AU2003270725A1 - Polishing media for chemical mechanical planarization (cmp) - Google Patents

Polishing media for chemical mechanical planarization (cmp)

Info

Publication number
AU2003270725A1
AU2003270725A1 AU2003270725A AU2003270725A AU2003270725A1 AU 2003270725 A1 AU2003270725 A1 AU 2003270725A1 AU 2003270725 A AU2003270725 A AU 2003270725A AU 2003270725 A AU2003270725 A AU 2003270725A AU 2003270725 A1 AU2003270725 A1 AU 2003270725A1
Authority
AU
Australia
Prior art keywords
cmp
chemical mechanical
mechanical planarization
polishing media
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003270725A
Inventor
Robert Charatan
Jibing Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of AU2003270725A1 publication Critical patent/AU2003270725A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B24D3/348—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties utilised as impregnating agent for porous abrasive bodies
AU2003270725A 2002-09-20 2003-09-18 Polishing media for chemical mechanical planarization (cmp) Abandoned AU2003270725A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US25132402A 2002-09-20 2002-09-20
US10/251,324 2002-09-20
US10/367,439 2003-02-14
US10/367,439 US20040058623A1 (en) 2002-09-20 2003-02-14 Polishing media for chemical mechanical planarization (CMP)
PCT/US2003/029243 WO2004026983A1 (en) 2002-09-20 2003-09-18 Polishing media for chemical mechanical planarization (cmp)

Publications (1)

Publication Number Publication Date
AU2003270725A1 true AU2003270725A1 (en) 2004-04-08

Family

ID=32033242

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003270725A Abandoned AU2003270725A1 (en) 2002-09-20 2003-09-18 Polishing media for chemical mechanical planarization (cmp)

Country Status (4)

Country Link
US (1) US20040058623A1 (en)
AU (1) AU2003270725A1 (en)
TW (1) TW200412366A (en)
WO (1) WO2004026983A1 (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103154178B (en) * 2010-10-21 2015-02-25 株式会社Moresco Lubricant composition for polishing glass substrates and polishing slurry
JP5945874B2 (en) * 2011-10-18 2016-07-05 富士紡ホールディングス株式会社 Polishing pad and manufacturing method thereof
WO2015026614A1 (en) * 2013-08-22 2015-02-26 Cabot Microelectronics Corporation Polishing pad with porous interface and solid core, and related apparatus and methods
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US9776361B2 (en) * 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
SG10202002601QA (en) 2014-10-17 2020-05-28 Applied Materials Inc Cmp pad construction with composite material properties using additive manufacturing processes
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10399201B2 (en) * 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
CN112025544B (en) * 2015-10-16 2022-11-01 应用材料公司 Method and apparatus for forming advanced polishing pads using additive manufacturing processes
US9771496B2 (en) 2015-10-28 2017-09-26 Cabot Microelectronics Corporation Tungsten-processing slurry with cationic surfactant and cyclodextrin
EP3397710B1 (en) 2015-12-29 2020-11-11 Cabot Microelectronics Corporation Cmp processing composition comprising alkylamine and cyclodextrin
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US10086494B2 (en) 2016-09-13 2018-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High planarization efficiency chemical mechanical polishing pads and methods of making
US10391606B2 (en) 2017-06-06 2019-08-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pads for improved removal rate and planarization
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. Abrasive delivery polishing pads and manufacturing methods thereof
CN112654655A (en) 2018-09-04 2021-04-13 应用材料公司 Advanced polishing pad formulations
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3918359B2 (en) * 1998-05-15 2007-05-23 Ｊｓｒ株式会社 Polymer composition for polishing pad and polishing pad
JP3880028B2 (en) * 1999-08-06 2007-02-14 Ｊｓｒ株式会社 Polymer composition for polishing pad and polishing pad using the same
JP3925041B2 (en) * 2000-05-31 2007-06-06 Ｊｓｒ株式会社 Polishing pad composition and polishing pad using the same
JP3826702B2 (en) * 2000-10-24 2006-09-27 Ｊｓｒ株式会社 Polishing pad composition and polishing pad using the same
KR100858392B1 (en) * 2001-04-25 2008-09-11 제이에스알 가부시끼가이샤 Polishing pad for semiconductor wafer and laminated body for polishing of semiconductor wafer equipped with the same as well as method for polishing of semiconductor wafer

Also Published As

Publication number Publication date
US20040058623A1 (en) 2004-03-25
WO2004026983A1 (en) 2004-04-01
TW200412366A (en) 2004-07-16

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase