US20030021718A1 - Lead-free solder alloy - Google Patents

Lead-free solder alloy Download PDF

Info

Publication number
US20030021718A1
US20030021718A1 US10/175,149 US17514902A US2003021718A1 US 20030021718 A1 US20030021718 A1 US 20030021718A1 US 17514902 A US17514902 A US 17514902A US 2003021718 A1 US2003021718 A1 US 2003021718A1
Authority
US
United States
Prior art keywords
solder
lead
solder alloy
soldering
free solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/175,149
Other languages
English (en)
Inventor
Osamu Munekata
Yoshitaka Toyoda
Tsukasa Ohnishi
Minoru Ueshima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=19033808&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=US20030021718(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Assigned to SENJU METAL INDUSTRY CO., LTD. reassignment SENJU METAL INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MUNEKATA, OSAMU, OHNISHI, TSUKASA, TOYODA, YOSHITAKA, UESHIMA, MINORU
Publication of US20030021718A1 publication Critical patent/US20030021718A1/en
Priority to US10/666,129 priority Critical patent/US7338567B2/en
Priority to US11/889,356 priority patent/US7682468B2/en
Priority to US12/659,815 priority patent/US8216395B2/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process

Definitions

  • Sn—Pb solders have long been used for soldering electronic components to printed wiring boards due to their low soldering temperatures, good solderability or solder wettability, and low cost.
  • a 63% Sn—Pb solder which is called a Sn—Pb eutectic solder or simply a eutectic solder due to its alloy composition near the eutectic composition for Sn—Pb alloys (61.9% Sn—Pb)
  • Sn—Pb solder 63% Sn—Pb solder, which is called a Sn—Pb eutectic solder or simply a eutectic solder due to its alloy composition near the eutectic composition for Sn—Pb alloys (61.9% Sn—Pb)
  • the percent of an element in an alloy composition refers to mass percent or “wt %”.
  • a Sn—based, lead-free solder alloy according to the present invention comprises 0.1%-3% of Cu, 0.001%-0.1% of P, and optionally 0.001%-0.1% of Ge.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
US10/175,149 2001-06-28 2002-06-20 Lead-free solder alloy Abandoned US20030021718A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US10/666,129 US7338567B2 (en) 2001-06-28 2003-09-22 Lead-free solder alloy
US11/889,356 US7682468B2 (en) 2001-06-28 2007-08-10 Lead-free solder alloy
US12/659,815 US8216395B2 (en) 2001-06-28 2010-03-22 Lead-free solder alloy

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-195903 2001-06-28
JP2001195903 2001-06-28

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/666,129 Continuation US7338567B2 (en) 2001-06-28 2003-09-22 Lead-free solder alloy

Publications (1)

Publication Number Publication Date
US20030021718A1 true US20030021718A1 (en) 2003-01-30

Family

ID=19033808

Family Applications (3)

Application Number Title Priority Date Filing Date
US10/175,149 Abandoned US20030021718A1 (en) 2001-06-28 2002-06-20 Lead-free solder alloy
US10/666,129 Expired - Lifetime US7338567B2 (en) 2001-06-28 2003-09-22 Lead-free solder alloy
US11/889,356 Expired - Lifetime US7682468B2 (en) 2001-06-28 2007-08-10 Lead-free solder alloy

Family Applications After (2)

Application Number Title Priority Date Filing Date
US10/666,129 Expired - Lifetime US7338567B2 (en) 2001-06-28 2003-09-22 Lead-free solder alloy
US11/889,356 Expired - Lifetime US7682468B2 (en) 2001-06-28 2007-08-10 Lead-free solder alloy

Country Status (7)

Country Link
US (3) US20030021718A1 (ja)
EP (2) EP1897649B1 (ja)
JP (6) JP3622788B2 (ja)
KR (1) KR100659890B1 (ja)
CN (2) CN100534699C (ja)
MY (1) MY136743A (ja)
TW (1) TW592872B (ja)

Cited By (29)

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Publication number Priority date Publication date Assignee Title
US20040101190A1 (en) * 2002-11-21 2004-05-27 Fujitsu Limited Characteristic amount calculating device for soldering inspection
US20050036902A1 (en) * 2002-07-09 2005-02-17 Masazumi Amagai Lead-free solder alloy
US20050039943A1 (en) * 2003-07-15 2005-02-24 Hitachi Cable, Ltd. Straight angle conductor and method of manufacturing the same
US20050153523A1 (en) * 2003-03-31 2005-07-14 Fay Hua Method for compensating for CTE mismatch using phase change lead-free super plastic solders
US20070276100A1 (en) * 2004-10-04 2007-11-29 Solvay Advanced Polymers, L.L.C. Electronic Components
CN100366377C (zh) * 2006-01-24 2008-02-06 昆山成利焊锡制造有限公司 无铅软钎焊料
CN100387741C (zh) * 2005-08-04 2008-05-14 上海交通大学 Sn-Zn-Cr合金无铅焊料的制备方法
US20080246164A1 (en) * 2004-06-01 2008-10-09 Minoru Ueshima Soldering Method, Solder Pellet for Die Bonding, Method for Manufacturing a Solder Pellet for Die Bonding, and Electronic Component
US20080292493A1 (en) * 2007-05-25 2008-11-27 Korea Institute Of Industrial Technology Quaternary Pb-free solder composition incorporating Sn-Ag-Cu-In
CN100439027C (zh) * 2007-01-18 2008-12-03 广州有色金属研究院 适用于铜铝异种金属软钎焊的无铅焊料合金
US20090218387A1 (en) * 2005-06-10 2009-09-03 Ryoichi Kurata Method of soldering portions plated by electroless ni plating
US20090304545A1 (en) * 2006-03-09 2009-12-10 Nippon Steel Materials Co., Ltd Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member
US20100266870A1 (en) * 2007-10-19 2010-10-21 Nihon Superior Sha Co., Ltd. Solder joint
US20100294565A1 (en) * 2007-07-13 2010-11-25 Yuji Kawamata Lead-free solder for vehicles and an vehicle-mounted electronic circuit
US20100307823A1 (en) * 2007-07-18 2010-12-09 Yuji Kawamata Indium-containing lead-free solder for vehicle-mounted electronic circuits
US20100307292A1 (en) * 2008-02-22 2010-12-09 Tetsuro Nishimura Method of regulating nickel concentration in lead-free solder containing nickel
US20120292087A1 (en) * 2009-12-28 2012-11-22 Senju Metal Industry Co., Ltd. Method for soldering surface-mount component and surface-mount component
CN103008903A (zh) * 2007-08-14 2013-04-03 株式会社爱科草英 无铅焊料组合物及使用它的印刷电路板与电子器件
US20130098506A1 (en) * 2010-06-01 2013-04-25 Yoshitaka Toyoda Lead-free solder paste
US20150037087A1 (en) * 2013-08-05 2015-02-05 Senju Metal Industry Co., Ltd. Lead-Free Solder Alloy
US20160279741A1 (en) * 2015-03-24 2016-09-29 Tamura Corporation Lead-free solder alloy, electronic circuit board, and electronic control device
US20170151636A1 (en) * 2015-11-30 2017-06-01 Senju Metal Industry Co., Ltd. Solder alloy
US20180029169A1 (en) * 2016-03-22 2018-02-01 Tamura Corporation Lead-free solder alloy, solder joint, solder paste composition, electronic circuit board, and electronic device
US20190070696A1 (en) * 2016-03-08 2019-03-07 Senju Metal Industry Co., Ltd. Solder Alloy, Solder Ball, Chip Solder, Solder Paste, and Solder Joint
US10286497B2 (en) 2014-04-30 2019-05-14 Nihon Superior Co., Ltd. Lead-free solder alloy
US10456872B2 (en) 2017-09-08 2019-10-29 Tamura Corporation Lead-free solder alloy, electronic circuit substrate, and electronic device
US10500680B2 (en) 2016-09-13 2019-12-10 Senju Metal Industry Co., Ltd. Solder alloy, solder ball, and solder joint
US11465244B2 (en) 2015-05-26 2022-10-11 Senju Metal Industry Co., Ltd. Solder alloy, solder ball, chip solder, solder paste and solder joint
US11607753B2 (en) 2019-06-28 2023-03-21 Senju Metal Industry Co., Ltd. Solder alloy, cast article, formed article, and solder joint

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US8216395B2 (en) * 2001-06-28 2012-07-10 Senju Metal Industry Co., Ltd. Lead-free solder alloy
TW592872B (en) * 2001-06-28 2004-06-21 Senju Metal Industry Co Lead-free solder alloy
EP1464431B1 (en) * 2002-01-10 2011-03-02 Senju Metal Industry Co., Ltd. Soldering method with refiling with solder having an oxidation suppressing element
JP3991788B2 (ja) * 2002-07-04 2007-10-17 日本電気株式会社 はんだおよびそれを用いた実装品
JP3724486B2 (ja) * 2002-10-17 2005-12-07 千住金属工業株式会社 鉛フリーはんだボール用合金とはんだボール
WO2004113013A1 (ja) * 2003-06-24 2004-12-29 Kabushiki Kaisha Toshiba はんだ部材、はんだ材料、はんだ付け方法、はんだ材料の製造方法およびはんだ接合部材
CN1295054C (zh) * 2003-08-20 2007-01-17 中国科学院金属研究所 一种Sn－Ag－Cu－X共晶型合金无铅电子焊料
CN1293985C (zh) * 2003-09-29 2007-01-10 中国科学院金属研究所 一种抗氧化的锡铜共晶合金无铅焊料
JP3925554B2 (ja) * 2003-10-07 2007-06-06 千住金属工業株式会社 鉛フリーはんだボール
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CN1317101C (zh) * 2003-11-07 2007-05-23 中国科学院金属研究所 一种抗氧化的锡银共晶无铅焊料
JP3827322B2 (ja) * 2004-07-29 2006-09-27 千住金属工業株式会社 鉛フリーはんだ合金
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CN1310737C (zh) * 2004-09-17 2007-04-18 张毅 一种高温抗氧化焊料及其制备方法
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US7816249B2 (en) 2005-05-20 2010-10-19 Fuji Electric Systems Co., Ltd. Method for producing a semiconductor device using a solder alloy
JP4635715B2 (ja) * 2005-05-20 2011-02-23 富士電機システムズ株式会社 はんだ合金およびそれを用いた半導体装置
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CN1325679C (zh) * 2005-08-04 2007-07-11 上海交通大学 Sn－Zn－Bi－Cr合金无铅焊料的制备方法
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