JP6579253B1 - ハンダボール、ハンダ継手および接合方法 - Google Patents
ハンダボール、ハンダ継手および接合方法 Download PDFInfo
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- JP6579253B1 JP6579253B1 JP2018211535A JP2018211535A JP6579253B1 JP 6579253 B1 JP6579253 B1 JP 6579253B1 JP 2018211535 A JP2018211535 A JP 2018211535A JP 2018211535 A JP2018211535 A JP 2018211535A JP 6579253 B1 JP6579253 B1 JP 6579253B1
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- solder
- mass
- solder ball
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
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- C—CHEMISTRY; METALLURGY
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- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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Abstract
Description
(1)Inが0.1質量%以上10質量%以下、残部がSnであり、L*a*b*表色系における黄色度(b*)が2.8以上15.0以下であり、L * a * b * 表色系における明度(L * )が60以上100以下である、ハンダボール。
ハンダボールにおけるInの含有量は、0質量%超10.0質量%以下である。Inの含有量を0質量%超とすることによりInを一定量確保できるので、Auのハンダ中への拡散を防止することができる。また、Inの含有量を10.0質量%以下とすることにより、酸化膜の成長を一定の範囲に抑制できるので、ハンダの濡れ性を低下させずに、Auのハンダ中への拡散を防止することができる。さらに、Inの含有量を上記範囲とすることにより、Inの含有量を少なくすることができるので、低コスト化を図ることができる。また、Inの含有量の好ましい範囲としては0.1質量%超7.0質量%以下であり、より好ましい範囲としては3.0質量%以上7.0質量%以下である。なお、Inの上記含有量は、エージング処理によるInの濃化によって実現される。
ハンダボールの球径は、0.1μm以上120μm以下である。ハンダボールの球径が120μmを超える場合には、ファインピッチでのハンダ付けをすることが困難となり、基板の微小化や電子部品の電極の狭ピッチ化の要求に対応することができないからである。下限値については、技術的にハンダバンプ形成用に用いることができる球径の限界として0.1μm以上とした。このように、ハンダボール10の球径を0.1μm以上120μm以下の範囲とすることで、電子部品の小型化や高集積化に対応することが可能となる。さらに、上述したAuのハンダ中への拡散防止効果はハンダボールの粒径が縮小する程に発揮される。そのため、ハンダボールの球径は120μm以下が好ましく、より好ましくは80μm以下であり、さらに好ましくは50μm以下であり、もっとも好ましくは30μm以下である。
ハンダボールのL*a*b*表色系における黄色度(b*)は、2.8以上15.0以下である。黄色度(b*)が2.8以上15.0以下の範囲であれば、ハンダ接合時におけるAuのハンダ中への拡散を効果的に抑制することが可能となる。ハンダボールを所定温度で所定時間、エージング処理すると、ハンダボールの表面に酸化In(InO)を多く含有する酸化膜が形成され、ハンダボールの表面のInの濃度が高くなる濃化現象が起こる。本実施の形態のようにInの含有量を0質量%超10.0質量%の低濃度とした場合でも、ハンダボール表面を意図的に酸化させることで、ハンダボール表面のInを高濃度化できるので、Auのハンダ中への拡散を抑制する効果を得ることができる。ここで、ハンダボールを過度に酸化させてハンダボール表面のInの濃度を高くした場合には、Auのハンダ中への拡散抑制効果をさらに高めることができると考えらえる。しかし、球径が120μm以下のハンダボールでは、酸化膜の影響が特に大きくなることから、ハンダ接合時の信頼性を低下させてしまうという問題がある。そのため、ハンダ付け性を考慮した酸化膜厚と、In濃化によるAuのハンダ中への拡散抑制効果を考慮した酸化膜厚との両方の条件を満たす酸化膜厚の管理が必要となってくる。そこで、本実施の形態では、ハンダボールの表面に形成される酸化膜厚を簡易かつ迅速に管理するために、L*a*b*表色系における黄色度(b*)を採用し、L*a*b*表色系における黄色度(b*)が2.8以上15.0以下となるハンダボールを作製することにより、所定の酸化膜厚のハンダボールを実現している。黄色度(b*)が2.8未満の場合には、Inが濃化されておらず、ハンダバンプ形成時に効果的にAuのハンダ中への拡散を抑制することができない場合がある。これに対し、黄色度(b*)が15.0を超える場合には、ハンダボール接合時のハンダの濡れ性が損なわれ得ると共に、ハンダ材のコストが上昇するからである。なお、黄色度(b*)は、より好ましくは、7以下である。
ハンダボールは、エージング処理により酸化膜が厚くなってくると、L*a*b*表色系における黄色度(b*)が上昇する一方で、L*a*b*表色系における明度(L*)が下降するという相関関係を有する。そのため、ハンダボールのエージング処理による酸化膜厚の管理方法として、上述したL*a*b*表色系における黄色度(b*)に加えて、L*a*b*表色系における明度(L*)も酸化膜を管理する指標の一つとして用いることができる。ハンダボールのL*a*b*表色系における明度(L*)は、60以上100以下である。明度(L*)が60未満の場合には、Inが濃化されておらず、ハンダバンプ形成時に効果的にAuのハンダ中への拡散を抑制することができない場合がある。これに対し、明度(L*)が100を超える場合には、ハンダボール接合時のハンダの濡れ性が損なわれ得る場合がある。なお、明度(L*)の上限値は、より好ましくは80以下である。
本発明を構成するハンダボールは、Ag、Cu、Bi、In、Sb、Ni、Co、Fe、Ge、Pを上記範囲にて含有している。これにより、接合信頼性の向上を図ることができる。Ag、Cu、Bi、In、Ni、Sb、Co、Fe、Ge,Pの含有量は、Inと接合部材との反応を妨げてはいけないため、Ag:0以上4質量%以下、Cu:0以上1.0質量%以下、Bi、In、Sbの群から合計で0以上3質量%以下、Ni、Co、Fe、Ge、Pの群から合計で0以上0.1質量%以下にするのが好ましい。
本発明に係るハンダボールの残部はSnである。つまり、ハンダボールの主成分はSnであり、ハンダボール中の金属元素の中では常に一番含有量が多くなる。前述の元素の他に不可避的不純物を含有してもよい。不可避的不純物を含有する場合であっても、前述の効果に影響することはない。また、本発明では含有しない元素が不可避的不純物として含有されても前述の効果に影響することはない。
本発明に係るハンダボールのα線量は、ソフトエラーを抑制する観点から、0.0200cph/cm2以下である。これは、電子部品の高密度実装においてソフトエラーが問題にならない程度のα線量である。α線量は、更なる高密度実装でのソフトエラーを抑制する観点から、より好ましくは0.0010cph/cm2以下である。
まず、球径が0.1μm以上120μm以下であって、Inを0超10.0質量%以下含有するハンダボールを作製する。ハンダボールの作製方法としては、溶融したハンダを滴下して球状に加工する滴下法や、ガスアトマイズ法等の公知の方法を採用できる。ハンダボールには、Ag、Cu、Bi、Ni、Sb、Co、Fe、Ge,Pの群からなる1種または2種以上の元素を添加することができる。
ハンダボールの黄色度(b*)および明度(L*)は、コニカミノルタ製CM−2600d型分光測色計を使用して測定した。
ハンダボールの表面のInの濃度は、電界放出型電子線マイクロアナライザ(Field Emission Electron Probe MicroAnalyser:FE−EPMA)にて定性分析を行い、半定量分析値を引用した。なお、ハンダボール表面のInの濃度は濃度変化を比較するため、半定量分析値を算出した。
エージング処理を行っていないSn−Inのハンダボールを用意し、このハンダボールの半定量分析値を基準としてエージング処理を行った各ハンダボール中のInの半定量分析値を比較することによりInの濃化の評価を行った。
(a)実施例または比較例のハンダボールの半定量分析値が基準のハンダボールの半定量分析値を超える場合:〇(濃化大)
(b)実施例または比較例のハンダボールの半定量分析値が基準のハンダボールの半定量分析値以下である場合:×(濃化不十分)
NiおよびAuめっき処理が順に施されたCu板を使用し、そのCu板上にフラックスWF−6400(千住金属工業社製)を印刷し、その上に各ハンダボールをマウントした。ハンダボールをマウントした電極パッドを、昇温速度5℃/secにてN2雰囲気下で25℃から250℃まで昇温し、その後1分間リフローした。このような処理を100個のハンダボールにおいて実施した。
(a)100個のハンダボールの全てが電極パッド全体に濡れ広がっている場合:〇(良好)
(b)1個以上のハンダボールが電極パッド全体に濡れ広がっていない場合:×(不可)
Claims (6)
- Inが0.1質量%以上10質量%以下、残部がSnであり、
L*a*b*表色系における黄色度(b*)が2.8以上15.0以下であり、
L * a * b * 表色系における明度(L * )が60以上100以下である、
ハンダボール。 - 前記Inが0.1質量%以上7質量%以下である、
請求項1に記載のハンダボール。 - 球径が0.1μm以上120μm以下である、
請求項1または2に記載のハンダボール。 - Ag:0以上4質量%以下、
Cu:0以上1.0質量%以下、
Bi、Sbの群から合計で0〜3質量%、
Ni、Co、Fe、Ge、Pの群から合計で0〜0.1質量%のうち少なくとも1種以上の元素を添加した、
請求項1から3の何れか一項に記載のハンダボール(ただし、Ag:3質量%、Cu:0.5質量%、In:0.2質量%、残部がSnからなるハンダボールを除く)。 - 請求項1から4の何れか一項に記載のハンダボールを用いたハンダ継手。
- 請求項1から4の何れか一項に記載の複数のハンダボールを電極上に配置する工程と、
前記電極上に配置した前記複数のハンダボールを有機酸ガスを用いて溶融する工程と、
を有する、接合方法。
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MYPI2019006511A MY178830A (en) | 2018-11-09 | 2019-11-06 | Solder ball, solder joint, and joining method |
TW108140222A TWI696515B (zh) | 2018-11-09 | 2019-11-06 | 焊接球、焊接接頭及接合方法 |
US16/677,011 US10780531B2 (en) | 2018-11-09 | 2019-11-07 | Solder ball, solder joint, and joining method |
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CN115485098A (zh) * | 2020-04-30 | 2022-12-16 | 千住金属工业株式会社 | 无铅且无锑的软钎料合金、焊料球、球栅阵列和钎焊接头 |
CN115485098B (zh) * | 2020-04-30 | 2023-10-03 | 千住金属工业株式会社 | 无铅且无锑的软钎料合金、焊料球、球栅阵列和钎焊接头 |
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CN111168274B (zh) | 2021-05-25 |
TWI696515B (zh) | 2020-06-21 |
JP2020075280A (ja) | 2020-05-21 |
MY178830A (en) | 2020-10-20 |
CN111168274A (zh) | 2020-05-19 |
KR20200054090A (ko) | 2020-05-19 |
TW202026086A (zh) | 2020-07-16 |
US10780531B2 (en) | 2020-09-22 |
US20200147732A1 (en) | 2020-05-14 |
KR102114590B1 (ko) | 2020-05-22 |
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