JP4392020B2 - 鉛フリーはんだボール - Google Patents
鉛フリーはんだボール Download PDFInfo
- Publication number
- JP4392020B2 JP4392020B2 JP2006511176A JP2006511176A JP4392020B2 JP 4392020 B2 JP4392020 B2 JP 4392020B2 JP 2006511176 A JP2006511176 A JP 2006511176A JP 2006511176 A JP2006511176 A JP 2006511176A JP 4392020 B2 JP4392020 B2 JP 4392020B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- lead
- mass
- free
- free solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Description
黄変:直径0.3mmのはんだボールを150℃の高温槽に1.0g(約一万個)投入し、48時間放置後、目視で表面の色を観察する。はんだボールの表面が黄変している数をカウントし、その割合をパーセンテージで表した結果を表1に示す。
はんだ付け性:直径0.5mmのはんだボールを用い、慣用の銅板上での広がり率の結果を表1に示す。広がり率の試験方法、計算式はJISZ3198-3(鉛フリーはんだ試験方法 第3部 広がり試験方法)に従い行った。実施例のはんだボールは、黄変およびはんだ広がりも良好であったが、Crの添加量が0.0005〜0.001質量%から外れる比較例のはんだボールは黄変または広がり率の両方の特性を満たすものはなかった。
Claims (9)
- Sn-Ag系はんだ、Sn-Cu系はんだ及びSn-Ag-Cu系はんだのうちいずれかの鉛フリーはんだからなるはんだボールであって、
2〜4質量%Ag及び0.5〜0.7質量%Cuのうち少なくともいずれか1種を含有し、0.0005〜0.003質量%Crを添加すると共に、残部Snで構成されることを特徴とする鉛フリーはんだボール。 - Sn-Sb系はんだの鉛フリーはんだからなるはんだボールであって、
4質量%Sbを含有し、0.0005〜0.003質量%Crを添加すると共に、残部Snで構成されることを特徴とする鉛フリーはんだボール。 - Sn-Ag-Sb系はんだの鉛フリーはんだからなるはんだボールであって、
2〜4質量%Ag及び4質量%Sbを含有し、0.0005〜0.003質量%Crを添加すると共に、残部Snで構成されることを特徴とする鉛フリーはんだボール。 - 請求項1乃至3のいずれかのCrの添加は、0.0005〜0.001質量%の範囲である鉛フリーはんだボール。
- 前記鉛フリーはんだに、さらにIn、Bi、P、Ni、Geのうち少なくともいずれか1種を0.005〜7.0質量%添加することを特徴とする請求項1乃至4のいずれかに記載の鉛フリーはんだボール。
- 前記鉛フリーはんだボールは、直径が0.05〜0.6mmであることを特徴とする請求項1乃至5のいずれかに記載の鉛フリーはんだボール。
- Sn-Ag系はんだ、Sn-Cu系はんだ及びSn-Ag-Cu系はんだのうちいずれかの鉛フリーはんだからなるはんだボールにおいて、
2〜4質量%Ag及び0.5〜0.7質量%Cuのうち少なくともいずれか1種を含有し、0.0005〜0.003質量%Crを添加すると共に、残部Snで構成することによってはんだボール表面の黄変を防止する方法。 - Sn-Sb系はんだの鉛フリーはんだからなるはんだボールにおいて、
4質量%Sbを含有し、0.0005〜0.003質量%Crを添加すると共に、残部Snで構成することによってはんだボール表面の黄変を防止する方法。 - Sn-Ag-Sb系はんだの鉛フリーはんだからなるはんだボールにおいて、
2〜4質量%Ag及び4質量%Sbを含有し、0.0005〜0.003質量%Crを添加すると共に、残部Snで構成することによってはんだボール表面の黄変を防止する方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004079348 | 2004-03-19 | ||
JP2004079348 | 2004-03-19 | ||
PCT/JP2005/004427 WO2005089999A1 (ja) | 2004-03-19 | 2005-03-14 | 鉛フリーはんだボール |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2005089999A1 JPWO2005089999A1 (ja) | 2008-01-31 |
JP4392020B2 true JP4392020B2 (ja) | 2009-12-24 |
Family
ID=34993512
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006511176A Active JP4392020B2 (ja) | 2004-03-19 | 2005-03-14 | 鉛フリーはんだボール |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4392020B2 (ja) |
TW (1) | TW200603932A (ja) |
WO (1) | WO2005089999A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8716860B2 (en) | 2011-12-14 | 2014-05-06 | Mk Electron Co., Ltd. | Tin-based solder ball and semiconductor package including the same |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5071802B2 (ja) * | 2008-04-08 | 2012-11-14 | 日立金属株式会社 | はんだボール、はんだ層及びはんだバンプ |
JP2011031253A (ja) * | 2009-07-30 | 2011-02-17 | Eishin Kogyo Kk | 無鉛ハンダ合金 |
WO2014024271A1 (ja) * | 2012-08-08 | 2014-02-13 | 千住金属工業株式会社 | 高温鉛フリーはんだ合金 |
EP3112080A4 (en) * | 2014-02-24 | 2017-11-29 | Koki Company Limited | Lead-free solder alloy, solder material, and joined structure |
JP6579253B1 (ja) * | 2018-11-09 | 2019-09-25 | 千住金属工業株式会社 | ハンダボール、ハンダ継手および接合方法 |
CN115464299A (zh) * | 2021-10-21 | 2022-12-13 | 上海华庆焊材技术股份有限公司 | 一种降低焊接空洞的预成型无铅焊片及其制备方法和应用 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3684811B2 (ja) * | 1998-01-28 | 2005-08-17 | 株式会社村田製作所 | 半田および半田付け物品 |
JP3753168B2 (ja) * | 1999-08-20 | 2006-03-08 | 千住金属工業株式会社 | 微小チップ部品接合用ソルダペースト |
-
2005
- 2005-03-08 TW TW094106915A patent/TW200603932A/zh unknown
- 2005-03-14 WO PCT/JP2005/004427 patent/WO2005089999A1/ja active Application Filing
- 2005-03-14 JP JP2006511176A patent/JP4392020B2/ja active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8716860B2 (en) | 2011-12-14 | 2014-05-06 | Mk Electron Co., Ltd. | Tin-based solder ball and semiconductor package including the same |
Also Published As
Publication number | Publication date |
---|---|
JPWO2005089999A1 (ja) | 2008-01-31 |
TW200603932A (en) | 2006-02-01 |
TWI334366B (ja) | 2010-12-11 |
WO2005089999A1 (ja) | 2005-09-29 |
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