TW200705376A - Diamond conditioning of soft chemical mechanical planarization/polishing (CMP) polishing pads - Google Patents

Diamond conditioning of soft chemical mechanical planarization/polishing (CMP) polishing pads

Info

Publication number
TW200705376A
TW200705376A TW095113436A TW95113436A TW200705376A TW 200705376 A TW200705376 A TW 200705376A TW 095113436 A TW095113436 A TW 095113436A TW 95113436 A TW95113436 A TW 95113436A TW 200705376 A TW200705376 A TW 200705376A
Authority
TW
Taiwan
Prior art keywords
polishing
cmp
chemical mechanical
mechanical planarization
pads
Prior art date
Application number
TW095113436A
Other languages
Chinese (zh)
Other versions
TWI303406B (en
Inventor
Philip Slutsky
Dan Doron
Boaz Eldad
Barak Yardeni
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of TW200705376A publication Critical patent/TW200705376A/en
Application granted granted Critical
Publication of TWI303406B publication Critical patent/TWI303406B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/007—Cleaning of grinding wheels

Abstract

Conditioning of chemical mechanical planarization (CMP) using conventional diamond-embedded abrasive strips are well suited to condition conventional "hard" polishing but not soft polishing pads because the diamonds not only remove waste material, but they also damage the polishing surface of the pad. Embodiments of the present invention condition soft polishing pads using diamond strips without damaging the soft polishing pad.
TW095113436A 2003-03-28 2003-12-18 Diamond conditioning of soft chemical mechanical planarization/polishing (cmp) polishing pads TWI303406B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/402,578 US20040192178A1 (en) 2003-03-28 2003-03-28 Diamond conditioning of soft chemical mechanical planarization/polishing (CMP) polishing pads

Publications (2)

Publication Number Publication Date
TW200705376A true TW200705376A (en) 2007-02-01
TWI303406B TWI303406B (en) 2008-11-21

Family

ID=32989732

Family Applications (2)

Application Number Title Priority Date Filing Date
TW092136019A TWI286502B (en) 2003-03-28 2003-12-18 Diamond conditioning of soft chemical mechanical planarization/polishing (CMP) polishing pads
TW095113436A TWI303406B (en) 2003-03-28 2003-12-18 Diamond conditioning of soft chemical mechanical planarization/polishing (cmp) polishing pads

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW092136019A TWI286502B (en) 2003-03-28 2003-12-18 Diamond conditioning of soft chemical mechanical planarization/polishing (CMP) polishing pads

Country Status (7)

Country Link
US (2) US20040192178A1 (en)
EP (1) EP1641596A1 (en)
KR (1) KR100818591B1 (en)
CN (1) CN1694783A (en)
AU (1) AU2003297156A1 (en)
TW (2) TWI286502B (en)
WO (1) WO2004094106A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9199357B2 (en) 1997-04-04 2015-12-01 Chien-Min Sung Brazed diamond tools and methods for making the same
US9238207B2 (en) 1997-04-04 2016-01-19 Chien-Min Sung Brazed diamond tools and methods for making the same
US9409280B2 (en) 1997-04-04 2016-08-09 Chien-Min Sung Brazed diamond tools and methods for making the same
US9463552B2 (en) 1997-04-04 2016-10-11 Chien-Min Sung Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods
US9221154B2 (en) 1997-04-04 2015-12-29 Chien-Min Sung Diamond tools and methods for making the same
US9868100B2 (en) 1997-04-04 2018-01-16 Chien-Min Sung Brazed diamond tools and methods for making the same
JP2005144298A (en) * 2003-11-13 2005-06-09 Seiko Epson Corp Surface washing and modification method and surface washing and modification apparatus
US7762872B2 (en) 2004-08-24 2010-07-27 Chien-Min Sung Superhard cutters and associated methods
US7658666B2 (en) 2004-08-24 2010-02-09 Chien-Min Sung Superhard cutters and associated methods
US20070060026A1 (en) 2005-09-09 2007-03-15 Chien-Min Sung Methods of bonding superabrasive particles in an organic matrix
US9724802B2 (en) 2005-05-16 2017-08-08 Chien-Min Sung CMP pad dressers having leveled tips and associated methods
US8398466B2 (en) 2006-11-16 2013-03-19 Chien-Min Sung CMP pad conditioners with mosaic abrasive segments and associated methods
US9138862B2 (en) 2011-05-23 2015-09-22 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US8974270B2 (en) 2011-05-23 2015-03-10 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US8393934B2 (en) 2006-11-16 2013-03-12 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US8678878B2 (en) 2009-09-29 2014-03-25 Chien-Min Sung System for evaluating and/or improving performance of a CMP pad dresser
US20090061743A1 (en) * 2007-08-29 2009-03-05 Stephen Jew Method of soft pad preparation to reduce removal rate ramp-up effect and to stabilize defect rate
TW200929348A (en) * 2007-11-21 2009-07-01 Jian-Min Sung Examination method for trimming chemical mechanical polishing pad and related system thereof
TWI388402B (en) 2007-12-06 2013-03-11 Methods for orienting superabrasive particles on a surface and associated tools
US8758091B2 (en) 2010-04-06 2014-06-24 Massachusetts Institute Of Technology Chemical-mechanical polishing pad conditioning system
WO2012040374A2 (en) 2010-09-21 2012-03-29 Ritedia Corporation Superabrasive tools having substantially leveled particle tips and associated methods
US9238295B2 (en) 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical window polishing pad
US9233451B2 (en) 2013-05-31 2016-01-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad stack
US9238296B2 (en) 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer
CN113183031A (en) * 2021-05-20 2021-07-30 杭州众硅电子科技有限公司 Dressing head rotating part, polishing pad dressing head and dresser

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Also Published As

Publication number Publication date
TWI303406B (en) 2008-11-21
AU2003297156A1 (en) 2004-11-19
EP1641596A1 (en) 2006-04-05
US20040192178A1 (en) 2004-09-30
TW200418612A (en) 2004-10-01
TWI286502B (en) 2007-09-11
CN1694783A (en) 2005-11-09
WO2004094106A1 (en) 2004-11-04
KR20050112113A (en) 2005-11-29
US20060183410A1 (en) 2006-08-17
KR100818591B1 (en) 2008-04-02

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