A1 (en) * 2007-04-17 2008-10-23 United Microelectronics Corp. Method of removing insulating layer on substrate
US20090023362A1 (en) * 2007-07-17 2009-01-22 Tzu-Shin Chen Retaining ring for chemical mechanical polishing, its operational method and application system
DE102009025243B4 (de) 2009-06-17 2011-11-17 Siltronic Ag Verfahren zur Herstellung und Verfahren zur Bearbeitung einer Halbleiterscheibe aus Silicium
EA026288B1 (ru) * 2011-07-22 2017-03-31 Сатисло Аг Оптическое изделие, содержащее незапотевающее покрытие с улучшенной долговечностью на основе поверхностно-активных веществ
WO2014047014A1 (en) * 2012-09-21 2014-03-27 3M Innovative Properties Company Incorporating additives into fixed abrasive webs for improved cmp performance
TWI530557B (zh) * 2014-05-29 2016-04-21 卡博特微電子公司 具高移除速率及低缺陷率之對氧化物與多晶矽及氮化物具有選擇性的ｃｍｐ組合物
NZ754331A (en) * 2016-12-22 2025-09-26 Illumina Inc Flow cell package and method for making the same
CN108250975B (zh) * 2016-12-28 2026-01-27 安集微电子科技（上海）股份有限公司 一种化学机械抛光液及其应用
TW202035361A (zh) * 2018-12-12 2020-10-01 美商3M新設資產公司 氟化胺氧化物界面活性劑

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US5738800A (en) * 1996-09-27 1998-04-14 Rodel, Inc. Composition and method for polishing a composite of silica and silicon nitride
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US6194317B1 (en) * 1998-04-30 2001-02-27 3M Innovative Properties Company Method of planarizing the upper surface of a semiconductor wafer
US6083419A (en) * 1997-07-28 2000-07-04 Cabot Corporation Polishing composition including an inhibitor of tungsten etching
US6121143A (en) * 1997-09-19 2000-09-19 3M Innovative Properties Company Abrasive articles comprising a fluorochemical agent for wafer surface modification
CA2342332A1 (en) * 1998-08-31 2000-03-09 Hiroki Terazaki Abrasive liquid for metal and method for polishing
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US6733553B2 (en) * 2000-04-13 2004-05-11 Showa Denko Kabushiki Kaisha Abrasive composition for polishing semiconductor device and method for producing semiconductor device using the same
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JP2002057130A (ja) * 2000-08-14 2002-02-22 Three M Innovative Properties Co Ｃｍｐ用研磨パッド
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Also Published As

Publication number Publication date
KR101432852B1 (ko) 2014-08-26
EP2109648B1 (en) 2012-08-01
CN101568613A (zh) 2009-10-28
TWI437084B (zh) 2014-05-11
JP2010514222A (ja) 2010-04-30
WO2008079651A1 (en) 2008-07-03
EP2109648A1 (en) 2009-10-21
US20080153392A1 (en) 2008-06-26
TW200838998A (en) 2008-10-01
CN101568613B (zh) 2013-02-06
EP2109648A4 (en) 2010-09-08
US8591764B2 (en) 2013-11-26
KR20090087927A (ko) 2009-08-18

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