CN100366377C - 无铅软钎焊料 - Google Patents
无铅软钎焊料 Download PDFInfo
- Publication number
- CN100366377C CN100366377C CNB2006100112638A CN200610011263A CN100366377C CN 100366377 C CN100366377 C CN 100366377C CN B2006100112638 A CNB2006100112638 A CN B2006100112638A CN 200610011263 A CN200610011263 A CN 200610011263A CN 100366377 C CN100366377 C CN 100366377C
- Authority
- CN
- China
- Prior art keywords
- leadless
- solder
- soft soldering
- lead
- soft solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
Description
产品 | SnCu | SnCuLa | SnCuLaNi | SnCuLaPGa | SnCuLaNiPGa |
润湿力(Nm) | 0.609 | 0.611 | 0.610 | 0.611 | 0.610 |
产品 | SnCu | SnCuLa | SnCuLaNi | SnCuLaPGa | SnCuLaNiPGa |
熔点(℃) | 227 | 228 | 226 | 228 | 226 |
产品 | SnCu | SnCuLa | SnCuLaNi | SnCuLaPGa | SnCuLaNiPGa |
扩展率(%) | 71.29 | 74.55 | 77.34 | 74.55 | 74.34 |
产品 | SnCu | SnCuLa | SnCuLaNi | SnCuLaPGa | SnCuLaNiPGa |
抗氧化能力(250℃) | 静态下保持10秒液面被氧化 | 静态下保持10秒液面被氧化 | 静态下保持10秒液面被氧化 | 静态下保持4小时液面仍为银白色 | 静态下保持4小时液面仍为银白色 |
实施例 | 原料组份用量(kg) | |||||
Sn | Cu | La | Ni | P | Ga | |
1 | 98.99 | 0.01 | 1.0 | |||
2 | 97.70 | 1.8 | 0.5 | |||
3 | 96.99 | 3.0 | 0.01 | |||
4 | 99.39 | 0.5 | 0.1 | 0.01 | ||
5 | 98.90 | 1.0 | 0.05 | 0.05 | ||
6 | 97.99 | 1.5 | 0.01 | 0.5 | ||
7 | 99.599 | 0.05 | 0.3 | 0.001 | 0.05 | |
8 | 97.16 | 2.0 | 0.8 | 0.01 | 0.03 | |
9 | 99.069 | 0.80 | 0.08 | 0.05 | 0.001 | |
10 | 99.60 | 0.3 | 0.06 | 0.03 | 0.005 | 0.005 |
11 | 98.23 | 1.6 | 0.04 | 0.1 | 0.015 | 0.015 |
12 | 97.14 | 2.5 | 0.02 | 0.3 | 0.02 | 0.02 |
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2006100112638A CN100366377C (zh) | 2006-01-24 | 2006-01-24 | 无铅软钎焊料 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2006100112638A CN100366377C (zh) | 2006-01-24 | 2006-01-24 | 无铅软钎焊料 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1803375A CN1803375A (zh) | 2006-07-19 |
CN100366377C true CN100366377C (zh) | 2008-02-06 |
Family
ID=36865590
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006100112638A Expired - Fee Related CN100366377C (zh) | 2006-01-24 | 2006-01-24 | 无铅软钎焊料 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100366377C (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101342643B (zh) * | 2008-09-03 | 2010-10-27 | 东南大学 | 含稀土钕的抗氧化无铅焊料 |
JP5821797B2 (ja) * | 2012-07-26 | 2015-11-24 | Tdk株式会社 | 電子部品の製造方法及び電子部品の製造装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000225490A (ja) * | 1999-02-08 | 2000-08-15 | Nihon Almit Co Ltd | 無鉛半田合金 |
JP2001287082A (ja) * | 2000-04-05 | 2001-10-16 | Fuji Electric Co Ltd | はんだ合金 |
US20030021718A1 (en) * | 2001-06-28 | 2003-01-30 | Osamu Munekata | Lead-free solder alloy |
-
2006
- 2006-01-24 CN CNB2006100112638A patent/CN100366377C/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000225490A (ja) * | 1999-02-08 | 2000-08-15 | Nihon Almit Co Ltd | 無鉛半田合金 |
JP2001287082A (ja) * | 2000-04-05 | 2001-10-16 | Fuji Electric Co Ltd | はんだ合金 |
US20030021718A1 (en) * | 2001-06-28 | 2003-01-30 | Osamu Munekata | Lead-free solder alloy |
Also Published As
Publication number | Publication date |
---|---|
CN1803375A (zh) | 2006-07-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Gaoxin Tin Industry (Huizhou) Co., Ltd. Assignor: Chengli Solder Mfg. Co., Ltd., Kunshan Contract fulfillment period: 2008.3.2 to 2016.3.2 contract change Contract record no.: 2009440001172 Denomination of invention: Soldering flux in use for soft soldering wire, and preparation method Granted publication date: 20080206 License type: Exclusive license Record date: 2009.8.11 |
|
LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.3.2 TO 2016.3.2; CHANGE OF CONTRACT Name of requester: GAOXIN TIN( HUIZHOU ) CO., LTD. Effective date: 20090811 |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080206 Termination date: 20160124 |
|
EXPY | Termination of patent right or utility model |