KR100333401B1 - 납땜용 무연합금 - Google Patents
납땜용 무연합금 Download PDFInfo
- Publication number
- KR100333401B1 KR100333401B1 KR1020000028810A KR20000028810A KR100333401B1 KR 100333401 B1 KR100333401 B1 KR 100333401B1 KR 1020000028810 A KR1020000028810 A KR 1020000028810A KR 20000028810 A KR20000028810 A KR 20000028810A KR 100333401 B1 KR100333401 B1 KR 100333401B1
- Authority
- KR
- South Korea
- Prior art keywords
- lead
- solder
- weight
- free
- soldering
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (2)
- 구리(Cu)가 0.5 - 5.0 중량%, 은(Ag)이 0.5 - 3.5 중량%, 비스므스(Bi)가 4.0 - 10.0 중량%, 인(P)이 0.0001 - 3.0 중량%, 나머지가 주석(Sn)으로 조성된 것을 특징으로 하는 납땜용 무연합금.
- 제 1 항에 있어서,인(P)의 함유량이 0.011 - 3.0 중량% 인 것을 특징으로 하는 납땜용 무연합금.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020000028810A KR100333401B1 (ko) | 2000-05-26 | 2000-05-26 | 납땜용 무연합금 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020000028810A KR100333401B1 (ko) | 2000-05-26 | 2000-05-26 | 납땜용 무연합금 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010107355A KR20010107355A (ko) | 2001-12-07 |
KR100333401B1 true KR100333401B1 (ko) | 2002-04-19 |
Family
ID=19670571
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020000028810A KR100333401B1 (ko) | 2000-05-26 | 2000-05-26 | 납땜용 무연합금 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100333401B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11285569B2 (en) | 2003-04-25 | 2022-03-29 | Henkel Ag & Co. Kgaa | Soldering material based on Sn Ag and Cu |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW592872B (en) * | 2001-06-28 | 2004-06-21 | Senju Metal Industry Co | Lead-free solder alloy |
KR101630935B1 (ko) | 2014-09-02 | 2016-06-16 | 에이에치코리아주식회사 | 전자부품 실장용 무연땜납 |
-
2000
- 2000-05-26 KR KR1020000028810A patent/KR100333401B1/ko active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11285569B2 (en) | 2003-04-25 | 2022-03-29 | Henkel Ag & Co. Kgaa | Soldering material based on Sn Ag and Cu |
Also Published As
Publication number | Publication date |
---|---|
KR20010107355A (ko) | 2001-12-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR19980068127A (ko) | 납땜용 무연 합금 | |
WO1997012719A1 (fr) | Soudure sans plomb | |
JP2001058286A (ja) | チップ部品接合用ソルダペースト | |
EP1289707A1 (en) | Variable melting point solders and brazes | |
JP2002018589A (ja) | 鉛フリーはんだ合金 | |
KR0168964B1 (ko) | 납땜성이 우수한 무연땜납 | |
JP4392020B2 (ja) | 鉛フリーはんだボール | |
JP2011062736A (ja) | 鉛フリー高温用接合材料 | |
JP2007075836A (ja) | 半田付け用無鉛合金 | |
JP2004148372A (ja) | 鉛フリーはんだおよびはんだ付け物品 | |
KR100333401B1 (ko) | 납땜용 무연합금 | |
KR100327768B1 (ko) | 납땜용 무연합금 | |
JP2000343273A (ja) | はんだ合金 | |
KR100337498B1 (ko) | 납땜용 무연합금 | |
KR100337497B1 (ko) | 납땜용 무연합금 | |
KR100337496B1 (ko) | 납땜용 무연합금 | |
KR100327767B1 (ko) | 납땜용 무연합금 | |
KR100333402B1 (ko) | 납땜용 무연합금 | |
KR0158600B1 (ko) | 기계적 특성이 우수한 무연땜납 | |
KR20050094535A (ko) | 저온계 무연합금 | |
JP2004330260A (ja) | SnAgCu系無鉛はんだ合金 | |
EP0931622B1 (en) | Solder paste | |
JP4471824B2 (ja) | 高温はんだ及びクリームはんだ | |
JP3992107B2 (ja) | 無鉛はんだ合金 | |
KR100756072B1 (ko) | 납땜용 무연합금 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20130205 Year of fee payment: 12 |
|
FPAY | Annual fee payment |
Payment date: 20140121 Year of fee payment: 13 |
|
FPAY | Annual fee payment |
Payment date: 20160311 Year of fee payment: 15 |
|
FPAY | Annual fee payment |
Payment date: 20170406 Year of fee payment: 16 |
|
FPAY | Annual fee payment |
Payment date: 20180410 Year of fee payment: 17 |
|
FPAY | Annual fee payment |
Payment date: 20190408 Year of fee payment: 18 |