JP2000144111A5 - - Google Patents
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- Publication number
- JP2000144111A5 JP2000144111A5 JP1999316145A JP31614599A JP2000144111A5 JP 2000144111 A5 JP2000144111 A5 JP 2000144111A5 JP 1999316145 A JP1999316145 A JP 1999316145A JP 31614599 A JP31614599 A JP 31614599A JP 2000144111 A5 JP2000144111 A5 JP 2000144111A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- composition
- surfactant
- integrated circuit
- polishing composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims description 32
- 239000000203 mixture Substances 0.000 claims description 30
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 23
- 239000002245 particle Substances 0.000 claims description 17
- 239000008119 colloidal silica Substances 0.000 claims description 16
- 239000004094 surface-active agent Substances 0.000 claims description 14
- 230000002378 acidificating effect Effects 0.000 claims description 13
- 239000000725 suspension Substances 0.000 claims description 13
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
- 125000000129 anionic group Chemical group 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 239000003082 abrasive agent Substances 0.000 claims description 2
- 238000007517 polishing process Methods 0.000 claims 4
- 239000004744 fabric Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 239000003945 anionic surfactant Substances 0.000 description 2
- 239000007900 aqueous suspension Substances 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9814073A FR2785614B1 (fr) | 1998-11-09 | 1998-11-09 | Nouveau procede de polissage mecano-chimique selectif entre une couche d'oxyde de silicium et une couche de nitrure de silicium |
| FR9814073 | 1998-11-09 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000144111A JP2000144111A (ja) | 2000-05-26 |
| JP2000144111A5 true JP2000144111A5 (enExample) | 2005-04-07 |
| JP4287002B2 JP4287002B2 (ja) | 2009-07-01 |
Family
ID=9532529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31614599A Expired - Lifetime JP4287002B2 (ja) | 1998-11-09 | 1999-11-08 | 集積回路電子産業のための新しい研磨組成物 |
Country Status (13)
| Country | Link |
|---|---|
| US (2) | US7144814B2 (enExample) |
| EP (1) | EP1000995B1 (enExample) |
| JP (1) | JP4287002B2 (enExample) |
| KR (1) | KR100562243B1 (enExample) |
| CN (1) | CN1137232C (enExample) |
| AT (1) | ATE232895T1 (enExample) |
| DE (1) | DE69905441T2 (enExample) |
| ES (1) | ES2192029T3 (enExample) |
| FR (1) | FR2785614B1 (enExample) |
| ID (1) | ID23760A (enExample) |
| MY (1) | MY121115A (enExample) |
| SG (1) | SG82027A1 (enExample) |
| TW (1) | TW502060B (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2785614B1 (fr) * | 1998-11-09 | 2001-01-26 | Clariant France Sa | Nouveau procede de polissage mecano-chimique selectif entre une couche d'oxyde de silicium et une couche de nitrure de silicium |
| FR2792643B1 (fr) * | 1999-04-22 | 2001-07-27 | Clariant France Sa | Composition de polissage mecano-chimique de couches en un materiau isolant a base de polymere a faible constante dielectrique |
| JP4507141B2 (ja) * | 2000-05-22 | 2010-07-21 | 隆章 徳永 | 研磨用組成物、その製造方法およびそれを用いた研磨方法 |
| JP2001347450A (ja) * | 2000-06-08 | 2001-12-18 | Promos Technologies Inc | 化学機械研磨装置 |
| GB0118348D0 (en) * | 2001-07-27 | 2001-09-19 | Ghoshouni Amir A S | Surface treatment of aluminium-based materials |
| US7077880B2 (en) | 2004-01-16 | 2006-07-18 | Dupont Air Products Nanomaterials Llc | Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarization |
| US6743267B2 (en) | 2001-10-15 | 2004-06-01 | Dupont Air Products Nanomaterials Llc | Gel-free colloidal abrasive polishing compositions and associated methods |
| DE10152993A1 (de) * | 2001-10-26 | 2003-05-08 | Bayer Ag | Zusammensetzung für das chemisch-mechanische Polieren von Metall- und Metall/Dielektrikastrukturen mit hoher Selektivität |
| DE10164262A1 (de) * | 2001-12-27 | 2003-07-17 | Bayer Ag | Zusammensetzung für das chemisch-mechanische Polieren von Metall- und Metall/Dielektrikastrukturen |
| KR100444307B1 (ko) * | 2001-12-28 | 2004-08-16 | 주식회사 하이닉스반도체 | 반도체소자의 금속배선 콘택플러그 형성방법 |
| US20040077295A1 (en) * | 2002-08-05 | 2004-04-22 | Hellring Stuart D. | Process for reducing dishing and erosion during chemical mechanical planarization |
| US6964600B2 (en) | 2003-11-21 | 2005-11-15 | Praxair Technology, Inc. | High selectivity colloidal silica slurry |
| US20050288397A1 (en) | 2004-06-29 | 2005-12-29 | Matthew Piazza | Viscous materials and method for producing |
| US8163049B2 (en) | 2006-04-18 | 2012-04-24 | Dupont Air Products Nanomaterials Llc | Fluoride-modified silica sols for chemical mechanical planarization |
| FR2910180A1 (fr) * | 2006-12-15 | 2008-06-20 | St Microelectronics | Procede de fabrication d'un transistor cmos a grilles metalliques duales. |
| US7691287B2 (en) * | 2007-01-31 | 2010-04-06 | Dupont Air Products Nanomaterials Llc | Method for immobilizing ligands and organometallic compounds on silica surface, and their application in chemical mechanical planarization |
| CN102268224B (zh) * | 2010-06-01 | 2013-12-04 | 中国科学院上海微系统与信息技术研究所 | 可控氧化硅去除速率的化学机械抛光液 |
| US20140154884A1 (en) | 2011-05-24 | 2014-06-05 | Kuraray Co., Ltd. | Erosion inhibitor for chemical mechanical polishing, slurry for chemical mechanical polishing, and chemical mechanical polishing method |
| CN103943491B (zh) * | 2014-04-28 | 2016-08-24 | 华进半导体封装先导技术研发中心有限公司 | 在转接板工艺中采用cmp对基板表面进行平坦化的方法 |
| CN105081996A (zh) * | 2014-05-21 | 2015-11-25 | 浙江师范大学 | 一种软弹性抛光磨具的制备工艺 |
| US10037889B1 (en) | 2017-03-29 | 2018-07-31 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Cationic particle containing slurries and methods of using them for CMP of spin-on carbon films |
| JP7141837B2 (ja) * | 2018-03-23 | 2022-09-26 | 株式会社フジミインコーポレーテッド | 研磨用組成物、研磨用組成物の製造方法、研磨方法、および半導体基板の製造方法 |
| US10759970B2 (en) * | 2018-12-19 | 2020-09-01 | Fujifilm Electronic Materials U.S.A., Inc. | Polishing compositions and methods of using same |
| US10763119B2 (en) * | 2018-12-19 | 2020-09-01 | Fujifilm Electronic Materials U.S.A., Inc. | Polishing compositions and methods of using same |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2558827B1 (fr) | 1984-01-27 | 1986-06-27 | Azote & Prod Chim | Procede de fabrication de nitromethane et installation |
| JPS61195183A (ja) * | 1985-02-22 | 1986-08-29 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 研磨粉固定型ポリウレタン研磨材料 |
| JPH04291723A (ja) * | 1991-03-20 | 1992-10-15 | Asahi Denka Kogyo Kk | シリコンウェハー用研摩剤 |
| US5527423A (en) * | 1994-10-06 | 1996-06-18 | Cabot Corporation | Chemical mechanical polishing slurry for metal layers |
| JP3192968B2 (ja) | 1995-06-08 | 2001-07-30 | 株式会社東芝 | 銅系金属用研磨液および半導体装置の製造方法 |
| US6046110A (en) | 1995-06-08 | 2000-04-04 | Kabushiki Kaisha Toshiba | Copper-based metal polishing solution and method for manufacturing a semiconductor device |
| US5958794A (en) * | 1995-09-22 | 1999-09-28 | Minnesota Mining And Manufacturing Company | Method of modifying an exposed surface of a semiconductor wafer |
| US5624303A (en) * | 1996-01-22 | 1997-04-29 | Micron Technology, Inc. | Polishing pad and a method for making a polishing pad with covalently bonded particles |
| US5733176A (en) * | 1996-05-24 | 1998-03-31 | Micron Technology, Inc. | Polishing pad and method of use |
| US5769691A (en) * | 1996-06-14 | 1998-06-23 | Speedfam Corp | Methods and apparatus for the chemical mechanical planarization of electronic devices |
| US5738800A (en) * | 1996-09-27 | 1998-04-14 | Rodel, Inc. | Composition and method for polishing a composite of silica and silicon nitride |
| FR2754937B1 (fr) * | 1996-10-23 | 1999-01-15 | Hoechst France | Nouveau procede de polissage mecano-chimique de couches de materiaux isolants a base de derives du silicium ou de silicium |
| US5759917A (en) * | 1996-12-30 | 1998-06-02 | Cabot Corporation | Composition for oxide CMP |
| DE69830676D1 (de) * | 1997-01-10 | 2005-08-04 | Texas Instruments Inc | CMP Suspension mit hoher Selektivität |
| FR2761629B1 (fr) | 1997-04-07 | 1999-06-18 | Hoechst France | Nouveau procede de polissage mecano-chimique de couches de materiaux semi-conducteurs a base de polysilicium ou d'oxyde de silicium dope |
| FR2772777B1 (fr) | 1997-12-23 | 2000-03-10 | Clariant Chimie Sa | Compositions silico-acryliques, procede de preparation et application pour l'obtention de revetements durcissables thermiquement ou par rayonnement |
| FR2785614B1 (fr) * | 1998-11-09 | 2001-01-26 | Clariant France Sa | Nouveau procede de polissage mecano-chimique selectif entre une couche d'oxyde de silicium et une couche de nitrure de silicium |
-
1998
- 1998-11-09 FR FR9814073A patent/FR2785614B1/fr not_active Expired - Lifetime
-
1999
- 1999-10-27 US US09/427,675 patent/US7144814B2/en not_active Expired - Lifetime
- 1999-10-29 SG SG9905375A patent/SG82027A1/en unknown
- 1999-11-04 ES ES99811011T patent/ES2192029T3/es not_active Expired - Lifetime
- 1999-11-04 AT AT99811011T patent/ATE232895T1/de not_active IP Right Cessation
- 1999-11-04 EP EP99811011A patent/EP1000995B1/en not_active Expired - Lifetime
- 1999-11-04 DE DE69905441T patent/DE69905441T2/de not_active Expired - Lifetime
- 1999-11-05 MY MYPI99004834A patent/MY121115A/en unknown
- 1999-11-08 JP JP31614599A patent/JP4287002B2/ja not_active Expired - Lifetime
- 1999-11-08 ID IDP991027D patent/ID23760A/id unknown
- 1999-11-09 KR KR1019990049347A patent/KR100562243B1/ko not_active Expired - Lifetime
- 1999-11-09 TW TW088119539A patent/TW502060B/zh not_active IP Right Cessation
- 1999-11-09 CN CNB991234774A patent/CN1137232C/zh not_active Expired - Lifetime
-
2006
- 2006-11-08 US US11/594,079 patent/US7252695B2/en not_active Expired - Lifetime
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