AU2003297156A1 - Diamond conditioning of soft chemical mechanical planarization/polishing (cmp) polishing pads - Google Patents

Diamond conditioning of soft chemical mechanical planarization/polishing (cmp) polishing pads

Info

Publication number
AU2003297156A1
AU2003297156A1 AU2003297156A AU2003297156A AU2003297156A1 AU 2003297156 A1 AU2003297156 A1 AU 2003297156A1 AU 2003297156 A AU2003297156 A AU 2003297156A AU 2003297156 A AU2003297156 A AU 2003297156A AU 2003297156 A1 AU2003297156 A1 AU 2003297156A1
Authority
AU
Australia
Prior art keywords
polishing
cmp
chemical mechanical
mechanical planarization
soft chemical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003297156A
Inventor
Dan Doron
Boaz Eldad
Philip Slutsky
Barak Yardeni
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of AU2003297156A1 publication Critical patent/AU2003297156A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/007—Cleaning of grinding wheels
AU2003297156A 2003-03-28 2003-12-15 Diamond conditioning of soft chemical mechanical planarization/polishing (cmp) polishing pads Abandoned AU2003297156A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/402,578 US20040192178A1 (en) 2003-03-28 2003-03-28 Diamond conditioning of soft chemical mechanical planarization/polishing (CMP) polishing pads
US10/402,578 2003-03-28
PCT/US2003/039969 WO2004094106A1 (en) 2003-03-28 2003-12-15 Diamond conditioning of soft chemical mechanical planarization/polishing (cmp) polishing pads

Publications (1)

Publication Number Publication Date
AU2003297156A1 true AU2003297156A1 (en) 2004-11-19

Family

ID=32989732

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003297156A Abandoned AU2003297156A1 (en) 2003-03-28 2003-12-15 Diamond conditioning of soft chemical mechanical planarization/polishing (cmp) polishing pads

Country Status (7)

Country Link
US (2) US20040192178A1 (en)
EP (1) EP1641596A1 (en)
KR (1) KR100818591B1 (en)
CN (1) CN1694783A (en)
AU (1) AU2003297156A1 (en)
TW (2) TWI286502B (en)
WO (1) WO2004094106A1 (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9199357B2 (en) 1997-04-04 2015-12-01 Chien-Min Sung Brazed diamond tools and methods for making the same
US9238207B2 (en) 1997-04-04 2016-01-19 Chien-Min Sung Brazed diamond tools and methods for making the same
US9409280B2 (en) 1997-04-04 2016-08-09 Chien-Min Sung Brazed diamond tools and methods for making the same
US9463552B2 (en) 1997-04-04 2016-10-11 Chien-Min Sung Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods
US9221154B2 (en) 1997-04-04 2015-12-29 Chien-Min Sung Diamond tools and methods for making the same
US9868100B2 (en) 1997-04-04 2018-01-16 Chien-Min Sung Brazed diamond tools and methods for making the same
JP2005144298A (en) * 2003-11-13 2005-06-09 Seiko Epson Corp Surface washing and modification method and surface washing and modification apparatus
US7762872B2 (en) 2004-08-24 2010-07-27 Chien-Min Sung Superhard cutters and associated methods
US7658666B2 (en) 2004-08-24 2010-02-09 Chien-Min Sung Superhard cutters and associated methods
US20070060026A1 (en) 2005-09-09 2007-03-15 Chien-Min Sung Methods of bonding superabrasive particles in an organic matrix
US9724802B2 (en) 2005-05-16 2017-08-08 Chien-Min Sung CMP pad dressers having leveled tips and associated methods
US8398466B2 (en) 2006-11-16 2013-03-19 Chien-Min Sung CMP pad conditioners with mosaic abrasive segments and associated methods
US9138862B2 (en) 2011-05-23 2015-09-22 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US8974270B2 (en) 2011-05-23 2015-03-10 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US8393934B2 (en) 2006-11-16 2013-03-12 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US8678878B2 (en) 2009-09-29 2014-03-25 Chien-Min Sung System for evaluating and/or improving performance of a CMP pad dresser
US20090061743A1 (en) * 2007-08-29 2009-03-05 Stephen Jew Method of soft pad preparation to reduce removal rate ramp-up effect and to stabilize defect rate
TW200929348A (en) * 2007-11-21 2009-07-01 Jian-Min Sung Examination method for trimming chemical mechanical polishing pad and related system thereof
TWI388402B (en) 2007-12-06 2013-03-11 Methods for orienting superabrasive particles on a surface and associated tools
US8758091B2 (en) 2010-04-06 2014-06-24 Massachusetts Institute Of Technology Chemical-mechanical polishing pad conditioning system
WO2012040374A2 (en) 2010-09-21 2012-03-29 Ritedia Corporation Superabrasive tools having substantially leveled particle tips and associated methods
US9238295B2 (en) 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical window polishing pad
US9233451B2 (en) 2013-05-31 2016-01-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad stack
US9238296B2 (en) 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer
CN113183031A (en) * 2021-05-20 2021-07-30 杭州众硅电子科技有限公司 Dressing head rotating part, polishing pad dressing head and dresser

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3863395A (en) * 1974-02-19 1975-02-04 Shugart Associates Inc Apparatus for polishing a spherical surface on a magnetic recording transducer
US4739759A (en) * 1985-02-26 1988-04-26 Concept, Inc. Microprocessor controlled electrosurgical generator
US4927432A (en) * 1986-03-25 1990-05-22 Rodel, Inc. Pad material for grinding, lapping and polishing
US5585147A (en) * 1994-06-28 1996-12-17 Matsushita Electric Works, Ltd. Process for a surface treatment of a glass fabric
US5611943A (en) * 1995-09-29 1997-03-18 Intel Corporation Method and apparatus for conditioning of chemical-mechanical polishing pads
EP0779655A3 (en) * 1995-12-14 1997-07-16 International Business Machines Corporation A method of chemically-mechanically polishing an electronic component
US5990010A (en) * 1997-04-08 1999-11-23 Lsi Logic Corporation Pre-conditioning polishing pads for chemical-mechanical polishing
JP3676030B2 (en) * 1997-04-10 2005-07-27 株式会社東芝 Polishing pad dressing method and semiconductor device manufacturing method
JP3231659B2 (en) * 1997-04-28 2001-11-26 日本電気株式会社 Automatic polishing equipment
US5885147A (en) * 1997-05-12 1999-03-23 Integrated Process Equipment Corp. Apparatus for conditioning polishing pads
US6045435A (en) * 1997-08-04 2000-04-04 Motorola, Inc. Low selectivity chemical mechanical polishing (CMP) process for use on integrated circuit metal interconnects
KR19990074921A (en) * 1998-03-16 1999-10-05 윤종용 Polishing Pad Conditioner in Wafer Polishing Equipment
US6354915B1 (en) * 1999-01-21 2002-03-12 Rodel Holdings Inc. Polishing pads and methods relating thereto
US6273797B1 (en) * 1999-11-19 2001-08-14 International Business Machines Corporation In-situ automated CMP wedge conditioner
US6419553B2 (en) * 2000-01-04 2002-07-16 Rodel Holdings, Inc. Methods for break-in and conditioning a fixed abrasive polishing pad
US6340326B1 (en) * 2000-01-28 2002-01-22 Lam Research Corporation System and method for controlled polishing and planarization of semiconductor wafers
US20010029155A1 (en) * 2000-01-31 2001-10-11 Applied Materials, Inc. Multi-step conditioning process
US6800020B1 (en) * 2000-10-02 2004-10-05 Lam Research Corporation Web-style pad conditioning system and methods for implementing the same
US6514127B2 (en) * 2000-11-30 2003-02-04 Taiwan Semiconductor Manufacturing Co., Ltd. Conditioner set for chemical-mechanical polishing station
US20020100743A1 (en) * 2000-12-05 2002-08-01 Bonner Benjamin A. Multi-step polish process to control uniformity when using a selective slurry on patterned wafers
US6409580B1 (en) * 2001-03-26 2002-06-25 Speedfam-Ipec Corporation Rigid polishing pad conditioner for chemical mechanical polishing tool
TW492065B (en) * 2001-07-20 2002-06-21 United Microelectronics Corp Structure of polishing pad conditioner and method of use
US6852020B2 (en) * 2003-01-22 2005-02-08 Raytech Innovative Solutions, Inc. Polishing pad for use in chemical—mechanical planarization of semiconductor wafers and method of making same
US7037184B2 (en) * 2003-01-22 2006-05-02 Raytech Innovation Solutions, Llc Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same

Also Published As

Publication number Publication date
TWI303406B (en) 2008-11-21
EP1641596A1 (en) 2006-04-05
US20040192178A1 (en) 2004-09-30
TW200418612A (en) 2004-10-01
TWI286502B (en) 2007-09-11
CN1694783A (en) 2005-11-09
WO2004094106A1 (en) 2004-11-04
KR20050112113A (en) 2005-11-29
US20060183410A1 (en) 2006-08-17
TW200705376A (en) 2007-02-01
KR100818591B1 (en) 2008-04-02

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase