TW200603932A - Lead free solder fall - Google Patents
Lead free solder fallInfo
- Publication number
- TW200603932A TW200603932A TW094106915A TW94106915A TW200603932A TW 200603932 A TW200603932 A TW 200603932A TW 094106915 A TW094106915 A TW 094106915A TW 94106915 A TW94106915 A TW 94106915A TW 200603932 A TW200603932 A TW 200603932A
- Authority
- TW
- Taiwan
- Prior art keywords
- free solder
- type
- bump
- mass
- lead
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004079348 | 2004-03-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200603932A true TW200603932A (en) | 2006-02-01 |
TWI334366B TWI334366B (zh) | 2010-12-11 |
Family
ID=34993512
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094106915A TW200603932A (en) | 2004-03-19 | 2005-03-08 | Lead free solder fall |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4392020B2 (zh) |
TW (1) | TW200603932A (zh) |
WO (1) | WO2005089999A1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5071802B2 (ja) * | 2008-04-08 | 2012-11-14 | 日立金属株式会社 | はんだボール、はんだ層及びはんだバンプ |
JP2011031253A (ja) * | 2009-07-30 | 2011-02-17 | Eishin Kogyo Kk | 無鉛ハンダ合金 |
KR101283580B1 (ko) | 2011-12-14 | 2013-07-05 | 엠케이전자 주식회사 | 주석계 솔더 볼 및 이를 포함하는 반도체 패키지 |
AU2012359292A1 (en) * | 2012-08-08 | 2014-02-27 | Senju Metal Industry Co., Ltd | High-temperature lead-free solder alloy |
JP6713106B2 (ja) * | 2014-02-24 | 2020-06-24 | 株式会社弘輝 | 鉛フリーはんだ合金、はんだ材料及び接合構造体 |
JP6579253B1 (ja) * | 2018-11-09 | 2019-09-25 | 千住金属工業株式会社 | ハンダボール、ハンダ継手および接合方法 |
CN115464299A (zh) * | 2021-10-21 | 2022-12-13 | 上海华庆焊材技术股份有限公司 | 一种降低焊接空洞的预成型无铅焊片及其制备方法和应用 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3684811B2 (ja) * | 1998-01-28 | 2005-08-17 | 株式会社村田製作所 | 半田および半田付け物品 |
JP3753168B2 (ja) * | 1999-08-20 | 2006-03-08 | 千住金属工業株式会社 | 微小チップ部品接合用ソルダペースト |
-
2005
- 2005-03-08 TW TW094106915A patent/TW200603932A/zh unknown
- 2005-03-14 JP JP2006511176A patent/JP4392020B2/ja active Active
- 2005-03-14 WO PCT/JP2005/004427 patent/WO2005089999A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
TWI334366B (zh) | 2010-12-11 |
JP4392020B2 (ja) | 2009-12-24 |
JPWO2005089999A1 (ja) | 2008-01-31 |
WO2005089999A1 (ja) | 2005-09-29 |
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