JP2000351957A5 - - Google Patents
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- Publication number
- JP2000351957A5 JP2000351957A5 JP2000120314A JP2000120314A JP2000351957A5 JP 2000351957 A5 JP2000351957 A5 JP 2000351957A5 JP 2000120314 A JP2000120314 A JP 2000120314A JP 2000120314 A JP2000120314 A JP 2000120314A JP 2000351957 A5 JP2000351957 A5 JP 2000351957A5
- Authority
- JP
- Japan
- Prior art keywords
- composition
- colloidal silica
- mechanochemical polishing
- aqueous suspension
- cationized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 35
- 239000008119 colloidal silica Substances 0.000 claims description 33
- 238000005498 polishing Methods 0.000 claims description 27
- 239000000203 mixture Substances 0.000 claims description 22
- 239000007900 aqueous suspension Substances 0.000 claims description 17
- 239000002245 particle Substances 0.000 claims description 16
- 230000002378 acidificating effect Effects 0.000 claims description 11
- 239000011810 insulating material Substances 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- NNCOOIBIVIODKO-UHFFFAOYSA-N aluminum;hypochlorous acid Chemical compound [Al].ClO NNCOOIBIVIODKO-UHFFFAOYSA-N 0.000 claims description 4
- 239000004744 fabric Substances 0.000 claims description 3
- 239000000725 suspension Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- 229910052733 gallium Inorganic materials 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 229910052726 zirconium Inorganic materials 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9905123A FR2792643B1 (fr) | 1999-04-22 | 1999-04-22 | Composition de polissage mecano-chimique de couches en un materiau isolant a base de polymere a faible constante dielectrique |
| FR9905123 | 1999-04-22 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000351957A JP2000351957A (ja) | 2000-12-19 |
| JP2000351957A5 true JP2000351957A5 (enExample) | 2005-04-07 |
| JP3967522B2 JP3967522B2 (ja) | 2007-08-29 |
Family
ID=9544750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000120314A Expired - Lifetime JP3967522B2 (ja) | 1999-04-22 | 2000-04-21 | 低誘電率を有するポリマーを基材とする絶縁材料における層の機械化学的研磨のための組成物 |
Country Status (17)
| Country | Link |
|---|---|
| US (1) | US6362108B1 (enExample) |
| EP (1) | EP1046690B1 (enExample) |
| JP (1) | JP3967522B2 (enExample) |
| KR (1) | KR100607919B1 (enExample) |
| CN (1) | CN1153823C (enExample) |
| AT (1) | ATE272100T1 (enExample) |
| CZ (1) | CZ300220B6 (enExample) |
| DE (1) | DE60012399T2 (enExample) |
| DK (1) | DK1046690T3 (enExample) |
| ES (1) | ES2223441T3 (enExample) |
| FR (1) | FR2792643B1 (enExample) |
| HU (1) | HU228376B1 (enExample) |
| ID (1) | ID25822A (enExample) |
| MY (1) | MY124983A (enExample) |
| PT (1) | PT1046690E (enExample) |
| SG (1) | SG83204A1 (enExample) |
| TW (1) | TW491886B (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6537563B2 (en) * | 2000-05-11 | 2003-03-25 | Jeneric/Pentron, Inc. | Dental acid etchant composition and method of use |
| JP3899456B2 (ja) | 2001-10-19 | 2007-03-28 | 株式会社フジミインコーポレーテッド | 研磨用組成物およびそれを用いた研磨方法 |
| FR2831179B1 (fr) | 2001-10-22 | 2005-04-15 | Rhodia Chimie Sa | Procede de preparation en milieu aqueux de compositions pigmentaires a base de silice |
| DE10152993A1 (de) * | 2001-10-26 | 2003-05-08 | Bayer Ag | Zusammensetzung für das chemisch-mechanische Polieren von Metall- und Metall/Dielektrikastrukturen mit hoher Selektivität |
| DE10164262A1 (de) * | 2001-12-27 | 2003-07-17 | Bayer Ag | Zusammensetzung für das chemisch-mechanische Polieren von Metall- und Metall/Dielektrikastrukturen |
| EP1567606A1 (en) * | 2002-10-22 | 2005-08-31 | Psiloquest, Inc. | A corrosion retarding polishing slurry for the chemical mechanical polishing of copper surfaces |
| JP2005268667A (ja) * | 2004-03-19 | 2005-09-29 | Fujimi Inc | 研磨用組成物 |
| US7052373B1 (en) * | 2005-01-19 | 2006-05-30 | Anji Microelectronics Co., Ltd. | Systems and slurries for chemical mechanical polishing |
| CN101077961B (zh) * | 2006-05-26 | 2011-11-09 | 安集微电子（上海）有限公司 | 用于精细表面平整处理的抛光液及其使用方法 |
| US7501346B2 (en) | 2006-07-21 | 2009-03-10 | Cabot Microelectronics Corporation | Gallium and chromium ions for oxide rate enhancement |
| JP6878772B2 (ja) * | 2016-04-14 | 2021-06-02 | 昭和電工マテリアルズ株式会社 | 研磨剤、研磨剤用貯蔵液及び研磨方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2677646B2 (ja) * | 1988-12-26 | 1997-11-17 | 旭電化工業株式会社 | コロイダルシリカの製造方法 |
| US5382272A (en) * | 1993-09-03 | 1995-01-17 | Rodel, Inc. | Activated polishing compositions |
| EP0773270B1 (en) * | 1995-11-10 | 2001-01-24 | Tokuyama Corporation | Polishing slurries and a process for the production thereof |
| MY133700A (en) * | 1996-05-15 | 2007-11-30 | Kobe Steel Ltd | Polishing fluid composition and polishing method |
| FR2754937B1 (fr) * | 1996-10-23 | 1999-01-15 | Hoechst France | Nouveau procede de polissage mecano-chimique de couches de materiaux isolants a base de derives du silicium ou de silicium |
| FR2761629B1 (fr) * | 1997-04-07 | 1999-06-18 | Hoechst France | Nouveau procede de polissage mecano-chimique de couches de materiaux semi-conducteurs a base de polysilicium ou d'oxyde de silicium dope |
| US6046111A (en) * | 1998-09-02 | 2000-04-04 | Micron Technology, Inc. | Method and apparatus for endpointing mechanical and chemical-mechanical planarization of microelectronic substrates |
| FR2785614B1 (fr) * | 1998-11-09 | 2001-01-26 | Clariant France Sa | Nouveau procede de polissage mecano-chimique selectif entre une couche d'oxyde de silicium et une couche de nitrure de silicium |
-
1999
- 1999-04-22 FR FR9905123A patent/FR2792643B1/fr not_active Expired - Lifetime
-
2000
- 2000-04-12 HU HU0001483A patent/HU228376B1/hu not_active IP Right Cessation
- 2000-04-18 SG SG200002196A patent/SG83204A1/en unknown
- 2000-04-18 MY MYPI20001633A patent/MY124983A/en unknown
- 2000-04-19 ES ES00810343T patent/ES2223441T3/es not_active Expired - Lifetime
- 2000-04-19 PT PT00810343T patent/PT1046690E/pt unknown
- 2000-04-19 AT AT00810343T patent/ATE272100T1/de not_active IP Right Cessation
- 2000-04-19 DK DK00810343T patent/DK1046690T3/da active
- 2000-04-19 EP EP00810343A patent/EP1046690B1/en not_active Expired - Lifetime
- 2000-04-19 DE DE60012399T patent/DE60012399T2/de not_active Expired - Lifetime
- 2000-04-20 ID IDP20000313D patent/ID25822A/id unknown
- 2000-04-20 US US09/553,037 patent/US6362108B1/en not_active Expired - Lifetime
- 2000-04-21 CN CNB001180320A patent/CN1153823C/zh not_active Expired - Lifetime
- 2000-04-21 TW TW089107528A patent/TW491886B/zh not_active IP Right Cessation
- 2000-04-21 JP JP2000120314A patent/JP3967522B2/ja not_active Expired - Lifetime
- 2000-04-21 KR KR1020000021188A patent/KR100607919B1/ko not_active Expired - Lifetime
- 2000-04-21 CZ CZ20001494A patent/CZ300220B6/cs not_active IP Right Cessation
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