CN103168341B - 具有轻度掺杂的排出装置的化学敏感的传感器 - Google Patents

具有轻度掺杂的排出装置的化学敏感的传感器 Download PDF

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CN103168341B
CN103168341B CN201180040544.5A CN201180040544A CN103168341B CN 103168341 B CN103168341 B CN 103168341B CN 201180040544 A CN201180040544 A CN 201180040544A CN 103168341 B CN103168341 B CN 103168341B
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Abstract

一种具有轻度掺杂的区域的化学敏感的传感器,所述轻度掺杂的区域会影响化学敏感的传感器的栅和电极之间的重叠电容。所述轻度掺杂的区域在化学敏感的传感器的栅区域的下面且邻近地延伸。通过操纵在电极下面的轻度掺杂的区域,实现对化学敏感的传感器的增益的修改。

Description

具有轻度掺杂的排出装置的化学敏感的传感器
相关申请
本申请要求2010年7月3日提交的美国临时专利申请系列号61/361,403的权益,其内容通过引用整体并入本文。
背景技术
电子装置和组件已经在化学和生物学(更一般地,“生命科学”)中得到众多应用,特别是用于检测和测量不同的化学和生物反应,以及鉴别、检测和测量不同的化合物。一种这样的电子装置被称作离子敏感的场效应晶体管,在相关文献中经常表示为ISFET(或pHFET)。ISFET常规地主要在科学和研究团体中采用,用于便利溶液的氢离子浓度(通常表示为“pH”)的测量。
更具体地,ISFET是一种阻抗转化装置,其以类似于MOSFET(金属氧化物半导体场效应晶体管)的方式运行,且为选择性地测量溶液中的离子活性而特别构建(例如,溶液中的氢离子是“分析物”)。在“Thirty years of ISFETOLOGY:what happened in the past30 years and what may happen in the next 30 years,”P. Bergveld, Sens.Actuators, 88(2003), 第1–20页(所述出版物通过引用整体并入本文)中,给出了ISFET的详细运行理论。
使用常规CMOS(互补金属氧化物半导体)方法来制造ISFET的细节,可以参见:Rothberg, 等人, 美国专利公开号2010/0301398, Rothberg, 等人, 美国专利公开号2010/0282617,和Rothberg等人, 美国专利公开2009/0026082;这些专利公开统称为“Rothberg”,并且都通过引用整体并入本文。但是,除了CMOS以外,也可以使用biCMOS(即,两极的和CMOS)加工,诸如包括PMOS FET阵列的方法,所述阵列具有在外围上的两极结构。可替换地,可以采用其它技术,其中敏感元件可以用三端装置来制作,其中感知的离子会导致信号的形成,所述信号控制3个终端之一;这样的技术还可以包括,例如,GaAs和碳纳米管技术。
以CMOS为例,P-型ISFET制造是基于p-型硅基质,其中形成N-型孔,它构成晶体管“主体”。在N-型孔内形成高度掺杂的P-型(P +)区域S和D,它们构成ISFET的源和排出装置。在N-型孔内还形成高度掺杂的N-型(N +)区域B,以提供与N-型孔的传导体(或“块”)的连接。氧化物层可以安置在源、排出装置和主体接头区上面,穿过它们制作开口,以提供与这些区域的电连接(通过电导体)。在源和排出装置之间,在N-型孔区域上面的位置,可以在氧化物层上面形成多晶硅栅。因为它安置在多晶硅栅和晶体管主体(即,N-型孔)之间,所述氧化物层经常被称作“栅氧化物”。
类似于MOSFET,ISFET的运行是基于由MOS(金属氧化物半导体)电容造成的电荷浓度(和因而通道电导)的调节,所述电容由多晶硅栅、栅氧化物和在源和排出装置之间的孔(例如,N-型孔)区域组成。当在栅和源区域之间施加负电压时,通过剥夺该区域的电子,在该区域和栅氧化物的界面处建立通道。就N-孔而言,所述通道是P-通道(反之亦然)。在N-孔的情况下,所述P-通道在源和排出装置之间延伸,且当栅-源负电势足以从源吸收孔进入通道时,传导电流穿过P-通道。通道开始传导电流时的栅-源电势称作晶体管的阈值电压VTH(当VGS具有大于阈值电压VTH的绝对值时,晶体管传导)。源因此得名,因为它是流过通道的电荷载体(p-通道的孔)的源;类似地,排出装置是电荷载体离开通道的地方。
如Rothberg所述,可以制造具有浮动栅结构的ISFET,所述浮动栅结构如下形成:将多晶硅栅联接到多个金属层上,所述金属层安置在一个或多个额外的氧化物层内,所述氧化物层安置在栅氧化物的上面。浮动栅结构由此得名,因为它与其它的ISFET相关导体在电学上分离;也就是说,它夹在栅氧化物和钝化层之间,所述钝化层安置在浮动栅的金属层(例如,顶金属层)的上面。
如Rothberg进一步所述,ISFET钝化层构成离子敏感的膜,其产生装置的离子灵敏度。与钝化层(尤其可以位于浮动栅结构上面的敏感区域)相接触的分析物溶液(即,含有目标分析物(包括离子)的溶液,或被测试目标分析物存在的溶液)中的分析物(诸如离子)的存在,会改变ISFET的电特征,从而调节流过ISFET的源和排出装置之间的通道的电流。钝化层可以包含多种不同材料中的任一种,以促进对特定离子的灵敏度;例如,包含氮化硅或氮氧化硅以及金属氧化物(诸如硅、铝或钽的氧化物)的钝化层通常会提供对分析物溶液中氢离子浓度(pH)的灵敏度,而包含聚氯乙烯(含有缬氨霉素)的钝化层会提供对分析物溶液中钾离子浓度的灵敏度。适用于钝化层且对其它离子(诸如钠、银、铁、溴、碘、钙和硝酸盐)敏感的物质是已知的,且钝化层可以包含多种材料(例如,金属氧化物、金属氮化物、金属氮氧化物)。关于在分析物溶液/钝化层界面处的化学反应,用于ISFET的钝化层的特定材料的表面可以包括这样的化学基团:其可以为分析物溶液捐献质子,或接受来自分析物溶液的质子,在任意给定的时间在分析物溶液界面处的钝化层的表面上剩下带负电荷的、带正电荷的和中性的位点。
关于离子灵敏度,通常称作“表面电势”的电势差出现在钝化层和分析物溶液的固/液界面处,随敏感区域中的离子浓度而变化,这是由于化学反应(例如,通常包含在敏感区域附近的分析物溶液中的离子对氧化物表面基团的解离)。该表面电势又影响ISFET的阈值电压;因而,ISFET的阈值电压随着在敏感区域附近的分析物溶液中的离子浓度的变化而变化。如Rothberg所述,由于ISFET的阈值电压VTH对离子浓度敏感,源电压VS提供与在ISFET的敏感区域附近的分析物溶液中的离子浓度直接有关的信号。
化学敏感的FET(“chemFET”)的阵列或更具体地ISFET,可以用于监测反应——包括例如核酸(例如,DNA)测序反应,这基于监测在反应过程中存在的、产生的或使用的分析物。更通常地,包括chemFET的大阵列在内的阵列可以用于检测和测量在众多化学和/或生物学过程(例如,生物学或化学反应、细胞或组织培养或监测、神经活性、核酸测序等)中的多种分析物(例如,氢离子、其它离子、非离子型分子或化合物等)的静态和/或动态量或浓度,其中基于这样的分析物测量可以得到有价值的信息。这样的chemFET阵列可以用于检测分析物的方法中和/或通过在chemFET表面处的电荷的变化而监测生物学或化学过程的方法中。ChemFET(或ISFET)阵列的这种用途包括:检测溶液中的分析物,和/或检测在chemFET表面(例如ISFET钝化层)上结合的电荷的变化。
关于ISFET阵列制造的研究记载在下述出版物中:“A large transistor-basedsensor array chip for direct extracellular imaging,”M. J. Milgrew, M. O.Riehle, and D. R. S. Cumming, Sensors and Actuators, B: Chemical, 111-112,(2005), 第347-353页, 和“The development of scalable sensor arrays usingstandard CMOS technology,”M.J. Milgrew, P.A. Hammond, 和D.R.S. Cumming,Sensors and Actuators, B: Chemical,103, (2004), 第37-42页,所述出版物通过引用并入本文,且在下文中共同称作“Milgrew等人”。在Rothberg中,含有关于制造和使用ChemFET或ISFET阵列的描述,所述阵列用于化学检测,包括与DNA测序有关的离子的检测。更具体地,Rothberg描述了使用chemFET阵列(特别是ISFET)来对核酸测序,其包括:将已知的核苷酸掺入反应室中的多个相同核酸中,所述反应室与chemFET接触或电容式联接,其中所述核酸与反应室中的单个珠子结合,并检测在chemFET处的信号,其中信号的检测指示一个或多个氢离子的释放,所述氢离子源自已知的三磷酸核苷酸向合成的核酸中的掺入。
离子敏感的金属氧化物场效应晶体管(ISFET)是已知的。由这些类型的晶体管感知的化学反应会产生强度非常小的电信号,因此可能需要由额外电路进行放大以提供信号增益,使得所述信号可以得到有效处理。所述额外电路在半导体基质上占据可以为其它传感器元件(而不是放大电路)使用的空间。如果化学敏感的传感器具有改进增益以消除对额外增益电路的需求,将是有益的。发明人认识到下述实施方案的益处。
附图说明
图1A-D解释了根据本发明的一个实施方案的半导体基质的构建。
图2A-D解释了根据本发明的一个实施方案,经过掺杂以提供轻度掺杂的排出装置的半导体。
图3解释了在本发明的一个实施方案中,由化学敏感的传感器的各个掺杂区域产生的电容的简图。
图4解释了根据本发明的一个实施方案的化学敏感的传感器的一种示例性结构。
图5解释了根据本发明的一个实施方案的化学敏感的传感器的另一种示例性结构。
具体实施方式
实施方案提供了具有改进增益的化学敏感的传感器。所述化学敏感的传感器可以包括:微孔、浮动栅终端、排出装置终端、源终端和在基质中的一对掺杂区域。所述微孔可以接收在化学反应中使用的样品。所述浮动栅可以与在基质上的栅电极电联接。所述排出装置终端连接和所述源终端连接可以是在所述化学敏感的传感器上的电终端。所述基质中的一对掺杂区域可以各自包括轻度掺杂的区域和高度掺杂的区域。每个轻度掺杂的区域可以在基质上的栅电极之下延伸,且每个高度掺杂的区域可以延伸以分别与所述排出装置终端和所述源终端联接。
另一个实施方案还可以提供具有改进增益的化学敏感的传感器。所述化学敏感的传感器可以包括:微孔、浮动栅终端、排出装置终端、源终端、在基质中的一对电极和一对掺杂区域。所述微孔可以接收在化学反应中使用的样品。所述浮动栅可以与在基质上的栅电极电联接。所述排出装置终端连接和所述源终端连接可以是在所述化学敏感的传感器上的电终端。所述一对电极可以形成在基质上,且所述一对电极中的一个电极在栅电极的任一侧。所述一对掺杂区域中的一个掺杂区域可以包括轻度掺杂的区域和高度掺杂的区域,同时所述一对掺杂区域中的另一个掺杂区域可以仅包括高度掺杂的区域。所述轻度掺杂的区域可以在电极的相应一个电极之下延伸,且每对的高度掺杂的区域延伸以分别与所述排出装置终端或所述源终端联接。
一个实施方案还可以提供一种构建根据本发明的一个实施方案的化学敏感的传感器的方法。所述方法可以形成具有第一电导类型的掺杂剂的基质。可以使用与用于形成基质相同电导类型的掺杂剂来构建外延层,但是以比基质上的掺杂剂更低的密度来制备。电极层可以形成在外延层上,该电极层由与用于形成基质的第一电导类型的掺杂剂不同的第二电导类型的掺杂剂形成。在电极层和基质上的掺杂剂的密度可以是类似的。可以掩蔽和蚀刻所述电极层,以生成栅和电极。使用多向植入技术,可以在所述电极之一附近建立第一轻度掺杂的区域,其中所述第一轻度掺杂的区域由与外延层掺杂剂不同电导类型的掺杂剂形成。可以生产与邻近栅的电极自对齐的扩散结,所述扩散结中的第一个与第一轻度掺杂的区域邻接,其由与栅、电极和轻度掺杂的区域类似的电导类型的掺杂剂形成。通过绝缘层、电介质层、传导层和金属层的交替层,可以形成浮动栅电极、在扩散区上面的电极和电极的触点。
图1A-D解释了根据本发明的一个实施方案的半导体基质的构建。在该实施方案中,可以在多晶硅基质110上制造化学敏感的传感器100,其中如图1A所示形成半导体掺杂,在该实施例中,所述半导体掺杂是P或(P +)-型掺杂剂。如图1B所示,可以在P + 型基质110上形成外延层(P-epi)120,其具有与P + 型基质110类似的电导类型(即,P-型)的掺杂,但是具有更低的密度。当然,可以使用其它掺杂诸如N-型掺杂。
可以在密集掺杂水平,用具有与基质(P +)110和外延层120不同的电导类型(即,N+)的掺杂剂,预掺杂要形成电荷耦合的传感器池的区域。在图1C中,N + 掺杂水平层130可以构建在P-型外延层120和P + 型基质110上面。N + 掺杂水平层130可以用在电荷耦合的化学传感器区域内。使用掩蔽和蚀刻操作,可以在N + 掺杂水平层130的预掺杂区域中形成化学敏感的传感器100的栅133和电极134、136,如图1D所示。本领域普通技术人员会理解,在所述的实施方案中,可以反转所述掺杂水平层。
上面公开的实施方案描述了晶体管的制造,基于施加于栅电极133的信号,所述晶体管可以为电极134、136之间的任意信号提供第一增益。通过将额外掺杂材料插入在基质110内与电极134、136或栅133邻近的位置处,可以修改化学敏感的传感器100的增益。所述额外掺杂材料可以影响晶体管100的电容,这从而修改晶体管100的增益。将结合图3更详细地解释增益修改的细节。
图2A解释了根据本发明的一个实施方案,额外掺杂在与栅电极邻近的外延层中的近似位置。图2A的装置可以具有与图1C的装置类似的基质结构。化学敏感的传感器200可以包括:第一电导类型的掺杂剂(即,P-型)的外延层220,从第二电导类型的掺杂剂(即,N-型)形成的栅电极215,和轻度掺杂的区域223、225。轻度掺杂的区域223、225也称作轻度掺杂的排出装置(LDD),它们可以具有与栅电极215相同电导类型的掺杂剂(即,P-型)。通过在轻度掺杂的区域223、225中注射比栅电极215更低密度的掺杂剂,可以修改化学敏感的传感器200的增益。所述轻度掺杂的区域223、225可以如下形成:例如,使用多向注射技术,将更低密度的掺杂剂注射进轻度掺杂的区域223、225中,在栅电极215的下面。当然,也可以使用其它技术。可以在轻度掺杂的区域之前或之后,添加所述晶体管的源和排出装置终端的高度掺杂的区域。图2B解释了扩散结223、225的布局,所述扩散结可以是高度掺杂的区域,用于与化学敏感的传感器220的源和排出装置终端联接,针对栅电极215和轻度掺杂的区域223、225。使用已知的掺杂技术,可以用高密度掺杂剂(其属于与栅电极215相同电导类型的掺杂剂)构建高度掺杂的区域223、225。
图2C和2D解释了具有改进掺杂的化学敏感的传感器的一个替代实施方案。图2C解释了这样的化学敏感的传感器202:其除了具有栅210以外,还可以具有电极214、216。在图2C中,可以掩蔽化学敏感的传感器202的栅210和电极214、216,以使多向掺杂植入物插入各个电极214、216附近,从而建立轻度掺杂的区域227、229或轻度掺杂的排出装置(LDD)。所述LDD 227和229可以由与外延层不同的电导类型(即,N +)形成。在所解释的实施方案中,所述LDD 227、229可以形成在化学敏感的传感器202内,在电极214、216的下面。可替换地,使用本领域已知的替代性的植入方法,可以植入LDD 227、229。
光致抗蚀剂层可以用于掩蔽所需区域,并形成扩散结235、237,所述扩散结可以与邻近栅210的电极214、216自对齐,且与LDD 227、229邻近。所述扩散区235和237可以由与栅210、电极214、216和LDD 227、229类似的电导类型形成,且不同于外延层221的电导类型。在图2D中,N + 扩散结237和239可以是高度掺杂的区域,且可以使用半导体领域已知的任意常规技术形成。另外,也可以形成其它结。可以在这样的掺杂剂密度水平掺杂所述轻度掺杂的区域227、229:所述掺杂剂密度水平小于扩散结237和239的掺杂剂密度水平。
图3的简图解释了与根据本发明的一个实施方案的化学敏感的传感器的各个掺杂区域有关的电容。解释的化学敏感的传感器300可以包括:栅电极384和扩散区391和395,它们构建在外延层397上。栅电极384和扩散区391、395的掺杂显示为N-型掺杂,而外延层397显示为P-型。当然,可以反转所述掺杂。所述扩散区391和395可以在高密度掺杂。所述扩散区391可以与化学敏感的传感器300的源终端接触,所述扩散区395可以与化学敏感的传感器300的排出装置终端接触。当然,所述源终端和所述排出装置终端可以互换。所述栅电极384可以与将来提供信号的浮动栅(未显示)连接。取决于来自浮动栅的信号的强度,可以根据已知的晶体管原理诱导通道396来传导。在排出装置扩散区395上的信号可以穿过通道396到达源扩散区391。另外,由于传感器300的制造,栅-至-排出装置电容Cgd可以存在于栅电极384和排出装置扩散区395之间。类似地,栅-至-源电容Cgs可以存在于栅电极384和源扩散区391之间。这些电容Cgd和Cgs的值可以影响传感器300的信号增益。所述电容Cgd和Cgs可以是扩散区391和395的掺杂与栅电极384之间的接头区的结果。电容Cgd和Cgs的一部分可以归于在扩散区和栅电极384的接头处的寄生电容。通过将轻度掺杂的区域394和392分别加入排出装置和源扩散区395和391,可以调节寄生电容的量。所述轻度掺杂的区域394和392可以在比高度掺杂的扩散区391和395更低的密度掺杂,但是可以将额外区域添加在扩散区395和391与栅电极384的接头处。由于所述额外区域,额外寄生电容Cpara1和/或Cpara2可以存在于接头区处。所述轻度掺杂的区域中的掺杂密度将会影响建立的寄生电容Cpara1和/或Cpara2的量。因此,在栅384/排出装置扩散区395处的总电容可以大致等于Cgd+ Cpara1,而在栅384/源扩散区391处的总电容可以大致等于Cgs + Cpara2。
寄生电容值Cpara1和/或Cpara2的存在,可以改变传感器300的增益。在具有化学敏感的传感器(例如,ISFET)和行选晶体管的像素中,可以以源极跟随器构型或以公共源构型读出像素。所述寄生电容值可以以不同方式影响像素的增益,所述方式取决于使用哪种构型。在源极跟随器构型中,整体(1)的增益是最大增益。寄生电容器用于减弱增益。这是因为,在流体界面处的信号与化学敏感的传感器的浮动栅电容式联接。所述寄生电容器产生电容式分压器,后者会减少在所述栅处发生的电荷至电压转换。因此,在源极跟随器构型中,消除LDD区域和使寄生电容最小化会提供最大增益。在公共源构型中,希望控制寄生电容以便建立负反馈,从而建立系统性增益值。在没有任何寄生电容的情况下,所述像素将在读出期间开环运行,非常大的增益没有得到过程参数的控制。因此,因为LDD区域可以被较好地控制和在装置之间一致地匹配,所述增益可以由这些建立的电容值来控制。在公共源构型中,最重要的重叠电容器是Cgd。所述像素的增益大致等于双层电容除以Cgd。作为实例,如果所述双层电容是3fF且Cgd的值是0.3fF,那么所述像素的增益是大约10。当它受到LDD控制时,这会变成较好地控制的参数。为了减少增益,Cgd随着LDD延伸增大而增加。为了增加增益,将LDD延伸减少至更低的Cgd。不希望具有小至不能得到较好控制的Cgd。因此,希望控制LDD区域以实现在1-20范围内的增益。
例如,在另一个实施方案中,可以消除与排出装置扩散区395结合的轻度掺杂的区域394,在传感器300上可以仅存在轻度掺杂的区域392。在该情况下,归因于源终端391的电容可以等于Cgs + Cpara2,而归因于排出装置终端395的电容可以仅等于Cds。在该实施方案中的传感器300的增益不同于上述存在寄生电容Cpara 1和Cpara 2的实施方案。因此,轻度掺杂的区域392和/或394的添加,可以用于改变传感器300的增益,并从而消除放大传感器300信号可能需要的额外电路。
根据本发明的一个实施方案的化学敏感的传感器的结构的一个示例性图示可以参见图4。所述化学敏感的传感器400可以包括:微孔部分401、堆积部分403和基质部分405。所述微孔部分401可以包括微孔410,所述微孔410可以具有在微孔410底部附近的钝化层,诸如氧化物层415。要检测的化学反应可以在微孔410中发生,且被堆积部分403中的浮动栅电极420检测到。
所述堆积部分403可以包括:浮动栅电极420,其堆积在绝缘层和电介质层432、434、436、461、465、469的交替层上面;传导层和金属层430、452、454、456、471、475和479;和栅电极484。所述基质部分405可以包括:可以用P + 掺杂剂掺杂的基质499、也可以是P-型掺杂剂的外延层497、和N + 掺杂区域491(源)和493(排出装置)。所述N + 掺杂区域491(源)和493(排出装置)可以是高度掺杂的区域,且所述用491’和493’标记的区域可以是轻度掺杂的区域。所述通道494可以变成传导性的,这基于从浮动栅420施加于栅484上的信号。当然,可以反转在基质405中、在区域491和493中、在外延层497中和在栅484中的掺杂。
根据运行模式,所述化学敏感的传感器400可以具有这样的信号增益:所述信号增益部分地依赖于由轻度掺杂的区域491’和/或493’(如果存在的话)提供的额外寄生电容。化学敏感的传感器400的实施方案可以是NMOS或PMOS装置,例如,形成为具有在浮动栅上面的微孔的标准NMOS或PMOS装置。所述微孔结构410可以含有氧化物或其它材料415,它们可以运输化学样品(例如,特定离子),以感知在化学敏感的传感器400的浮动栅420上的电荷。该电荷转移然后可以由与化学敏感的传感器400联接的读电路(未显示)解读,且电荷转移量可以代表在微孔410中的样品内所含有的离子的量。以此方式,阵列中的每个化学敏感的传感器400可以用于检测微孔410中的样品内的局部变异,例如,样品液体的离子浓度,其呈现在化学敏感的传感器400的阵列(未显示)上面。
将参照图5描述根据本发明另一个实施方案的化学敏感的传感器的另一种示例性结构。所述化学敏感的传感器500可以包括:微孔部分501、堆积部分503和基质部分505。所述微孔部分501可以包括微孔510,所述微孔510可以具有在微孔510底部附近的钝化层,诸如氧化物层515。要检测的化学反应可以在微孔510中发生,且被堆积部分503中的浮动栅电极520检测到。
所述堆积部分503可以包括:浮动栅电极520,其堆积在绝缘层和电介质层542、545、546、561、565、569以及传导层和金属层552、555、556、571、574、575、577和579的交替层上面。可以为电极581和585形成栅电极584和触电564、567。所述基质部分505可以包括:可以用P + 掺杂剂掺杂的基质599、也可以是P-型掺杂剂的外延层597、和N + 掺杂区域591(源)和595(排出装置)。当然,可以反转在基质505中的掺杂。所述电极581和585可以积累来自栅电极584的电荷,以促进限制和分离。电极581和585与栅电极584的电荷耦合可以形成像素,所述像素可以放入阵列中用于可寻址读出。从栅电极584至电极581和585的电荷转移,可以增加晶体管增益。此外,寄生电容的操纵也可以影响电荷转移,如上面结合图3所解释的,其也会影响晶体管增益。通过添加轻度掺杂的区域591’和/或595’(它们可以在比高度掺杂的区域591和595更低的密度掺杂),可以操纵寄生电容。另外,VR终端563和Tx终端585也可以影响电荷转移,所述终端可以起电荷包的屏障或孔的作用。
应当指出,预见到使用更多或更少金属层和绝缘层的实施方案,前述实施方案仅仅是示例性的实施例。另外,电极的数目可以随不同的实施方案有很大变化。在形成浮动栅电极以后,可以如下形成任意额外的电极和电极触点、化学敏感的传感器(包括离子):用原硅酸四乙酯(TEOS)或氧化物建立绝缘层或电介质层,并在浮动栅电极上面蚀刻微孔。所述微孔然后可以具有钝化层,所述钝化层至少放置在所述微孔的底部中。使用下述的技术,使用从与上述那些类似的方法制备的结构,可以感知化学试剂和离子。前述结构的变化实施方案是可能的。例如,可以使用单层多晶硅形成栅电极。可以使用N +或P + 电极制作所述结构。还预见到,使用单一电极多晶硅间隙间隔的实施方案,会使得在足够小的过程节点(诸如0.13 um和以下)对电极进行电荷耦合成为可能。0.13 um和以下的过程节点会使电荷耦合结构能够在当前的CMOS工艺中工作。但是,应当指出,所述过程节点不限于这样小,可以容易地更大。还预见到这样的实施方案:其采用表面通道、埋藏的通道,和使用离子植入来形成通道堵塞。
另外,预见到这样的实施方案:其使用埋藏的电荷转移,具有多种N-型植入物以建立希望的电势特性,从而避免界面态和避免闪烁噪音。
应当指出,前面的描述仅仅提供了示例性的实施方案,本领域技术人员会容易地明白用于制造本文公开的化学敏感的传感器的不同方法。例如,使用掩蔽技术,可以在栅和电极之前形成轻度掺杂的排出装置。因此,本文讨论的步骤不一定以任何特定次序执行,且可以使用本领域已知的任意半导体技术来执行。
本文具体地解释和描述了本发明的几个实施方案。但是,应当理解,上述教导覆盖本发明的改进和变体。在其它情况下,没有详细描述公知的操作、组件和电路,以免影响对实施例的理解。可以理解,本文所公开的具体结构和功能细节可以是代表性的,而不一定限制实施方案的范围。
本领域技术人员从前面的描述可以理解,本发明可以以多种形式实现,且各个实施方案可以单独地或组合地实现。因此,尽管已经结合其具体实施例描述了本发明的实施方案,不应如此限制本发明的实施方案和/或方法的真实范围,因为熟练的从业人员在研究附图、说明书和下述权利要求以后会明白其它修改。
各个实施方案可使用硬件元件、软件元件或者它们的结合来实现。硬件元件的实例可以包括:处理器、微处理器、电路、电路元件(例如晶体管、电阻器、电容器、电感器等)、集成电路、专用集成电路(ASIC)、可编程逻辑装置(PLD)、数字信号处理器(DSP)、现场可编程门阵列(FPGA)、逻辑门、寄存器、半导体器件、芯片、微芯片、芯片组等。软件的实例可以包括:软件组件、程序、应用、计算机程序、应用程序、系统程序、机器程序、操作系统软件、中间件、固件、软件模块、例程、子例程、函数、方法、过程、软件接口、应用程序接口(API)、指令集、计算代码、计算机代码、代码段、计算机代码段、字、值、符号或者它们的任何结合。确定实施方案是否使用硬件元件和/或软件元件来实现,可根据任何数量的因素而改变,所述因素例如希望的计算速率、功率级、耐热性、处理周期预算、输入数据速率、输出数据速率、存储器资源、数据总线速度以及其它设计或性能限制。
一些实施方案可以例如使用计算机可读介质或产品来实现,所述介质或产品可存储指令或指令集,所述指令或指令集如果被机器执行,会使所述机器执行根据实施方案的方法和/或操作。这样的机器可包括例如:任何适当的处理平台、计算平台、计算装置、处理装置、计算系统、处理系统、计算机、处理器等,并且可使用硬件和/或软件的任何适当组合来实现。所述计算机可读介质或产品可包括例如:任何适当类型的存储器单元、存储器装置、存储器产品、存储器介质、存储装置、存储产品、存储介质和/ 或存储单元,例如存储器、可移动或不可移动介质、可擦除或不可擦除介质、可写或可重写介质、数字或模拟介质、硬盘、软盘、光盘只读存储器(CD-ROM)、可记录光盘(CD-R)、可重写光盘(CD-RW)、光盘、磁介质、磁光介质、可移动存储卡或盘、各种类型的数字多功能光盘(DVD)、磁带、盒式磁带等。所述指令可以包括任何适当类型的代码,例如源代码、编译代码、解释代码、可执行代码、静态代码、动态代码、加密代码等,所述代码使用任何适当的高级的、低级的、面向对象的、可视的、编译的和/或解释的编程语言来实现。

Claims (23)

1.一种化学敏感的传感器,其包括:
与基质上的栅电极电联接的浮动栅;
排出装置终端连接;
源终端连接;
在所述基质中的一对掺杂区域,每个掺杂区域包括轻度掺杂的区域和高度掺杂的区域,其中每个所述轻度掺杂的区域在所述基质上的所述栅电极之下延伸,且每个所述高度掺杂的区域延伸以分别与所述排出装置终端和所述源终端联接。
2.根据权利要求1所述的化学敏感的传感器,其另外包括:
用于接收样品的微孔。
3.根据权利要求2所述的化学敏感的传感器,其中所述微孔具有在孔底部处与所述浮动栅邻近的氧化物层。
4.根据权利要求1所述的化学敏感的传感器,其中寄生电容存在于所述栅电极和轻度掺杂的区域下面之间。
5.根据权利要求1所述的化学敏感的传感器,其中根据在所述轻度掺杂的区域中使用的掺杂剂的量,修改所述化学敏感的传感器的增益。
6.根据权利要求1所述的化学敏感的传感器,其中在比所述高度掺杂的区域的掺杂剂密度水平更小的掺杂剂密度水平,掺杂所述轻度掺杂的区域。
7.一种化学敏感的传感器,其包括:
与基质上的栅电极电联接的浮动栅;
排出装置终端连接;
源终端连接;
形成在所述基质上的一对电极,且所述一对电极中的一个电极在所述栅电极的任一侧;
在所述基质中的一对掺杂区域,所述一对掺杂区域中的一个掺杂区域包括轻度掺杂的区域和高度掺杂的区域,其中所述轻度掺杂的区域在所述电极的相应一个电极之下延伸,且每对的高度掺杂的区域延伸以分别与所述排出装置终端和所述源终端联接。
8.根据权利要求7所述的化学敏感的传感器,其另外包括:
用于接收生物材料的微孔。
9.根据权利要求8所述的化学敏感的传感器,其中所述微孔具有在孔底部处与所述浮动栅邻近的氧化物层。
10.根据权利要求7所述的化学敏感的传感器,其中所述一对电极中的一个电极用作参比电极和用作电荷包的屏障或孔。
11.根据权利要求7所述的化学敏感的传感器,其中所述一对电极中的一个电极用作扩散电极并且促进电荷包。
12.一种化学敏感的传感器,其包括:
与栅电极电联接的浮动栅;
用轻度掺杂的区域和高度掺杂的区域形成的源;和
用轻度掺杂的区域和高度掺杂的区域形成的排出装置;
其中所述源的轻度掺杂的区域和所述排出装置的轻度掺杂的区域在所述浮动栅附近向彼此延伸进入通道区域中。
13.根据权利要求12所述的化学敏感的传感器,所述源和所述排出装置的高度掺杂的区域包括:
比所述源和所述排出装置的轻度掺杂的区域更大的掺杂剂浓度。
14.根据权利要求12所述的化学敏感的传感器,其中所述源和所述排出装置的高度掺杂的区域远离所述通道区域和邻近所述浮动栅的区域地延伸。
15.根据权利要求12所述的化学敏感的传感器,其中所述源的高度掺杂的区域与金属触点联接。
16.根据权利要求12所述的化学敏感的传感器,其中所述排出装置的高度掺杂的区域与金属触点联接。
17.根据权利要求12所述的化学敏感的传感器,其中所述源的轻度掺杂的区域的体积大于所述排出装置的轻度掺杂的区域。
18.根据权利要求12所述的化学敏感的传感器,其中所述源和所述排出装置的轻度掺杂的区域造成增加的电容,所述增加的电容限制所述化学敏感的传感器的增益。
19.一种制作化学敏感的传感器的方法,所述方法包括:
形成具有第一电导类型的掺杂剂的基质;
使用与用于形成所述基质相同电导类型的掺杂剂来构建外延层,但是以比所述基质上的掺杂剂更低的密度来制备;
在所述外延层上形成电极层,所述电极层由与用于形成所述基质的第一电导类型的掺杂剂不同的第二电导类型的掺杂剂形成,其中在所述电极层和所述基质上的掺杂剂均为密集掺杂水平或轻度掺杂水平;
掩蔽和蚀刻所述电极层,以生成栅和电极;
使用多向植入技术,在所述电极之一附近建立第一轻度掺杂的区域,其中所述第一轻度掺杂的区域由与外延层掺杂剂不同电导类型的掺杂剂形成;
生产与邻近所述栅的电极自对齐的扩散结,所述扩散结中的第一个与第一轻度掺杂的区域邻接,其由与所述栅、电极和轻度掺杂的区域类似的电导类型的掺杂剂形成;和
通过绝缘层、电介质层、传导层和金属层的交替层,形成浮动栅电极、在扩散区上面的电极和电极的触点。
20.根据权利要求19所述的方法,其另外包括:
使用多向植入技术,在所述电极之一附近建立第二轻度掺杂的区域,其中所述第二轻度掺杂的区域由与外延层掺杂剂不同电导类型的掺杂剂形成。
21.根据权利要求20所述的方法,其中所述扩散结中的第二个与第二轻度掺杂的区域邻接。
22.根据权利要求19所述的方法,其另外包括:
在扩散区上形成额外电极。
23.根据权利要求19所述的方法,其另外包括:
形成微孔,以容纳样品在所述浮动栅上面。
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